CN212515215U - Electromagnetic micro-mirror structure - Google Patents
Electromagnetic micro-mirror structure Download PDFInfo
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- CN212515215U CN212515215U CN202020630475.XU CN202020630475U CN212515215U CN 212515215 U CN212515215 U CN 212515215U CN 202020630475 U CN202020630475 U CN 202020630475U CN 212515215 U CN212515215 U CN 212515215U
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Abstract
An electromagnetic micro-mirror structure, comprising: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer, a cover plate wafer, a cantilever beam structure, a ferromagnetic mirror surface, a wafer bonding interface layer, a gas absorption film, a cavity, an electromagnet and a metal sheet; wherein: the wafer bonding interface layer is arranged between the nonmagnetic substrate wafer and the cover plate wafer, the cantilever beam structure is connected with the nonmagnetic substrate wafer, the ferromagnetic mirror surface is arranged on the cantilever beam structure, the air suction film is arranged in the cover plate wafer, the cover plate wafer is internally provided with a cavity, and the electromagnet and the metal sheet are arranged outside the cover plate wafer. The utility model has the advantages that: electromagnetic type micro mirror structure, influence the warpage angle of magnetic mirror surface and cantilever through the electro-magnet, and then change the direction of the light of intaking through the apron wafer, the biggest deflection angle can reach 45 degrees. And the transmission of optical signals is realized. The magnetic mirror and the cantilever are controlled by electromagnetic drive, and the maximum deflection angle can reach 30 to 45 degrees.
Description
Technical Field
The utility model relates to a micro mirror structure field, in particular to electromagnetic type micro mirror structure
Background
At present, the reflective mirror surface of the electrostatic MEMS micro-mirror is small and needs to work in a resonance state to realize a large rotation angle. The response speed of the micro-mirror is often slow due to the hysteresis effect of the thermal actuator of the electrothermal MEMS scanning mirror, and the electrothermal MEMS scanning mirror is not suitable for being widely applied to the technical field of laser scanning. Piezoelectric materials in the piezoelectric MEMS scanning micro-mirror are incompatible with the traditional integrated circuit process, and become a main obstacle of taking piezoelectric drive as a micro-mirror driving mode. In the existing electromagnetic scanning micro-mirror, the effective size of a reflecting surface is limited, so that the driving torque is reduced, and the micro-mirror cannot obtain a large deflection angle.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to overcoming the above problems, and in particular to providing an electromagnetic micro mirror structure.
The utility model provides an electromagnetic type micro mirror structure, its characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The nonmagnetic substrate wafer 1 provides support for the micromirror structure.
The cover plate wafer 2 is a glass sheet assembly and can pass through optical signals.
The cantilever beam structure 3 is an elastic part structure.
Can be made of non-magnetic silicon, gallium arsenide or glass, or can be made of magnetic iron, nickel, cobalt, stainless steel and alloys of these metals.
The ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference. The magnetically driven MEMS micro-mirror chips are arranged in an array form, and can complete the angular deviation of more light rays. In a multi-micromirror array, adjacent magnetic fields are shielded from interference.
The utility model has the advantages that:
electromagnetic type micro mirror structure, influence the warpage angle of magnetic mirror surface and cantilever through the electro-magnet, and then change the direction of the light of intaking through the apron wafer, the biggest deflection angle can reach 45 degrees. And the transmission of optical signals is realized. The magnetic mirror and the cantilever are controlled by electromagnetic drive, and the maximum deflection angle can reach 30 to 45 degrees.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and embodiments:
FIG. 1 is a schematic structural diagram of an electromagnetic micro-mirror;
fig. 2 is a schematic diagram of an electromagnetic micromirror structure.
Detailed Description
Example 1
The utility model provides an electromagnetic type micro mirror structure, its characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The nonmagnetic substrate wafer 1 provides support for the micromirror structure.
The cover plate wafer 2 is a glass sheet assembly and can pass through optical signals.
The cantilever beam structure 3 is an elastic part structure.
Can be made of non-magnetic silicon, gallium arsenide or glass, or can be made of magnetic iron, nickel, cobalt, stainless steel and alloys of these metals.
The ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference. The magnetically driven MEMS micro-mirror chips are arranged in an array form, and can complete the angular deviation of more light rays. In a multi-micromirror array, adjacent magnetic fields are shielded from interference.
Example 2
The utility model provides an electromagnetic type micro mirror structure, its characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
Can be made of non-magnetic silicon, gallium arsenide or glass, or can be made of magnetic iron, nickel, cobalt, stainless steel and alloys of these metals.
The ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference. The magnetically driven MEMS micro-mirror chips are arranged in an array form, and can complete the angular deviation of more light rays. In a multi-micromirror array, adjacent magnetic fields are shielded from interference.
Example 3
The utility model provides an electromagnetic type micro mirror structure, its characterized in that: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer 1, a cover plate wafer 2, a cantilever beam structure 3, a ferromagnetic mirror surface 4, a wafer bonding interface layer 5, a gas absorption film 6, a cavity 7, an electromagnet 8 and a metal sheet 9;
wherein: a wafer bonding interface layer 5 is arranged between the nonmagnetic substrate wafer 1 and the cover plate wafer 2, the cantilever beam structure 3 is connected with the nonmagnetic substrate wafer 1, the ferromagnetic mirror surface 4 is arranged on the cantilever beam structure 3, the air suction film 6 is arranged in the cover plate wafer 2, a cavity 7 is arranged in the cover plate wafer 2, and the electromagnet 8 and the metal sheet 9 are arranged outside the cover plate wafer 2.
The cantilever beam structure 3 is an elastic part structure.
Can be made of non-magnetic silicon, gallium arsenide or glass, or can be made of magnetic iron, nickel, cobalt, stainless steel and alloys of these metals.
The ferromagnetic mirror surface 4; can be made of iron, nickel, cobalt, stainless steel and alloy of these metals, and can reflect optical signals after polishing treatment.
The wafer bonding interface layer 5 is an interface formed by bonding the cover plate wafer 2 and the nonmagnetic substrate wafer 1 together, can be in direct contact or is provided with an interlayer, and the interlayer can be a metal layer and comprises gold, aluminum, germanium and tin.
A getter film 6; in the bonded cavity 7, for absorbing gases, maintaining a vacuum, can consist of one or several metals or their oxidation.
The cavity 7 is as follows: etching grooves in the nonmagnetic substrate wafer 1 and the cover plate wafer 2 by using an etching method, and forming a vacuum cavity after integrating by using a wafer bonding process to protect the micro-mirror structure; and (3) an electromagnet 8: carry out the electro-magnet of driven to the electromagnetism micro-mirror, the electro-magnet work back can change the warpage angle of cantilever beam 3 and magnetic mirror surface 4 in the MEMS chip, and then changes the angle of the light of intaking through glass wafer 2.
The metal sheet 9 is a Mu metal sheet, the metal sheets used for shielding the magnetic field between the electromagnets 8 are made of molybdenum metal, and adjacent magnetic fields are shielded in the multi-micromirror array to prevent interference. The magnetically driven MEMS micro-mirror chips are arranged in an array form, and can complete the angular deviation of more light rays. In a multi-micromirror array, adjacent magnetic fields are shielded from interference.
Claims (5)
1. An electromagnetic micro-mirror structure, comprising: the electromagnetic micro-mirror structure comprises a nonmagnetic substrate wafer (1), a cover plate wafer (2), a cantilever beam structure (3), a ferromagnetic mirror surface (4), a wafer bonding interface layer (5), a gas absorption film (6), a cavity (7), an electromagnet (8) and a metal sheet (9);
wherein: a wafer bonding interface layer (5) is arranged between the nonmagnetic substrate wafer (1) and the cover plate wafer (2), the cantilever beam structure (3) is connected with the nonmagnetic substrate wafer (1), the ferromagnetic mirror surface (4) is arranged on the cantilever beam structure (3), the air suction film (6) is arranged in the cover plate wafer (2), a cavity (7) is formed in the cover plate wafer (2), and the electromagnet (8) and the metal sheet (9) are arranged outside the cover plate wafer (2).
2. The electromagnetic micromirror structure of claim 1, wherein: the nonmagnetic substrate wafer (1) is a hard material piece and can provide support for a micro-mirror structure.
3. The electromagnetic micromirror structure of claim 1, wherein: the cover plate wafer (2) is a glass sheet assembly and can pass through optical signals.
4. The electromagnetic micromirror structure of claim 1, wherein: the cantilever beam structure (3) is an elastic piece.
5. The electromagnetic micromirror structure of claim 1, wherein: the wafer bonding interface layer (5) is an interface for bonding the cover plate wafer (2) and the nonmagnetic substrate wafer (1) together, and can be in direct contact or have an interlayer between the cover plate wafer and the nonmagnetic substrate wafer.
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| CN202020630475.XU CN212515215U (en) | 2020-04-24 | 2020-04-24 | Electromagnetic micro-mirror structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111367072A (en) * | 2020-04-24 | 2020-07-03 | 罕王微电子（辽宁）有限公司 | Electromagnetic micro-mirror structure and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111367072A (en) * | 2020-04-24 | 2020-07-03 | 罕王微电子（辽宁）有限公司 | Electromagnetic micro-mirror structure and preparation method thereof |
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