CN211577878U - Self-destruction device for memory chip - Google Patents
Self-destruction device for memory chip Download PDFInfo
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- CN211577878U CN211577878U CN202020566792.XU CN202020566792U CN211577878U CN 211577878 U CN211577878 U CN 211577878U CN 202020566792 U CN202020566792 U CN 202020566792U CN 211577878 U CN211577878 U CN 211577878U
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Abstract
The utility model discloses a memory chip self-destruction device. The device comprises an assembly body, a control unit plate and a pin adapter plate, wherein the assembly body is of a box-shaped structure with an upper opening and a lower opening; the top of the assembly body is provided with a control unit board, the bottom of the assembly body is provided with a pin adapter board, the control unit board, the pin adapter board and the pin adapter board form a sealed cavity, and a micro-explosion structure body, an isolation layer and a storage chip are sequentially arranged in the cavity from top to bottom; the upper surface of the control unit board is provided with an integrated control circuit; the bottom surface of the pin adapter plate is provided with an extension pin, and the pin of the storage chip is connected to the extension pin through the pin adapter plate; the memory chip receives an external control signal through the extension pin and sends the external control signal to the integrated control circuit through the control lead, and the integrated control circuit is controlled to detonate the micro-explosion structure. The utility model discloses the structure of device can be adjusted according to the shape of the storage chip who protects, can adapt to the storage chip protection of different specifications, has good commonality and adaptability.
Description
Technical Field
The utility model relates to an electronic chip safety protection technical field, especially a memory chip self-destruction device.
Background
The information security mainly comprises five aspects of confidentiality, authenticity, integrity, unauthorized copying and security of a parasitic system of the information. In order to achieve the purpose of security and confidentiality of electronic information carried by a memory chip, the memory chip needs to have a self-destruction function under certain conditions, and when set conditions are met, the memory chip can be rapidly self-destroyed.
The self-destruction device used in the industry at present is mostly combined by a plurality of components, for example, patent 1 (application number CN201220282536.3) proposed by beijing pink technologies ltd discloses a solid-state memory with self-destruction function, which adopts a power supply burning mode to avoid the influence of the larger leakage current of the MOSFET switch tube on the signal integrity of the IO signal and the control signal of the nand flash chip; the control of the burning current is comprehensively considered, the problem of power overload is solved by switching channels or cutting off a physical self-destruction power supply, and the requirement on the physical self-destruction power supply is reduced; the NANDFlash chips are burned one by one in an independent channel self-destruction mode, so that each NANDFlash chip can be burned; however, the solid-state memory is complicated in structure and cannot be used on a single memory chip with a small size. Patent 2 (application number 201610614718.9) proposed by fuzhou rui core microelectronics corporation discloses a chip self-destruction device and method, the device comprises a password confirmation module, a password error counting judgment unit, a security level setting storage unit, an OTP programming control unit, an OTPROM array, two OTP value judgment units, an EMMC initialization control unit, EMMC memory particles, a memory initialization unit and a security information storage unit; the OTPROM array is sequentially connected with an EMMC initialization control unit and an EMMC storage grain through one OTP value judging unit, and is sequentially connected with a storage initialization unit and a secret information storage unit through the other OTP value judging unit, and the device can enable a chip to be self-destroyed under the condition that brute force cracking is confirmed, or only completely eliminates secret data without damaging the chip; however, the device adopts a plurality of unit combinations to further judge whether the self-destruction condition is met, has the defects of complex structure, high cost and difficult realization, and inevitably needs to change the external packaging characteristics of the storage chip during realization.
Disclosure of Invention
An object of the utility model is to provide a commonality and strong adaptability's storage chip self-destruction device under the prerequisite that does not change the original packaging structure of storage chip, combines self-destruction device and storage chip to carry out the encapsulation of system, can adapt to the storage chip protection of different specifications.
Realize the utility model discloses the technical solution of purpose does: a self-destruction device for a memory chip comprises an assembly body, a control unit board and a pin adapter board, wherein the assembly body is of a box-shaped structure with an upper opening and a lower opening; the top of the assembly body is provided with a control unit board, the bottom of the assembly body is provided with a pin adapter board, the control unit board, the pin adapter board and the pin adapter board form a sealed cavity, and a micro-explosion structure body, an isolation layer and a storage chip are sequentially arranged in the cavity from top to bottom;
the upper surface of the control unit board is provided with an integrated control circuit; the bottom surface of the pin adapter plate is provided with an extension pin, and the pin of the storage chip is connected to the extension pin through the pin adapter plate; the memory chip receives an external control signal through the extension pin and sends the external control signal to the integrated control circuit through the control lead, and the integrated control circuit is controlled to detonate the micro-explosion structure.
Further, the upper surface of the control unit board is also provided with a destruction switch, a switch isolation board and a power supply, wherein:
the destruction switch is connected with the integrated control circuit and used for triggering the detonation signal of the micro-explosion structure; the switch isolation plate is arranged below the destroying switch and used for isolating the conduction of the destroying switch, and the switch isolation plate can be extracted from the lower part of the destroying switch;
the power supply is used for supplying power for the integrated control circuit, the micro-explosion structure body and the storage chip.
Furthermore, the assembly body is a rectangular box-shaped structure formed by 4 side wall plates, and the inner part of the cavity of the structure is an upper space, a lower space and a shoulder; the shape and size of the upper space are matched with those of the micro-explosion structure body and are used for installing the micro-explosion structure body; the lower space is used for installing an isolation layer and a memory chip; the shoulder is matched with the pin adapter plate and used for installing the pin adapter plate.
Furthermore, a chip welding position is arranged in the middle of the upper surface of the pin adapter plate and used for welding a storage chip; and the layout of the extension pins at the bottom of the pin adapter plate is the same as that of the storage chip.
Furthermore, the four corners of the control unit board are fixed to the top of the assembly body through a set of fixing screws, and the four corners of the pin adapter board are fixed to the bottom of the assembly body through another set of fixing screws, so that the control unit board, the pin adapter board and the assembly body form a whole.
Furthermore, a blasting hole site is arranged at the center position below the shell of the micro-explosion structure, a through hole is arranged at the center position of the isolation layer, and the blasting hole site of the micro-explosion structure and the through hole at the center of the isolation layer correspond to the wafer position of the storage chip.
Furthermore, the extension pins comprise functional pins and custom pins, the functional pins correspond to pins with defined functions in the memory chip, and the custom pins correspond to idle pins in the memory chip; the self-defined pin is connected with the integrated control circuit and used for sending the received external control signal to the integrated control circuit.
Furthermore, the isolation layer is made of heat insulation materials, and the thickness of the isolation layer is 1.5-0.2 mm.
Compared with the prior art, the utility model, it is showing the advantage and lies in: (1) on the premise of not changing the original packaging structure of the memory chip, the self-destruction device and the memory chip are combined for system packaging, and the memory chip is physically destroyed under the condition that the conditions are met, so that the data security of the memory chip is improved; (2) the device structure can be adjusted according to the shape structure of the protected memory chip, can adapt to the protection of the memory chips with different specifications, and has good universality and adaptability.
Drawings
Fig. 1 is a schematic structural diagram of the self-destruction device of the present invention.
Fig. 2 is a schematic top structure diagram of the present invention.
Fig. 3 is a schematic diagram of the internal structure of the present invention.
Fig. 4 is a schematic structural diagram of the microexplosion structure of the present invention.
Detailed Description
The following describes the present invention with reference to the accompanying drawings.
With reference to fig. 1, the self-destruction device for memory chips of the present invention comprises an assembly body 1, a control unit board 3 and a pin adapter board 7, wherein the assembly body 1 has a box-shaped structure with an upper opening and a lower opening; the top of the assembly body 1 is provided with a control unit plate 3, the bottom of the assembly body is provided with a pin adapter plate 7, the control unit plate 3, the bottom of the assembly body and the pin adapter plate form a sealed cavity, and a micro-explosion structure body 4, an isolation layer 2 and a storage chip 9 are sequentially arranged in the cavity from top to bottom;
the upper surface of the control unit board 3 is provided with an integrated control circuit 13; the bottom surface of the pin adapter plate 7 is provided with an extension pin, and the pin of the storage chip 9 is switched to the extension pin through the pin adapter plate 7; the memory chip 9 receives an external control signal through the extension pin, and sends the external control signal to the integrated control circuit 13 through the control lead, so as to control the integrated control circuit 13 to detonate the micro-explosion structural body 4.
As a specific embodiment, referring to fig. 2, a destruction switch 12, a switch isolation board 11 and a power supply 5 are further disposed on the upper surface of the control unit board 3, wherein:
the destruction switch 12 is connected with the integrated control circuit 13 and is used for triggering the detonation signal of the micro-explosion structure 4; the switch isolation plate 11 is arranged below the destruction switch 12 and used for isolating the conduction of the destruction switch 12, and the switch isolation plate 11 can be extracted from the lower part of the destruction switch 12;
the power supply 5 is used for supplying power to the integrated control circuit 13, the micro-explosion structural body 4 and the storage chip 9.
With reference to fig. 3, as a specific example, the assembly body 1 is a rectangular box-shaped structure formed by 4 side wall plates 24, and the inner part of the cavity of the structure is an upper space 23, a lower space 22 and a shoulder 21; the shape and size of the upper space 23 are matched with those of the micro-explosion structural body 4 and are used for installing the micro-explosion structural body 4; the lower space 22 is used for mounting the isolation layer 2 and the memory chip 9; the shoulder 21 is adapted to the pin adapter plate 7 for mounting the pin adapter plate 7.
As a specific embodiment, a chip soldering position is arranged in the middle of the upper surface of the pin interposer 7 for soldering the memory chip 9; the layout of the extension pins at the bottom of the pin adapter plate 7 is the same as that of the memory chip 9.
As a specific embodiment, four corners of the control unit board 3 are fixed to the top of the assembly body 1 through a set of fixing screws 6, and four corners of the pin adapter board 7 are fixed to the bottom of the assembly body 1 through another set of fixing screws 6, so that the control unit board 3, the pin adapter board 7 and the assembly body 1 are integrated.
Referring to fig. 4, as a specific embodiment, a blasting hole 41 is disposed at a central position below a shell 42 of the micro-explosion structure 4, a through hole is disposed at a central position of the isolation layer 2, and both the blasting hole 41 of the micro-explosion structure 4 and the through hole at the center of the isolation layer 2 correspond to a wafer position of the memory chip 9.
As a specific embodiment, the extension pins include a functional pin 8 and a custom pin 10, where the functional pin 8 corresponds to a pin defining a function in the memory chip 9, and the custom pin 10 corresponds to a free pin in the memory chip 9; the custom pin 10 is connected to the integrated control circuit 13, and is used for sending the received external control signal to the integrated control circuit 13. The equipment or computer using the memory chip 9 sends out a self-instruction, the instruction is received by the memory chip 9, the instruction automatically locates the appointed idle pin, the idle pin sends out related instruction information and sends the related instruction information to the integrated control circuit 13, and the integrated control circuit 13 detonates the micro-explosion structural body 4 of the device.
As a specific embodiment, the isolation layer 2 is made of a heat insulating material, has a thickness of 1.5-0.2 mm, and is used for insulating heat of an upper space 23 of the cavity and dissipating heat of a lower space 22.
As a specific example, the destruction switch 12 and the switch isolation plate 11 are disposed at other positions by lead wires, for example, when the chip is in the case, if the chip is to be operated outside the case, the destruction switch and the switch isolation plate can be disposed at convenient positions by lead wires.
As a specific embodiment, the micro-explosion structure 4 comprises an upper shell, a primer cap, a initiating explosive chamber and a lower guard plate; the upper shell and the lower guard plate form a sealed space, and the detonating primer and the initiating explosive chamber are arranged in the sealed space; and an explosion directional window is arranged in the center of the lower guard plate. Go up casing and backplate down and adopt tenon fourth of twelve earthly branches fixed mode or thread tightening mode:
the tenon-and-mortise fixing mode specifically comprises the following steps:
the upper shell is a cavity body with an opening at the bottom, a first fixing support lug and a second fixing support lug are arranged at two ends of the outer wall of the upper shell, a first device fixing hole and a second device fixing hole are respectively formed in the first fixing support lug and the second fixing support lug, and first to fourth tenon seats and a circular bead are arranged at the bottom end inside the upper shell;
the lower guard plate is provided with first to fourth tenon protrusions, the thickness of the lower guard plate is matched with the depth of the shoulder of the upper shell, and the positions and the thicknesses of the first to fourth tenon protrusions are matched with the first to fourth tenon seats of the upper shell. The widths of the first tenon projection, the second tenon projection and the fourth tenon projection are larger than the widths of the first tenon seat, the second tenon seat and the fourth tenon seat.
The thread fixing mode is as follows:
the upper shell is a cavity body with a round opening at the bottom, an internal thread is arranged in the round opening, the lower protective plate is a round plate with an external thread, and the internal thread is matched with the external thread.
Furthermore, the detonation detonator is provided with 2 detonation signal wires, the 2 detonation signal wires are led out from the side wall of the upper shell, the upper layer of the initiating explosive chamber is filled with high-energy explosives, the lower layer of the initiating explosive chamber is filled with heat insulation materials, the inner surface of the upper shell, the outer surface of the detonation detonator and the upper surface of the lower protection plate are provided with corrosion-resistant coating layers, an energy attenuation plate is arranged in the explosion orientation window, 4-16 prefabricated fragments are arranged on the energy attenuation plate, and after the device is detonated, the electronic chip is simultaneously bombarded by the prefabricated fragments.
The utility model discloses memory chip self-destruction device's application method, including following step:
3, sending a detonation signal to the integrated control circuit 13 through the control lead, and starting the micro-detonation structure 4 through the integrated control circuit 13;
and 4, blasting the micro-explosion structure 4 to enable the shock wave to penetrate through the isolation layer 2 to damage the storage chip 9.
The device of the utility model combines the self-destruction device and the memory chip for system packaging on the premise of not changing the original packaging structure of the memory chip, and physically destroys the memory chip under the satisfied condition, thereby improving the data security of the memory chip; the device structure can be adjusted according to the shape structure of the protected memory chip, can adapt to the protection of the memory chips with different specifications, and has good universality and adaptability.
Claims (10)
1. A memory chip self-destruction device is characterized by comprising an assembly body (1), a control unit board (3) and a pin adapter board (7), wherein the assembly body (1) is of a box-shaped structure with an upper opening and a lower opening; the top of the assembly body (1) is provided with a control unit plate (3), the bottom of the assembly body is provided with a pin adapter plate (7), the control unit plate, the pin adapter plate and the pin adapter plate form a sealed cavity, and a micro-explosion structure body (4), an isolation layer (2) and a storage chip (9) are sequentially arranged in the cavity from top to bottom;
an integrated control circuit (13) is arranged on the upper surface of the control unit board (3); an extension pin is arranged on the bottom surface of the pin adapter plate (7), and a pin of the storage chip (9) is connected to the extension pin through the pin adapter plate (7); the storage chip (9) receives an external control signal through the expansion pin and sends the external control signal to the integrated control circuit (13) through the control lead, and the integrated control circuit (13) is controlled to detonate the micro-explosion structure body (4).
2. The memory chip self-destruction device according to claim 1, wherein the upper surface of the control unit board (3) is further provided with a destruction switch (12), a switch isolation board (11) and a power supply (5), wherein:
the destruction switch (12) is connected with the integrated control circuit (13) and is used for triggering the detonation signal of the micro-explosion structure body (4); the switch isolation plate (11) is arranged below the destruction switch (12) and used for isolating the conduction of the destruction switch (12), and the switch isolation plate (11) can be extracted from the lower part of the destruction switch (12);
the power supply (5) is used for supplying power to the integrated control circuit (13), the micro-explosion structure body (4) and the storage chip (9).
3. The memory chip destructor according to claim 1 or 2, characterized in that said assembly body (1) is formed by 4 side wall plates (24) in a rectangular box-like structure, the inner part of the cavity of which is an upper space (23), a lower space (22) and a shoulder (21); the shape and size of the upper space (23) are matched with those of the micro-explosion structural body (4) and used for installing the micro-explosion structural body (4); the lower space (22) is used for installing the isolation layer (2) and the memory chip (9); the shoulder (21) is matched with the pin adapter plate (7) and is used for installing the pin adapter plate (7).
4. The memory chip self-destruction device according to claim 3, wherein a chip bonding position is arranged in the middle of the upper surface of the pin adapter plate (7) and used for bonding the memory chip (9); and the layout of the extension pins at the bottom of the pin adapter plate (7) is the same as that of the storage chip (9).
5. The memory chip destructor according to claim 3, wherein four corners of the control unit board (3) are fixed to the top of the assembly body (1) by a set of fixing screws (6), and four corners of the pin adapter board (7) are fixed to the bottom of the assembly body (1) by another set of fixing screws (6), so that the control unit board (3), the pin adapter board (7) and the assembly body (1) are integrated.
6. The self-destruction device of the memory chip according to claim 4 or 5, wherein a blasting hole site (41) is arranged at the center position below the shell (42) of the micro-explosion structure body (4), a through hole is arranged at the center position of the isolation layer (2), and the blasting hole site (41) of the micro-explosion structure body (4) and the through hole at the center of the isolation layer (2) correspond to the wafer position of the memory chip (9).
7. The memory chip destructor according to claim 4 or 5, wherein the extension pins comprise a functional pin (8) and a custom pin (10), the functional pin (8) corresponding to a pin of the memory chip (9) defining a function, the custom pin (10) corresponding to a free pin of the memory chip (9); the custom pin (10) is connected with the integrated control circuit (13) and is used for sending the received external control signal to the integrated control circuit (13).
8. The self-destruction device for memory chips as claimed in claim 5, wherein the isolation layer (2) is made of a heat insulating material and has a thickness of 1.5-0.2 mm.
9. The memory chip self-destruction device according to claim 5, wherein the micro-blasting structural body (4) comprises an upper shell, a primer detonator, a initiating explosive chamber and a lower guard plate;
the upper shell and the lower guard plate form a sealed space, and the detonating detonator and the initiating explosive chamber are arranged in the sealed space; and an explosion directional window is arranged in the center of the lower guard plate.
10. The self-destruction device of the memory chip of claim 5, wherein the upper shell and the lower guard plate of the micro-explosion structure body (4) adopt a mortise and tenon joint fixing mode or a thread fixing mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020566792.XU CN211577878U (en) | 2020-04-16 | 2020-04-16 | Self-destruction device for memory chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020566792.XU CN211577878U (en) | 2020-04-16 | 2020-04-16 | Self-destruction device for memory chip |
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| CN211577878U true CN211577878U (en) | 2020-09-25 |
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| CN202020566792.XU Active CN211577878U (en) | 2020-04-16 | 2020-04-16 | Self-destruction device for memory chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2777001C1 (en) * | 2021-10-12 | 2022-07-29 | Акционерное общество "Научно-производственное предприятие "Краснознамёнец" | Information storage device with the possibility of its destruction |
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2020
- 2020-04-16 CN CN202020566792.XU patent/CN211577878U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2777001C1 (en) * | 2021-10-12 | 2022-07-29 | Акционерное общество "Научно-производственное предприятие "Краснознамёнец" | Information storage device with the possibility of its destruction |
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