JP6845401B2 - Cooling device and a cooling system equipped with the cooling device - Google Patents

Description

The present invention relates to a cooling device used for cooling a heating element such as an electronic device and a cooling system including the cooling device.

In a data center or the like in which a large number of electronic devices are arranged in a room, the entire electronic device is often cooled by a method such as cooling the room by air cooling. In data centers, etc., the amount of heat (heat energy) emitted from electronic devices is enormous, and as the data processing capacity improves, the amount of heat generated from electronic devices increases, so the cooling efficiency of electronic devices can be improved. It has become a challenge.

Therefore, attempts have been made to cool electronic devices by water cooling instead of air cooling, and it has been confirmed that the effect is high. As a system for cooling electronic devices by water cooling, for example, as shown in FIGS. 8A and 8B, heat receiving surface 2 made of copper, for example, having a heat receiving surface 2 on the upper side of the electronic component mounting substrate 1 which is a heating element. A cooling system has been proposed in which a plate (cold plate) 3 (3a, 3b, 3c) is provided to cool the electronic component mounting substrate 1.

In this system, the heat receiving plate 3 is provided with a refrigerant passage 4 (hatched portion, see) as shown in FIG. 9, and the refrigerant passage 4 is provided with a refrigerant such as a chiller 7 shown in FIG. The structure is such that the cooler is cooled through a refrigerant such as water (usually water, which is referred to as water in the following description). In FIG. 8, reference numeral 5 (hatched portion, see) indicates a refrigerant flow pipe, and reference numeral 6 indicates a circulation pump.

Jikkenhei 6-6957 Japanese Unexamined Patent Publication No. 2010-212533 JP-A-2017-33267 Japanese Unexamined Patent Publication No. 2003-179375

However, in the cooling system as shown in FIG. 8 formed by providing the water-cooled heat receiving plate 3 as shown in FIG. 9, water is passed through the refrigerant passage 4 provided on almost the entire surface of the heat receiving plate 3. In addition, there is a problem that the cooling device having the heat receiving plate 3 becomes heavy. Further, in order to pass water through the long refrigerant passages 4 arranged in a meandering shape, for example, a large power for sending water by a circulation pump 6 is required, which causes a problem of large size and high cost of the cooling system. there were. Above all, in a cooling system having a heat receiving plate 3 to which a water cooling method is applied, when water leaks in a water channel including a refrigerant passage 4, if the water adheres to an electronic device, a short circuit accident or a system There was a problem that enormous damage such as suspension could be considered.

In addition, in order to keep the in-plane temperature of the heat receiving plate 3 uniform and improve the cooling efficiency, a technique such as forming a very thin groove called a microchannel in the heat receiving plate 3 or providing a collision jet configuration. Improvements have also been attempted, but in order to make such technical improvements, there arises a problem that the configuration becomes complicated and the cost increases accordingly.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a safe and easy-to-use cooling device and the cooling device, which are lightweight, inexpensive, and have extremely low risk of water leakage. To provide a cooling system.

In order to achieve the above object, the present invention is a means for solving the problem with the following configuration. That is, the cooling device of the first invention has a heat receiving plate having a heat receiving surface for receiving heat from a heating element, and a refrigerant flowing section provided with a refrigerant flow passage through which a liquid refrigerant flows. Is provided next to the heat receiving plate or close to the edge of the heat receiving plate, and the heat receiving plate has a portion of most of one or more heat pipes along the heat receiving surface of the heat receiving plate. The most of the region portions arranged along the heat receiving surface of the heat pipe have interval-arranged passage portions in which a plurality of passages through which the hydraulic fluid flows are arranged with each other. A heat pipe provided in almost the entire area of the plate surface along the heat receiving surface of the heat receiving plate, and at least one end side of both ends of the heat pipe is formed as a protruding portion protruding from the heat receiving plate to the outside. The protruding portion directly protrudes from the heat receiving plate through the proximity portion between the heat receiving plate and the refrigerant flow portion from the heat receiving plate, and passes through the proximity portion between the heat receiving plate and the refrigerant flow portion. The heat pipe is passed through the refrigerant flow section, and the refrigerant flow passage of the refrigerant flow section linearly crosses the protruding portion of the heat pipe protruding from the heat receiving plate. with flow passage and formed to aspects sandwiching from both sides of the I the side on the opposite side, the coolant cooling passage forms a substantially U-shaped folded path folded back in the longitudinal direction central portion of the refrigerant flow passage The heat pipes at the protruding portions are sandwiched by the surfaces of the folded passages facing each other , and the heat pipes are thermally connected to the refrigerant flow section so that the refrigerant flow section and the heat receiving plate are directly connected to each other. Alternatively, it is formed as an integral part coupled via the heat pipe, and the heat of the heating element is transferred to the heat pipe via the heat receiving surface of the heat receiving plate, and the heat is transferred to the heat pipe of the refrigerant flow unit. A means for solving the problem is provided by a configuration in which the heating element is cooled by being cooled by the liquid refrigerant flowing through the refrigerant flow passage from both sides of the heat pipe by the refrigerant flow passage. ..

Further, in the cooling device of the second invention, in addition to the configuration of the first invention, the refrigerant flow portion includes a perforated plate member in which a plurality of through holes are juxtaposed along the plate surface direction of the plate-shaped member. has the refrigerant flow passage multi Anaban member is bent into a substantially U-shape by the through-hole of the multi Anaban member is formed in the folding passage of substantially U-shaped, the liquid refrigerant in the refrigerant flow passage It is characterized in that the heat pipe at the portion of the heat pipe protruding toward the refrigerant flow portion side by being circulated is sandwiched from both sides by the refrigerant flow passage and cooled by the liquid refrigerant. ..

Further, in the cooling device of the third invention, in addition to the configuration of the first or second invention, the heat receiving surface of the heat receiving plate is formed on the surface of the heat receiving plate, and the back surface side opposite to the heat receiving plate is formed. A heat pipe holding plate is provided on the back surface of the heat pipe holding plate and the heat pipe holding plate, and the heat pipe is sandwiched and arranged at the distance between the heat pipe holding plate and the heat receiving plate.

Further, in the cooling device of the fourth invention, in addition to the configuration of any one of the first to third inventions, a groove for arranging a heat pipe is formed in the heat receiving plate, and the groove is formed with the groove. It is characterized in that a heat pipe is arranged. Further, in the cooling device of the fifth invention, in addition to the configuration of any one of the first to third inventions, a hole for arranging a heat pipe is formed in the heat receiving plate, and the hole is formed with the hole. It is characterized in that a heat pipe is arranged.

Further, in the cooling device of the sixth invention, in addition to the configuration of any one of the first to fifth inventions, more than 70% of the total length of the heat pipe is arranged on the heat receiving plate and the remaining length. Is arranged in the refrigerant flow section.

Further, in the cooling device of the seventh invention, in addition to the configuration of any one of the first to sixth inventions, the heat pipe is formed into a flat shape having a substantially elliptical cross section or a substantially rectangular cross section, and the flat shape is formed. The heat pipe is arranged so that the major axis direction of the shape is substantially parallel to the surface direction of the heat receiving plate.

Further, the cooling system of the eighth invention includes the cooling device of any one of the first to seventh inventions, and cools the refrigerant to be circulated in the refrigerant flow section of the cooling device to the outside of the cooling device. It is characterized in that the refrigerant cooling device for the purpose is thermally connected.

The cooling device of the present invention has a configuration in which a heat receiving plate having a heat receiving surface for receiving heat from a heating element is provided with a heat pipe along the plate surface of the heat receiving plate, and the heat pipe is provided with a heat receiving function. It is characterized by having a heat receiving plate that has been provided. Since the inside of the heat pipe contains a small amount of hydraulic fluid but is almost hollow, the heat receiving plate does not become heavy as in the case of providing a water pipe on the heat receiving plate as shown in the conventional example, and the weight of the cooling device can be reduced. It is possible. Therefore, even when it is assumed that the cooling device is applied to a server or the like of a data center or the like, the weight of the cooling device can be reduced to reduce the cost of incidental equipment or building structure.

Further, in the cooling device of the present invention, since the heat receiving plate is not provided with a water pipe or the like, there is almost no concern about leakage of water or the like, and even if the hydraulic fluid of the heat pipe leaks, unlike the leakage from the water pipe or the like. Damage can be minimized.

Further, unlike the cooling device using a water pipe, the cooling device of the present invention does not require a large power for sending water by a pump or the like, and can make the system lighter, lower cost, and save energy. it can. In addition, it is possible to reduce deterioration of the water pipe or the like due to erosion corrosion caused by sending water to the water pipe by a pump or the like, high long-term reliability, and almost maintenance-free on the heat receiving plate side.

Then, in the present invention, one end side or both ends side of the heat pipe protruding from the heat receiving plate is thermally connected to the refrigerant flow passage next to the heat receiving plate or close to the end edge portion of the heat receiving plate, and the heat pipe ( By cooling the heat of the heating element received by the heat pipe having the heat receiving function as described above with the liquid refrigerant flowing through the refrigerant flow passage, the heating element can be cooled quickly. Refrigerant is circulated through the refrigerant flow passage, but unlike the case where water is passed through a water pipe laid in almost the entire area of the plate surface of the heat receiving plate as in the conventional example, one end side of the heat pipe or Since the refrigerant may be circulated to cool both ends, a large power source is not required, weight reduction is possible, and pipeline deterioration due to erosion corrosion or the like is extremely small.

Furthermore, the cooling device of the present invention, since the cold medium circulating unit the heat receiving plate forms an integral part coupled directly or via the heat pipes can easily be handled.

The cooling system of the present invention is provided with an excellent cooling device, and by thermally connecting a refrigerant cooling device for cooling the refrigerant to be distributed to the refrigerant flow section of the cooling device to the outside of the cooling device. With a simple configuration, a heating element such as an electronic device can be cooled quickly and satisfactorily, and a lightweight and inexpensive cooling system can be constructed.

Further, in the present invention, by arranging 70% or more of the total length of the heat pipe of the cooling device on the heat receiving plate and arranging the remaining length on the refrigerant flow section, the length of the heat pipe arranged on the heat receiving plate is provided. By increasing the ratio of the heat pipes, it is possible to efficiently cool the cooling device, and it is possible to further reduce the weight of the cooling device and the weight of the cooling system. In addition, the power cost required for the cooling system can be significantly reduced.

Further, in the present invention, the heat pipe of the cooling device is formed into a flat shape having a substantially elliptical shape or a substantially rectangular cross section, and the heat pipe is formed so that the major axis direction of the flat shape is substantially parallel to the surface direction of the heat receiving plate. By arranging the above, a wide thermal joint surface between the heat receiving plate and the heat pipe can be formed, efficient cooling can be performed, and the thickness of the cooling device can be reduced.

Further, in the present invention, a heat pipe holding plate is provided on the back surface side of the heat receiving plate of the cooling device opposite to the heat receiving surface, with a gap between the heat pipe holding plate and the heat receiving plate. By sandwiching and arranging the heat pipes in the heat receiving plate, the cooling device can be formed very easily by sandwiching the heat pipes in the heat receiving plate, and further cost reduction can be achieved.

Further, in the present invention, a groove for arranging the heat pipe to the heat receiving plate of the cooling device is formed, or disposing the heat pipe to the groove, for arranging the heat pipe before Symbol receiving plate hole was formed to facilitate the arrangement of the heat pipe by or arranged the heat pipe to the hole can be formed very easily cooling device in this configuration.

Further, in the present invention, the refrigerant flow portion of the cooling device has a perforated plate member in which a plurality of through holes are formed side by side along the plate surface direction of the plate-shaped member, and the perforated plate member has a substantially U shape. is a by the through-hole of the bent and multi Anaban member to that the refrigerant flow passage is formed in the folded path of the substantially U-shaped, the refrigerant liquid to the through hole of the cold multi Anaban member By forming the structure in which the portion of the heat pipe protruding toward the refrigerant flow portion side is cooled by circulating the heat pipe, a cooling device can be formed very easily using the perforated plate member, and the through hole of the perforated plate member can be formed. A liquid refrigerant can be circulated to the heat pipe to efficiently cool the heat pipe.

It is a schematic explanatory view (a) explaining the plane structure in 1st Example of the cooling device which concerns on this invention, the side view (b) of the cooling device, and the cross-sectional view (c) of AA'. It is explanatory drawing for demonstrating the refrigerant flow part in the cooling apparatus of 1st Example. It is a schematic explanatory view (a) explaining the plane structure in the 2nd Example of the cooling device which concerns on this invention, the side view (b) of the cooling device, and the cross-sectional view (c) of AA'. It is explanatory drawing for demonstrating the refrigerant flow part in 3rd Example of the cooling apparatus which concerns on this invention. It is a top view which shows typically the 4th Example of the cooling apparatus which concerns on this invention. It is a side view which shows typically the state example which provided the 5th Example of the cooling apparatus which concerns on this invention on the electronic component of the electronic component mounting substrate. It is a perspective view which shows typically the structural example of the heat receiving plate in another Example of the cooling apparatus which concerns on this invention. It is a schematic side view (a) and plan view (b) for demonstrating an example of a conventional cooling system. It is a top view which shows typically the structure of the cooling plate provided in the cooling system shown in FIG.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the description of this embodiment, the same name parts as those of the conventional example are designated by the same reference numerals, and the duplicated description thereof will be omitted or simplified.

FIG. 1A schematically shows an explanatory diagram illustrating a planar configuration of a first embodiment of the cooling device according to the present invention. As shown in the figure, the cooling device of the first embodiment has, for example, a copper flat plate-shaped heat receiving plate having a heat receiving surface 2 that receives heat from a heating element (electronic component mounting substrate 1 or the like shown in FIG. 8). 3 and a refrigerant flow section 9 provided with a refrigerant flow path 8 through which a liquid refrigerant flows, and the refrigerant flow section 9 is provided close to (for example, in close contact with) the heat receiving plate 3. ing. As shown in FIG. 1B, the refrigerant flow unit 9 is formed by having a plate member 10 made of, for example, an aluminum alloy, which is arranged above and below the plate member 10 at intervals from each other. Is folded back and arranged at the portion C in FIG. 1 (a).

Note that FIG. 1A shows the heat receiving plate 3 through the heat receiving plate 3, and the heat receiving plate 3 has a heat pipe along the plate surface on the back side of the heat receiving plate 3 over almost the entire region of the heat receiving plate 3. 11 (see the shaded area in the figure) is laid and arranged, and at least one end side of the heat pipe 11 protrudes from the heat receiving plate 3. Then, the protruding portion is thermally connected is sandwiched from above and below the plate member 10 of the refrigerant flow portion 9 to the refrigerant flow portion 9, the cooling device, refrigerant circulating unit 9 and the heat receiving plate 3 and a heat pipe 11 It is an integral part that is connected via. Since the plate member 10 forming the refrigerant flow section 9 is not transparent, the heat pipe 11 cannot be seen when the refrigerant flow section 9 is viewed from above, but the heat pipe 11 is arranged in the refrigerant flow section 9 for the sake of clarity. The heat pipe 11 provided (sandwiched between the plate members 10) is shown by a solid line.

In this embodiment, 70% or more of the total length of the heat pipe 11 is arranged on the heat receiving plate 3, and the remaining length is arranged on the refrigerant flow section 9. Further, as shown in FIG. 1C, the heat pipe 11 is formed in a flat shape having a substantially elliptical shape or a substantially rectangular cross section, and the major axis direction of the flat shape is substantially parallel to the surface direction of the heat receiving plate 3. The heat pipe 11 is arranged so as to be. On the back surface side of the heat receiving plate 3 opposite to the heat receiving surface 2, for example, a copper flat plate-shaped heat pipe holding plate 13 is provided via a space between the back surface and the heat pipe holding plate 13 and the heat receiving plate 3. The heat pipes 11 are sandwiched and arranged at the above intervals.

Both the heat receiving plate 3 and the heat pipe holding plate 13 are formed of, for example, a copper plate having a thickness of about 1 mm, and the plate member 10 forming the refrigerant flow portion 9 is also a plate having a thickness of about 1 mm. Is about 2 mm, the thickness of the cooling device is about 4 mm, which is very thin. When the heat receiving plate 3 and the heat pipe holding plate 13 are made of copper and the plate member 10 is made of an aluminum alloy, the contact surface between the heat receiving plate 3 and the heat pipe holding plate 13 and the plate member 10 is appropriately plated with nickel or the like. There is.

Further, in the plate member 10 forming the refrigerant flow section 9, the refrigerant flow path 8 formed by the pipeline 14 extends in a direction crossing the arrangement direction of the heat pipe 11 in a manner as shown in FIG. , It is folded back on the C side of the figure and arranged in a U shape. External pipelines (for example, the refrigerant flow pipe 5 shown in FIG. 8) for introducing and deriving the refrigerant are connected to one end side and the other end side of the conduit 14 forming the refrigerant flow passage 8, respectively. , A refrigerant (for example, water) circulates as shown by the arrow in FIG. 1 (a). Then, in the cooling device of the present embodiment, the heat of the heating element is transferred to the heat pipe 11 via the heat receiving surface 2 of the heat receiving plate 3, and the heat is cooled by the refrigerant flowing through the refrigerant flow unit 9. The heating element is configured to be cooled by the above.

The cooling device of this embodiment is configured as described above, and a cooling system is provided by providing a refrigerant cooler such as a chiller 7 for cooling the refrigerant to be distributed to the refrigerant flow section of the cooling device outside the cooling device. For example, the refrigerant derived from the chiller 7 or the like by driving the circulation pump 6 as shown in FIG. 8 is introduced into the refrigerant flow passage 8 via the refrigerant flow pipe 5, and the refrigerant and heat are introduced. The refrigerant warmed by heat exchange with the end of the pipe 11 is led out through the refrigerant flow passage 8 and sent to the chiller 7 or the like, cooled by the chiller 7 or the like, and sent to the refrigerant flow passage 8 again. The heating element such as the electronic component mounting substrate 1 is repeatedly cooled.

As described above, in this embodiment as well, the refrigerant from the chiller 7 and the like is circulated through the refrigerant flow passage 8, but the refrigerant flow passage 8 is different from the conventional refrigerant passage 4 shown in FIG. It is not in a state of being laid over the entire surface of the heat receiving plate 3 while bypassing, but the refrigerant can be circulated even with a small amount of power because the direction is changed only once in the refrigerant flow section 9.

Next, a second embodiment of the cooling device according to the present invention will be described. In each of the following examples including the second embodiment, the same name as that of the first embodiment is designated by the same reference numerals, and the duplicated description thereof will be omitted or simplified.

FIG. 3 (a) schematically shows an explanatory view illustrating a planar configuration of the cooling device of the second embodiment, and FIG. 3 (b) shows a side view of the cooling device in FIG. 3 (c). ) Show a cross-sectional view taken along the line AA'of FIG. 3A. As shown in these figures, in the cooling device of the second embodiment, the configuration of the heat receiving plate 3 side is almost the same as that of the first embodiment, and in the second embodiment, the refrigerant flow unit 9 side is configured. The configuration is different from that of the first embodiment.

Specifically, the refrigerant flow section 9 in the second embodiment exhibits a tubular shape (duct shape) in which a refrigerant flow path 8 through which liquid refrigerant flows flows in a direction crossing the arrangement direction of the heat pipe 11 is formed. As shown by the arrow in FIG. 3A, the refrigerant flows from one end side to the other end side of the refrigerant flow passage 8. Both the refrigerant introduction section and the refrigerant lead-out section of the refrigerant flow passage 8 have reduced diameters, and provide an external pipeline (for example, the refrigerant flow pipe 5 shown in FIG. 8) for introducing and leading out the refrigerant. It is formed so that it can be easily connected. Further, the connection portion between the refrigerant flow unit 9 and the heat pipe 11 (see S in FIG. 3C) is sealed so that the refrigerant such as water does not leak.

In the second embodiment, the refrigerant flow passage 8 is short only by flowing from one end side to the other end side in the refrigerant flow section 9, and the refrigerant can be circulated even with a small amount of power, and has the same effect as that of the first embodiment. Can be played.

Next, a third embodiment of the cooling device according to the present invention will be described. In the cooling device of the third embodiment, the configuration of the heat receiving plate 3 side is substantially the same as that of the first embodiment, and in the third embodiment, the configuration of the refrigerant flow unit 9 side is different from that of the first embodiment. It has a structure. Specifically, as shown in FIG. 4, in the third embodiment, the plate member 10 forming the refrigerant flow portion 9 is formed with a plurality of through holes 15 arranged side by side along the plate surface direction of the plate-shaped member. It is formed of the perforated plate member 16 formed by the perforated plate member 16, and the portion of the heat pipe 11 protruding toward the refrigerant flow portion 9 side is cooled by flowing a liquid refrigerant through the through hole 15 of the perforated plate member 16. ing.

Cap members 17 are provided on one end side and the other end side of the perforated plate member 16, respectively, and the cap member 17 and the perforated plate member 16 are provided so that the refrigerant does not leak between the cap member 17 and the perforated plate member 16. Is sealed. The tip side of the cap member 17 has a reduced diameter, and is formed so that an external pipeline (for example, the refrigerant flow pipe 5 shown in FIG. 8) for introducing or deriving the refrigerant can be easily connected.

Next, a fourth embodiment of the cooling device according to the present invention will be described. In the cooling device of the fourth embodiment, as shown in FIG. 5, one heat pipe 11 is arranged on the heat receiving plate 3 in a serpentine manner, and one end side 20 of the heat pipe 11 is omitted in the refrigerant distribution unit 9. It is bent at a right angle so as to extend in the longitudinal direction of the refrigerant flow section 9. The configuration of the refrigerant distribution unit 9 can be formed in the same manner as in any of the first to third embodiments, for example, but the configuration is omitted in FIG.

In the fourth embodiment, by bending one heat pipe 11, the heat pipe 11 can be more easily arranged on the heat receiving plate 3, and the production is easier. Further, for example, when the refrigerant flow unit 9 as applied in the second embodiment is provided to form the cooling device, the number of parts for sealing the heat pipe 11 and the refrigerant flow unit 9 can be reduced by that amount. However, the production becomes easier, and the worry of water leakage and the like can be further reduced.

Next, a fifth embodiment of the cooling device according to the present invention will be described. As shown in FIG. 6, the cooling device of the fifth embodiment is formed by providing the refrigerant flow section 9 not next to the heat receiving plate 3 but at the edge portion of the heat receiving plate 3, and the refrigerant flowing section 9 is provided. Is provided on the opposite side of the heat receiving surface 2 of the heat receiving plate 3, and is provided in contact with the heat pipe holding plate 13. In the example shown in FIG. 6, the electronic component 22 on the electronic component mounting substrate (board) 21 is a heating element, and the cooling device of the fifth embodiment is applied as a cooling device for cooling the electronic component 22. It is provided on the electronic component 22.

In the fifth embodiment, since the refrigerant flow section 9 is provided on the heat pipe holding plate 13 in this way, as shown in the figure, the end side of the heat pipe 11 is on the upper side of the figure. It is provided so as to be bent toward the refrigerant flow section 9 side, and is thermally connected to the refrigerant flow section 9.

When the cooling device is configured such that the refrigerant flow unit 9 is provided on the heat pipe holding plate 13 as in the fifth embodiment, the electronic component 22 as a heating element arranged on the substrate 21 is cooled. In addition, for example, even if another component arranged on the substrate 21 is provided close to the electronic component 22, the component can be provided in such a manner that the cooling device does not touch the component, and the cooling device is arranged. You can increase the degree of freedom. As a modification of the fifth embodiment, depending on the arrangement mode of the electronic component 22, as shown by the chain line in FIG. 6, the refrigerant flow unit 9 is provided on the heat receiving plate 3 side to thermally heat the heat pipe 11. You can also connect.

The present invention is not limited to the above embodiments, and various embodiments may be adopted. For example, in each of the above embodiments, the heat pipe 11 is sandwiched between the flat plate-shaped heat receiving plate 3 and the flat plate-shaped heat pipe holding plate 13, but the heat receiving plate 3 and the heat pipe holding plate 13 are sandwiched between the heat receiving plates 3 and the heat pipe holding plate 13. A groove 18 for arranging the heat pipe 11 as shown in FIG. 7A may be formed on the surface in contact with the heat pipe 11, and the heat pipe 11 may be arranged in the groove. ..

Further, in order to dispose the heat pipe 11 in the heat receiving plate 3, a heat pipe insertion hole 19 (hole) as shown in FIG. 7B is formed, and the heat pipe 11 is arranged in the heat pipe insertion hole 19. It may be set up.

Further, if the heat receiving plate 3 and the refrigerant flow portion 9 are arranged in close proximity to each other, a gap can be provided between the heat receiving plate 3 and the refrigerant flow portion 9, and the heat receiving plate 3 and the refrigerant flow portion 9 can be formed with a gap between them. A large interval S may be provided between them.

Further, in each of the above embodiments, 70% or more of the total length of the heat pipe 11 is arranged on the heat receiving plate 3, and the remaining length is arranged on the refrigerant flow section 9. However, the heat receiving plate of the heat pipe 11 is arranged. The arrangement ratio to 3 is not particularly limited and is appropriately set.

Further, in each of the above embodiments, the heat pipe 11 is formed in a flat shape having a substantially elliptical shape or a substantially rectangular cross section, but the heat pipe 11 is not necessarily formed in a flat shape having a substantially elliptical shape or a substantially rectangular cross section. It is not always formed, and may have other shapes.

Further, the shape and material of the heat receiving plate 3 and the refrigerant flow unit 9 are appropriately set. For example, the planar shape of the heat receiving plate 3 may be made into a circular shape, an elliptical shape, or a more complicated shape. You can also. Even when the shape of the heat receiving plate 3 is complicated, for example, as in the fourth embodiment, if one heat pipe 11 is bent to form a pattern corresponding to the shape of the heat receiving plate 3, the pattern can be formed. It is also possible to mass-produce the cooling device by providing the heat pipe 11 and the heat receiving plate 3 of the above.

Since the cooling device and the cooling system of the present invention can cool the heating element efficiently with a simple structure and are lightweight, they can be used for cooling electronic parts and the like.

1 Electronic component mounting board 2 Heat receiving surface 3 Heat receiving plate 8 Refrigerant flow path 9 Refrigerant flow part 10 Plate member 11 Heat pipe 13 Heat pipe holding plate 14 Pipe line 15 Through hole 16 Perforated plate member 18 Groove 19 hole

Claims (8)

It has a heat receiving plate having a heat receiving surface for receiving heat from a heating element, and a refrigerant flow section having a refrigerant flow path through which a liquid refrigerant flows, and the refrigerant flow section is next to the heat receiving plate or on the heat receiving plate. Provided close to the edge portion, the heat receiving plate is provided with most of the region portions of one or more heat pipes along the heat receiving surface of the heat receiving plate, and the heat receiving of the heat pipe. Most of the region portions arranged along the surface have interval-arranged passage portions in which a plurality of passages through which the hydraulic fluid flows are arranged with intervals from each other, and the plate surface of the heat-receiving plate along the heat-receiving surface. The heat pipe provided in almost the entire region of the heat receiving plate and arranged on the heat receiving plate has at least one end side of both ends as a protruding portion protruding from the heat receiving plate to the outside, and the protruding portion is formed from the heat receiving plate. It protrudes straight from the heat receiving plate through the close portion between the heat receiving plate and the refrigerant flow portion, and is passed through the refrigerant flow portion through the close portion between the heat receiving plate and the refrigerant flow portion, and is passed through the refrigerant flow portion. The refrigerant flow passage of the heat pipe extends straight across the protruding portion of the heat pipe protruding from the heat receiving plate, and the heat pipe at the protruding portion is crossed from both sides of the heat pipe on one side thereof and on the opposite side. with flow passage and formed to embodiments for clamping, the coolant cooling passages wherein the opposing surfaces of said folded path forms a substantially U-shaped folded path folded back in the longitudinal direction central portion of the refrigerant flow passage It said heat pipe at the site protrusion are clamped, integral member the heat pipe is thermally connected to the refrigerant flow section and the heat receiving plate and the refrigerant flow portion bonded directly or via the heat pipe The heat of the heating element is transferred to the heat pipe through the heat receiving surface of the heat receiving plate, and the heat is transferred to both sides of the heat pipe by the refrigerant flow passage of the refrigerant flow unit. A cooling device characterized in that the heating element is cooled by being cooled by a liquid refrigerant flowing through the refrigerant flow passage. The refrigerant flow portion has a perforated plate member in which a plurality of through holes are formed side by side along the plate surface direction of the plate-shaped member, and the perforated plate member is bent into a substantially U shape to form the perforated plate member. The refrigerant flow passage is formed into a substantially U-shaped folded-back passage by the through hole, and the liquid refrigerant is circulated through the refrigerant flow passage to allow the heat pipe at the protruding portion of the heat pipe to the refrigerant flow portion side. The cooling device according to claim 1, wherein the refrigerant is sandwiched from both sides by the refrigerant flow passage and cooled by the liquid refrigerant. The heat receiving surface of the heat receiving plate is formed on the front surface of the heat receiving plate, and a heat pipe holding plate is provided on the back surface side opposite to the heat receiving plate via a space between the back surface and the heat pipe holding plate, and the heat pipe holding plate and the heat receiving plate are provided. plate with claim 1 or claim 2 Symbol placement of the cooling device, characterized in that the heat pipe in the gap are arranged is sandwiched in. The method according to any one of claims 1 to 3 , wherein a groove for arranging the heat pipe is formed in the heat receiving plate, and the heat pipe is arranged in the groove. Cooling system. The method according to any one of claims 1 to 3 , wherein a hole for arranging the heat pipe is formed in the heat receiving plate, and the heat pipe is arranged in the hole. Cooling system. The method according to any one of claims 1 to 5 , wherein 70% or more of the total length of the heat pipe is arranged on the heat receiving plate and the remaining length is arranged on the refrigerant flow section. Cooling system. The heat pipe is formed in a flat shape having a substantially elliptical shape or a substantially rectangular cross section, and the heat pipe is arranged so that the major axis direction of the flat shape is substantially parallel to the surface direction of the heat receiving plate. The cooling device according to any one of claims 1 to 6, wherein the cooling device is characterized. A cooling device according to any one of claims 1 to 7 is provided, and a refrigerant cooling device for cooling the refrigerant to be distributed to the refrigerant flow section of the cooling device is thermally connected to the outside of the cooling device. A cooling system characterized by being present.

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