CN111372431A - Water-cooling radiator applied to medical equipment and manufacturing method thereof - Google Patents
Water-cooling radiator applied to medical equipment and manufacturing method thereof Download PDFInfo
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- CN111372431A CN111372431A CN202010285372.9A CN202010285372A CN111372431A CN 111372431 A CN111372431 A CN 111372431A CN 202010285372 A CN202010285372 A CN 202010285372A CN 111372431 A CN111372431 A CN 111372431A
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- 238000001816 cooling Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 230000017525 heat dissipation Effects 0.000 claims abstract description 240
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 164
- 238000005219 brazing Methods 0.000 claims abstract description 16
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 238000004891 communication Methods 0.000 claims description 29
- 238000003466 welding Methods 0.000 claims description 7
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000003054 catalyst Substances 0.000 claims description 2
- 239000011541 reaction mixture Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 6
- 238000007789 sealing Methods 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a water-cooling radiator applied to medical equipment, which comprises a water inlet pipe, a water return pipe and at least two radiating plates, wherein the radiating plates are oppositely arranged and connected in a brazing mode, and a radiating flow channel communicated with the water inlet pipe and the water return pipe is formed between the radiating plates. This water-cooled radiator makes two heating panels connect through brazing for water-cooled radiator's difficult appearance defects such as weld leak, two heating panels homoenergetic reach the heat dissipation purpose simultaneously, have correspondingly promoted water-cooled radiator's radiating efficiency, in order to satisfy medical equipment's heat dissipation demand.
Description
Technical Field
The invention relates to the technical field of heat dissipation equipment, in particular to a water-cooling radiator applied to medical equipment and a manufacturing method thereof.
Background
Medical devices are typically high power, high energy consuming devices that generate large amounts of heat that requires efficient heat sinks to dissipate. At present, cooling equipment of medical equipment comprises two types, namely a water-cooling radiator and an air-cooling radiator, and the specific heat capacity of water is higher than that of air, so that the cooling effect of the water-cooling radiator is better.
Because the water-cooled radiator needs to flow in the water-cooled radiator through cooling liquid such as water flow, the requirement on the sealing property of the inner cavity of the water-cooled radiator is high, and the existing production mode easily causes the risk of leakage of the water-cooled radiator.
Disclosure of Invention
Based on this, it is necessary to provide an improved water-cooled radiator to the aforesaid problem, makes two heating panels connect through brazing for water-cooled radiator's difficult appearance defects such as weld leakage, and two heating panels homoenergetic reach the heat dissipation purpose simultaneously, have correspondingly promoted water-cooled radiator's radiating efficiency, in order to satisfy medical equipment's heat dissipation demand.
The utility model provides a be applied to medical equipment's water-cooling radiator, water-cooling radiator includes inlet tube, wet return and two piece at least heating panels, set up relatively between the heating panel and braze welding and connect, just still form between the heating panel communicate in the inlet tube reaches the heat dissipation runner of wet return.
Furthermore, the heat dissipation flow channel comprises a plurality of heat dissipation cavities and a plurality of communication cavities, and the heat dissipation cavities are arranged at intervals one by one and are communicated with one another through the communication cavities; and the heat dissipation cavities are arranged in an array. So set up to make the heat dissipation runner in the heating panel can corresponding increase the area of contact between flowing water and the heating panel, in order to promote the radiating efficiency.
Furthermore, the inner side surface of the heat dissipation plate is inwards sunken to form heat dissipation grooves, and the two heat dissipation grooves are oppositely arranged to form the heat dissipation cavity. So set up, be convenient for form the heat dissipation chamber between the heating panel. So set up, can greatly increased rivers area of contact in the heat dissipation runner to make the radiating efficiency who promotes water-cooling radiator.
Furthermore, the wall surface of the heat dissipation groove extends outwards and is convexly provided with a plurality of heat dissipation bulges, and the heat dissipation bulges corresponding to the same heat dissipation cavities are arranged in rows and columns. So set up for rivers can form orderly flow direction, cause the turbulent scheduling problem in avoiding rivers in the heat dissipation runner.
Furthermore, the heat dissipation bulges are arranged in a manner of being opposite to each other in rows and columns; and/or the presence of a catalyst in the reaction mixture,
a plurality of radiating bulges are arranged in a staggered way in rows and columns.
So set up, easily the bellied processing of dispelling the heat, and make rivers can form orderly flow direction.
Furthermore, a drainage channel is formed between the heat dissipation protrusion and the side wall of the heat dissipation cavity, and the drainage channel is communicated with the communication cavity. So set up, drainage channel is used for making rivers concentrate and evenly flow to each row of heat dissipation arch to and the corresponding conflux flows out the heat dissipation chamber.
Further, the heat dissipation plate includes a heat dissipation plate made of copper or aluminum alloy. So set up, not only make the water-cooling radiator can obtain better radiating effect, the water-cooling radiator dead weight that adopts aluminum alloy system heat dissipation board moreover can be lighter relatively.
Furthermore, the number of the heat dissipation flow channels is multiple; the heat dissipation flow channels are arranged at intervals, and the water inlet pipe and the water return pipe are converged.
Furthermore, a plurality of connecting channels are further arranged among the heat dissipation flow channels, and the connecting channels are communicated with the water inlet pipe. So set up for the inlet tube can carry out heat transfer through each heat dissipation runner of connecting channel fast flow direction to in each heat dissipation runner.
Furthermore, the water-cooling radiator comprises a switching block, and the switching block is arranged at the end part of the water inlet pipe and/or the end part of the water return pipe. So set up for the inlet tube is convenient for be connected with external pipeline.
Further, the manufacturing method of the water-cooling radiator comprises the following steps:
respectively processing symmetrical radiating grooves and communicating grooves on the inner side surfaces of the first radiating plate and the second radiating plate;
the heat dissipation grooves and the communication grooves of the first heat dissipation plate and the second heat dissipation plate are opposite to each other, and the first heat dissipation plate and the second heat dissipation plate are connected in an assembling and brazing mode, so that a heat dissipation flow channel is formed between the first heat dissipation plate and the second heat dissipation plate;
and a water inlet pipe and a water return pipe are arranged on the first heat dissipation plate and/or the second heat dissipation plate, and the water inlet pipe and the water return pipe are respectively communicated with the heat dissipation flow channel.
The invention provides a water-cooled radiator, which is characterized in that two heat dissipation plates are connected through brazing, so that the water-cooled radiator is not easy to have the defects of welding leakage and the like, and meanwhile, the two heat dissipation plates can achieve the purpose of heat dissipation, so that the heat dissipation efficiency of the water-cooled radiator is correspondingly improved, and the heat dissipation requirement of medical equipment is met.
Drawings
FIG. 1 is a schematic structural diagram of a water-cooled radiator according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of the water-cooled heat sink shown in FIG. 1 in which two heat dissipation plates are butted with each other;
FIG. 3 is a schematic structural diagram of a first heat dissipation plate in the water-cooled heat sink shown in FIG. 1;
FIG. 4 is a schematic structural diagram of a second heat dissipating plate of the water-cooled heat sink shown in FIG. 1;
fig. 5 is a schematic structural diagram of a first heat dissipation plate according to another embodiment of the present invention;
fig. 6 is a schematic structural diagram of a first heat dissipation plate according to another embodiment of the present invention;
fig. 7 is an enlarged view of the first heat dissipating plate shown in fig. 6 at a;
fig. 8 to 15 are schematic structural views illustrating arrangement of heat dissipation protrusions according to various embodiments of the present invention;
fig. 16 is a schematic flow chart illustrating a method for manufacturing a water-cooled heat sink according to an embodiment of the present invention.
100, a water-cooling radiator; 10. a heat dissipation plate; 11. 11a, 11b, a first heat dissipation plate; 12. a second heat dissipation plate; 13. 13a, 13b heat dissipation flow channels; 131. a water inlet; 132. 132a and a water return port; 133. a water inlet channel; 134. a water return channel; 135. a connecting channel; 136. a heat dissipation cavity; 137. a communicating cavity; 138. a heat dissipation protrusion; 1381. a drainage channel; 20. a water inlet pipe; 21. a transfer block; 30. a water return pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a water-cooling heat sink 100 according to an embodiment of the present invention; fig. 2 is a schematic structural view illustrating the abutting joint of two heat dissipation plates 10 in the water-cooled heat sink 100 shown in fig. 1.
The invention provides a water-cooling radiator 100 which is applied to medical equipment and used for cooling components needing heat dissipation in the medical equipment.
In particular, the water-cooled radiator in the present embodiment is applied to a magnetic resonance apparatus. The gradient power amplifier in the magnetic resonance equipment is a matched power supply of the magnetic resonance equipment, and mainly has the function of outputting pulse gradient signals of certain voltage and current to the gradient coil and is used for imaging. Through measurement and calculation, the total loss of the whole gradient system is up to more than 2 ten thousand watts, a large amount of heat generated by the gradient system is urgently required to be radiated by a high-efficiency water-cooling radiator, and the traditional water-cooling radiator cannot meet the radiating requirement of the gradient system. The water-cooled heat sink 100 may be used to cool the gradient system described above to ensure stable operation of the magnetic resonance apparatus. The rf system in the mri apparatus is also suitable for cooling by the water-cooled heat sink 100.
Of course, the water-cooled heat sink 100 can also be applied to cooling of other devices, such as electronic devices and the like.
The water-cooled heat sink 100 comprises two heat dissipation plates 10, a water inlet pipe 20 and a water return pipe 30, wherein the two heat dissipation plates 10 are respectively a first heat dissipation plate 11 and a second heat dissipation plate 12, the first heat dissipation plate 11 and the second heat dissipation plate 12 are hermetically connected with each other, and a heat dissipation flow channel 13 is formed between the first heat dissipation plate 11 and the second heat dissipation plate 12; the inlet pipe 20 is connected with the first heat dissipation plate 11; the water return pipe 30 is connected to the second heat radiating plate 12; the water inlet pipe 20 and the water return pipe 30 are respectively communicated with the heat dissipation flow passage 13. The first heat dissipation plate 11 and the second heat dissipation plate 12 are used for forming a heat dissipation flow passage 13; the water inlet pipe 20 is used for connecting an external water inlet pipeline, and the water return pipe 30 is used for connecting an external water return pipeline to form a complete cooling loop.
It is understood that in other embodiments, the water inlet pipe 20 and the water return pipe 30 may be connected to the same heat dissipating plate 10, such as the first heat dissipating plate 11 or the second heat dissipating plate 12, as long as the function of water inlet and return can be achieved; the water inlet pipe 20 and the water return pipe 30 may be fixedly connected to the heat dissipating plate 10 by welding, or may be connected to the heat dissipating plate 10 by other means, such as a screw connection, as long as the relatively fixed connection can be achieved and the water return pipe is communicated with the heat dissipating flow passage 13; the number of the first heat dissipation plate 11 and the second heat dissipation plate 12 may be correspondingly set to be plural, and the plural first heat dissipation plates 11 and the plural second heat dissipation plates 12 are stacked or spliced to form the corresponding heat dissipation channels 13.
Of course, the coolant used in the water-cooled radiator 100 may be other than water as long as the function of heat radiation is achieved.
Because the water-cooled radiator needs to flow through cooling liquid such as water flow and the like in the water-cooled radiator, the requirement on the sealing property of the inner cavity of the water-cooled radiator is high. The existing preparation process is easy to generate leakage risk when preparing the water-cooling radiator with a complex internal structure.
In this embodiment, the heat dissipation plates 10 are connected by brazing, so that the heat dissipation plates 10 of the water-cooled heat sink 100 can be welded precisely, the risk of leakage of the water-cooled heat sink 100 is reduced correspondingly, and stable operation of the medical equipment can be maintained.
The corresponding heat dissipation channels 13 are arranged between the heat dissipation plates 10, so that the external structure of the water-cooling heat sink 100 is simplified, welding among a plurality of pipelines can be reduced, and the leakage risk is reduced.
In one embodiment, the heat dissipation plate 10 is made of a copper plate or an aluminum alloy plate to ensure good heat transfer through the heat dissipation plate 10. The copper plate is adopted to prepare the heat dissipation plate 10, and the heat dissipation effect of the heat dissipation plate 10 can be greatly improved due to the excellent heat conductivity of copper; by forming the heat radiation plate 10 from an aluminum alloy plate, the weight and manufacturing cost of the water-cooled heat sink 100 can be reduced, and the amount of the medical equipment with the water-cooled heat sink 100 can be reduced accordingly.
In addition, the copper plate or the aluminum alloy plate can be connected by the brazing to obtain the water-cooled heat sink 100 with good connection strength and good sealing performance.
Of course, if the heat dissipation efficiency is not considered, the heat dissipation plate 10 may be made of other metal materials, such as stainless steel, as long as the heat dissipation flow channel 13 can be formed to achieve the purpose of heat dissipation.
In one embodiment, the end of the water inlet pipe 20 away from the heat dissipation plate 10 is further provided with a transfer block 21. The adapter block 21 is used to connect the water inlet pipe 20 with an external pipeline. The adapter 21 is fixedly connected to the water inlet pipe 20 by welding or the like. Preferably, a sealing ring is disposed between the junction block 21 and the water inlet pipe 20 to further enhance the sealing performance therebetween. So set up for inlet tube 20 is convenient for be connected with external pipeline.
One end of the return pipe 30 is also provided with a junction block 21, which will not be described herein.
Referring to fig. 3 to 6, fig. 3 is a schematic structural diagram of the first heat dissipation plate 11 in the water-cooled heat sink 100 shown in fig. 1; fig. 4 is a schematic structural view of the second heat dissipation plate 12 in the water-cooled heat sink 100 shown in fig. 1; fig. 5 is a schematic structural diagram of a first heat dissipation plate 11a according to another embodiment of the present invention; fig. 6 is a schematic structural diagram of a first heat sink 11b according to another embodiment of the present invention.
In one embodiment, the heat dissipation plate 10 is a substantially square plate; a heat dissipation flow channel 13 is formed between the two heat dissipation plates 10; the heat dissipation plate 10 is correspondingly provided with a water inlet 131 at a position relatively close to the water inlet pipe 20; a return port 132 is formed at a position of the heat radiating plate 10 relatively close to the return pipe 30. The water inlet 131 and the water return 132 are respectively connected to two ends of the heat dissipation flow channel 13.
It is understood that in other embodiments, the shape of the heat dissipation plate 10 may be configured according to the actual installation space, for example, an annular or circular plate, as long as the corresponding heat dissipation cavity 136 and the communication cavity 137 can be provided inside.
In one embodiment, as shown in fig. 3 and 4, the number of the heat dissipation flow channels 13 is two, and the two heat dissipation flow channels 13 are substantially parallel and extend along the length direction of the heat dissipation plate 10. It is understood that in other embodiments, the number of the heat dissipation flow channels 13 may be set to one or more than three; the two heat dissipation flow channels 13 may be disposed obliquely or alternately, as long as the connection between the water inlet 131 and the water return 132 can be achieved.
It is understood that in other embodiments, as shown in fig. 6, only one heat dissipation flow channel 13b formed between the first heat dissipation plate 11b and the second heat dissipation plate may be provided.
In one embodiment, the number of the water inlets 131 and the water return ports 132 is one, and the water inlets 131 and the water return ports 132 are disposed at two sides of the length direction of the heat dissipation plate 10, so that the water inlets 131 and the water return ports 132 are connected to two ends of the heat dissipation flow channel 13. The two ends of the two heat dissipation channels 13 are respectively collected at the water inlet 131 and the water return 132. The number of the water inlet 131 and the water return port 132 is set to one, so that the number of the water inlet pipe 20 and the water return pipe 30 corresponds to one. As shown in fig. 4, the direction of the arrows in the figure is the direction of water flow. With this arrangement, the connection between the water inlet pipe 20 and the water return pipe 30 and the heat radiating plate 10 can be reduced.
It is understood that in other embodiments, the number of the water inlets 131 may be provided in plurality, and a plurality of the water inlets 131 may be communicated with each other and connected to the same water inlet pipe 20. The setting of the water return port 132 is similar to that of the water inlet port 131, and is not described in detail herein.
In one embodiment, the water inlet 131 is disposed between the two heat dissipation flow channels 13 and relatively close to one end of the inlet water, so that the distance between the two heat dissipation flow channels 13 from the water inlet 131 is the same, and the water flow of the water inlet 131 can flow to the two heat dissipation flow channels 13 equally.
It is understood that in other embodiments, the water inlet 131 may be disposed at a side close to only one of the heat dissipation flow channels 13, as long as it is possible to provide water inlet for two heat dissipation flow channels 13. The setting of the water return port 132 is similar to that of the water inlet port 131, and is not described in detail herein.
In one embodiment, the heat dissipation channel 13a includes a water inlet channel 133, a water return channel 134 and a connection channel 135, the water inlet channel 133 and the water return channel 134 are disposed substantially in parallel and respectively extend along the length direction of the first heat dissipation plate 11 a; one end of the water inlet channel 133 is connected with the water inlet 131, and one end of the water return channel 134 is connected with the water return port 132 a; the water inlet 131 and the water return 132a are opened at both diagonal ends of the first heat sink 11 a. The connection channel 135 is transversely disposed between the water inlet channel 133 and the water return channel 134, and is used for communicating the water inlet channel 133 and the water return channel 134. So set up for can obtain longer heat dissipation runner 13 between inhalant canal 133 and the return water passageway 134, so that the heat exchange is more thorough.
It is understood that, in other embodiments, the water inlet channel 133 is not necessarily provided, and the connection channel may be directly connected to the water inlet 131 and the water return channel 134, as long as the connection between the water inlet 131 and the water return channel 134 is achieved.
In one embodiment, as shown in fig. 5, fig. 5 illustrates a case where a plurality of heat dissipation flow channels 13a can communicate with each other. The number of the water return passages 134 is two, and the number of the corresponding water return ports 132a is two. The two water return passages 134 are respectively arranged on both sides of the first heat dissipation plate 11a in the width direction and are arranged in parallel; one ends of the two water return passages 134 are connected to the corresponding water return ports 132a, respectively, and the other ends are connected to the water inlet passage 133 through a connection passage 135. The number of the water inlet channels 133 is one, the water inlet channels are arranged between the two water return channels 134, and correspondingly, the number of the water inlets 131 is one; one end of the water inlet channel 133 is connected to the water inlet 131, and the other end is connected to the water return channel 134 through a connection channel 135. In an embodiment, a plurality of connecting passages 135 are disposed between the water inlet passage 133 and the water return passage 134, so that water in the water inlet passage 133 can flow to the water return passage 134 through the plurality of connecting passages 135, as shown in fig. 5, the direction of an arrow in the figure is a water flow direction, so as to increase the overall heat dissipation area and correspondingly improve the heat dissipation efficiency.
It is understood that in other embodiments, the number of the water return channels 134 may also be more than three, as long as the connection with the water inlet channel 133 and the water return port 132a can be realized; the number of the connection passages 135 may be set to one as long as the connection between the water inlet passage 133 and the water return passage 134 can be achieved.
In one embodiment, as shown in fig. 3 and 4, two opposite sides of the two heat dissipation plates 10 are inner side surfaces; the inner side surfaces of the heat dissipation plates 10 are recessed inwards to form heat dissipation grooves (not numbered) and communication grooves (not numbered), the corresponding heat dissipation grooves of the two heat dissipation plates are oppositely arranged to form a heat dissipation cavity 136, and the corresponding communication grooves of the two heat dissipation plates are oppositely arranged to form a communication cavity 137; the plurality of heat dissipation cavities 136 are arranged at intervals one by one and communicate with each other through the plurality of communication cavities 137 to form the heat dissipation flow path 13 in the heat dissipation plate 10. One of the plurality of heat dissipation chambers 136 relatively adjacent to the water inlet 131 communicates with the water inlet 131 through the communication chamber 137; one of the plurality of heat dissipation chambers 136 relatively close to the return port 132 communicates with the return port 132 through the communication chamber 137. The heat dissipation cavity 136 is a cavity for cooling by water flow; the communication chamber 137 is used for communicating the plurality of heat dissipation chambers 136, and the heat dissipation chambers 136, the water inlet 131 and the water return port 132. The water flows in from the water inlet 131, exchanges heat with external heat in the heat dissipation chamber 136 through the communication chamber 137, and flows out through the communication chamber 137 and the water return port 132. The arrangement is such that the water flow can exchange heat in the plurality of heat dissipation cavities 136 through the communication cavity 137.
It is understood that the heat dissipation chamber 136 may not be spaced apart, as long as heat dissipation of the water flow within the chamber is achieved.
The number of the heat dissipation cavities 136 in the same heat dissipation flow channel 13 can be set to be four, six or eight. Of course, the number of the heat dissipation cavities 136 can be set according to the actual working condition requirement. Fig. 3 and 4 show the case where the heat dissipation cavities of the plurality of different heat dissipation flow channels are not communicated with each other.
The heat dissipation chamber 136 has a substantially square cross-sectional shape, and the communication chamber 137 is connected to two diagonally opposite corners of the heat dissipation chamber 136 to allow the water flow to sufficiently flow in the heat dissipation chamber 136 and dissipate heat.
It is understood that in other embodiments, the cross-section of the heat dissipation cavity 136 may be configured in other shapes, such as circular, as long as the water flow can dissipate heat in the cavity; the communication chamber 137 may be provided at any position on the outer periphery of the heat dissipation chamber 136 as long as communication between the respective heat dissipation chambers 136 is achieved.
In one embodiment, a heat dissipation cavity 136 may be correspondingly disposed between the water inlet channel 133 and the water return channel 134 to increase a heat dissipation area of the water flow and improve heat dissipation efficiency. As shown in fig. 5, fig. 4 shows a case where a plurality of heat dissipation chambers in the same row of the heat dissipation plate communicate with each other.
In one embodiment, the heat dissipation cavities 136 are arranged in a linear array so as to process the heat dissipation cavities 136 and the corresponding communication cavities 137.
Referring to fig. 7, fig. 7 is an enlarged view of the first heat sink 11b shown in fig. 6 at a; .
In one embodiment, the inner side surfaces of the heat dissipation plates 10 are all recessed inward, and a plurality of heat dissipation protrusions 138 are formed at corresponding positions of the inner side surfaces in a protruding manner; and the heat dissipating protrusion 138 is disposed in the heat dissipating cavity 136. The heat dissipating protrusions 138 are used to increase the contact area with water flow and rapidly transfer heat on the heat dissipating plate 10 to the water flow, and the water flow enters the heat dissipating cavity 136 and carries away the heat on the heat dissipating protrusions 138 through friction with the heat dissipating protrusions 138. With such an arrangement, the contact area of the water flow in the heat dissipation flow channel 13b can be greatly increased, so that the heat dissipation efficiency of the water-cooled heat sink 100 is improved.
Preferably, the heat dissipating protrusion 138 and the heat dissipating plate 10 are integrally formed.
In one embodiment, the heat dissipating protrusions 138 are substantially in the form of a pin cluster, and the plurality of heat dissipating protrusions 138 are arranged in rows and columns and form a pin cluster. By such arrangement, the water flow can form an orderly flow direction, so as to avoid the problems of turbulence and the like caused by the water flow in the heat dissipation flow channel 13 b.
It is understood that, in other embodiments, the heat dissipating protrusion 138 may be provided in other shapes, such as a fin shape, as long as the increase of the contact area with the water flow in the heat dissipating flow channel 13b can be achieved.
In one embodiment, a drainage channel 1381 is further formed in the heat dissipation cavity 136 at a position relatively close to the first flow channel, and the heat dissipation cavity 136 is respectively communicated with the communication cavity 137 through a plurality of drainage channels 1381. The flow-guiding channels 1381 are used to concentrate and uniformly flow the water to the rows of heat-dissipating protrusions 138 and to correspondingly converge and flow out of the heat-dissipating cavity 136.
Of course, the heat dissipating protrusions 138 and the flow guiding channels 1381 may be applied to the first heat dissipating plates 11 and 11a and the second heat dissipating plate 12.
Referring to fig. 8 to 15, fig. 8 to 15 are schematic structural views of the heat dissipation protrusion 138 according to various embodiments of the present invention.
The sectional shape of the heat dissipation protrusions 138 may be a regular polygon or a circle. So set up, the heat dissipation of regular shape is protruding 138 and is easily processed and shaped, and the rivers that flow through between the heat dissipation protruding 138 also can be relatively even and stable. Regular polygons include, but are not limited to, the following shapes: square, diamond, regular hexagon.
In one embodiment, the heat dissipating protrusions 138 are arranged in opposite rows and columns; or, the heat dissipating protrusions 138 are arranged in staggered rows and columns. So set up, can make the distance between the heat dissipation arch 138 equal to easily the machine-shaping of heat dissipation arch 138 and form the orderly flow direction of rivers. As shown in fig. 8 to 15, the heat dissipating protrusions 138 may be provided in various shapes and in various arrangements.
The heat dissipation process of the water-cooled heat sink 100 is described in detail below:
the water flow enters the communicating cavities 137 through the water inlet pipe 20 and the water inlet 131, and sequentially flows through the communicating cavities 137 to enter the heat dissipation flow channels 13; when water flow enters the heat dissipation cavities 136 in sequence, heat on the heat dissipation protrusions 138 is taken away after sufficient friction is generated between the water flow and the heat dissipation protrusions 138; then, the water flow is converged to the return port 132 via the plurality of communication chambers 137 and flows out through the return pipe 30.
The invention provides a water-cooling radiator 100, which enables two heat dissipation plates 10 to be connected through brazing, so that the water-cooling radiator 100 is not easy to have the defects of welding leakage and the like, meanwhile, the two heat dissipation plates 10 can achieve the purpose of heat dissipation, the heat dissipation efficiency of the water-cooling radiator 100 is correspondingly improved, and the heat dissipation requirement of medical equipment is met.
Referring to fig. 16, fig. 16 is a schematic flow chart illustrating a method for manufacturing a water-cooled heat sink according to an embodiment of the present invention.
The invention provides a manufacturing method of a water-cooling radiator, which comprises the following steps:
s10, respectively processing symmetrical radiating grooves and communicating grooves on the inner side surfaces of the first radiating plate and the second radiating plate;
s20, the heat dissipation grooves and the communication grooves of the first heat dissipation plate and the second heat dissipation plate are opposite to each other, and the first heat dissipation plate and the second heat dissipation plate are spliced and connected in a soldering mode, so that a heat dissipation flow channel is formed between the first heat dissipation plate and the second heat dissipation plate;
and S30, mounting a water inlet pipe and a water return pipe on the first heat dissipation plate and/or the second heat dissipation plate, and respectively communicating the water inlet pipe and the water return pipe with the heat dissipation flow channels.
Specifically, in step 10, the inner side surfaces of the first heat dissipation plate and the second heat dissipation plate are respectively processed with a heat dissipation groove and a communication groove through a processing center; a plurality of first heat dissipation plates and a plurality of second heat dissipation plates may be welded to each other.
In step S20, aligning the heat dissipation grooves and the communication grooves in the two heat dissipation plates, placing a plate-shaped vacuum brazing material with the same size as the heat dissipation plates between the heat dissipation plates, wherein the thickness of the brazing material is about 0.05mm, fixing and clamping the front cold plate and the brazing material together by using a clamp, placing the plate-shaped vacuum brazing material into a vacuum brazing furnace, raising the temperature to a specific temperature, keeping the temperature for a certain time, discharging the plate-shaped vacuum brazing material out of the furnace, placing the plate-shaped vacuum brazing material for a certain time, opening the clamp after the plate-; and a heat dissipation flow channel is formed between the two symmetrical heat dissipation grooves and the communication groove.
Of course, the thickness of the solder can be selected according to the actual working condition requirement.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (11)
1. The utility model provides a be applied to medical equipment's water-cooling radiator, its characterized in that, water-cooling radiator includes inlet tube (20), wet return (30) and two piece at least heating panels (10), set up relatively between heating panel (10) and braze welding connect, just still form between heating panel (10) communicate in inlet tube (20) and heat dissipation runner (13) of wet return (30).
2. The water-cooled heat sink applied to medical equipment according to claim 1, wherein the heat dissipation flow channel (13) comprises a plurality of heat dissipation cavities (136) and a plurality of communication cavities (137), the heat dissipation cavities (136) are arranged at intervals and are communicated with each other through the communication cavities (137); the heat dissipation cavities (136) are arranged in an array.
3. The water-cooled heat sink applied to medical equipment according to claim 2, wherein the inner side surface of the heat dissipation plate (10) is recessed inwards to form heat dissipation grooves, and the two heat dissipation grooves are oppositely arranged to form the heat dissipation cavity (136).
4. The water-cooled heat sink applied to medical equipment according to claim 3, wherein the wall surface of the heat sink extends outwards and is provided with a plurality of heat dissipating protrusions (138) in a protruding manner, and the plurality of heat dissipating protrusions (138) corresponding to the same heat dissipating cavity (136) are arranged in rows and columns.
5. The water-cooled heat sink for medical equipment as recited in claim 4, wherein a plurality of said heat dissipating protrusions (138) are arranged in a row; and/or the presence of a catalyst in the reaction mixture,
the heat dissipation bulges (138) are arranged in a staggered way in rows and columns.
6. The water-cooled heat sink applied to medical equipment according to claim 4, wherein a drainage channel (1381) is formed between the heat dissipation protrusion (138) and the side wall of the heat dissipation cavity (136), and the drainage channel (1381) is communicated with the communication cavity (137).
7. The water-cooled heat sink applied to medical equipment according to claim 1, wherein the heat dissipation plate (10) comprises a heat dissipation plate made of copper or aluminum alloy.
8. The water-cooled heat sink applied to medical equipment according to claim 1, wherein the number of the heat dissipation flow passage (13) is plural; the heat dissipation flow channels (13) are arranged at intervals and are collected at the water inlet pipe (20) and the water return pipe (30).
9. The water-cooled heat sink applied to medical equipment as recited in claim 8, wherein a connecting channel (135) is further provided between a plurality of heat dissipation flow channels (13), and the connecting channel (135) is communicated with the water inlet pipe (20).
10. The water-cooled radiator applied to medical equipment according to claim 1, characterized in that the water-cooled radiator comprises a junction block (21), and the junction block (21) is arranged at the end of the water inlet pipe (20) and/or the end of the water return pipe (30).
11. A manufacturing method of a water-cooling radiator applied to medical equipment is characterized by comprising the following steps:
symmetrical radiating grooves and communicating grooves are respectively processed on the inner side surfaces of the first radiating plate (11) and the second radiating plate (12);
the heat dissipation grooves and the communication grooves of the first heat dissipation plate (11) and the second heat dissipation plate (12) are opposite to each other, and the first heat dissipation plate (11) and the second heat dissipation plate (12) are connected in a splicing and brazing mode, so that a heat dissipation flow channel (13) is formed between the first heat dissipation plate (11) and the second heat dissipation plate (12);
and a water inlet pipe (20) and a water return pipe (30) are arranged on the first heat dissipation plate (11) and/or the second heat dissipation plate (12), and the water inlet pipe (20) and the water return pipe (30) are respectively communicated with the heat dissipation flow channel (13).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010285372.9A CN111372431A (en) | 2020-04-13 | 2020-04-13 | Water-cooling radiator applied to medical equipment and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010285372.9A CN111372431A (en) | 2020-04-13 | 2020-04-13 | Water-cooling radiator applied to medical equipment and manufacturing method thereof |
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| CN111372431A true CN111372431A (en) | 2020-07-03 |
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| CN202010285372.9A Pending CN111372431A (en) | 2020-04-13 | 2020-04-13 | Water-cooling radiator applied to medical equipment and manufacturing method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202354002U (en) * | 2011-10-27 | 2012-07-25 | 株洲市众瑞传热技术有限责任公司 | Water cooling radiator with uniform thermal field |
| CN205403539U (en) * | 2016-03-10 | 2016-07-27 | 李山山 | Novel cooler |
| CN106774740A (en) * | 2016-12-20 | 2017-05-31 | 深圳市迅凌科技有限公司 | Board-like water-cooled graphic card radiator |
| CN107256075A (en) * | 2017-08-23 | 2017-10-17 | 湖南智热技术股份有限公司 | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink |
| CN107329555A (en) * | 2017-08-23 | 2017-11-07 | 湖南智热技术股份有限公司 | Soldering formula CPU water-filled radiators |
| CN107975416A (en) * | 2017-12-28 | 2018-05-01 | 南京吉茂汽车零件有限公司 | A kind of full aluminum radiator radiator of automobile |
| CN211457869U (en) * | 2020-04-13 | 2020-09-08 | 上海联影医疗科技有限公司 | Water-cooling radiator applied to medical equipment |
-
2020
- 2020-04-13 CN CN202010285372.9A patent/CN111372431A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202354002U (en) * | 2011-10-27 | 2012-07-25 | 株洲市众瑞传热技术有限责任公司 | Water cooling radiator with uniform thermal field |
| CN205403539U (en) * | 2016-03-10 | 2016-07-27 | 李山山 | Novel cooler |
| CN106774740A (en) * | 2016-12-20 | 2017-05-31 | 深圳市迅凌科技有限公司 | Board-like water-cooled graphic card radiator |
| CN107256075A (en) * | 2017-08-23 | 2017-10-17 | 湖南智热技术股份有限公司 | Soldering formula CPU liquid cooling heat radiators with internal memory heat sink |
| CN107329555A (en) * | 2017-08-23 | 2017-11-07 | 湖南智热技术股份有限公司 | Soldering formula CPU water-filled radiators |
| CN107975416A (en) * | 2017-12-28 | 2018-05-01 | 南京吉茂汽车零件有限公司 | A kind of full aluminum radiator radiator of automobile |
| CN211457869U (en) * | 2020-04-13 | 2020-09-08 | 上海联影医疗科技有限公司 | Water-cooling radiator applied to medical equipment |
Non-Patent Citations (1)
| Title |
|---|
| 刘孝丽: "基于绿色设计理论与方法的Cu-Al接头设计研究", 《CNKI优秀硕士学位论文》, 15 October 2012 (2012-10-15), pages 1 - 53 * |
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