CN111380875A - Defect detection method and system - Google Patents
Defect detection method and system Download PDFInfo
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- CN111380875A CN111380875A CN201811645096.1A CN201811645096A CN111380875A CN 111380875 A CN111380875 A CN 111380875A CN 201811645096 A CN201811645096 A CN 201811645096A CN 111380875 A CN111380875 A CN 111380875A
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- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
The application discloses a defect detection method and a system, wherein the method comprises the following steps: step S1: collecting color images and black and white images of a position to be detected of a product; step S2: performing defect analysis processing on the black-and-white image; step S3: and when the product has no defect at the position to be detected, discarding the corresponding color image. The defect detection system provided by the application can synchronously acquire the color image and the black and white image of the position to be detected without retaking when the defect detection is finished, thereby improving the UPH to the maximum extent and saving the time cost.
Description
Technical Field
The present disclosure relates to the field of wafer defect detection, and more particularly, to a method and a system for detecting defects.
Background
With the rapid development of semiconductor integrated circuits, it is generally necessary to detect the defects of the wafer after the wafer is manufactured.
After the wafer defect detection is completed, if a defective wafer is found, a color camera needs to be called to photograph the detected defect to obtain a corresponding defect color picture, which is generally called as a retake, so that an operator can conveniently re-judge the defect type.
However, in a factory, the number of times of the back-shooting increases with the number of defects, and the time cost increases accordingly, which seriously affects the productivity of the equipment.
Therefore, how to effectively reduce the wafer inspection cost is a technical problem that needs to be solved by those skilled in the art.
Content of application
The application aims to provide a defect detection method and system, which are used for synchronously acquiring color defect pictures of products and reducing the product detection cost.
In order to achieve the above purpose, the present application provides the following technical solutions:
a method of defect detection, comprising the steps of:
step S1: collecting color images and black and white images of a position to be detected of a product;
step S2: performing defect analysis processing on the black-and-white image;
step S3: and when the product has no defect at the position to be detected, discarding the corresponding color image.
Preferably, after step S3, the method further includes:
step S4: and repeating the operations of the step S1 to the step S3 until the acquisition is finished.
Preferably, in step S1, the image acquisition component acquires a color image and a black-and-white image of the position to be measured of the product; the image acquisition section includes: the objective lens is used for collecting signal light returned by the product; a light splitting device for splitting the signal light into first signal light and second signal light; a black-and-white image sensor for receiving the first signal light to form a black-and-white image; and the color image sensor is used for receiving the second signal light and forming a color image.
Preferably, in step S1, a black-and-white camera is used to collect a black-and-white image of the position to be measured of the product, and a color camera is used to collect a color image of the position to be measured of the product.
Preferably, in step S1, before the step of collecting the color image and the black-and-white image, the method further includes the steps of: providing illumination to the product.
Preferably, the product is a wafer.
A defect detection system comprises an image acquisition module, a defect analysis module and a defect synchronous photographing module, wherein the image acquisition module is used for acquiring a black-white image and a color image of a position to be detected of a product, the defect analysis module is used for carrying out defect analysis on the black-white image, and the defect synchronous photographing module is used for judging whether the corresponding color image needs to be reserved according to an analysis result of the defect analysis module.
Preferably, the image acquisition module comprises a black-and-white camera for acquiring black-and-white images of the position to be measured of the product and a color camera for acquiring color images of the position to be measured of the product.
Preferably, the image acquisition module includes: the objective lens is used for collecting signal light returned by the product; a light splitting device for splitting the signal light into first signal light and second signal light; a black-and-white image sensor for receiving the first signal light to form a black-and-white image; and the color image sensor is used for receiving the second signal light and forming a color image.
Preferably, the defect synchronous photographing module is configured to: when the original image data collected by the black-and-white camera is processed and analyzed by the defect analysis module, the color image data corresponding to the black-and-white image is reserved when the defect exists, and the color image data corresponding to the black-and-white image is discarded as garbage data when the defect does not exist.
The defect detection method provided by the application comprises the following steps: step S1: collecting color images and black and white images of a position to be detected of a product; step S2: performing defect analysis processing on the black-and-white image; step S3: and when the product has no defect at the position to be detected, discarding the corresponding color image. According to the defect detection method, the color image and the black and white image of the position to be detected are synchronously acquired, so that the color defect picture can be synchronously acquired without back shooting while the defect detection is finished, the UPH is improved to the maximum extent, and the time cost is saved.
The defect detection system comprises an image acquisition module, a defect analysis module and a defect synchronous photographing module, wherein the image acquisition module is used for acquiring black-and-white images and color images of positions to be detected of products, the defect analysis module is used for performing defect analysis on the black-and-white images, and the defect synchronous photographing module is used for judging whether the corresponding color images need to be reserved according to analysis results of the defect analysis module. The defect detection system provided by the application can synchronously realize the acquisition of color defect photos without retaking when the defect detection is finished by synchronously acquiring the color images and the black and white images of the positions to be detected, thereby improving the UPH to the maximum extent and saving the time cost.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a defect detection method provided herein;
FIG. 2 is a schematic diagram illustrating a defect detection system according to an embodiment of the present disclosure;
wherein: 100-product; 101-an objective lens; 102-a light source; 103-a color camera; 104 black and white camera.
Detailed Description
The core of the application is to provide a defect detection method and system, which are used for synchronously obtaining color defect pictures of products and reducing the product detection cost.
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings.
Referring to fig. 1 and fig. 2, fig. 1 is a flowchart illustrating a defect detection method provided in the present application; fig. 2 is a schematic structural diagram of an embodiment of a defect detection system provided in the present application.
In this embodiment, the defect detection method includes the steps of:
step S1: collecting a color image and a black-and-white image of the position to be detected of the product 100 to obtain original image information, wherein the black-and-white image is used for defect analysis of the position to be detected of the product 100;
step S2: performing defect analysis processing on the black-and-white image, and judging whether the position to be detected of the product 100 has a defect;
step S3: when the product 100 has a defect at the position to be detected, the color image corresponding to the position to be detected, namely the color image obtained synchronously with the black-and-white image, is reserved, and when the product 100 has no defect at the position to be detected, the corresponding color image is discarded;
the defect detection system provided by the application can synchronously realize the acquisition of color defect photos without retaking when the defect detection is finished by synchronously acquiring the color images and the black and white images of the positions to be detected, thereby improving the UPH to the maximum extent and saving the time cost.
In addition to the above embodiments, the method further includes, after step S3:
step S4: and repeating the operations of the step S1 to the step S3 until the acquisition is finished.
It should be noted that the ending of the collection refers to ending the collection of all positions to be measured of the product, or ending the collection of the appointed position to be measured.
On the basis of the above embodiments, in step S1, the image acquisition component acquires a color image and a black-and-white image of the position to be measured of the product 100; the image acquisition section includes: an objective lens 101 for collecting signal light returned by the product 100; a light splitting device for splitting the signal light into first signal light and second signal light; a black-and-white image sensor for receiving the first signal light to form a black-and-white image; and the color image sensor is used for receiving the second signal light and forming a color image.
Alternatively, in step S1, the black-and-white camera 104 is used to capture a black-and-white image of the product 100, and the color camera 103 is used to capture a color image of the product 100, specifically, the color camera 103 may be arranged concentrically with the optical lens of the black-and-white camera 104 by setting the reflective mirror.
Further, the black-and-white camera 104 and the color camera 103 are concentrically arranged, which is a basis for implementing a defect synchronous photographing technology, and is used for ensuring that positions of black-and-white image metadata and color image metadata correspond to each other one by one, so as to ensure that the retained color image metadata is accurate.
In addition to the above embodiments, before the step S1 of acquiring the color image and the black-and-white image, the method further includes the steps of: the product 100 is illuminated, and specifically, the light source 102 is illuminated on the product 100 through the arrangement of the light source 102 and the reflector, so that the definition of image acquisition is ensured.
In addition to the above embodiments, the product 100 is a wafer, i.e., a circular silicon wafer used for manufacturing a silicon semiconductor integrated circuit.
In addition to the defect detection method, the application also provides a defect detection system.
The defect detection system comprises an image acquisition module for acquiring black-and-white images and color images of a position to be detected of the product 100, a defect analysis module for performing defect analysis on the black-and-white images, and a defect synchronous photographing module for judging whether the corresponding color images need to be reserved according to an analysis result of the defect analysis module.
Further, the image acquisition module includes: an objective lens 101 for collecting signal light returned by the product 100; a light splitting device for splitting the signal light into first signal light and second signal light; a black-and-white image sensor for receiving the first signal light to form a black-and-white image; and the color image sensor is used for receiving the second signal light and forming a color image.
Or, the image acquisition module includes a black-and-white camera 104 acquisition module for acquiring a black-and-white image of the position to be measured of the product 100 and a color camera 103 acquisition module for acquiring a color image of the position to be measured of the product 100, and the color camera 103 may be arranged concentrically with the optical lens of the black-and-white camera 104 by setting the reflective mirror.
Specifically, the image metadata obtained by the black-and-white camera 104 acquisition module is analyzed and processed by the defect analysis module, and then the position information, the size information, and the original result map of the defect, that is, the color image metadata corresponding to the black-and-white image, are output.
Specifically, the black-and-white camera 104 acquisition module is used for acquiring a black-and-white image and inputting original metadata for defect detection; the color camera 103 acquisition module is used for acquiring a color image and acquiring the color image required for implementing the defect synchronous photographing technology, that is, the color camera 103 acquisition module can selectively retain or discard the corresponding color image according to an instruction of whether the corresponding color image is retained or not, which is sent by the defect synchronous photographing module.
On the basis of the above embodiments, the defect synchronous photographing module is configured to: after the original image data acquired by the black-and-white camera 104 is processed and analyzed by the defect analysis module, when a defect exists, the color image data corresponding to the black-and-white image is retained, and when the defect does not exist, the color image data corresponding to the black-and-white image is discarded as garbage data.
In the defect detection system provided by this embodiment, the color camera 103 and the black-and-white camera 104 are used to collect original image data in parallel, and the black-and-white image metadata and the color image metadata correspond to each other one to one, after the original image data collected by the black-and-white camera 104 is processed and analyzed by the defect analysis module, when a defect exists, the color image metadata corresponding to the black-and-white image is retained, and when no defect exists, the color image metadata corresponding to the black-and-white image is thrown away as garbage data, and finally, the retained color image is a color image corresponding to all defects; when the detection process is finished, the color image processing is also finished synchronously without shooting back, and the detection efficiency is obviously improved.
The defect detection method and system provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
Claims (10)
1. A method of defect detection, comprising the steps of:
step S1: collecting color images and black and white images of a position to be detected of a product;
step S2: performing defect analysis processing on the black-and-white image;
step S3: and when the product has no defect at the position to be detected, discarding the corresponding color image.
2. The defect detection method of claim 1, wherein the step S3 is followed by further comprising:
step S4: and repeating the operations of the step S1 to the step S3 until the acquisition is finished.
3. The defect detection method of claim 1, wherein in step S1, the image acquisition component acquires a color image and a black-and-white image of the position to be detected of the product; the image acquisition section includes: the objective lens is used for collecting signal light returned by the product; a light splitting device for splitting the signal light into first signal light and second signal light; a black-and-white image sensor for receiving the first signal light to form a black-and-white image; and the color image sensor is used for receiving the second signal light and forming a color image.
4. The defect detection method of claim 1, wherein in step S1, the black-and-white camera is used to collect black-and-white images of the product position to be detected, and the color camera is used to collect color images of the product position to be detected.
5. The defect detection method according to claim 1, wherein in the step S1, before the capturing of the color image and the black-and-white image, further comprising the steps of: providing illumination to the product.
6. The method of any one of claims 1 to 5, wherein the product is a wafer.
7. A defect detection system is characterized by comprising an image acquisition module, a defect analysis module and a defect synchronous photographing module, wherein the image acquisition module is used for acquiring a black-and-white image and a color image of a position to be detected of a product, the defect analysis module is used for carrying out defect analysis on the black-and-white image, and the defect synchronous photographing module is used for judging whether the corresponding color image needs to be reserved according to an analysis result of the defect analysis module.
8. The defect detection system of claim 7, wherein the image acquisition module comprises a black and white camera for acquiring black and white images of the location of the product to be tested and a color camera for acquiring color images of the location of the product to be tested.
9. The defect detection system of claim 7, wherein the image acquisition module comprises: the objective lens is used for collecting signal light returned by the product; a light splitting device for splitting the signal light into first signal light and second signal light; a black-and-white image sensor for receiving the first signal light to form a black-and-white image; and the color image sensor is used for receiving the second signal light and forming a color image.
10. The defect detection system of claim 7, wherein the defect-synchronized photographing module is configured to: when the original image data collected by the black-and-white camera is processed and analyzed by the defect analysis module, the color image data corresponding to the black-and-white image is reserved when the defect exists, and the color image data corresponding to the black-and-white image is discarded as garbage data when the defect does not exist.
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