CN212121186U

CN212121186U - Micro-explosion device for destroying electronic chip

Info

Publication number: CN212121186U
Application number: CN202020568056.8U
Authority: CN
Inventors: 孙万忠; 韩学平; 周明春; 刘静
Original assignee: Taixin Hi Tech Beijing Technology Co ltd
Current assignee: Taixin Hi Tech Beijing Technology Co ltd
Priority date: 2020-04-16
Filing date: 2020-04-16
Publication date: 2020-12-11
Anticipated expiration: 2030-04-16

Abstract

The utility model discloses a microexplosion device for electronic chip destroys. The device comprises an upper shell, an initiation detonator, a initiating explosive chamber and a lower guard plate, wherein a cavity body with an opening is arranged below the upper shell, two fixed lugs are arranged at two ends of the cavity body, the initiation detonator is provided with 2 initiation signal wires and is led out from the side wall of the upper shell, the upper part of the initiating explosive chamber is filled with high-energy explosive, and the lower part of the initiating explosive chamber is filled with heat insulation substances; the lower guard plate is provided with an explosion directional window, an energy attenuation plate is arranged in the explosion directional window, and the energy attenuation plate is provided with a plurality of prefabricated fragments. The utility model discloses little explosion device's explosion opportunity and power are controllable, small, the time of depositing is long, environmental suitability is good, loading and unloading are convenient, can carry out the physics to appointed electronic chip effectively and destroy, control explosion power through the energy attenuation board simultaneously for other electronic component do not suffer the damage, thereby reach the purpose of destroying appointed electronic chip under certain condition, improved electronic chip's data security.

Description

Micro-explosion device for destroying electronic chip

Technical Field

The utility model relates to an electron chip safety protection technical field, especially a explode device a little for electron chip destroys.

Background

With the development of science and technology, electronic chips have more and more powerful functions, chips with storage and control functions become important carriers of technology and information, and in some cases, the chips with storage and control functions need to be destroyed, but the current destruction of key electronic chips is mostly a circuit fusing method, so that the key electronic chips are not destroyed essentially and can be recovered under specific conditions.

In order to thoroughly destroy information stored in an electronic chip, the only method is to physically destroy a chip wafer, and man-made physical destruction is easily interfered by various factors, so that the chip cannot be destroyed. A patent (application No. 201510187373.9) by liupeng et al of the beijing university of science and technology discloses a self-destruction microsystem for a nonvolatile memory chip and a self-destruction method thereof, which specifically comprises the following steps: when the memory chip is in a normal state, the micro safety protection unit short-circuits the micro energy conversion element to ensure that the micro energy conversion element does not fire; when the self-destruction decision chip judges that the system needs the self-destruction of the storage chip, a protection command is sent to the micro safety protection unit through the protection control end, the micro safety protection unit connected with the pair of ignition electrodes of the micro energy conversion unit in parallel is disconnected for removing the protection, then the ignition control end sends an ignition signal to the micro energy conversion unit, the micro energy conversion unit generates heat to cause the energetic medicament in the packaging shell to be burnt and even to generate detonation, a large amount of heat is released in the reaction process, so that the irreparable physical damage is caused to the storage chip, and the irreparable destruction of the information in the storage chip is realized. However, this patent only proposes a conceptual approach to physical destruction of chips, and does not design a specific device for physical destruction of electronic chips.

Disclosure of Invention

An object of the utility model is to provide a little explodes device that is used for electronic chip to destroy that the opportunity of explosion and power are controllable, small, the time of depositing is long, environmental suitability is good, loading and unloading are convenient.

Realize the utility model discloses the technical solution of purpose does: a micro-explosion device for destroying electronic chips comprises an upper shell, a detonating primer, a priming chamber and a lower guard plate;

the upper shell and the lower guard plate form a sealed space, and the detonating primer and the initiating explosive chamber are arranged in the sealed space; and an explosion directional window is arranged in the center of the lower guard plate.

Furthermore, the upper shell and the lower guard plate are fixed in a mortise-tenon joint mode or a thread fixing mode.

Further, the tenon fourth of twelve earthly branches fixed mode specifically is as follows:

the upper shell is a cavity body with an opening at the bottom, a first fixing support lug and a second fixing support lug are arranged at two ends of the outer wall of the upper shell, a first device fixing hole and a second device fixing hole are respectively formed in the first fixing support lug and the second fixing support lug, and first to fourth tenon seats and a circular bead are arranged at the bottom end inside the upper shell;

the lower guard plate is provided with first to fourth tenon protrusions, the thickness of the lower guard plate is matched with the depth of the shoulder of the upper shell, and the positions and the thicknesses of the first to fourth tenon protrusions are matched with the first to fourth tenon seats of the upper shell.

Furthermore, the widths of the first tenon projection, the second tenon projection and the fourth tenon projection are larger than the widths of the first tenon seat, the second tenon seat and the fourth tenon seat.

Further, the thread fixing mode is as follows:

the upper shell is a cavity body with a round opening at the bottom, an internal thread is arranged in the round opening, the lower protective plate is a round plate with an external thread, and the internal thread is matched with the external thread.

Furthermore, the detonating detonator is provided with 2 detonating signal wires, and the 2 detonating signal wires are led out from the side wall of the upper shell.

Furthermore, the upper layer of the initiating explosive device chamber is filled with high-energy explosive, and the lower layer of the initiating explosive device chamber is filled with heat insulation materials.

Further, the inner surface of the upper shell, the outer surface of the detonating primer and the upper surface of the lower guard plate are all provided with anti-corrosion coating layers.

Further, an energy attenuation plate is arranged in the explosion directional window.

Furthermore, 4-16 prefabricated fragments are arranged on the energy attenuation plate, and after the device is detonated, the electronic chip is simultaneously bombarded by the prefabricated fragments.

Compared with the prior art, the utility model, it is showing the advantage and lies in: (1) when the protected electronic chip is destroyed, the destroying power is controllable, the destroying time is controllable, complete physical destruction can be completed aiming at the electronic chip, and peripheral circuits and other electronic elements are not damaged; (2) the method is suitable for electronic chips of different models and has good universality; (3) small volume, long storage time, good environmental adaptability and convenient assembly and disassembly.

Drawings

Fig. 1 is a schematic structural diagram of a microexplosion device for electronic chip destruction according to the present invention.

Fig. 2 is a schematic sectional view taken along line a-a of fig. 1 according to the present invention.

Fig. 3 is a schematic bottom view of the upper housing of the present invention.

Fig. 4 is a schematic bottom view of the middle lower guard plate of the present invention.

Fig. 5 is a schematic structural view of the middle screw thread fixing mode of the present invention.

Fig. 6 is a schematic structural view of the prefabricated fragments on the medium energy attenuation plate of the present invention, wherein (a), (b), and (c) are schematic structural views of 4, 9, and 16 prefabricated fragments on the energy attenuation plate, respectively.

Detailed Description

The following describes the present invention with reference to the accompanying drawings.

With reference to fig. 1 to 6, the utility model relates to a micro-explosion device for electronic chip destruction, which comprises an upper shell 4, a primer detonator 3, a priming chamber 5 and a lower guard plate 8;

the upper shell 4 and the lower guard plate 8 form a sealed space, and the detonating primer 3 and the initiating explosive chamber 5 are arranged in the sealed space; the lower guard plate 8 is provided with an explosion directional window 9, and the explosion directional window 9 is positioned in the center of the lower guard plate 8.

Further, the upper shell 4 and the lower protection plate 8 adopt a mortise and tenon fixing mode or a thread fixing mode.

As a specific example, the mortise and tenon fixing manner is as follows:

referring to fig. 3, a cavity body opened below the upper casing 4 is provided, in order to facilitate fixing the device to a designated position, a first fixing lug 1 and a second fixing lug 6 are provided outside the upper casing 4, and a first device fixing hole 12 and a second device fixing hole 7 are respectively provided on the first fixing lug 1 and the second fixing lug 6, so that the device can be easily fixed by using bolts; the bottom end in the upper shell 4 is provided with first to

fourth tenon seats

111, 112, 113 and 114 and a shoulder 13;

referring to fig. 4, the lower guard plate 8 is provided with first to

fourth tenons

101, 102, 103 and 104, the thickness of the lower guard plate 8 matches with the depth of the shoulder 13 of the upper shell 4, and the positions and thicknesses of the first to

fourth tenons

101, 102, 103 and 104 match with the first to

fourth tenons

111, 112, 113 and 114 of the upper shell 4.

Further, the widths of the first to

fourth tenon protrusions

101, 102, 103 and 104 are greater than the widths of the first to

fourth tenon seats

111, 112, 113 and 114, the lower protective body 8 and the upper shell 4 are combined by pressing, so that the first to

fourth tenon protrusions

101, 102, 103 and 104 can be combined conveniently, and in order to facilitate pressing, the two short end faces of the first to

fourth tenon protrusions

101, 102, 103 and 104 are provided with round chamfers.

Further, the thread fixing mode is as follows:

the upper shell 4 is a hollow cavity with a round hole at the lower part, an internal thread 15 is arranged in the round hole, the lower protection plate is a round plate with an external thread 16, and the internal thread 15 is matched with the external thread 16, as shown in fig. 5.

The detonating detonator 3 is provided with 2 detonating signal wires 2, and the 2 detonating signal wires 2 are led out from the side wall of the upper shell 4;

the upper layer of the initiating explosive device chamber 5 is filled with high-energy explosive 51, and the lower layer is filled with heat insulating material 52, as shown in figure 2;

the inner surface of the upper shell 4, the outer surface of the detonating primer 3 and the upper surface of the lower guard plate 8 are all provided with anti-corrosion coating layers;

an energy attenuation plate 14 is arranged in the explosion orientation window 9.

As a specific example, in order to increase the damage resistance of the upper shell 4 during explosion, round chamfers are provided at each corner inside the upper shell 4, and the explosion directing window 9 may be configured as an inverted trapezoid for better explosion effect.

As a specific example, for better explosion effect, 4-16 pre-fabricated fragments are arranged on the energy attenuation plate, as shown in fig. 6(a) - (c), so that after the device is detonated, the plurality of pre-fabricated fragments simultaneously bombard the electronic chip.

As a specific example, in order to conveniently dissipate heat generated by the operation of the electronic chip, the material of the upper housing 4 and the lower protective plate 8 is metal, preferably aluminum or aluminum alloy.

The function of the thermal insulation material 52 is to prevent the electronic chip from affecting the initiating explosive device during operation.

The utility model discloses an assembly process will go up casing 4 and invert, at first install detonating detonator 3 and detonating signal line 2, set up high explosive 51, then cover high explosive 51 completely with thermal-insulated material, install backplate 8 down at last to place energy attenuation board 14 in backplate 8's the directional window 9 of explosion.

The utility model discloses a working process is after detonating signal is received to detonating signal line 2, detonates detonating detonator 3, and then detonates high explosive 51, and high explosive 51's shock wave carries out the bombardment to electronic chip through energy attenuation board 14 back.

Considering from the aspect of device universality, the number of the fixed support lugs of the upper shell 4 of the utility model is not limited to 2, and the positions are not limited to two sides of the upper shell 4, if the area of the chip to be destroyed is too large, the number of the fixed support lugs can be 4, and the positions can be arranged at 4 corners of the upper shell 4 and also can be arranged outside the 4 sides; can be more than 4 with tenon seat and quantity setting when electronic chip is too big, when electronic chip is less, tenon seat and quantity setting are less than 4, as long as can with last casing 4 with protect the body down just can, go up the casing and do not restrict to the rectangle yet, according to electronic chip's specific shape, can set up to polygon, circular or oval, above all the condition all or partial with the utility model discloses the detonation tool who combines together and constitute all is within this patent protection scope.

Claims

1. A micro-explosion device for electronic chip destruction is characterized by comprising an upper shell (4), a detonating primer (3), a priming chamber (5) and a lower guard plate (8);

the upper shell (4) and the lower protective plate (8) form a sealed space, and the detonating primer (3) and the initiating explosive chamber (5) are arranged in the sealed space; an explosion directional window (9) is arranged in the center of the lower protective plate (8).

2. The microexplosion device for electronic chip destruction according to claim 1, wherein the upper shell (4) and the lower guard plate (8) are fixed by mortise and tenon joint or screw thread.

3. The microexplosion device for electronic chip destruction according to claim 2, wherein the tenon-and-mortise fixing manner is as follows:

the upper shell (4) is a cavity body with an opening at the bottom, a first fixing support lug (1) and a second fixing support lug (6) are arranged at two ends of the outer wall of the upper shell, a first device fixing hole (12) and a second device fixing hole (7) are respectively formed in the first fixing support lug (1) and the second fixing support lug (6), and first to fourth tenon seats (111, 112, 113 and 114) and a shoulder (13) are arranged at the bottom end inside the upper shell (4);

the lower protection plate (8) is provided with first to fourth tenon protrusions (101, 102, 103, 104), the thickness of the lower protection plate (8) is matched with the depth of a shoulder (13) of the upper shell (4), and the positions and the thicknesses of the first to fourth tenon protrusions (101, 102, 103, 104) are matched with first to fourth tenon seats (111, 112, 113, 114) of the upper shell (4).

4. The microexplosion device for electronic chip destruction according to claim 3, wherein the widths of the first to fourth tenon protrusions (101, 102, 103, 104) are larger than the widths of the first to fourth tenon seats (111, 112, 113, 114).

5. The microexplosion device for electronic chip destruction according to claim 2, wherein said thread fastening means is as follows:

go up casing (4) for the bottom have a cavity body of circular trompil, be equipped with internal thread (15) in the circular trompil, lower backplate for the circular slab that has external screw thread (16), internal thread (15) and external screw thread (16) phase-match.

6. The micro-blasting device for electronic chip destruction according to claim 3, 4 or 5, wherein the detonation detonator (3) is provided with 2 detonation signal wires (2), and the 2 detonation signal wires (2) are led out from the side wall of the upper shell (4).

7. The microexplosion device for electronic chip destruction according to claim 3, 4 or 5, characterized in that the upper layer of the pyrotechnic chamber (5) is filled with high explosive (51) and the lower layer is filled with insulating substance (52).

8. The micro-blasting device for electronic chip destruction according to claim 3, 4 or 5, characterized in that the inner surface of the upper shell (4), the outer surface of the primer detonator (3) and the upper surface of the lower guard plate (8) are provided with a corrosion-resistant coating.

9. The microexplosion device for electronic chip destruction according to claim 3, 4 or 5, characterized in that an energy attenuation plate (14) is arranged inside the explosion directing window (9).

10. The microexplosion device for electronic chip destruction according to claim 9, characterized in that 4-16 pre-fabricated fragments are provided on the energy attenuation plate (14), which pre-fabricated fragments simultaneously bombard the electronic chip after detonation of the device.