CN111389876A - Micro-explosion device for destroying electronic chip - Google Patents
Micro-explosion device for destroying electronic chip Download PDFInfo
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- CN111389876A CN111389876A CN202010300806.8A CN202010300806A CN111389876A CN 111389876 A CN111389876 A CN 111389876A CN 202010300806 A CN202010300806 A CN 202010300806A CN 111389876 A CN111389876 A CN 111389876A
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- Prior art keywords
- electronic chip
- upper shell
- explosion
- tenon
- plate
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- 238000004880 explosion Methods 0.000 title claims abstract description 26
- 239000002360 explosive Substances 0.000 claims abstract description 19
- 230000000977 initiatory effect Effects 0.000 claims abstract description 17
- 239000012634 fragment Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract 2
- 230000006378 damage Effects 0.000 claims description 20
- 230000001681 protective effect Effects 0.000 claims description 8
- 238000005474 detonation Methods 0.000 claims description 6
- 238000005422 blasting Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000037452 priming Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000007797 corrosion Effects 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention discloses a micro-explosion device for destroying an electronic chip. The device comprises an upper shell, an initiation detonator, a initiating explosive chamber and a lower guard plate, wherein a cavity body with an opening is arranged below the upper shell, two fixed lugs are arranged at two ends of the cavity body, the initiation detonator is provided with 2 initiation signal wires and is led out from the side wall of the upper shell, the upper part of the initiating explosive chamber is filled with high-energy explosive, and the lower part of the initiating explosive chamber is filled with heat insulation substances; the lower guard plate is provided with an explosion directional window, an energy attenuation plate is arranged in the explosion directional window, and the energy attenuation plate is provided with a plurality of prefabricated fragments. The micro-explosion device has the advantages of controllable explosion time and power, small volume, long storage time, good environmental adaptability and convenient assembly and disassembly, can effectively physically destroy the appointed electronic chip, and simultaneously controls the explosion power through the energy attenuation plate to prevent other electronic elements from being damaged, thereby achieving the purpose of destroying the appointed electronic chip under certain conditions and improving the data security of the electronic chip.
Description
Technical Field
The invention relates to the technical field of electronic chip safety protection, in particular to a micro-explosion device for destroying an electronic chip.
Background
With the development of science and technology, electronic chips have more and more powerful functions, chips with storage and control functions become important carriers of technology and information, and in some cases, the chips with storage and control functions need to be destroyed, but the current destruction of key electronic chips is mostly a circuit fusing method, so that the key electronic chips are not destroyed essentially and can be recovered under specific conditions.
In order to thoroughly destroy information stored in an electronic chip, the only method is to physically destroy a chip wafer, and man-made physical destruction is easily interfered by various factors, so that the chip cannot be destroyed. A patent (application No. 201510187373.9) by liupeng et al of the beijing university of science and technology discloses a self-destruction microsystem for a nonvolatile memory chip and a self-destruction method thereof, which specifically comprises the following steps: when the memory chip is in a normal state, the micro safety protection unit short-circuits the micro energy conversion element to ensure that the micro energy conversion element does not fire; when the self-destruction decision chip judges that the system needs the self-destruction of the storage chip, a protection command is sent to the micro safety protection unit through the protection control end, the micro safety protection unit connected with the pair of ignition electrodes of the micro energy conversion unit in parallel is disconnected for removing the protection, then the ignition control end sends an ignition signal to the micro energy conversion unit, the micro energy conversion unit generates heat to cause the energetic medicament in the packaging shell to be burnt and even to generate detonation, a large amount of heat is released in the reaction process, so that the irreparable physical damage is caused to the storage chip, and the irreparable destruction of the information in the storage chip is realized. However, this patent only proposes a conceptual approach to physical destruction of chips, and does not design a specific device for physical destruction of electronic chips.
Disclosure of Invention
The invention aims to provide a micro-explosion device for destroying an electronic chip, which has the advantages of controllable explosion time and power, small volume, long storage time, good environmental adaptability and convenient assembly and disassembly.
The technical solution for realizing the purpose of the invention is as follows: a micro-explosion device for destroying electronic chips comprises an upper shell, a detonating primer, a priming chamber and a lower guard plate;
the upper shell and the lower guard plate form a sealed space, and the detonating primer and the initiating explosive chamber are arranged in the sealed space; and an explosion directional window is arranged in the center of the lower guard plate.
Furthermore, the upper shell and the lower guard plate are fixed in a mortise-tenon joint mode or a thread fixing mode.
Further, the tenon fourth of twelve earthly branches fixed mode specifically is as follows:
the upper shell is a cavity body with an opening at the bottom, a first fixing support lug and a second fixing support lug are arranged at two ends of the outer wall of the upper shell, a first device fixing hole and a second device fixing hole are respectively formed in the first fixing support lug and the second fixing support lug, and first to fourth tenon seats and a circular bead are arranged at the bottom end inside the upper shell;
the lower guard plate is provided with first to fourth tenon protrusions, the thickness of the lower guard plate is matched with the depth of the shoulder of the upper shell, and the positions and the thicknesses of the first to fourth tenon protrusions are matched with the first to fourth tenon seats of the upper shell.
Furthermore, the widths of the first tenon projection, the second tenon projection and the fourth tenon projection are larger than the widths of the first tenon seat, the second tenon seat and the fourth tenon seat.
Further, the thread fixing mode is as follows:
the upper shell is a cavity body with a round opening at the bottom, an internal thread is arranged in the round opening, the lower protective plate is a round plate with an external thread, and the internal thread is matched with the external thread.
Furthermore, the detonating detonator is provided with 2 detonating signal wires, and the 2 detonating signal wires are led out from the side wall of the upper shell.
Furthermore, the upper layer of the initiating explosive device chamber is filled with high-energy explosive, and the lower layer of the initiating explosive device chamber is filled with heat insulation materials.
Further, the inner surface of the upper shell, the outer surface of the detonating primer and the upper surface of the lower guard plate are all provided with anti-corrosion coating layers.
Further, an energy attenuation plate is arranged in the explosion directional window.
Furthermore, 4-16 prefabricated fragments are arranged on the energy attenuation plate, and after the device is detonated, the electronic chip is simultaneously bombarded by the prefabricated fragments.
Compared with the prior art, the invention has the remarkable advantages that: (1) when the protected electronic chip is destroyed, the destroying power is controllable, the destroying time is controllable, complete physical destruction can be completed aiming at the electronic chip, and peripheral circuits and other electronic elements are not damaged; (2) the method is suitable for electronic chips of different models and has good universality; (3) small volume, long storage time, good environmental adaptability and convenient assembly and disassembly.
Drawings
Fig. 1 is a schematic structural diagram of a micro-explosion device for electronic chip destruction according to the present invention.
FIG. 2 is a schematic sectional view taken along line A-A of FIG. 1 according to the present invention.
Fig. 3 is a schematic bottom view of the upper housing of the present invention.
FIG. 4 is a schematic bottom view of the lower guard plate of the present invention.
Fig. 5 is a schematic structural view of a screw fastening method according to the present invention.
Fig. 6 is a schematic structural diagram of the prefabricated fragments on the energy attenuation plate of the present invention, wherein (a), (b), and (c) are schematic structural diagrams of 4, 9, and 16 prefabricated fragments on the energy attenuation plate, respectively.
Detailed Description
The following further describes embodiments of the present invention with reference to the drawings.
With reference to fig. 1 to 6, the micro-blasting device for electronic chip destruction according to the present invention includes an upper casing 4, a primer detonator 3, a initiating explosive chamber 5 and a lower guard plate 8;
the upper shell 4 and the lower guard plate 8 form a sealed space, and the detonating primer 3 and the initiating explosive chamber 5 are arranged in the sealed space; the lower guard plate 8 is provided with an explosion directional window 9, and the explosion directional window 9 is positioned in the center of the lower guard plate 8.
Further, the upper shell 4 and the lower protection plate 8 adopt a mortise and tenon fixing mode or a thread fixing mode.
As a specific example, the mortise and tenon fixing manner is as follows:
referring to fig. 3, a cavity body opened below the upper casing 4 is provided, in order to facilitate fixing the device to a designated position, a first fixing lug 1 and a second fixing lug 6 are provided outside the upper casing 4, and a first device fixing hole 12 and a second device fixing hole 7 are respectively provided on the first fixing lug 1 and the second fixing lug 6, so that the device can be easily fixed by using bolts; the bottom end in the upper shell 4 is provided with first to fourth tenon seats 111, 112, 113 and 114 and a shoulder 13;
referring to fig. 4, the lower guard plate 8 is provided with first to fourth tenons 101, 102, 103 and 104, the thickness of the lower guard plate 8 matches with the depth of the shoulder 13 of the upper shell 4, and the positions and thicknesses of the first to fourth tenons 101, 102, 103 and 104 match with the first to fourth tenons 111, 112, 113 and 114 of the upper shell 4.
Further, the widths of the first to fourth tenon protrusions 101, 102, 103 and 104 are greater than the widths of the first to fourth tenon seats 111, 112, 113 and 114, the lower protective body 8 and the upper shell 4 are combined by pressing, so that the first to fourth tenon protrusions 101, 102, 103 and 104 can be combined conveniently, and in order to facilitate pressing, the two short end faces of the first to fourth tenon protrusions 101, 102, 103 and 104 are provided with round chamfers.
Further, the thread fixing mode is as follows:
the upper shell 4 is a hollow cavity with a round hole at the lower part, an internal thread 15 is arranged in the round hole, the lower protection plate is a round plate with an external thread 16, and the internal thread 15 is matched with the external thread 16, as shown in fig. 5.
The detonating detonator 3 is provided with 2 detonating signal wires 2, and the 2 detonating signal wires 2 are led out from the side wall of the upper shell 4;
the upper layer of the initiating explosive device chamber 5 is filled with high-energy explosive 51, and the lower layer is filled with heat insulating material 52, as shown in figure 2;
the inner surface of the upper shell 4, the outer surface of the detonating primer 3 and the upper surface of the lower guard plate 8 are all provided with anti-corrosion coating layers;
an energy attenuation plate 14 is arranged in the explosion orientation window 9.
As a specific example, in order to increase the damage resistance of the upper shell 4 during explosion, round chamfers are provided at each corner inside the upper shell 4, and the explosion directing window 9 may be configured as an inverted trapezoid for better explosion effect.
As a specific example, for better explosion effect, 4-16 pre-fabricated fragments are arranged on the energy attenuation plate, as shown in fig. 6(a) - (c), so that after the device is detonated, the plurality of pre-fabricated fragments simultaneously bombard the electronic chip.
As a specific example, in order to conveniently dissipate heat generated by the operation of the electronic chip, the material of the upper housing 4 and the lower protective plate 8 is metal, preferably aluminum or aluminum alloy.
The function of the thermal insulation material 52 is to prevent the electronic chip from affecting the initiating explosive device during operation.
In the assembly process of the invention, an upper shell 4 is inverted, a detonating detonator 3 and a detonating signal wire 2 are firstly installed, high-energy explosive 51 is arranged, then the high-energy explosive 51 is completely covered by a heat insulating material, finally a lower protective plate 8 is installed, and an energy attenuation plate 14 is arranged in an explosion orientation window 9 of the lower protective plate 8.
The working process of the invention is that the initiation signal wire 2 detonates the initiation detonator 3 after receiving the initiation signal, and then detonates the high explosive 51, and the shock wave of the high explosive 51 bombards the electronic chip after passing through the energy attenuation plate 14.
In view of the universality of the device, the number of the fixing lugs of the upper shell 4 of the invention is not limited to 2, and the positions are not limited to two sides of the upper shell 4, if the area of the chip to be destroyed is too large, the number of the fixing lugs can be 4, and the positions can be arranged on 4 corners of the upper shell 4 or on the outer sides of 4 sides; when the electronic chip is too large, the number of the tenon seats can be set to be more than 4, when the electronic chip is smaller, the number of the tenon seats is set to be less than 4, the upper shell 4 can be combined with the lower protective body, the upper shell is not limited to be rectangular, and the electronic chip can be set to be polygonal, circular or elliptical according to the specific shape of the electronic chip, and all or part of the detonation tool combined with the embodiment of the invention is within the protection scope of the patent.
Claims (10)
1. A micro-explosion device for electronic chip destruction is characterized by comprising an upper shell (4), a detonating primer (3), a priming chamber (5) and a lower guard plate (8);
the upper shell (4) and the lower protective plate (8) form a sealed space, and the detonating primer (3) and the initiating explosive chamber (5) are arranged in the sealed space; an explosion directional window (9) is arranged in the center of the lower protective plate (8).
2. The microexplosion device for electronic chip destruction according to claim 1, wherein the upper shell (4) and the lower guard plate (8) are fixed by mortise and tenon joint or screw thread.
3. The microexplosion device for electronic chip destruction according to claim 2, wherein the tenon-and-mortise fixing manner is as follows:
the upper shell (4) is a cavity body with an opening at the bottom, a first fixing support lug (1) and a second fixing support lug (6) are arranged at two ends of the outer wall of the upper shell, a first device fixing hole (12) and a second device fixing hole (7) are respectively formed in the first fixing support lug (1) and the second fixing support lug (6), and first to fourth tenon seats (111, 112, 113 and 114) and a shoulder (13) are arranged at the bottom end inside the upper shell (4);
the lower protection plate (8) is provided with first to fourth tenon protrusions (101, 102, 103, 104), the thickness of the lower protection plate (8) is matched with the depth of a shoulder (13) of the upper shell (4), and the positions and the thicknesses of the first to fourth tenon protrusions (101, 102, 103, 104) are matched with first to fourth tenon seats (111, 112, 113, 114) of the upper shell (4).
4. The microexplosion device for electronic chip destruction according to claim 3, wherein the widths of the first to fourth tenon protrusions (101, 102, 103, 104) are larger than the widths of the first to fourth tenon seats (111, 112, 113, 114).
5. The microexplosion device for electronic chip destruction according to claim 2, wherein said thread fastening means is as follows:
go up casing (4) for the bottom have a cavity body of circular trompil, be equipped with internal thread (15) in the circular trompil, lower backplate for the circular slab that has external screw thread (16), internal thread (15) and external screw thread (16) phase-match.
6. The micro-blasting device for electronic chip destruction according to claim 3, 4 or 5, wherein the detonation detonator (3) is provided with 2 detonation signal wires (2), and the 2 detonation signal wires (2) are led out from the side wall of the upper shell (4).
7. The microexplosion device for electronic chip destruction according to claim 3, 4 or 5, characterized in that the upper layer of the pyrotechnic chamber (5) is filled with high explosive (51) and the lower layer is filled with insulating substance (52).
8. The micro-blasting device for electronic chip destruction according to claim 3, 4 or 5, characterized in that the inner surface of the upper shell (4), the outer surface of the primer detonator (3) and the upper surface of the lower guard plate (8) are provided with a corrosion-resistant coating.
9. The microexplosion device for electronic chip destruction according to claim 3, 4 or 5, characterized in that an energy attenuation plate (14) is arranged inside the explosion directing window (9).
10. The microexplosion device for electronic chip destruction according to claim 9, characterized in that 4-16 pre-fabricated fragments are provided on the energy attenuation plate (14), which pre-fabricated fragments simultaneously bombard the electronic chip after detonation of the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010300806.8A CN111389876B (en) | 2020-04-16 | 2020-04-16 | Micro-explosion device for destroying electronic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010300806.8A CN111389876B (en) | 2020-04-16 | 2020-04-16 | Micro-explosion device for destroying electronic chip |
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| Publication Number | Publication Date |
|---|---|
| CN111389876A true CN111389876A (en) | 2020-07-10 |
| CN111389876B CN111389876B (en) | 2024-02-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010300806.8A Active CN111389876B (en) | 2020-04-16 | 2020-04-16 | Micro-explosion device for destroying electronic chip |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114001607A (en) * | 2021-11-17 | 2022-02-01 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
| WO2022148493A1 (en) * | 2021-01-06 | 2022-07-14 | 南方科技大学 | Method and device for breaking down waste power battery using controlled explosion |
| WO2023045113A1 (en) * | 2021-09-22 | 2023-03-30 | 深圳先进技术研究院 | Chip attachment apparatus capable of realizing chip self-destruction and control method therefor |
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| DE3879936D1 (en) * | 1988-07-19 | 1993-05-06 | Stuvex Int Nv | CLAMPING DEVICE FOR EXPLOSION PANELS. |
| JPH05166464A (en) * | 1991-12-13 | 1993-07-02 | Sony Corp | Disassembly device for cathode ray tube and method for using this device |
| CN2145766Y (en) * | 1992-12-12 | 1993-11-10 | 淮南矿业学院 | Clamping casing coal resistant container |
| CN103514383A (en) * | 2012-06-29 | 2014-01-15 | 北京理工大学 | Outward-embedded type chip explosion self-destruction micro device |
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| CN108592707A (en) * | 2018-07-27 | 2018-09-28 | 中国工程物理研究院化工材料研究所 | A kind of micro electronmechanical intelligent and safe priming device and preparation method thereof |
| CN212121186U (en) * | 2020-04-16 | 2020-12-11 | 泰鑫高科(北京)技术有限公司 | Micro-explosion device for destroying electronic chip |
-
2020
- 2020-04-16 CN CN202010300806.8A patent/CN111389876B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3879936D1 (en) * | 1988-07-19 | 1993-05-06 | Stuvex Int Nv | CLAMPING DEVICE FOR EXPLOSION PANELS. |
| JPH05166464A (en) * | 1991-12-13 | 1993-07-02 | Sony Corp | Disassembly device for cathode ray tube and method for using this device |
| CN2145766Y (en) * | 1992-12-12 | 1993-11-10 | 淮南矿业学院 | Clamping casing coal resistant container |
| CN103514383A (en) * | 2012-06-29 | 2014-01-15 | 北京理工大学 | Outward-embedded type chip explosion self-destruction micro device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022148493A1 (en) * | 2021-01-06 | 2022-07-14 | 南方科技大学 | Method and device for breaking down waste power battery using controlled explosion |
| WO2023045113A1 (en) * | 2021-09-22 | 2023-03-30 | 深圳先进技术研究院 | Chip attachment apparatus capable of realizing chip self-destruction and control method therefor |
| CN114001607A (en) * | 2021-11-17 | 2022-02-01 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
| CN114001607B (en) * | 2021-11-17 | 2023-01-13 | 北京理工大学 | Integrated information self-destruction energetic microsystem with isolation safety system and implementation method |
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| CN111389876B (en) | 2024-02-27 |
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Effective date of registration: 20230515 Address after: Room 634, 6th Floor, Building A, Tengfei Building, No. 88 Jiangmiao Road, Nanjing, Jiangsu Province, 210018 Applicant after: Nanjing Ruipujing Technology Co.,Ltd. Address before: 2160, 1st Floor, Building 2, No. A6 Baijiazhuang Road, Chaoyang District, Beijing, 100020 Applicant before: Taixin hi tech (Beijing) Technology Co.,Ltd. |
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