CN111358128B - 钻石杀菌膜用匀膜一体机以及自洁净宝石级钻石制备方法 - Google Patents
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Abstract
本发明钻石杀菌膜用匀膜一体机以及自洁净宝石级钻石制备方法，由钻石卡头、智能旋转机构、加热系统、加热腔体，抽气装置、控制单元系统、机体支架构成。匀膜工艺如下：(1)放样：在钻饰卡头上固定抛光装置；(2)旋转：智能旋转机构上，对布满钻石的钻石卡头进行旋转工艺；(3)滴胶：采用滴定管，垂直于钻石卡头的上方滴定TiO2溶胶；(4)烘焙：在腔体内进行烘焙；(5)负压坚膜：在负压腔体内坚膜；(6)取样：待坚膜后，分别取出每颗钻石，进行下一步工艺流程。
Description
技术领域
本发明涉及宝石级钻石生产加工领域，具体涉及一种自洁净宝石级制备设备及方法。
背景技术
加工好的钻石色彩斑斓、晶莹剔透，深受人们喜爱。璀璨的钻石也非常昂贵，切工VG级、成色I级、净度SI2级的1.00克拉的裸钻价格在2万人民币以上。切工EX级、成色D级、净度IF级的2.00克拉的裸钻价格在10万人民币以上。
但是，佩戴一段时间，甚至只经过一周，钻石就会变得灰蒙蒙，看上去还不如玻璃。这是因为钻石具有很强的亲油性，佩戴一段时间后，钻石表面会有一层油污。一般化妆和做家务时，需要取下钻饰，放到首饰盒里保存。既使注意保存，钻石也需要经常清洗才能保持璀璨的光芒。目前，正确的保养方式是每隔两三个月将钻石首饰送专业珠宝店做一次保养，包括清洗、翻新。保养的经济和时间成本是一个钻石行业买卖双方的共同痛点，如果钻石具有自洁净功能，将解决这一难题。
发明内容
本发明要解决的技术问题提供一种钻石制备方法以及设备，解决宝石级钻石亲油性强，容易沾上油污，需要经常清洗的技术缺陷。
为了解决上述技术问题，本发明公开一种：钻石杀菌膜用匀膜一体机，其包括钻石卡头、旋转机构、滴定管、加热系统以及抽气负压系统；所述钻石卡头用于固定钻石，滴定管位于钻石卡头上方，钻石卡头由旋转机构带动转动，滴定管中设置有二氧化钛溶胶；加热系统包括一个加热腔，钻石卡头位于加热腔中；抽气负压系统连接加热腔用于给加热腔抽气。所述钻石卡头底部设置有卡槽，所述旋转机构包括电机以及旋转杆，旋转杆由电机带动转动，在旋转杆上设置有一个与之垂直的定位销，卡槽与定位销相配合从而将钻石头卡头固定在旋转杆上，电机位于加热腔外部。
进一步的，还包括一个多轴机械手以及取料机械手，多轴机械手用于夹持钻石并将钻石的任一切面旋转至水平朝上，取料机械手夹持钻石并将其在钻石卡头以及多轴机械手中往复平移运输，在钻石卡头中设置有多水平的且可以轴向移动的固定针用于固定钻石。
进一步的，所述多轴机械手包括第一机械臂、与第一机械臂连接的第二机械臂以及与第二机械臂连接的第三机械臂；所述第一机械臂与第二机械臂均可在竖直平面内转动，且两个竖直平面互相垂直；所述第三机械臂可沿轴向转动，在第三机械壁上设置有多个可沿轴向移动的固定针；所述取料机械手包括一个安装板，安装板可上下以及水平移动，在安装板上一个竖直的吸头以及多个可以轴向移动的且水平的固定针用于固定钻石。
此外，本发明还公开了一种自洁净宝石级钻石制备方法，包括如下步骤：
(1)磨切：磨或切出钻石本体的切面；
(2)匀膜：将薄膜溶胶液滴在一个切面上，切面高速旋转，液滴在离心力作用下向外飞溅，但是粘附在切面表面的液态膜，形成一层厚度均匀薄膜；
(3)烘焙：蒸发薄膜内的溶剂，牢固薄膜与切面；
(4)转动：转动钻石本体，使另一个切面水平；随后重复匀膜、烘焙和转动步骤，直至所有切面上都形成薄膜；
(5)抛光：修整薄膜的均匀度及切面间的轮廓。
进一步的，所述薄膜溶胶液为二氧化钛溶胶液体，烘焙的温度为60℃-120℃，时间为30s-120s。
进一步的，所述薄膜的厚度可使至少一种波长的紫外光在透光薄膜和对应的钻石本体切面表面的反射光形成相长干涉。
进一步的，薄膜的厚度为126.85nm、63.425nm、92.5nm或46.25nm。
本发明与现有技术相比具有以下优点：
干涉后的紫外线有利于将空气中的氧气变成臭氧，臭氧的强氧化作用可以杀灭细菌，而不影响钻石的观感。因为紫外线不在可见光波长范围内；自洁净的特点有利于钻石的佩戴，在化妆、做家务时，佩戴者不用刻意收起，这也降低了遗失的概率；自洁净的特点有利于延长钻石的保养周期，降低保养的时间成本。
附图说明
图1为本发明的结构示意图。
具体实施方式
以下结合附图对本发明的具体实施方式做具体说明。
如图1所示，本发明的钻石杀菌膜用匀膜一体机包括钻石卡头3、旋转机构、滴定管1、加热系统以及抽气负压系统。所述钻石卡头3用于固定钻石，滴定管1位于钻石卡头上方，钻石卡头由旋转机构带动转动，滴定管1中设置有二氧化钛溶胶，滴定管可水平移动，并对位置进行精准调节，从而使其位于钻石的对应位置。加热系统包括一个加热腔2、加热丝、陶瓷固定装置、PI温控装置构成，钻石卡头位于加热腔中，加热腔中内壁设置加热丝进行电加热，加热腔的上盖可自动进行闭合或者打开。抽气负压系统连接加热腔用于给加热腔抽气。其包括一个抽气管51以及负压风机52，抽气负压装置排出腔体内杂气体,同时,二氧化钛在负压系统内完成坚膜，采用负压装置，使得小分子H2O在低压情况下脱离溶胶，使得二氧化钛薄膜与金刚石结合力增强，达到150MPa。
钻石卡头底部设置有卡槽32，旋转机构包括电机42以及旋转杆43，旋转杆43由电机带动转动，在旋转杆43上设置有一个与之垂直的定位销41，卡槽与定位销相配合从而将钻石头卡头固定在旋转杆上，电机42位于加热腔外部。
本发明包括一个多轴机械手以及取料机械手，多轴机械手用于夹持钻石并将钻石的任一切面旋转至水平朝上，多轴机械手包括第一机械臂71、与第一机械臂连接的第二机械臂72以及与第二机械臂连接的第三机械臂73；所述第一机械臂与第二机械臂均可在竖直平面内转动，且两个竖直平面互相垂直；所述第三机械臂73可沿轴向转动，在第三机械壁上设置有多个可沿轴向移动的固定针74。
取料机械手夹持钻石并将其在钻石卡头以及多轴机械手中往复平移运输，其包括一个安装板61，安装板61可上下以及水平移动，可以通过两组丝杠实现，在此不再赘述。在安装板61上一个吸头63，以及多个可以轴向移动的且水平的固定针62用于固定钻石，吸头竖直设置，用于吸附钻石的水平切面。在钻石卡头中设置有多个水平的且可以轴向移动的固定针62用于固定钻石，固定针62包括多组，且不再同一条直线以及同意高度上，从而从多个方向对钻石进行固定。
此外，本发明还配置了智能控制系统，通过控制单元6实现旋转杆的转速控制以及机械手的作动。控制单元包括控制柜与触摸显示屏。本发明还包括一个支撑架8用于对各结构进行支撑。
此外，本发明还公开了一种采用上述设备钻石的方法，包括如下步骤。
(1)磨切：磨或切出钻石本体的所有切面；
(2)匀膜：将TiO2薄膜溶胶液滴在一个切面上，切面高速旋转，转速控制在4746rpm或者3626rpm；液滴在离心力作用下向外飞溅，但是粘附在切面表面的液态膜，形成一层厚度均匀薄膜；旋转时间控制在60S；
(3)烘焙：蒸发薄膜内的溶剂，牢固薄膜与切面；烘焙温度85℃，时间60s。
(4)转动：转动钻石本体，使另一个切面水平：随后重复匀膜、烘焙和转动步骤，直至所有切面上都形成薄膜；
(5)抛光：修整薄膜的均匀度及切面间的轮廓。
钻石表面的薄膜厚度，根据两次反射的光程差为紫外线波长的正整数倍而设计，可以使紫外线的一次反射和二次反射发生相长干涉。干涉后的紫外线光子作用到钻石表面时，由于大多数碳氢化合物对185nm波长的紫外光具有较强的吸收能力，吸收后分解为离子、游离态原子、受激分子和中子。用光敏作用清除油污，保持钻石的洁净。使185nm波长紫外线发生相干干涉的膜层厚度包括但不限于92.5nm和46.25nm。
空气中的臭氧吸收干涉前后波长253.7nm的紫外线，分解出活泼的原子氧，能使物体表面的碳和碳氢化合物分解为可挥发的二氧化碳和水蒸气逸出表面，清除黏附在钻石表面的碳和有机污染物。使253.7nm波长紫外线发生相干干涉的膜层厚度包括但不限于126.85nm和63.425nm。
Claims (2)
1.一种钻石杀菌膜用匀膜一体机，其特征在于：包括钻石卡头、旋转机构、滴定管、加热系统以及抽气负压系统；所述钻石卡头用于固定钻石，滴定管位于钻石卡头上方，钻石卡头由旋转机构带动转动，滴定管中设置有二氧化钛溶胶；加热系统包括一个加热腔，钻石卡头位于加热腔中；抽气负压系统连接加热腔用于给加热腔抽气；还包括一个多轴机械手以及取料机械手，多轴机械手用于夹持钻石并将钻石的任一切面旋转至水平朝上，取料机械手夹持钻石并将其在钻石卡头以及多轴机械手中往复平移运输，在钻石卡头中设置有多个水平的且可以轴向移动的固定针用于固定钻石；所述钻石卡头底部设置有卡槽，所述旋转机构包括电机以及旋转杆，旋转杆由电机带动转动，在旋转杆上设置有一个与之垂直的定位销，卡槽与定位销相配合从而将钻石卡头固定在旋转杆上，电机位于加热腔外部；所述多轴机械手包括第一机械臂、与第一机械臂连接的第二机械臂以及与第二机械臂连接的第三机械臂；所述第一机械臂与第二机械臂均可在竖直平面内转动，且两个竖直平面互相垂直；所述第三机械臂可沿轴向转动，在第三机械臂上设置有多个可沿轴向移动的固定针；所述取料机械手包括一个安装板，安装板可上下以及水平移动，在安装板上一个竖直的吸头以及多个可以轴向移动的且水平的固定针用于固定钻石。
2.一种自洁净宝石级钻石制备方法，采用如权利要求1所述的钻石杀菌膜用匀膜一体机，包括如下步骤：
（1）磨切：磨或切出钻石本体的切面；
（2）匀膜：将薄膜溶胶液滴在一个切面上，切面高速旋转，液滴在离心力作用下向外飞溅，但是粘附在切面表面的液态膜，形成一层厚度均匀薄膜；所述薄膜溶胶液为二氧化钛溶胶液体，烘焙的温度为60℃-120℃，时间为30s-120s；薄膜的厚度为126.85nm、63.425nm、92.5nm或46.25nm；
（3）烘焙：蒸发薄膜内的溶剂，牢固薄膜与切面；
（4）转动：转动钻石本体，使另一个切面水平；
随后重复匀膜、烘焙和转动步骤，直至所有切面上都形成薄膜；
（5）抛光：修整薄膜的均匀度及切面间的轮廓。
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