CN111367072A - Electromagnetic micro-mirror structure and preparation method thereof - Google Patents
Electromagnetic micro-mirror structure and preparation method thereof Download PDFInfo
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- CN111367072A CN111367072A CN202010329766.XA CN202010329766A CN111367072A CN 111367072 A CN111367072 A CN 111367072A CN 202010329766 A CN202010329766 A CN 202010329766A CN 111367072 A CN111367072 A CN 111367072A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
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Abstract
An electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer, a cover plate wafer, a cantilever beam structure, a ferromagnetic mirror surface, a wafer bonding interface layer, a getter film, a cavity, an electromagnet and a metal sheet; wherein: a wafer bonding interface layer is arranged between the nonmagnetic substrate wafer and the cover plate wafer, the ferromagnetic mirror surface is arranged on the cantilever beam structure, the air suction film is arranged in the cover plate wafer, and the electromagnet and the metal sheet are arranged outside the cover plate wafer. A preparation method of electromagnetic micro-mirror structure comprises forming a nonmagnetic substrate wafer from nonmagnetic materials such as silicon, gallium arsenide or glass; a cover wafer capable of passing optical signals; and the ferromagnetic mirror surface can reflect the optical signal after being subjected to polishing treatment. The invention has the advantages that: the warping angle of the magnetic mirror surface and the cantilever is influenced by the electromagnet, the direction of light rays shot through the cover plate wafer is changed, and transmission of optical signals is achieved. The magnetic mirror surface and the cantilever are controlled by electromagnetic drive, and the maximum deflection angle can reach 45 degrees.
Description
Technical Field
The invention relates to the field of micromirrors, in particular to an electromagnetic micromirror structure and a preparation method thereof.
Background
At present, the reflective mirror surface of the electrostatic MEMS micro-mirror is small and needs to work in a resonance state to realize a large rotation angle. The response speed of the micro-mirror is often slow due to the hysteresis effect of the thermal actuator of the electrothermal MEMS scanning mirror, and the electrothermal MEMS scanning mirror is not suitable for being widely applied to the technical field of laser scanning. Piezoelectric materials in the piezoelectric MEMS scanning micro-mirror are incompatible with the traditional integrated circuit process, and become a main obstacle of taking piezoelectric drive as a micro-mirror driving mode. In the existing electromagnetic scanning micro-mirror, the effective size of a reflecting surface is limited, so that the driving torque is reduced, and the micro-mirror cannot obtain a large deflection angle.
Disclosure of Invention
The present invention is directed to overcoming the above problems, and particularly to providing an electromagnetic micromirror structure and a method for fabricating the same.
The invention provides an electromagnetic micro-mirror structure, which is characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The nonmagnetic substrate wafer 1 is a hard material piece and can provide support for a micro-mirror structure.
The cover plate wafer 2 is a glass sheet assembly and can pass through optical signals.
The cantilever beam structure 3 is an elastic part.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A method for fabricating the electromagnetic micromirror structure of claim 1, wherein: the nonmagnetic substrate wafer 1: the micro-mirror structure is made of nonmagnetic materials such as silicon, gallium arsenide or glass and the like, and provides support for the micro-mirror structure; cover plate wafer 2: a glass sheet assembly capable of passing an optical signal; cantilever beam structure 3: can be made of non-magnetic silicon, gallium arsenide or glass, or magnetic iron, nickel, cobalt, stainless steel and their alloys; the ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5; the wafer bonding process bonds the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together to form an interface which can be in direct contact with each other and also can be made of metal including gold, aluminum, germanium and tin; a getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference.
The invention has the advantages that:
according to the electromagnetic micro-mirror structure and the preparation method, the warping angles of the magnetic mirror surface and the cantilever are influenced by the electromagnet, so that the direction of light rays shot through the cover plate wafer is changed, and the maximum deflection angle can reach 45 degrees. And the transmission of optical signals is realized. The magnetic mirror and the cantilever are controlled by electromagnetic drive, and the maximum deflection angle can reach 30 to 45 degrees.
Drawings
The invention is described in further detail below with reference to the following figures and embodiments:
FIG. 1 is a schematic structural diagram of an electromagnetic micro-mirror;
fig. 2 is a schematic diagram of an electromagnetic micromirror structure.
Detailed Description
Example 1
The invention provides an electromagnetic micro-mirror structure, which is characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The nonmagnetic substrate wafer 1 is a hard material piece and can provide support for a micro-mirror structure.
The cover plate wafer 2 is a glass sheet assembly and can pass through optical signals.
The cantilever beam structure 3 is an elastic part.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A method for fabricating the electromagnetic micromirror structure of claim 1, wherein: the nonmagnetic substrate wafer 1: the micro-mirror structure is made of nonmagnetic materials such as silicon, gallium arsenide or glass and the like, and provides support for the micro-mirror structure; cover plate wafer 2: a glass sheet assembly capable of passing an optical signal; cantilever beam structure 3: can be made of non-magnetic silicon, gallium arsenide or glass, or magnetic iron, nickel, cobalt, stainless steel and their alloys; the ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5; the wafer bonding process bonds the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together to form an interface which can be in direct contact with each other and also can be made of metal including gold, aluminum, germanium and tin; a getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference.
Example 2
The invention provides an electromagnetic micro-mirror structure, which is characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The cantilever beam structure 3 is an elastic part.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A method for fabricating the electromagnetic micromirror structure of claim 1, wherein: the nonmagnetic substrate wafer 1: the micro-mirror structure is made of nonmagnetic materials such as silicon, gallium arsenide or glass and the like, and provides support for the micro-mirror structure; cover plate wafer 2: a glass sheet assembly capable of passing an optical signal; cantilever beam structure 3: can be made of non-magnetic silicon, gallium arsenide or glass, or magnetic iron, nickel, cobalt, stainless steel and their alloys; the ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5; the wafer bonding process bonds the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together to form an interface which can be in direct contact with each other and also can be made of metal including gold, aluminum, germanium and tin; a getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
Example 3
The invention provides an electromagnetic micro-mirror structure, which is characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A method for fabricating the electromagnetic micromirror structure of claim 1, wherein: the nonmagnetic substrate wafer 1: the micro-mirror structure is made of nonmagnetic materials such as silicon, gallium arsenide or glass and the like, and provides support for the micro-mirror structure; cover plate wafer 2: a glass sheet assembly capable of passing an optical signal; cantilever beam structure 3: can be made of non-magnetic silicon, gallium arsenide or glass, or magnetic iron, nickel, cobalt, stainless steel and their alloys; the ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5; the wafer bonding process bonds the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together to form an interface which can be in direct contact with each other and also can be made of metal including gold, aluminum, germanium and tin; a getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference.
Claims (9)
1. An electromagnetic micro-mirror structure, comprising: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer (1), a cover plate wafer (2), a cantilever beam structure (3), a ferromagnetic mirror surface (4), a wafer bonding interface layer (5), a gas absorption film (6), a cavity (7), an electromagnet (8) and a metal sheet (9);
wherein: a wafer bonding interface layer (5) is arranged between the nonmagnetic substrate wafer (1) and the cover plate wafer (2), the cantilever beam structure (3) is connected with the nonmagnetic substrate wafer (1), the ferromagnetic mirror surface (4) is arranged on the cantilever beam structure (3), the air suction film (6) is arranged in the cover plate wafer (2), a cavity (7) is formed in the cover plate wafer (2), and the electromagnet (8) and the metal sheet (9) are arranged outside the cover plate wafer (2).
2. The electromagnetic micromirror structure of claim 1, wherein: the nonmagnetic substrate wafer (1) is a hard material piece and can provide support for a micro-mirror structure.
3. The electromagnetic micromirror structure of claim 1, wherein: the cover plate wafer (2) is a glass sheet assembly and can pass through optical signals.
4. The electromagnetic micromirror structure of claim 1, wherein: the cantilever beam structure (3) is an elastic piece.
5. The electromagnetic micromirror structure of claim 1, wherein: the wafer bonding interface layer (5) is an interface formed by bonding the cover plate wafer (2) and the nonmagnetic substrate wafer (1) together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
6. A method for fabricating the electromagnetic micromirror structure of claim 1, wherein: in the preparation method of the electromagnetic micro-mirror structure, the nonmagnetic substrate wafer (1) is made of nonmagnetic materials such as silicon, gallium arsenide or glass and the like, and provides support for the micro-mirror structure; a cover wafer (2) formed by a glass sheet assembly capable of passing an optical signal; the cantilever beam structure (3) can be made of nonmagnetic silicon, gallium arsenide or glass, and also can be made of magnetic iron, nickel, cobalt, stainless steel and alloy of the metals; the ferromagnetic mirror surface (4); can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
7. The method of claim 6, wherein: the wafer bonding interface layer (5); the wafer bonding process bonds the cover plate wafer (2) and the nonmagnetic substrate wafer (1) together to form an interface which can be in direct contact with each other and can also be made of metal comprising gold, aluminum, germanium and tin; a getter film (6); in the bonded cavity (7) for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
8. The method of claim 6, wherein: said cavity (7): etching grooves in the nonmagnetic substrate wafer (1) and the cover plate wafer (2) by using an etching method, and combining the grooves into a whole by using a wafer bonding process to form a vacuum cavity for protecting the micro-mirror structure; electromagnet (8): the electromagnet for driving the electromagnetic micro-mirror can change the warping angle of a cantilever beam (3) and a magnetic mirror surface (4) in the MEMS chip after the electromagnet works, and further change the angle of light rays shot through the glass wafer (2).
9. The method of claim 6, wherein: the metal sheets (9) are Mu metal sheets, the metal sheets used for shielding magnetic fields between the electromagnets (8) are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965238A (en) * | 2021-02-05 | 2021-06-15 | 西安知象光电科技有限公司 | Piezoelectric-driven vacuum sealing micro-mirror |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09138366A (en) * | 1995-11-15 | 1997-05-27 | Brother Ind Ltd | Optical scanner |
| JP2003202509A (en) * | 2001-10-09 | 2003-07-18 | Hitachi Maxell Ltd | Magnetic material, magnetostriction actuator and optical switch using magnetostriction actuator |
| JP2003311692A (en) * | 2002-04-24 | 2003-11-05 | Oki Sensor Device Corp | Mechanism device and magnetic driving type mechanism device |
| CN101497422A (en) * | 2009-01-20 | 2009-08-05 | 东南大学 | Low-temperature glass solder bonding and encapsulating method based on disc level glass micro-chamber |
| CN102241388A (en) * | 2011-05-18 | 2011-11-16 | 中国科学院上海微系统与信息技术研究所 | MEMS (micro electro mechanical system) wafer-level three-dimensional mixing integration packaging structure and method |
| CN103048784A (en) * | 2012-12-21 | 2013-04-17 | 无锡微奥科技有限公司 | Passively-driven MEMS (Micro Electro Mechanical Systems) optical switch and machining process |
| US20130278907A1 (en) * | 2010-04-28 | 2013-10-24 | Lemoptix Sa | Optical mems scanning micro-mirror with anti-speckle cover |
| CN104803340A (en) * | 2015-04-09 | 2015-07-29 | 上海新微技术研发中心有限公司 | Packaging structure and packaging method of MEMS optical chip based on silicon-glass bonding |
| DE102014216075A1 (en) * | 2014-08-13 | 2015-10-15 | Carl Zeiss Smt Gmbh | Mirror arrangement and optical system with such a mirror arrangement |
| CN106249402A (en) * | 2016-08-31 | 2016-12-21 | 常州创微电子机械科技有限公司 | A kind of one-dimensional micro mirror of Electromagnetic Drive |
| CN207986671U (en) * | 2017-10-30 | 2018-10-19 | 罕王微电子（辽宁）有限公司 | A kind of all standing getter wafer scale electronic component |
| CN208013399U (en) * | 2018-04-25 | 2018-10-26 | 重庆师范大学 | Plane NMR radio frequency coil assemblies |
| CN109761188A (en) * | 2018-12-25 | 2019-05-17 | 合肥芯福传感器技术有限公司 | A kind of wafer-level vacuum encapsulating method |
| CN110737088A (en) * | 2019-10-10 | 2020-01-31 | 贺思源 | External electromagnet flexible printed circuit board micro-mirror for large-angle laser scanning |
| CN212515215U (en) * | 2020-04-24 | 2021-02-09 | 罕王微电子（辽宁）有限公司 | Electromagnetic micro-mirror structure |
-
2020
- 2020-04-24 CN CN202010329766.XA patent/CN111367072A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09138366A (en) * | 1995-11-15 | 1997-05-27 | Brother Ind Ltd | Optical scanner |
| JP2003202509A (en) * | 2001-10-09 | 2003-07-18 | Hitachi Maxell Ltd | Magnetic material, magnetostriction actuator and optical switch using magnetostriction actuator |
| JP2003311692A (en) * | 2002-04-24 | 2003-11-05 | Oki Sensor Device Corp | Mechanism device and magnetic driving type mechanism device |
| CN101497422A (en) * | 2009-01-20 | 2009-08-05 | 东南大学 | Low-temperature glass solder bonding and encapsulating method based on disc level glass micro-chamber |
| US20130278907A1 (en) * | 2010-04-28 | 2013-10-24 | Lemoptix Sa | Optical mems scanning micro-mirror with anti-speckle cover |
| US20180210224A1 (en) * | 2010-04-28 | 2018-07-26 | Intel Corporation | Optical mems scanning micro-mirror with anti-speckle cover |
| CN102241388A (en) * | 2011-05-18 | 2011-11-16 | 中国科学院上海微系统与信息技术研究所 | MEMS (micro electro mechanical system) wafer-level three-dimensional mixing integration packaging structure and method |
| CN103048784A (en) * | 2012-12-21 | 2013-04-17 | 无锡微奥科技有限公司 | Passively-driven MEMS (Micro Electro Mechanical Systems) optical switch and machining process |
| DE102014216075A1 (en) * | 2014-08-13 | 2015-10-15 | Carl Zeiss Smt Gmbh | Mirror arrangement and optical system with such a mirror arrangement |
| CN104803340A (en) * | 2015-04-09 | 2015-07-29 | 上海新微技术研发中心有限公司 | Packaging structure and packaging method of MEMS optical chip based on silicon-glass bonding |
| CN106249402A (en) * | 2016-08-31 | 2016-12-21 | 常州创微电子机械科技有限公司 | A kind of one-dimensional micro mirror of Electromagnetic Drive |
| CN207986671U (en) * | 2017-10-30 | 2018-10-19 | 罕王微电子（辽宁）有限公司 | A kind of all standing getter wafer scale electronic component |
| CN208013399U (en) * | 2018-04-25 | 2018-10-26 | 重庆师范大学 | Plane NMR radio frequency coil assemblies |
| CN109761188A (en) * | 2018-12-25 | 2019-05-17 | 合肥芯福传感器技术有限公司 | A kind of wafer-level vacuum encapsulating method |
| CN110737088A (en) * | 2019-10-10 | 2020-01-31 | 贺思源 | External electromagnet flexible printed circuit board micro-mirror for large-angle laser scanning |
| CN212515215U (en) * | 2020-04-24 | 2021-02-09 | 罕王微电子（辽宁）有限公司 | Electromagnetic micro-mirror structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112965238A (en) * | 2021-02-05 | 2021-06-15 | 西安知象光电科技有限公司 | Piezoelectric-driven vacuum sealing micro-mirror |
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