CN111351442A - Film thickness control method, device and equipment and computer readable storage medium - Google Patents
Film thickness control method, device and equipment and computer readable storage medium Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/59—Transmissivity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
- G01N2021/558—Measuring reflectivity and transmission
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Abstract
The invention discloses a film thickness control method, a device, equipment and a computer-readable storage medium, wherein the control method comprises the following steps: setting the test thickness of the film layer, and coating the film according to the test thickness to obtain a film layer to be tested; detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected; comparing the test thickness with the detection thickness to obtain a scale factor; and determining the film thickness value set during film coating according to the scale factor. The invention can effectively avoid contact measurement, thereby avoiding the surface damage of the film sample to be measured.
Description
Technical Field
The present invention relates to the field of film thickness detection technologies, and in particular, to a method, an apparatus, a device, and a computer-readable storage medium for controlling a film thickness.
Background
In the prior art or after the film coating process, the thickness of a film sample to be measured is usually detected by a step test method, the step test method mainly uses a step instrument, one or more probes with probes are installed in the step instrument to scan the surface of the film sample to be measured in a transverse contact mode, the probes move up and down along with the tiny peaks and valleys on the surface of the film sample to be measured in the scanning process, the height change of the probes is converted into electric signals by a displacement sensor, and finally the signals are recorded to draw the surface appearance of the film sample to be measured and measure the film thickness of the film sample to be measured.
However, when a film sample to be tested is tested by using a step tester of the step testing method, the probe contacts with the surface of the film sample to be tested, and the surface of the film sample to be tested is easily damaged when the probe contacts with the surface of the film sample to be tested.
The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.
Disclosure of Invention
Therefore, in order to solve the problem that a probe of a step profiler is easy to damage the surface of a film sample to be measured when the step profiler is used for thickness measurement, it is necessary to provide a film thickness control method, a film thickness control device, film thickness control equipment and a computer readable storage medium, which aim to effectively avoid contact measurement and further avoid the surface damage of the film sample to be measured.
In order to achieve the above object, the present invention provides a film thickness control method, which comprises the steps of:
setting the test thickness of the film layer, and coating the film according to the test thickness to obtain a film layer to be tested;
detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected;
comparing the test thickness with the detection thickness to obtain a scale factor;
and determining the film thickness value set during film coating according to the scale factor.
Optionally, the step of detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected includes:
performing spectrum detection on the film layer to be detected to obtain first reflection data or first transmission data of the film layer to be detected;
and calculating the detection thickness of the film layer to be detected according to the first reflection data or the first transmission data.
Optionally, the step of calculating the detection thickness of the film to be detected according to the first reflection data or the first transmission data includes:
obtaining a first optical curve of the optical wavelength and the reflectivity or the optical wavelength and the transmissivity according to the first reflection data or the first transmission data;
and calculating the detection thickness of the film layer to be detected according to the first optical curve.
Optionally, the step of calculating the detection thickness of the film layer to be detected according to the first optical curve includes:
selecting a peak and/or a trough of the first optical curve to obtain a refractive index and an extinction coefficient corresponding to the peak and/or the trough;
and calculating the detection thickness of the film layer to be detected according to the optical wavelength corresponding to the wave crest and/or the wave trough, the refractive index and the extinction coefficient.
Optionally, the film layer is plated on the surface of the transparent substrate;
before the step of calculating the detection thickness of the film layer to be detected according to the first optical curve, the method comprises the following steps:
performing spectrum detection on the film coating surface of the transparent substrate to obtain second reflection data or second transmission data of the film coating surface of the transparent substrate;
obtaining a second optical curve according to the second reflection data or the second transmission data;
the step of calculating the detection thickness of the film layer to be detected according to the first optical curve further includes:
and combining the first optical curve and the second optical curve, and calculating to obtain the detection thickness of the film layer to be detected.
Optionally, the step of setting the test thickness of the film layer, and performing film coating according to the test thickness to obtain the film layer to be tested includes:
setting a first operating parameter of the coating equipment;
before the step of determining the film thickness value set during film coating according to the scale factor, the method comprises the following steps:
and setting a second operation parameter of the coating equipment, and determining that the first operation parameter is consistent with the second operation parameter.
Optionally, the step of determining the film thickness value set during the film plating according to the scale factor includes:
and designing the design thickness of the film layer, and combining the design thickness and the scale factor to determine the film thickness value set during film coating.
Optionally, after the step of determining the film thickness value set during the film plating according to the scaling factor, the method includes:
fitting according to the set film thickness value to form a first spectrum curve;
performing spectrum detection on the film coated according to the set film thickness value to obtain a second spectrum curve;
and comparing and analyzing the first spectral curve and the second spectral curve, and detecting whether the thickness of the plated film layer meets the requirement.
In addition, in order to achieve the above object, the present invention also provides a plating apparatus comprising: the device comprises a memory, a processor and a film thickness control program which is stored on the memory and can run on the processor; the film thickness control program, when executed by the processor, implements the steps of the film thickness control method as described above.
Further, in order to achieve the above object, the present invention also provides a computer-readable storage medium having stored thereon a film thickness control program which, when executed by a processor, implements the steps of the film thickness control method as described above.
According to the technical scheme provided by the invention, the film coating operation is carried out on the surface of the substrate according to the test thickness by setting the test thickness of the film layer, and the film layer to be tested is obtained after film coating; detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected; comparing the test thickness with the detection thickness to obtain a scale factor; the test thickness and the detection thickness have certain errors due to the influence of process conditions, and the errors of the test thickness and the detection thickness are unchanged under the same coating condition, so that the scale factor obtained by comparing the test thickness with the detection thickness is also unchanged. The design needs to reach the thickness of the coating film layer required by the coating film, the film thickness value set during the coating film layer is determined according to the scale factor, the coating film is carried out according to the set film thickness value, the obtained film thickness can reach the coating film design requirement, and the film surface to be detected does not need to be contacted in the mode according to the scale factor, so that the damage to the film layer is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart of a film thickness control method according to a first embodiment of the present invention;
FIG. 2 is a schematic flow chart of a film thickness control method according to a second embodiment of the present invention;
FIG. 3 is a schematic flow chart of a film thickness control method according to a third embodiment of the present invention;
FIG. 4 is a schematic flow chart of a film thickness control method according to a fourth embodiment of the present invention;
FIG. 5 is a schematic flow chart of a fifth embodiment of a method for controlling film thickness according to the present invention;
FIG. 6 is a flowchart illustrating a film thickness control method according to a sixth embodiment of the present invention;
FIG. 7 is a schematic flow chart illustrating a method for controlling a film thickness according to a seventh embodiment of the present invention;
FIG. 8 is a flowchart illustrating an eighth embodiment of a method for controlling film thickness according to the present invention;
FIG. 9 is a schematic diagram of a first optical curve and a second optical curve in a method for controlling a film thickness according to the present invention;
FIG. 10 is a schematic diagram of a first optical curve and a second optical curve for a design thickness of 40nm according to the method for controlling a film thickness of the present invention;
FIG. 11 is a schematic diagram of a first optical curve and a second optical curve when the design thickness is 20nm in the method for controlling the thickness of a film according to the present invention;
FIG. 12 is a schematic diagram of a first optical curve and a second optical curve under a design thickness of 16nm in the method for controlling a film thickness according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1, a first embodiment of the present invention provides a film thickness control method, which includes the steps of:
step S10, setting the testing thickness of the film, and coating the film according to the testing thickness to obtain a film to be tested; specifically, the test thickness of the film layer is set, and is usually thicker, typically up to several hundred nanometers or more, for example, 400 nanometers. And coating the film on the substrate according to the coating process steps, and generating a film layer to be detected on the substrate. In addition, the coating process generally includes confirming whether hardware and software of the equipment can work normally, cleaning a coating chamber, adding a coating material, installing a coating substrate, vacuumizing to a coating condition, confirming coating parameters, and starting the coating equipment to perform coating operation. The coating principle includes vacuum sputtering, magnetron sputtering and the like.
Step S20, detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected; specifically, after the coating is completed, the coated substrate is taken out, the film layer to be detected is detected, for example, by a non-contact method such as spectrum detection, and the obtained optical curve is analyzed, so that the detection thickness of the film layer to be detected can be calculated, and usually, the film layer to be detected is a single-layer film (or a multi-layer or super-multi-layer film in other cases), and the thickness of the single-layer film layer to be detected can be better detected. The mode of spectral detection also can avoid contacting the rete surface that awaits measuring, avoids appearing the fish tail.
In addition, the film layer to be measured mainly aims at calculating a scale factor, and it can be understood that the film layer to be measured is a sample and is not used in an actual product, so that the thickness of the film layer to be measured can also be measured in a contact manner, such as a step test method.
Step S30, comparing the test thickness with the detection thickness to obtain a scale factor; specifically, the measured thickness is a set value, and may be understood as a theoretical value, and the detected thickness is measured and may be understood as an actual value, and generally, there is a certain error between the theoretical value and the actual value, that is, there is a certain error between the measured thickness and the detected thickness, for example, the detected thickness may be greater than the measured thickness, the detected thickness may be smaller than the measured thickness, or the detected thickness may be equal to the measured thickness. Under the same operation parameters of the coating equipment, the scale factors are generally the same, that is, the set test thickness is reduced, the detection thickness is reduced, the set test thickness is increased, and the detection thickness is increased.
And step S40, determining the film thickness value set during film coating according to the scale factor. Because the scale factor is fixed, the scale factor is obtained by measurement before coating production, the film thickness value input on coating equipment during coating is calculated according to the scale factor, namely the set film thickness value, and the film layer obtained by coating according to the film thickness value is the film layer required by production. According to the method, the film thickness measurement is avoided during film coating through the scale factor, the detection time is saved, and the film coating production efficiency is improved.
In the technical scheme provided by the embodiment, by setting the test thickness of the film layer, film coating operation is performed on the surface of the substrate according to the test thickness, and the film layer to be tested is obtained after film coating; detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected; comparing the test thickness with the detection thickness to obtain a scale factor; the test thickness and the detection thickness have certain errors due to the influence of process conditions, and the errors of the test thickness and the detection thickness are unchanged under the same coating condition, so that the scale factor obtained by comparing the test thickness with the detection thickness is also unchanged. The design needs to reach the thickness of the coating film layer required by the coating film, the film thickness value set during the coating film layer is determined according to the scale factor, the coating film is carried out according to the set film thickness value, the obtained film thickness can reach the coating film design requirement, and the film surface to be detected does not need to be contacted in the mode according to the scale factor, so that the damage to the film layer is avoided.
Referring to fig. 2, based on the first embodiment, a second embodiment of the present invention is provided, where the step S20 of detecting the film to be detected to obtain the detected thickness of the film to be detected includes:
step S21, performing spectrum detection on the film layer to be detected, and obtaining first reflection data or first transmission data of the film layer to be detected.
The spectrum detection data of different material films are also different, so the material of the film, such as titanium oxide, is the same in this embodiment. And obtaining first reflection data or first transmission data of the film layer to be detected through spectrum detection, and calculating corresponding characteristics of the film layer to be detected through the first reflection data and the first transmission data, wherein the characteristics comprise optical constants.
Step S22, calculating the detection thickness of the film to be detected according to the first reflection data or the first transmission data.
And calculating the optical constants of the film layer to be detected by an envelope curve method according to the first reflection data or the first transmission data, recording and storing the calculated optical constants, and calculating the detection thickness of the film layer to be detected by combining the optical constants of the materials through optical design software. Referring to fig. 3, based on the second embodiment, a third embodiment of the present invention is provided, in which the step S22 of calculating the detected thickness of the film to be detected according to the first reflection data or the first transmission data includes:
step S220, obtaining a first optical curve of the optical wavelength and the reflectivity or the optical wavelength and the transmissivity according to the first reflection data or the first transmission data; specifically, the reflectivity or the transmissivity of different optical wavelengths on the film layer to be measured is different, and a continuous reflection curve of the optical wavelengths and the reflectivity or a transmission curve of the optical wavelengths and the transmissivity is generated in a range from small to large according to the first reflection data or the first transmission data, and the reflection curve and the transmission curve are first optical curves. The wavelength of light is typically in the ultraviolet to infrared range, for example 350nm to 1150 nm.
Step S221, calculating the detection thickness of the film layer to be detected according to the first optical curve.
Similarly, according to the first optical curve, the optical constants of the film layer to be detected are calculated through an envelope curve method, the calculated optical constants are recorded and stored, and the detection thickness of the film layer to be detected is calculated through optical software by combining the optical constants.
Referring to fig. 4, based on the third embodiment, a fourth embodiment of the present invention is provided, in which step S221 of calculating a detected thickness of the film to be detected according to the first optical curve includes:
step S221a, selecting a peak and/or a trough of the first optical curve, and obtaining a refractive index and an extinction coefficient corresponding to the peak and/or the trough; the first optical curve is not a smooth curve, that is, the first optical curve itself fluctuates up and down, thereby forming a plurality of peaks and valleys, the peaks refer to the high points of the fluctuation of the first optical curve, and the valleys refer to the low points of the fluctuation of the first optical curve. Generally speaking, the thicker the thickness of the film to be measured, the greater the number of peaks and valleys included in the first optical curve, and thus the more data points that can be selected, the more accurate the measurement result will be.
Step S221b, calculating the detection thickness of the film layer to be detected according to the wavelength of light, the refractive index and the extinction coefficient corresponding to the peak and/or the trough. Specifically, the optical constants include the wavelength of light at the peak or the trough, and the refractive index and the extinction coefficient corresponding to the wavelength of light. The optical wavelength corresponding to the wave crest can be selected, the optical wavelength corresponding to the wave trough can be selected, the optical wavelength corresponding to the combination of the wave crest and the wave trough can be selected, the corresponding optical wavelength, the refractive index and the extinction coefficient are brought into optical software, and then the detection thickness is calculated. Referring to the table I, the peak or the trough of the first optical curve corresponds to the refractive index and the extinction coefficient, the test thickness of the film layer to be tested is 400nm, and the test thickness calculated by optical software is 392.62 nm.
Watch 1
| Wavelength (nm) | Refractive index | Extinction coefficient |
| 414.85 | 2.61499 | 0.00211 |
| 446.94 | 2.55918 | 0.00144 |
| 491.32 | 2.49495 | 0.00076 |
| 548.55 | 2.43800 | 0.00047 |
| 628.23 | 2.40764 | 0.00043 |
| 742.12 | 2.40377 | 0.00034 |
| 915.79 | 2.39984 | 0.00029 |
Referring to fig. 5, a fifth embodiment of the present invention is proposed on the basis of the third embodiment, wherein a film layer is coated on the surface of a transparent substrate;
before step S221 of calculating the detection thickness of the film to be detected according to the first optical curve, the method includes:
step S50, performing spectrum detection on the film coating surface of the transparent substrate to obtain second reflection data or second transmission data of the film coating surface of the transparent substrate; generally, the optical film layer does not exist independently and is usually attached to the surface of the substrate, the coated substrate is usually a transparent substrate, and the optical characteristics of the light source are changed on the surface of the coated film layer, so that in order to accurately calculate the detection thickness, the spectrum detection is carried out on the transparent substrate to obtain second reflection data or second transmission data of the coated surface of the transparent substrate, and the transparent substrate can be transparent glass or a transparent resin material; when the film surface reflection data and the substrate reflection data are used, the substrate for film coating may be opaque, such as a silicon wafer. In the transmittance measurement, the measurement can be performed from both surfaces of the substrate, and attention is paid to the film surface and the non-film surface in the measurement of the single-sided reflection.
Step S60, obtaining a second optical curve according to the second reflection data or the second transmission data; fitting the first optical curve and the second optical curve together, and determining the position of the second optical curve corresponding to the peak or the trough of the first optical curve through the fitted graphs.
Referring to fig. 9, a1 represents the second optical curve, a2 represents the first optical curve, and the step S221 of calculating the detected thickness of the film to be detected according to the first optical curve further includes:
step S221c, combining the first optical curve and the second optical curve, and calculating to obtain the detection thickness of the film layer to be detected. Through combining first optical curve and second optical curve, and then obtain the corresponding data value of transparent substrate at first optical curve position, will corresponding data value substitutes to optical software, can more accurate calculation obtain the detection thickness of rete that awaits measuring.
Referring to fig. 6, on the basis of any one of the first to fifth embodiments, a sixth embodiment of the present invention is provided, in which a test thickness of a film is set, and a film is plated according to the test thickness, before the step S10 of obtaining a film to be tested, the method includes:
step S70, setting a first operating parameter of the coating equipment; specifically, the first operation parameter includes a condition for achieving the vacuum degree, a material used, a heating temperature, a plating rate, and the like. The principle of coating is the same, for example, vacuum sputtering or evaporation is used. Because of the performance difference of different coating devices, the coating devices are the same device.
Before step S40 of determining a film thickness value set at the time of plating based on the scale factor, the method includes:
and step S80, setting a second operation parameter of the coating equipment, and determining that the first operation parameter is consistent with the second operation parameter. Specifically, when the coating is performed again by the coating equipment, the operation parameter, that is, the second operation parameter, needs to be set, and if the operation parameter changes, the accuracy of the measurement result is easily affected.
Referring to fig. 7, in addition to any one of the first to fifth embodiments, the step S40 of determining the film thickness value set during the plating according to the scaling factor according to the seventh embodiment of the present invention includes:
and step S41, designing the design thickness of the film layer, and combining the design thickness and the scale factor to determine the film thickness value set during film coating.
The scale factor is generally fixed, for example, the set film layer test thickness is 400nm, and the actual detection thickness is 392.62nm, then T is 400nm/392.62nm is 1.019, where T represents the scale factor. By using the film system design software, the design thickness d1 of the film layer is designed to be 40nm, d2 ═ d1 ═ 40nm ═ 1.019 ═ 40.76nm, and d2 is the set film thickness value. Furthermore, according to the film system design software, the design thickness d1 of the film layer is designed to be 20nm, and d2 ═ d1 ═ T ═ 20nm ═ 1.019 ═ 20.38 nm. The design thickness d1 of the film layer may be 16nm, so that d2 ═ d1 ═ T ═ 16nm ═ 1.019 ═ 216.304 nm.
Referring to fig. 8, an eighth embodiment of the present invention is provided on the basis of any one of the first to fifth embodiments, and includes, after the step S40 of determining the film thickness value set during the plating according to the scaling factor:
step S90, fitting and forming a first spectrum curve according to the set film thickness value; for example, the first spectral curve includes a transmission curve, and the first spectral curve is presented in the display interface by optical software or film system design software.
Step S91, performing spectrum detection on the film coated according to the set film thickness value to obtain a second spectrum curve; similarly, the second spectral curve also includes a transmission curve, and the second spectral curve is presented in the display interface through optical software or film system design software.
And step S92, comparing and analyzing the first spectral curve and the second spectral curve, and detecting whether the thickness of the plating film layer meets the requirement. And judging whether the coating result meets the design requirement through visual comparison or software analysis.
In fig. 10, a first spectral curve of 40nm in thickness is designed, the first spectral curve is a broken line, and a second spectral curve is an actual measurement result.
In fig. 11, a first spectral curve of 40nm in thickness is designed, the first spectral curve is a broken line, and a second spectral curve is an actual measurement result.
In fig. 12, a first spectral curve of 40nm in thickness is designed, the first spectral curve is a broken line, and a second spectral curve is an actual measurement result.
The present invention also provides a coating apparatus, comprising: the device comprises a memory, a processor and a film thickness control program which is stored on the memory and can run on the processor; the film thickness control program, when executed by the processor, implements the steps of the film thickness control method as described above.
The specific implementation of the coating apparatus of the present invention may refer to each of the embodiments of the film thickness control method described above, and will not be described herein again.
The present embodiment also provides a computer-readable storage medium, on which a film thickness control program is stored, which when executed by a processor implements the steps of the film thickness control method as described above.
For the specific implementation of the computer-readable storage medium of the present invention, reference may be made to the embodiments of the film thickness control method described above, which are not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solution of the present invention may be embodied in the form of a software product, which is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk) as described above and includes instructions for enabling a terminal device (e.g., a mobile phone, a computer, a server, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A film layer thickness control method, characterized in that the control method comprises the steps of:
setting the test thickness of the film layer, and coating the film according to the test thickness to obtain a film layer to be tested;
detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected;
comparing the test thickness with the detection thickness to obtain a scale factor;
and determining the film thickness value set during film coating according to the scale factor.
2. The film thickness control method of claim 1, wherein the step of detecting the film to be detected to obtain the detected thickness of the film to be detected comprises:
performing spectrum detection on the film layer to be detected to obtain first reflection data or first transmission data of the film layer to be detected;
and calculating the detection thickness of the film layer to be detected according to the first reflection data or the first transmission data.
3. The film thickness control method of claim 2, wherein the step of calculating the detected thickness of the film to be measured according to the first reflection data or the first transmission data comprises:
obtaining a first optical curve of the optical wavelength and the reflectivity or the optical wavelength and the transmissivity according to the first reflection data or the first transmission data;
and calculating the detection thickness of the film layer to be detected according to the first optical curve.
4. The method for controlling film thickness according to claim 3, wherein the step of calculating the detected thickness of the film to be detected according to the first optical curve comprises:
selecting a peak and/or a trough of the first optical curve to obtain a refractive index and an extinction coefficient corresponding to the peak and/or the trough;
and calculating the detection thickness of the film layer to be detected according to the optical wavelength corresponding to the wave crest and/or the wave trough, the refractive index and the extinction coefficient.
5. The film thickness control method of claim 3, wherein the film is coated on the surface of a transparent substrate;
before the step of calculating the detection thickness of the film layer to be detected according to the first optical curve, the method comprises the following steps:
performing spectrum detection on the film coating surface of the transparent substrate to obtain second reflection data or second transmission data of the film coating surface of the transparent substrate;
obtaining a second optical curve according to the second reflection data or the second transmission data;
the step of calculating the detection thickness of the film layer to be detected according to the first optical curve further includes:
and combining the first optical curve and the second optical curve, and calculating to obtain the detection thickness of the film layer to be detected.
6. The method for controlling film thickness according to any one of claims 1 to 5, wherein the step of setting a test thickness of the film and performing the coating according to the test thickness to obtain the film to be tested comprises:
setting a first operating parameter of the coating equipment;
before the step of determining the film thickness value set during film coating according to the scale factor, the method comprises the following steps:
and setting a second operation parameter of the coating equipment, and determining that the first operation parameter is consistent with the second operation parameter.
7. The method for controlling film thickness according to any one of claims 1 to 5, wherein the step of determining the film thickness value set during the film plating according to the scaling factor comprises:
and designing the design thickness of the film layer, and combining the design thickness and the scale factor to determine the film thickness value set during film coating.
8. The method for controlling the thickness of the film layer according to any one of claims 1 to 5, wherein the step of determining the film thickness value set during the film coating according to the scale factor comprises the following steps:
fitting according to the set film thickness value to form a first spectrum curve;
performing spectrum detection on the film coated according to the set film thickness value to obtain a second spectrum curve;
and comparing and analyzing the first spectral curve and the second spectral curve, and detecting whether the thickness of the plated film layer meets the requirement.
9. A plating apparatus, characterized by comprising: the device comprises a memory, a processor and a film thickness control program which is stored on the memory and can run on the processor; the film thickness control program, when executed by the processor, implements the steps of the film thickness control method of any one of claims 1 to 8.
10. A computer-readable storage medium, having a film thickness control program stored thereon, which when executed by a processor, implements the steps of the film thickness control method of any one of claims 1 to 8.
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