CN111354720A - Power module - Google Patents

Abstract

In order to overcome the problems that the inductance of the power module can be reduced by adopting a stacked arrangement mode in the prior art, but the occupied space is relatively large, and the volume of the power module is not beneficial to being reduced, the invention provides a power module so as to further reduce the volume of the power module and realize microminiaturization of the power module. The power module provided by the invention comprises a power module and a capacitor module; the tail ends of the capacitor electrodes of the capacitor module and the tail ends of the input electrodes of the power module are bent and then welded, and the original positions electrically connected in the horizontal direction are changed into positions electrically connected in the vertical direction, so that the inductance of the power module can be reduced, the occupied area of the power module can be reduced, the size of the power module is reduced, and microminiaturization of the power module can be realized.

Description

Power module

Technical Field

The invention relates to the field of power modules.

Background

The power module is a power switch module which is formed by combining and packaging power electronic and electric devices such as Metal-Oxide-Semiconductor Field effect transistors (MOSFET), Insulated Gate Bipolar Transistors (IGBT) and Fast Recovery Diodes (FRD) according to certain functions and is mainly used for power conversion of electric vehicles, photovoltaic power generation, wind power generation, industrial frequency conversion and other occasions.

For example, fig. 1a shows a schematic block diagram of an IGBT-based power module, which is formed by connecting three IGBT bridges and a capacitor core in parallel, where the upper and lower sides are respectively connected to the positive and negative electrodes of an external power supply, and the middle is connected to an output electrode; fig. 1b shows a schematic block diagram of a MOSFET-based power module, which is formed by connecting three MOSFET bridges and a capacitor core in parallel, wherein the upper side and the lower side of the MOSFET bridges are respectively connected with the anode and the cathode of an external power supply, and the middle of the MOSFET bridges is connected with an output electrode.

As shown in fig. 1c and 1d, the power module includes a power module 1000 and a capacitor module 2000; the power module 1000 mainly includes a base plate and power units 1 arranged on the base plate (wherein, the power modules may include a plurality of power units 1 according to the number of circuits required to control the number of circuits, such as if used in a three-phase circuit as a control module, it may include 3 power units 1, respectively labeled as 1U \1V \1W), a circuit copper layer 11 is formed on the power units 1 in a layout manner, and a power chip 13 is disposed on the circuit copper layer 11 to realize bridge type switching control, the power units 1 are formed by connecting power electronic devices including an upper MOSFET tube and a lower MOSFET tube or an IGBT in series, and an electrode between the two MOSFET tubes or the IGBT is used as an output electrode; the power unit 1 is connected with a first input electrode 4, a second input electrode 3 and an output electrode 5; usually, the first input electrode 4 and the second input electrode 3 are respectively used as a positive electrode and a negative electrode for connecting with a positive electrode and a negative electrode of an external power supply.

Taking MOSFET as an example, it is known that it comprises 3 electrodes: the grid electrode is used as an input control electrode and is used for inputting a control signal and controlling the connection and disconnection between the source electrode and the drain electrode. By output from the source or drain. IGBTs are also known, which also comprise three electrodes: a gate (G), a collector (C), an emitter (E); the gate electrode corresponds to the grid electrode of the MOS tube, and the collector electrode corresponds to the drain electrode of the MOS tube; the emitter corresponds to the source electrode of the MOS tube; the gate electrode is used as an input control electrode and is also used for connection and disconnection between the emitter and the collector; both controls are also substantially the same.

However, as the power switches in the power module 1000 are repeatedly switched, the inductance resulting from their structural configuration may reduce the reliability of the power module. In the conventional power module 1000, the freewheeling loop of the power module 1000 has a large inductance due to a large area of the freewheeling loop, so that the power module 1000 has a large switching loss and low reliability.

As an improvement, as shown in fig. 2a and 2b, an optimized power module is disclosed, which includes a capacitor module 2000 and a power module 1000, in this example, the power module 1000 is provided in 3 separately packaged forms, and two input electrodes and two output electrodes 5 are led out respectively; the capacitor module 2000 includes a first capacitor electrode 9, a second capacitor electrode, and a capacitor core 8; the first capacitor electrode 9 comprises a first capacitor electrode connection end 91, a first capacitor electrode body 92 and a first capacitor clamping end 93; the second capacitance electrode 8 comprises a second capacitance electrode connecting end 81, a second capacitance electrode body 82 and a second capacitance clamping end 83; the capacitor core 7 is clamped between the first capacitor clamping end 93 and the second capacitor clamping end 83; the two input electrodes and the two capacitor electrodes in the power module 1000 are disposed in an up-down stacked arrangement as shown in fig. 2a and 2b, and are electrically connected to the first capacitor electrode connection terminal 91 and the second capacitor electrode connection terminal 81, respectively, so as to reduce the inductance thereof by this arrangement.

However, the stacked arrangement occupies a relatively large space, which is not favorable for making the size of the power module small.

Disclosure of Invention

In order to overcome the problems that the inductance of the power module can be reduced by adopting a stacked arrangement mode in the prior art, but the occupied space is relatively large, and the volume of the power module is not beneficial to being reduced, the invention provides a power module so as to further reduce the volume of the power module and realize microminiaturization of the power module.

The power module provided by the invention comprises a power module and a capacitor module;

the capacitor module comprises a capacitor core, a first capacitor electrode and a second capacitor electrode; the first capacitor electrode comprises a first capacitor electrode connecting end, a first capacitor electrode body and a first capacitor clamping end; the second capacitor electrode comprises a second capacitor electrode connecting end, a second capacitor electrode body and a second capacitor clamping end; the capacitor core is clamped between the first capacitor clamping end and the second capacitor clamping end; the first capacitor electrode connecting end and the second capacitor electrode connecting end are arranged in a laminated manner;

the power module comprises a bottom plate, and a power unit, an output electrode and two input electrodes which are arranged on the bottom plate; the two input electrodes comprise a first input electrode and a second input electrode;

the power unit comprises a substrate, a circuit copper layer and a power chip set, wherein the circuit copper layer is formed on the substrate, and the power chip set is arranged on the circuit copper layer; the circuit copper layer comprises a first input conductive layer, a second input conductive layer and an output conductive layer; the power chip set comprises a first bridge arm power chip set and a second bridge arm power chip set;

the first input electrode comprises a first main body part, a first internal connecting part and a first external connecting part; the second input electrode comprises a second main body part, a second inner connecting part and a second outer connecting part; the first and second input electrodes are arranged in a stack;

the first main body part extends towards the capacitor module and is bent to form the first external connection part; the second main body part extends towards the capacitor module and is bent to form the second external part;

the first capacitor electrode connecting end further extends towards the power module and is bent to form a first capacitor bending tail end; the second capacitor electrode connecting end further extends towards the power module and is bent to form a second capacitor bending tail end;

the bent tail end of the first capacitor is electrically connected with the first external connection end of the first input electrode; the second capacitor bending end is electrically connected with the second external terminal of the second input electrode.

According to the power module provided by the invention, the tail ends of the capacitor electrodes of the capacitor module and the input electrodes of the power module are bent and then welded, and the original position electrically connected in the horizontal direction is changed into the position electrically connected in the vertical direction, so that the inductance of the power module can be reduced, the occupied area of the power module can be reduced, the size of the power module is reduced, and the microminiaturization of the power module can be realized.

Furthermore, the bent tail end of the first capacitor is bent upwards, and the first external connection end is bent upwards; the second capacitor bending tail end is bent downwards, and the second external terminal is bent downwards.

Further, the first capacitor bending end comprises a plurality of finger-shaped first capacitor bending golden fingers; the second capacitor bending tail end comprises a plurality of finger-shaped second capacitor bending golden fingers;

the first external connection end comprises a plurality of first external connection golden fingers with the number corresponding to that of the first capacitor bending golden fingers; the second external connection end comprises a plurality of second external connecting golden fingers with the number corresponding to that of the second capacitor bending golden fingers;

the first capacitor bending golden fingers are electrically connected with the first external golden fingers one by one; the second capacitor bending golden fingers are electrically connected with the second external golden fingers one by one.

Furthermore, the first capacitor bending golden finger and the first external golden finger are both bent upwards; the second capacitor bending golden finger and the second external golden finger are both bent downwards;

or, the first capacitor bending golden finger and the first external golden finger are both bent downwards; the second capacitor bending golden finger and the second external golden finger are both bent upwards.

Furthermore, the first capacitor bending golden finger, the second capacitor bending golden finger, the first external golden finger and the second external golden finger are bent upwards or downwards;

gaps are reserved among the first capacitor bending golden fingers to accommodate the second capacitor bending golden fingers; gaps are reserved among the second capacitor bending golden fingers to accommodate the first capacitor bending golden fingers; so that the first capacitor bending golden finger and the second capacitor bending golden finger are arranged in a staggered mode;

a gap is reserved between the first external connecting golden fingers to accommodate the second external connecting golden fingers; gaps are reserved among the second external golden fingers to accommodate the first external golden fingers; so that the first external golden finger and the second external golden finger are arranged in a staggered mode;

the first capacitor bending golden fingers and the first external golden fingers which are arranged in a staggered mode are electrically connected one by one; and the second capacitor bending golden fingers and the second external golden fingers are electrically connected one by one after being arranged in a staggered manner.

Furthermore, the bent tail end of the first capacitor is attached to and welded with the first external connection end of the first input electrode; and the second bent end of the second capacitor is jointed and welded with the second external end of the second input electrode.

Furthermore, the bent end of the first capacitor and the first external connection end of the first input electrode are both provided with an external connection hole, and the first capacitor is electrically connected with the external connection hole on the first external connection end of the first input electrode in a matching manner through a fastening connecting piece; and the bent tail end of the second capacitor and the second external connection end of the second input electrode are respectively provided with an external connection hole, and the second capacitor is electrically connected with the external connection hole on the second external connection end of the second input electrode in a matching way through a fastening connecting piece.

Further, the fastening connector comprises a bolt and a nut; the bolt penetrates through the first capacitor bending tail end and the outer connection hole of the first outer connection end, and the first capacitor bending tail end is electrically connected with the first outer connection end after being screwed down through a nut; and the bolt penetrates through the second capacitor bending tail end and the outer connecting hole of the second outer connecting end, and the second capacitor bending tail end is electrically connected with the second outer connecting end after being screwed up by a nut.

Further, the bottom plate comprises a lower bottom plate and an upper bottom plate; the power unit comprises an upper power unit and a lower power unit; a lower power unit is formed on the lower bottom plate, and an upper power unit is formed on the upper bottom plate;

the lower power unit comprises a lower substrate and a circuit copper layer arranged on the lower substrate, wherein the circuit copper layer comprises a second input conductive layer and an output conductive layer;

the second inner connecting part of the second input electrode is electrically connected with the second input conductive layer, and the output conductive layer is electrically connected with the output electrode; wherein, a plurality of groups of upper bridge chips are arranged on the second input conducting layer, and a plurality of groups of lower bridge chips are arranged on the output conducting layer;

the upper power unit comprises a first input conductive layer, a plurality of hollowed regions are formed on the first input conductive layer, and source electrode connecting bridges are arranged in the hollowed regions; the first interconnecting part of the first input electrode is electrically connected with the first input conductive layer;

a plurality of first metal pressing blocks are arranged on the upper bridge chip, the first metal pressing blocks are electrically connected with the source electrode connecting bridge, and then the source electrode connecting bridge is electrically connected with the output conducting layer through second metal pressing blocks;

and a plurality of third metal pressing blocks are arranged on the lower bridge chip and electrically connected with the first input conducting layer.

Furthermore, the first input conducting layer comprises a plurality of paths of first input connecting parts, a connecting through area and a plurality of paths of connecting passages connected between the plurality of paths of second input connecting parts and the connecting through area, and the connecting through area is electrically connected with the lower bridge chip through the third metal pressing block; and a plurality of hollowed areas are enclosed among the multi-path connecting passage, the multi-path second input connecting part and the connecting passage area.

Drawings

FIG. 1a is a schematic block diagram of an IGBT power module;

FIG. 1b is a functional block diagram of a MOSFET power module;

FIG. 1c is a schematic top view of a power module;

FIG. 1d is a schematic cross-sectional view of a power module;

FIG. 2a is a schematic perspective view of a power module in the prior art;

FIG. 2b is an enlarged schematic view at A in FIG. 2 a;

fig. 3 is a schematic perspective view of a first power module according to an embodiment of the present invention;

fig. 4 is a schematic perspective view of a first power module (without an insulating frame) provided in an embodiment of the present invention;

FIG. 5 is an enlarged schematic view at B in FIG. 4;

FIG. 6 is a schematic cross-sectional view of a first power module according to an embodiment of the invention;

fig. 7 is a schematic perspective view of a power module of a first power module according to an embodiment of the present invention;

fig. 8 is a schematic perspective view of a power module (with an insulating frame removed) of a first power module according to an embodiment of the invention;

fig. 9 is an exploded view of a power module of a first power module according to an embodiment of the present invention;

fig. 10 is a second exploded schematic view of a power module of the first power module according to the embodiment of the invention;

fig. 11 is a schematic perspective view of a second power module according to an embodiment of the invention;

fig. 12 is a perspective view of a second power module (with the insulating frame removed) provided in an embodiment of the invention;

FIG. 13 is an enlarged schematic view at C of FIG. 12;

FIG. 14 is a schematic cross-sectional view of a second power module provided in an embodiment of the present invention;

fig. 15 is a schematic perspective view of a power module of a second power module according to an embodiment of the present invention;

fig. 16 is a perspective view of a power module (with the insulating frame removed) of a second power module according to an embodiment of the present invention;

fig. 17 is a perspective view of a third power module according to an embodiment of the invention;

fig. 18 is a perspective view of a third power module (with the insulating frame removed) provided in accordance with an embodiment of the present invention;

FIG. 19 is an enlarged schematic view at D of FIG. 18;

FIG. 20 is a schematic cross-sectional view of a third power module provided in an embodiment of the present invention;

fig. 21 is a perspective view of a power module of a third power module according to an embodiment of the invention;

fig. 22 is a perspective view of a power module (without an insulating frame) of a third power module provided in an embodiment of the present invention;

fig. 23 is a perspective view of a fourth power module according to an embodiment of the invention;

fig. 24 is a perspective view of a fourth power module (with the insulating frame removed) according to an embodiment of the invention;

fig. 25 is a second perspective view of a fourth power module (with the insulating frame removed) according to the embodiment of the invention;

fig. 26 is a third perspective view of a fourth power module (with the insulating frame removed) according to the embodiment of the invention;

fig. 27 is an enlarged schematic view at E in fig. 26;

FIG. 28 is a schematic cross-sectional view of a fourth power module provided in an embodiment of the present invention;

fig. 29 is a perspective view of a power module of a fourth power module according to an embodiment of the present invention;

fig. 30 is a perspective view of a power module (with the insulating frame removed) of a fourth power module according to an embodiment of the invention.

The prior art and the reference numerals in the present invention are as follows:

1000, a power module; 2000. a capacitive module;

1. a power unit; 1A, a lower power unit; 1B, an upper power unit; 11. a circuit copper layer; 12. a substrate; 13. a power chip; 13a, an upper bridge chip; 13b, a lower bridge chip; 14. a data pin;

10. fastening a connecting piece; 10a, a bolt; 10b, a screw cap;

111. an output conductive layer; 112. a first input conductive layer; 113. a second input conductive layer; 1121. a first input connection; 1122. a connection path; 1123. a connecting through region;

114. a source connecting bridge; 115. a first metal compact; 116. a second metal compact; 117. a third metal compact;

2. a base plate; 21. a lower base plate; 22. an upper base plate;

3. a second input electrode; 31. a second outer terminal; 32. a second main body portion; 33. a second interconnector portion; 310. a second external connection hole; 311. a second externally connected golden finger;

4. a first input electrode; 41. a first outer terminal; 42. a first main body portion; 43. a first interconnector portion; 410. a first external connection hole; 411. a first externally connected golden finger;

5. an output electrode; 51. an output external connection part; 52. an output main body section; 53. an output interconnector; 510. an output outer connection hole;

6. an insulating frame;

7. a capacitor core;

8. a second capacitance electrode; 81. a second capacitor electrode connection terminal; 82. a second capacitive electrode body; 83. a second capacitor clamp terminal; 80. a second capacitor bending end; 801. the second capacitor bends the golden finger;

9. a first capacitance electrode; 91. a first capacitor electrode connection terminal; 92. a first capacitive electrode body; 93. a first capacitor clamping end; 90. a first capacitor bending end; 901. the first capacitor bends the golden finger.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In this embodiment, four power modules shown in the drawings will be explained by way of illustration of various embodiments. The core idea of the present invention to bend and electrically connect the ends of the capacitor electrodes of the capacitor module and the input electrodes of the power module, and to change the position of the electrical connection in the horizontal direction to the electrical connection in the vertical direction is specifically described.

Example 1

As shown in fig. 3-10, in this example, the first power module is taken as an example to explain the innovative connection manner between the capacitor module 2000 and the power module 1000 according to the present invention.

As shown in fig. 3 to 6, the power module disclosed in this example includes a power module 1000 and a capacitance module 2000; the capacitance module 2000 comprises a capacitance core 7, a first capacitance electrode 9 and a second capacitance electrode 8; the first capacitor electrode 9 comprises a first capacitor electrode connecting end 91, a first capacitor electrode body 92 and a first capacitor clamping end 93; the second capacitance electrode 8 comprises a second capacitance electrode connection end 81, a second capacitance electrode body 82 and a second capacitance clamping end 83; the capacitor core 7 is clamped between the first capacitor clamping end 93 and the second capacitor clamping end 83; the first capacitor electrode connection end 91 and the second capacitor electrode connection end 81 are arranged in a stacked manner; as is clear from fig. 6, the first capacitor electrode connection terminal 91 and the second capacitor electrode connection terminal 81 are parallel to each other with a gap therebetween.

For convenience, the power module 1000 will be specifically explained in the following embodiments by taking a MOSFET as an example.

The power module 1000 in this example belongs to a double-sided heat dissipation type power module 1000 (but not limited to the double-sided heat dissipation type power module, and other types of power modules 1000 are possible), and each power module 1000 includes a base plate 2 packaged in an insulating frame 6, a power unit 1 formed on the base plate 2, and two input electrodes and two output electrodes 5 electrically connected from the power unit 1. The two input electrodes comprise a first input electrode 4 and a second input electrode 3, respectively. The power unit comprises a general substrate 12, a circuit copper layer formed on the substrate 12, and a power chip set arranged on the circuit copper layer; the circuit copper layer comprises a first input conductive layer 112, a second input conductive layer 113 and an output conductive layer 111; the power chip set comprises a first bridge arm power chip set and a second bridge arm power chip set;

as shown in fig. 3 and 4, in the double-sided heat dissipation type power module 1000 disclosed in this embodiment, the base plate 2 includes a lower base plate 21 and an upper base plate 22; a lower power unit 1A is arranged on a lower bottom plate 21, and an upper power unit 1B is arranged on an upper bottom plate 22; the arrangement of the upper plate 22 and the lower plate 21 makes it possible to form a double-sided heat dissipation effect. The upper power unit 1B and the lower power unit 1A integrally form the power unit 1 to implement the functions of a bridge circuit shown in fig. 1. The base plate 2 is typically made of a metal material, such as any one of copper, copper alloy, aluminum, and aluminum alloy, and the purpose of the base plate 2 is to dissipate heat in the power unit 1.

The first input electrode 4 includes a first main body portion 42, a first internal connection portion 43, and a first external connection portion; the second input electrode 3 includes a second main body portion 32, a second interconnecting portion 33, and a second interconnecting portion; as a specific connection relationship, referring to fig. 7-10, the first interconnection 43 is connected to the first input conductive layer 112, the second interconnection 33 is connected to the second input conductive layer 113, and the first input electrode 4 and the second input electrode 3 are arranged in a stack; the first body portion 42 and the second body portion 32 are arranged in parallel, and a gap is left between the first body portion 42 and the second body portion 32.

Referring to the enlarged schematic view shown in fig. 5, the first main body 42 extends toward the capacitor module and is bent to form the first external connection portion; the second main body portion 32 extends in the direction of the capacitor module 2000 and is bent to form the second external connection portion;

the first capacitor electrode connection end 91 further extends toward the power module 1000 and bends to form a first capacitor bending end 90; the second capacitor electrode connecting end 81 further extends towards the power module 1000 and is bent to form a second capacitor bent end 80;

the first capacitor bending end 90 is electrically connected to the first external terminal 41 of the first input electrode 4; the second capacitor bending end 80 is electrically connected to the second external terminal 31 of the second input electrode 3.

In this example, the first capacitor bending end 90 bends upward, and the first external terminal 41 bends upward; the second capacitor bending end 80 bends downward, and the second external terminal 31 bends downward.

As for the above-mentioned electrical connection, a direct contact bonding soldering connection, which is a bonding soldering connection in this example, may be adopted, but other electrical connection methods known in the art may be adopted, for example, an electrical connection method will be described in embodiment 4 below.

As shown in fig. 9, the lower power unit 1A includes a lower substrate and a circuit copper layer 11 disposed on the lower substrate, wherein the circuit copper layer 11 includes a second input conductive layer 113 and an output conductive layer 111; as is well known, the semiconductor device further includes a control conductive layer (not shown) electrically connected to the gate of each power chip through a bonding wire.

Wherein the second input conductive layer 113 is electrically connected to the second input electrode 3; a plurality of groups of upper bridge chips 13a are arranged on the second input conductive layer 113; the output conductive layer 111 has a number of sets of lower bridge chips 13b corresponding to the number of sets.

The upper bridge chip 13a and the lower bridge chip 13b form two groups connected in parallel respectively; the power control unit is called as a first bridge arm power chipset and a second bridge arm power chipset respectively, which are called as a first power chipset and a second power chipset for short, or called as an upper bridge power chipset and a lower bridge power chipset (for example, the second bridge arm power chipset is used as the upper bridge power chipset, and the first bridge arm power chipset is used as the lower bridge power chipset); the power unit 1 is formed by connecting power electronic devices comprising an upper MOS tube and a lower MOS tube or an IGBT in series, is respectively connected between two input electrodes, and takes an extraction electrode between the two MOS tubes or the IGBT as an output electrode 5.

The input electrode and the output electrode 5 are commonly referred to collectively as power electrodes. In addition to the power electrodes (or power pins), the power unit 1 is provided with a data pin 14 for sampling or controlling.

In this example, as shown in fig. 3 to 10, the first input electrode 4 is a positive electrode, and the second input electrode 3 is a negative electrode. Wherein, the first input electrode 4 comprises a first external connection portion 41, a first main body portion 42 and a first internal connection portion 43; the first interconnect 43 is electrically connected to the first input conductive layer 112; the second input electrode 3 includes a second external connection portion 31, a second body portion 32, and a second internal connection portion 33; the second interconnect 33 is electrically connected to the second input conductive layer 113. The output electrode 5 includes an output external connection portion 51, an output main body portion 52, and an output internal connection portion 53. In this example, the first input conductive layer 112 is a positive conductive layer, and the second input conductive layer 113 is a negative conductive layer.

As shown in fig. 10, the upper power unit 1B includes a first input conductive layer 112, and a plurality of hollow areas are formed on the first input conductive layer 112, and a source connecting bridge 114 is disposed in the hollow areas, and the source connecting bridge 114 is not electrically connected to the first input conductive layer 112. The first input conductive layer 112 includes a plurality of first input connection portions 1121 for electrically connecting to the first input electrodes 4, and is electrically connected to the first input electrodes 4 in a plurality of ways. As shown in fig. 10, the left side of the first input conductive layer 112 is divided into a plurality of branches, i.e., a plurality of first input connection portions 1121, for electrically connecting with the first input electrode 4. The right side of the bottom bridge chip is a connection through region 1123 formed by a large piece of copper foil and electrically connected with the bottom bridge chip 13b, the connection through region 1123 is connected with the multiple first input connection parts 1121 through a plurality of connection paths 1122, and a plurality of hollow regions are defined between the multiple connection paths 1122 and the plurality of first input connection parts 1121 and the connection through region 1123.

Preferably, as shown in fig. 9, the second interconnection 33 of the second input electrode 3 is formed into a plurality of similar fingers and electrically connected to the plurality of second input connection parts 1121, respectively, and the second input electrode 3 and the second input connection parts 1121 are formed into fingers so as to release stress (due to a large difference in expansion coefficient between the circuit copper layer 11 and the substrate 12). Meanwhile, the current distribution of each power chip of the lower bridge chip set is adjusted by adjusting the width of the current path copper sheet 1122 and the width of the second interconnecting part 33. This way, the stability and overload capacity of the module operation can be further improved.

Similarly, as shown in fig. 10, the first interconnection portion 43 of the first input electrode 4 may be formed into a similar multi-path finger shape and electrically connected to the first input conductive layer 112. Similarly, as shown in fig. 9, the output interconnection 53 of the output electrode 5 may be formed into a similar multi-path finger shape and electrically connected to the output conductive layer 111.

As shown in fig. 9, a plurality of first metal compacts 115 are disposed on the upper bridge chip 13a, the first metal compacts 115 are electrically connected to the source connecting bridge 114, the source of the upper bridge chip 13a is electrically connected to the source connecting bridge 114 through the first metal compacts 115 (e.g., electrically connected by means of press-bonding), and then the source connecting bridge 114 is electrically connected to the output conductive layer 111 through the second metal compacts 116.

A plurality of third metal pressing blocks 117 are disposed on the lower bridge chip 13b, and the third metal pressing blocks 117 are electrically connected to the first input conductive layer 112, so that the source of the lower bridge chip 13b is electrically connected to the first input conductive layer 112 through the third metal pressing blocks 117.

As shown in fig. 6, the double-sided heat dissipation type power module 1000 disclosed in this embodiment can form two current loops, where the first loop flows from the second input electrode 3 into the second input conductive layer 113, then enters the upper bridge chip 13a through the drain of the upper bridge chip 13a, enters the source connection bridge 114 from the source of the upper bridge chip 13a through the first metal pressing block 115, enters the output conductive layer 111 from the source connection bridge 114 through the second metal pressing block 116, and is output from the output conductive layer 111 through the output electrode 5. The second loop is that the free-wheeling current flowing from the first input electrode 4 enters the first input conductive layer 112, then enters the lower bridge chip 13b from the source of the lower bridge chip 13b through the third metal pressing block 117, then enters the output conductive layer 111 from the drain of the lower bridge chip 13b, and is output from the output conductive layer 111 through the output electrode 5.

The power module provided by the embodiment is characterized in that the tail ends of the capacitor electrodes of the capacitor module and the tail ends of the input electrodes of the power module are bent and then welded, and the original positions electrically connected in the horizontal direction are changed into positions electrically connected in the vertical direction, so that the inductance of the power module 1000 can be reduced, the occupied area of the power module can be reduced, the size of the power module is reduced, and the microminiaturization of the power module can be realized.

Example 2

As shown in fig. 11-16, in this example, the second power module is taken as an example to explain the innovative connection manner between the capacitor module 2000 and the power module 1000 according to the present invention.

Most of the technical solutions of this embodiment are the same as those of embodiment 1, and the difference is only the difference between the capacitive electrode of the capacitive module 2000 and the input electrode of the power module 1000, so that the other internal structures of the capacitive module 2000 and the power module 1000 are not specifically described, and only the difference is explained.

In this example, referring specifically to the enlarged schematic diagram shown in fig. 13, the first capacitor bending end 90 includes a plurality of finger-shaped first capacitor bending gold fingers 901; the second capacitor meander end 80 comprises a plurality of finger-shaped second capacitor meander fingers 801;

the first external connection end 41 comprises a plurality of first external connection gold fingers 411 in a number corresponding to the first capacitance bending gold finger 901; the second external connection end 31 comprises a plurality of second external connection golden fingers 311 with the number corresponding to that of the second capacitance bending golden fingers 801;

the first capacitor bending gold fingers 901 are electrically connected with the first external gold fingers 411 one by one; the second capacitor bending gold fingers 801 are electrically connected with the second external gold fingers 311 one by one.

In this example, the first capacitor bending gold finger 901 and the first external gold finger 411 are both bent upwards; the second capacitor bending gold finger 801 and the second external connecting gold finger 311 are both bent downwards;

in this example, the first capacitor bending end 90 is configured as a first capacitor bending gold finger 901 with a plurality of fingers, the second capacitor bending end 80 is configured as a second capacitor bending gold finger 801 with a plurality of fingers, the first external connection terminal 41 is configured to include a number of first external connection gold fingers 411 corresponding to the first capacitor bending gold finger 901, and the second external connection terminal 31 is configured to include a number of second external connection gold fingers 311 corresponding to the second capacitor bending gold finger 801.

As shown in fig. 14, the operation principle is also the same as that in embodiment 1, and two current loops may be formed, the first loop flowing from the second input electrode 3 into the second input conductive layer 113, then entering the upper bridge chip 13a through the drain of the upper bridge chip 13a, entering the source connection bridge 114 from the source of the upper bridge chip 13a through the first metal compact 115, entering the output conductive layer 111 from the source connection bridge 114 through the second metal compact 116, and outputting from the output conductive layer 111 through the output electrode 5. The second loop is that the free-wheeling current flowing from the first input electrode 4 enters the first input conductive layer 112, then enters the lower bridge chip 13b from the source of the lower bridge chip 13b through the third metal pressing block 117, then enters the output conductive layer 111 from the drain of the lower bridge chip 13b, and is output from the output conductive layer 111 through the output electrode 5.

Through the mode, the reliability of the electric connection can be ensured, the inductance of the power module 1000 can be reduced, and the occupied area of the power module can be reduced, so that the size of the power module is reduced, the microminiaturization of the power module can be realized, and the welding stress can be reduced.

Example 3

As shown in fig. 17-22, in this example, a third power module is taken as an example to explain the innovative connection manner between the capacitor module 2000 and the power module 1000 according to the present invention.

Most of the technical solutions of this embodiment are the same as those of embodiment 1, and the difference is only the difference between the electrical connection manners of the capacitor electrode of the capacitor module 2000 and the input electrode of the power module 1000, so that other internal structures of the capacitor module 2000 and the power module 1000 are not specifically described, and only the difference is explained.

In this example, the first input electrode 4 is a positive electrode, and the second input electrode 3 is a negative electrode. The first input electrode 4 includes a first external connection portion 41, a first main body portion 42 and a first internal connection portion 43, and a first external connection hole 410 is formed in the first external connection portion 41; the first interconnection 43 is electrically connected to the first input conductive layer 112; the second input electrode 3 includes a second external connection portion 31, a second body portion 32, and a second internal connection portion 33; the second interconnect 33 is electrically connected to the second input conductive layer 113; the second outer connecting portion 31 is provided with a second outer connecting hole 310. The output electrode 5 includes an output external connection portion 51, an output main body portion 52, and an output internal connection portion 53; the output external connection part 51 is provided with an output external connection hole 510. In this example, the first input conductive layer 112 serves as a positive conductive layer, and the second input conductive layer 113 serves as a negative conductive layer.

Please further refer to the enlarged schematic view of fig. 19; the first capacitor bending end 90 and the first external connection end 41 of the first input electrode 4 are both provided with an external connection hole, and the first capacitor bending end is electrically connected with the external connection hole on the first external connection end 41 of the first input electrode 4 through the cooperation of a fastening connecting piece 10; the second capacitor bending end 80 and the second external connection end 31 of the second input electrode 3 are both provided with external connection holes, and the external connection holes on the second external connection end 31 of the second input electrode 3 are matched with fastening connectors 10 to realize electrical connection (in this example, the external connection holes on the first capacitor bending end 90 and the second capacitor bending end 80 are not marked).

In this example, the fastening connector 10 includes a bolt 10a and a nut 10 b; the bolt 10a penetrates through the first capacitor bending tail end 90 and the outer connection hole of the first outer connection end 41, and the first capacitor bending tail end 90 is electrically connected with the first outer connection end 41 after being screwed down by a nut 10 b; the bolt 10a passes through the second capacitor bending end 80 and the outer connection hole of the second outer connection end 31, and the second capacitor bending end 80 is electrically connected with the second outer connection end 31 after being screwed down by the nut 10 b. Of course, the fastening connection 10 is not limited to the engagement of the bolt 10a and the nut 10b, and other similar riveting methods are also possible.

As shown in fig. 20, the operation principle is the same as that of embodiments 1 and 2, and will not be described again.

Through the mode, the inductance of the power module 1000 can be reduced, and the area occupied by the power module can be reduced, so that the size of the power module is reduced, and the microminiaturization of the power module can be realized. And the reliability of the electrical connection between the capacitor module 2000 and the power module 1000 can be provided.

Example 4

As shown in fig. 23-30, in this example, a fourth power module is taken as an example to explain the innovative connection manner between the capacitor module 2000 and the power module 1000 according to the present invention.

Most of the technical solutions of this embodiment are the same as those of embodiment 2, and the difference is only between the capacitive electrode of the capacitive module 2000 and the input electrode of the power module 1000, so that the other internal structures of the capacitive module 2000 and the power module 1000 are not specifically described, and only the difference is explained.

Referring to fig. 23 to fig. 27, in this example, the first capacitor meander gold finger 901, the second capacitor meander gold finger 801, the first external gold finger 411, and the second external gold finger 311 all meander upward; because they are bent upward, they need to be designed to be offset so as not to interfere with each other. Of course, the first capacitor bending gold finger 901, the second capacitor bending gold finger 801, the first external gold finger 411 and the second external gold finger 311 may also be bent downward, and the same essence is obtained.

A gap is left between the first capacitor bending golden fingers 901 to accommodate the second capacitor bending golden fingers 801; a gap is left between the second capacitor bending golden fingers 801 to accommodate the first capacitor bending golden fingers 901; so that the first capacitor bending golden finger 901 and the second capacitor bending golden finger 801 are arranged in a staggered manner;

a gap is left between the first external golden fingers 411 to accommodate the second external golden fingers 311; a gap is reserved between the second external golden fingers 311 to accommodate the first external golden finger 411; so that the first external golden finger 411 and the second external golden finger 311 are arranged in a staggered manner;

the first capacitor bending gold fingers 901 and the first external gold fingers 411 which are arranged in a staggered manner are electrically connected one by one; the second bent capacitor gold fingers 801 and the second external gold fingers 311 are electrically connected one by one after being arranged in a staggered manner.

The electrical connection mode is a joint welding connection.

For the offset design, the meaning of the first external golden finger 411 and the second external golden finger 311 in the power module 1000 can be understood at a glance according to the drawings in this example, for example, refer to fig. 29 and fig. 30, such that the first external golden finger 411 and the second external golden finger 311 are offset and spaced from each other. That is, the first external connecting gold finger 411, the second external connecting gold finger 311, the first external connecting gold finger 411 and the second external connecting gold finger 311 are arranged in sequence from left to right of the paper surface. However, the present invention is not necessarily limited to the above, and for example, it may be configured such that: the first external golden finger 411, the second external golden finger 311 and the second external golden finger 311 are arranged in sequence. Alternatively, the first external golden finger 411, the second external golden finger 311 and the first external golden finger 411 are arranged in sequence, and so on. Correspondingly, the first capacitor bending golden finger 901 and the second capacitor bending golden finger 801 of the capacitor module 2000 may be correspondingly staggered. And will not be described in detail.

As shown in fig. 28, the operation principle is the same as that of the above embodiments, and will not be described again.

Similarly, the reliability of the electrical connection can be ensured by the mode, the inductance of the power module 1000 can be reduced, and the area occupied by the power module can be reduced, so that the size of the power module is reduced, the microminiaturization of the power module can be realized, and the welding stress can be reduced.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. A power module comprises a power module and a capacitor module; the capacitor module comprises a capacitor core, a first capacitor electrode and a second capacitor electrode; the first capacitor electrode comprises a first capacitor electrode connecting end, a first capacitor electrode body and a first capacitor clamping end; the second capacitor electrode comprises a second capacitor electrode connecting end, a second capacitor electrode body and a second capacitor clamping end; the capacitor core is clamped between the first capacitor clamping end and the second capacitor clamping end; the first capacitor electrode connecting end and the second capacitor electrode connecting end are arranged in a laminated manner;

the power module comprises a bottom plate, and a power unit, an output electrode and two input electrodes which are arranged on the bottom plate; the two input electrodes comprise a first input electrode and a second input electrode;

the power unit comprises a substrate, a circuit copper layer and a power chip set, wherein the circuit copper layer is formed on the substrate, and the power chip set is arranged on the circuit copper layer; the circuit copper layer comprises a first input conductive layer, a second input conductive layer and an output conductive layer; the power chip set comprises a first bridge arm power chip set and a second bridge arm power chip set;

the first input electrode comprises a first main body part, a first internal connecting part and a first external connecting part; the second input electrode comprises a second main body part, a second inner connecting part and a second outer connecting part; the first and second input electrodes are arranged in a stack;

the first main body part extends towards the capacitor module and is bent to form the first external connection part; the second main body part extends towards the capacitor module and is bent to form the second external part;

the first capacitor electrode connecting end further extends towards the power module and is bent to form a first capacitor bending tail end; the second capacitor electrode connecting end further extends towards the power module and is bent to form a second capacitor bending tail end;

the bent tail end of the first capacitor is electrically connected with the first external connection end of the first input electrode; the second capacitor bending end is electrically connected with the second external terminal of the second input electrode.

2. The power module as claimed in claim 1, wherein the first capacitor bending end is bent upward, and the first external terminal is bent upward; the bent tail end of the second capacitor is bent downwards, and the second external terminal is bent downwards.

3. The power module as claimed in claim 1, wherein the first capacitor bending end comprises a plurality of finger-shaped first capacitor bending gold fingers; the second capacitor bending tail end comprises a plurality of finger-shaped second capacitor bending golden fingers;

the first external connection end comprises a plurality of first external connection golden fingers with the number corresponding to that of the first capacitor bending golden fingers; the second external connection end comprises a plurality of second external connection golden fingers with the number corresponding to that of the second capacitor bending golden fingers;

the first capacitor bending golden fingers are electrically connected with the first external golden fingers one by one; the second capacitor bending golden fingers are electrically connected with the second external golden fingers one by one.

4. The power module as claimed in claim 3, wherein the first capacitor bending gold finger and the first external gold finger are both bent upward; the second capacitor bending golden finger and the second external golden finger are both bent downwards;

or on the contrary, the first capacitor bending golden finger and the first external golden finger are both bent downwards; the second capacitor bending golden finger and the second external golden finger are both bent upwards.

5. The power module according to claim 3, wherein the first capacitor bending gold finger, the second capacitor bending gold finger, the first external gold finger and the second external gold finger are bent upward or downward;

gaps are reserved among the first capacitor bending golden fingers to accommodate the second capacitor bending golden fingers; gaps are reserved among the second capacitor bending golden fingers to accommodate the first capacitor bending golden fingers; so that the first capacitor bending golden finger and the second capacitor bending golden finger are arranged in a staggered mode;

a gap is reserved between the first external connecting golden fingers to accommodate the second external connecting golden fingers; gaps are reserved among the second external golden fingers to accommodate the first external golden fingers; so that the first external golden finger and the second external golden finger are arranged in a staggered mode;

the first capacitor bending golden fingers and the first external golden fingers which are arranged in a staggered mode are electrically connected one by one; and the second capacitor bending golden fingers and the second external golden fingers are electrically connected one by one after being arranged in a staggered manner.

6. The power module as claimed in claims 1-5, wherein the first capacitor bending end is in joint welding connection with the first external connection end of the first input electrode; and the bent end of the second capacitor is jointed and welded with the second external terminal of the second input electrode.

7. The power module as claimed in claim 1, wherein the first bent end of the capacitor and the first external terminal of the first input electrode are respectively provided with an external connection hole, and the first bent end of the capacitor and the first external terminal of the first input electrode are electrically connected by a fastening connector in a matching manner; and the bent tail end of the second capacitor and the second external connection end of the second input electrode are respectively provided with an external connection hole, and the second capacitor is electrically connected with the external connection holes on the second external connection end of the second input electrode in a matching manner through fastening connecting pieces.

8. The power module of claim 7, wherein the fastening connection comprises a bolt and a nut; the bolt penetrates through the first capacitor bending tail end and the outer connection hole of the first outer connection end, and the first capacitor bending tail end is electrically connected with the first outer connection end after being screwed down through a nut; and the bolt penetrates through the second capacitor bending tail end and the outer connecting hole of the second outer connecting end, and the second capacitor bending tail end is electrically connected with the second outer connecting end after being screwed up by a nut.

9. The power module of claim 1, wherein the chassis includes a lower chassis and an upper chassis; the power unit comprises an upper power unit and a lower power unit; a lower power unit is formed on the lower bottom plate, and an upper power unit is formed on the upper bottom plate;

the lower power unit comprises a lower substrate and a circuit copper layer arranged on the lower substrate, wherein the circuit copper layer comprises a second input conductive layer and an output conductive layer;

the second inner connecting part of the second input electrode is electrically connected with the second input conductive layer, and the output conductive layer is electrically connected with the output electrode; wherein, a plurality of groups of upper bridge chips are arranged on the second input conducting layer, and a plurality of groups of lower bridge chips are arranged on the output conducting layer;

the upper power unit comprises a first input conductive layer, a plurality of hollowed areas are formed on the first input conductive layer, and source electrode connecting bridges are arranged in the hollowed areas; the first interconnecting part of the first input electrode is electrically connected with the first input conductive layer;

a plurality of first metal pressing blocks are arranged on the upper bridge chip, the first metal pressing blocks are electrically connected with the source electrode connecting bridge, and then the source electrode connecting bridge is electrically connected with the output conducting layer through second metal pressing blocks;

and a plurality of third metal pressing blocks are arranged on the lower bridge chip and electrically connected with the first input conducting layer.

10. The power module as claimed in claim 9, wherein the first input conductive layer comprises a plurality of first input connection portions, a plurality of connection through regions and a plurality of connection vias connected between the plurality of second input connection portions and the plurality of connection through regions, and the connection through regions are electrically connected with the lower bridge chip through the third metal pressing block; and a plurality of hollowed areas are enclosed among the multi-path connecting passage, the multi-path second input connecting part and the connecting passage area.

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