CN111351442A - Film thickness control method, device, device and computer readable storage medium - Google Patents

Film thickness control method, device, device and computer readable storage medium Download PDF

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CN111351442A
CN111351442A CN202010205938.2A CN202010205938A CN111351442A CN 111351442 A CN111351442 A CN 111351442A CN 202010205938 A CN202010205938 A CN 202010205938A CN 111351442 A CN111351442 A CN 111351442A
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film
thickness
film layer
detected
coating
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陶利松
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Goertek Optical Technology Co Ltd
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Goertek Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55Specular reflectivity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59Transmissivity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55Specular reflectivity
    • G01N2021/558Measuring reflectivity and transmission

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  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

The invention discloses a film thickness control method, a device, equipment and a computer-readable storage medium, wherein the control method comprises the following steps: setting the test thickness of the film layer, and coating the film according to the test thickness to obtain a film layer to be tested; detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected; comparing the test thickness with the detection thickness to obtain a scale factor; and determining the film thickness value set during film coating according to the scale factor. The invention can effectively avoid contact measurement, thereby avoiding the surface damage of the film sample to be measured.

Description

膜层厚度控制方法、装置、设备及计算机可读存储介质Film thickness control method, device, device and computer readable storage medium

技术领域technical field

本发明涉及膜厚检测技术领域,尤其涉及一种膜层厚度控制方法、装置、设备及计算机可读存储介质。The present invention relates to the technical field of film thickness detection, and in particular, to a film thickness control method, device, device and computer-readable storage medium.

背景技术Background technique

目前镀膜工艺过程中或镀膜结束后,通常利用台阶测试法对待测薄膜样品的厚度进行检测,台阶测试法主要利用台阶仪,在台阶仪中安装一个或多个带有探针的探头,对待测薄膜样品表面做横向接触式扫描,在扫描过程中,探针会随待测薄膜样品表面的微小峰谷做上下运动,探针的高度变化由位移传感器转变成电信号,最后记录这些信号,以绘制出待测薄膜样品表面形貌,并测试出待测薄膜样品的膜厚。At present, during the coating process or after the coating is finished, the thickness of the film sample to be measured is usually detected by the step test method. The step test method mainly uses a step tester, in which one or more probes with probes are installed to test The surface of the film sample is scanned by lateral contact. During the scanning process, the probe will move up and down with the tiny peaks and valleys on the surface of the film sample to be measured. The surface morphology of the thin film sample to be tested is drawn, and the film thickness of the thin film sample to be tested is measured.

但是,在利用台阶测试法的台阶仪测试待测薄膜样品时,探针会与待测薄膜样品表面相接触,在其与待测薄膜样品表面接触时容易对待测薄膜样品表面造成损伤。However, when using the step tester of the step test method to test the thin film sample to be tested, the probe will contact the surface of the thin film sample to be tested, and the surface of the thin film sample to be tested is easily damaged when it contacts the surface of the thin film sample to be tested.

上述内容仅用于辅助理解本申请的技术方案,并不代表承认上述内容是现有技术。The above content is only used to assist the understanding of the technical solutions of the present application, and does not mean that the above content is the prior art.

发明内容SUMMARY OF THE INVENTION

基于此,针对利用台阶仪进行厚度测量,台阶仪的探针容易对待测薄膜样品表面造成损伤的问题,有必要提供一种膜层厚度控制方法、装置、设备及计算机可读存储介质,旨在能够有效避免接触式测量,进而避免待测薄膜样品表面损伤。Based on this, it is necessary to provide a film thickness control method, device, equipment and computer-readable storage medium for the problem that the probe of the step meter is easy to damage the surface of the thin film sample to be measured by using the step meter for thickness measurement. It can effectively avoid contact measurement, thereby avoiding surface damage of the film sample to be measured.

为实现上述目的,本发明提出的一种膜层厚度控制方法,所述控制方法步骤包括:In order to achieve the above purpose, the present invention proposes a method for controlling the thickness of a film layer, wherein the steps of the control method include:

设定膜层的测试厚度,依据所述测试厚度进行镀膜,获得待测膜层;Set the test thickness of the film layer, and perform coating according to the test thickness to obtain the film layer to be tested;

对所述待测膜层进行检测,获得所述待测膜层的检测厚度;Detecting the film layer to be tested to obtain the detected thickness of the film layer to be tested;

将所述测试厚度和所述检测厚度进行对比,获得比例因子;Comparing the test thickness and the detection thickness to obtain a scale factor;

依据所述比例因子确定镀膜时设定的膜厚数值。The film thickness value set during coating is determined according to the scale factor.

可选地,所述对所述待测膜层进行检测,获得所述待测膜层的检测厚度的步骤,包括:Optionally, the step of detecting the film layer to be measured to obtain the detected thickness of the film layer to be measured includes:

对所述待测膜层进行光谱检测,获得所述待测膜层的第一反射数据或第一透射数据;Perform spectral detection on the film layer to be measured to obtain first reflection data or first transmission data of the film layer to be measured;

依据所述第一反射数据或所述第一透射数据,计算得出所述待测膜层的检测厚度。According to the first reflection data or the first transmission data, the detected thickness of the to-be-measured film layer is calculated.

可选地,所述依据所述第一反射数据或所述第一透射数据,计算得出所述待测膜层的检测厚度的步骤,包括:Optionally, the step of calculating the detected thickness of the film layer to be measured according to the first reflection data or the first transmission data includes:

依据所述第一反射数据或所述第一透射数据,获得光波长与反射率或光波长与透射率的第一光学曲线;obtaining a first optical curve of light wavelength and reflectivity or light wavelength and transmittance according to the first reflection data or the first transmission data;

依据所述第一光学曲线,计算得出所述待测膜层的检测厚度。According to the first optical curve, the detected thickness of the to-be-measured film layer is calculated.

可选地,所述依据所述第一光学曲线,计算得出所述待测膜层的检测厚度的步骤,包括:Optionally, the step of calculating the detected thickness of the film layer to be measured according to the first optical curve includes:

选取所述第一光学曲线的波峰和/或波谷,获得所述波峰和/或所述波谷对应的折射率与消光系数;Selecting the peaks and/or troughs of the first optical curve to obtain the refractive index and extinction coefficient corresponding to the peaks and/or the troughs;

依据所述波峰和/或所述波谷对应的光波长、所述折射率以及所述消光系数,计算得出所述待测膜层的检测厚度。According to the wavelength of light corresponding to the wave peak and/or the wave trough, the refractive index and the extinction coefficient, the detected thickness of the film layer to be measured is calculated.

可选地,所述膜层镀制在透明基板表面;Optionally, the film layer is plated on the surface of the transparent substrate;

所述依据所述第一光学曲线,计算得出所述待测膜层的检测厚度的步骤之前,包括:Before the step of calculating the detected thickness of the film layer to be measured according to the first optical curve, the method includes:

对所述透明基板的镀膜面进行光谱检测,获得所述透明基板的镀膜面的第二反射数据或第二透射数据;Perform spectral detection on the coating surface of the transparent substrate to obtain second reflection data or second transmission data of the coating surface of the transparent substrate;

依据所述第二反射数据或所述第二透射数据获得第二光学曲线;obtaining a second optical curve according to the second reflection data or the second transmission data;

所述依据所述第一光学曲线,计算得出所述待测膜层的检测厚度的步骤,还包括:The step of calculating the detected thickness of the film layer to be measured according to the first optical curve further includes:

将所述第一光学曲线和所述第二光学曲线结合,计算得出所述待测膜层的检测厚度。Combining the first optical curve and the second optical curve, the detected thickness of the film layer to be measured is calculated.

可选地,所述设定膜层的测试厚度,依据所述测试厚度进行镀膜,获得待测膜层的步骤之前,包括:Optionally, before the step of setting the test thickness of the film layer, performing coating according to the test thickness, and obtaining the film layer to be tested, comprising:

设定镀膜设备的第一运行参数;Set the first operating parameters of the coating equipment;

所述依据所述比例因子确定镀膜时设定的膜厚数值的步骤之前,包括:Before the step of determining the film thickness value set during coating according to the scale factor, the steps include:

设定所述镀膜设备的第二运行参数,确定所述第一运行参数和第二运行参数一致。Setting the second operating parameter of the coating device, and determining that the first operating parameter and the second operating parameter are consistent.

可选地,所述依据所述比例因子确定镀膜时设定的膜厚数值的步骤,包括:Optionally, the step of determining the film thickness value set during coating according to the scale factor includes:

设计膜层的设计厚度,将所述设计厚度和所述比例因子结合确定镀膜时设定的膜厚数值。The design thickness of the film layer is designed, and the design thickness and the scale factor are combined to determine the film thickness value set during film coating.

可选地,所述依据所述比例因子确定镀膜时设定的膜厚数值的步骤之后,包括:Optionally, after the step of determining the film thickness value set during coating according to the scale factor, the step includes:

依据设定的所述膜厚数值拟合形成第一光谱曲线;Fitting to form a first spectral curve according to the set value of the film thickness;

对依据设定的所述膜厚数值镀膜的膜层进行光谱检测,获得第二光谱曲线;Perform spectral detection on the film layer coated according to the set film thickness value to obtain a second spectral curve;

将所述第一光谱曲线和所述第二光谱曲线对比分析,检测镀制膜层厚度是否符合要求。The first spectral curve and the second spectral curve are compared and analyzed to detect whether the thickness of the coating film meets the requirements.

此外,为了实现上述目的,本发明还提供一种镀膜设备,所述镀膜设备包括:存储器、处理器及存储在所述存储器上并可在所述处理器上运行的膜层厚度控制程序;所述膜层厚度控制程序被所述处理器执行时实现如上文所述的膜层厚度控制方法的步骤。In addition, in order to achieve the above object, the present invention also provides a coating device, which includes: a memory, a processor, and a film thickness control program stored on the memory and running on the processor; When the film thickness control program is executed by the processor, the steps of the film thickness control method as described above are implemented.

此外,为了实现上述目的,本发明还提供一种计算机可读存储介质,所述计算机可读存储介质上存储有膜层厚度控制程序,所述膜层厚度控制程序被处理器执行时实现如上文所述的膜层厚度控制方法的步骤。In addition, in order to achieve the above object, the present invention also provides a computer-readable storage medium, where a film thickness control program is stored on the computer-readable storage medium, and the film thickness control program is executed by a processor to achieve the above The steps of the film thickness control method.

本发明提出的技术方案中,通过设定膜层的测试厚度,依据所述测试厚度在基板表面进行镀膜作业,镀膜后获得待测膜层;对所述待测膜层进行检测,检测获得所述待测膜层的检测厚度;将所述测试厚度和所述检测厚度进行对比,获得比例因子;所述测试厚度和所述检测厚度由于工艺条件的影响,两者具有一定误差,相同的镀膜条件下,所述测试厚度和所述检测厚度误差不变,由此可知,所述测试厚度和所述检测厚度对比获得的比例因子也是不变的。设计需要达到镀膜要求膜层的厚度,依据比例因子确定镀制膜层时设定的膜厚数值,依据设定的膜厚数值进行镀膜,获得的膜层厚度能够达到镀膜设计要求,通过这种依据比例因子的方式,无需接触待测薄膜表面,进而避免对膜层造成损伤。In the technical scheme proposed by the present invention, by setting the test thickness of the film layer, a film coating operation is performed on the surface of the substrate according to the test thickness, and the film layer to be tested is obtained after the film coating; The detection thickness of the film layer to be tested; the test thickness and the detection thickness are compared to obtain a scale factor; the test thickness and the detection thickness have certain errors due to the influence of the process conditions, and the same coating film Under the conditions, the error of the test thickness and the detection thickness is unchanged, it can be seen that the scale factor obtained by comparing the test thickness and the detection thickness is also unchanged. The design needs to meet the thickness of the film required by the coating. The film thickness value set when the film is coated is determined according to the scale factor, and the film is coated according to the set film thickness value, and the obtained film thickness can meet the coating design requirements. Through this According to the scale factor, there is no need to touch the surface of the film to be tested, thereby avoiding damage to the film.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图示出的结构获得其他的附图。In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

图1为本发明膜层厚度控制方法第一实施例的流程示意图;1 is a schematic flowchart of a first embodiment of a film thickness control method according to the present invention;

图2为本发明膜层厚度控制方法第二实施例的流程示意图;2 is a schematic flowchart of a second embodiment of the method for controlling the thickness of a film layer according to the present invention;

图3为本发明膜层厚度控制方法第三实施例的流程示意图;3 is a schematic flowchart of a third embodiment of a method for controlling film thickness of the present invention;

图4为本发明膜层厚度控制方法第四实施例的流程示意图;FIG. 4 is a schematic flowchart of a fourth embodiment of the film thickness control method of the present invention;

图5为本发明膜层厚度控制方法第五实施例的流程示意图;FIG. 5 is a schematic flowchart of a fifth embodiment of the film thickness control method of the present invention;

图6为本发明膜层厚度控制方法第六实施例的流程示意图;6 is a schematic flowchart of a sixth embodiment of a method for controlling film thickness of the present invention;

图7为本发明膜层厚度控制方法第七实施例的流程示意图;FIG. 7 is a schematic flowchart of a seventh embodiment of a method for controlling film thickness of the present invention;

图8为本发明膜层厚度控制方法第八实施例的流程示意图;FIG. 8 is a schematic flowchart of an eighth embodiment of a method for controlling film thickness of the present invention;

图9为本发明膜层厚度控制方法中第一光学曲线和第二光学曲线示意图;9 is a schematic diagram of a first optical curve and a second optical curve in the film thickness control method of the present invention;

图10为本发明膜层厚度控制方法中设计厚度为40nm情况下,第一光学曲线和第二光学曲线示意图;10 is a schematic diagram of the first optical curve and the second optical curve when the design thickness is 40 nm in the film thickness control method of the present invention;

图11为本发明膜层厚度控制方法中设计厚度为20nm情况下,第一光学曲线和第二光学曲线示意图;11 is a schematic diagram of the first optical curve and the second optical curve when the design thickness is 20 nm in the film thickness control method of the present invention;

图12为本发明膜层厚度控制方法中设计厚度16nm情况下,第一光学曲线和第二光学曲线示意图。FIG. 12 is a schematic diagram of the first optical curve and the second optical curve when the design thickness is 16 nm in the film thickness control method of the present invention.

本发明目的的实现、功能特点及优点将结合实施例,参照附图做进一步说明。The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

具体实施方式Detailed ways

下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明的一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

需要说明,本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等,如果该特定姿态发生改变时,则该方向性指示也相应地随之改变。It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

另外,在本发明中如涉及“第一”、“第二”等的描述仅用于描述目的,而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中,“多个”的含义是至少两个,例如两个,三个等,除非另有明确具体的限定。In addition, descriptions such as "first", "second", etc. in the present invention are only for descriptive purposes, and should not be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

在本发明中,除非另有明确的规定和限定,术语“连接”、“固定”等应做广义理解,例如,“固定”可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise expressly specified and limited, the terms "connected", "fixed" and the like should be understood in a broad sense, for example, "fixed" may be a fixed connection, a detachable connection, or an integrated; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two elements or an interaction relationship between the two elements, unless otherwise explicitly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

另外,本发明各个实施例之间的技术方案可以相互结合,但是必须是以本领域普通技术人员能够实现为基础,当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在,也不在本发明要求的保护范围之内。In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

参阅图1所示,本发明提出的第一实施例,一种膜层厚度控制方法,控制方法步骤包括:Referring to FIG. 1, the first embodiment of the present invention is a method for controlling the thickness of a film layer. The steps of the control method include:

步骤S10,设定膜层的测试厚度,依据测试厚度进行镀膜,获得待测膜层;具体地,设定膜层的测试厚度,通常膜层的测试厚度较厚,一般达到几百纳米以上,例如400纳米。按照镀膜工艺步骤在基板上镀膜,并在基板上生成待测膜层。另外,镀膜工艺步骤通常包括确认设备的硬件和软件是否能正常工作,对镀膜腔室进行清洁,加装镀膜材料,安装镀膜基板,抽真空到镀膜条件下,确认镀膜参数,启动镀膜设备进行镀膜作业。镀膜的原理包括真空溅射和磁控溅射等。Step S10, set the test thickness of the film layer, perform coating according to the test thickness, and obtain the film layer to be tested; specifically, set the test thickness of the film layer, usually the test thickness of the film layer is thicker, generally reaching several hundreds of nanometers or more, For example 400 nanometers. According to the coating process steps, a film is coated on the substrate, and a film layer to be measured is formed on the substrate. In addition, the coating process steps usually include confirming whether the hardware and software of the equipment can work normally, cleaning the coating chamber, adding coating materials, installing the coating substrate, vacuuming to the coating conditions, confirming the coating parameters, and starting the coating equipment for coating. Operation. The principles of coating include vacuum sputtering and magnetron sputtering.

步骤S20,对待测膜层进行检测,获得待测膜层的检测厚度;具体地,镀膜完成后,取出镀膜基板,对待测膜层进行检测,例如通过光谱检测等非接触的方式进行检测,通过获得的光学曲线进行分析,能够计算得出待测膜层的检测厚度,通常待测膜层是一层单层膜(在其他情况下可以为多层或超多层膜),单层的待测膜层能够更好的检测出其厚度。光谱检测的方式也能够避免接触待测膜层表面,避免出现划伤。In step S20, the film layer to be measured is detected to obtain the detection thickness of the film layer to be measured; specifically, after the coating is completed, the coated substrate is taken out, and the film layer to be measured is detected, for example, by non-contact methods such as spectral detection, The obtained optical curve can be analyzed to calculate the detection thickness of the film to be tested. Usually, the film to be tested is a single-layer film (in other cases, it can be a multi-layer or ultra-multi-layer film). The measuring layer can better detect its thickness. The spectral detection method can also avoid touching the surface of the film to be measured and avoid scratches.

另外,待测膜层的主要目的在于计算得出比例因子,可以理解待测膜层是一种样品,并不用于实际的产品中,因此也可以用接触式的方式测量待测膜层的厚度,比如台阶测试法。In addition, the main purpose of the film to be tested is to calculate the scale factor. It can be understood that the film to be tested is a sample and is not used in actual products. Therefore, the thickness of the film to be tested can also be measured in a contact way. , such as the step test method.

步骤S30,将测试厚度和检测厚度进行对比,获得比例因子;具体地,测试厚度是设定值,可以理解为理论值,而检测厚度是测量得出的,可以理解为实际值,一般来说,理论值和实际值有一定误差,就是说,测试厚度和检测厚度有一定误差,比如,检测厚度可能大于测试厚度,检测厚度也可小于测试厚度,还可以是两者相等。在相同的镀膜设备运行参数下,通常比例因子也是相同的,就是说,设定的测试厚度下降,检测厚度也下降,设定的测试厚度上升,检测厚度也上升。Step S30, comparing the test thickness and the detection thickness to obtain a scale factor; specifically, the test thickness is a set value, which can be understood as a theoretical value, while the detection thickness is obtained by measurement and can be understood as an actual value, generally speaking , there is a certain error between the theoretical value and the actual value, that is to say, there is a certain error between the test thickness and the test thickness, for example, the test thickness may be greater than the test thickness, the test thickness may also be smaller than the test thickness, or the two may be equal. Under the same operating parameters of the coating equipment, the scaling factor is usually the same, that is, when the set test thickness decreases, the test thickness also decreases, and the set test thickness increases, and the test thickness also increases.

步骤S40,依据比例因子确定镀膜时设定的膜厚数值。由于比例因子是固定的,在进行镀膜生产之前,测定得出比例因子,依据比例因子推算出镀膜时在镀膜设备上输入的膜厚数值,即设定的膜厚数值,依据膜厚数值镀膜得到的膜层就是生产需要的膜层。此种方式通过比例因子,避免在镀膜时进行膜层厚度测量,节省检测时间,提升镀膜生产效率。Step S40, determining the film thickness value set during film coating according to the scale factor. Since the scale factor is fixed, before the coating production, the scale factor is measured and obtained. According to the scale factor, the film thickness value input on the coating equipment during coating is calculated, that is, the set film thickness value, which is obtained by coating according to the film thickness value. The film layer is the film layer required for production. In this way, the scale factor is used to avoid film thickness measurement during coating, saving testing time and improving coating production efficiency.

本实施例提出的技术方案中,通过设定膜层的测试厚度,依据所述测试厚度在基板表面进行镀膜作业,镀膜后获得待测膜层;对所述待测膜层进行检测,检测获得所述待测膜层的检测厚度;将所述测试厚度和所述检测厚度进行对比,获得比例因子;所述测试厚度和所述检测厚度由于工艺条件的影响,两者具有一定误差,相同的镀膜条件下,所述测试厚度和所述检测厚度误差不变,由此可知,所述测试厚度和所述检测厚度对比获得的比例因子也是不变的。设计需要达到镀膜要求膜层的厚度,依据比例因子确定镀制膜层时设定的膜厚数值,依据设定的膜厚数值进行镀膜,获得的膜层厚度能够达到镀膜设计要求,通过这种依据比例因子的方式,无需接触待测薄膜表面,进而避免对膜层造成损伤。In the technical solution proposed in this embodiment, by setting the test thickness of the film layer, a film coating operation is performed on the surface of the substrate according to the test thickness, and the film layer to be tested is obtained after the film coating; The detected thickness of the film layer to be tested; the tested thickness and the detected thickness are compared to obtain a scale factor; the tested thickness and the detected thickness have a certain error due to the influence of the process conditions, and the same Under the coating conditions, the error between the test thickness and the detection thickness is unchanged, so it can be seen that the proportional factor obtained by comparing the test thickness and the detection thickness is also unchanged. The design needs to meet the thickness of the film required by the coating. The film thickness value set when the film is coated is determined according to the scale factor, and the film is coated according to the set film thickness value, and the obtained film thickness can meet the coating design requirements. Through this According to the scale factor, there is no need to touch the surface of the film to be tested, thereby avoiding damage to the film.

参阅图2所示,在第一实施例的基础上,提出本发明的第二实施例,对待测膜层进行检测,获得待测膜层的检测厚度的步骤S20,包括:Referring to FIG. 2 , on the basis of the first embodiment, a second embodiment of the present invention is proposed. The step S20 of detecting the film layer to be measured and obtaining the detected thickness of the film layer to be measured includes:

步骤S21,对待测膜层进行光谱检测,获得待测膜层的第一反射数据或第一透射数据。Step S21, performing spectral detection on the film layer to be measured to obtain first reflection data or first transmission data of the film layer to be measured.

不同的材质膜层光谱检测的数据也不同,因此本实施例针对的膜层材质相同,例如氧化钛。通过光谱检测,获得待测膜层的第一反射数据或第一透射数据,通过第一反射数据和第一透射数据能够计算得出待测膜层的相应特性,包括光学常数。The data of spectral detection of film layers of different materials are also different, so the film layers targeted in this embodiment are of the same material, such as titanium oxide. Through spectral detection, the first reflection data or first transmission data of the film to be measured can be obtained, and the corresponding characteristics of the film to be measured, including optical constants, can be calculated from the first reflection data and the first transmission data.

步骤S22,依据第一反射数据或第一透射数据,计算得出待测膜层的检测厚度。Step S22, calculating the detection thickness of the film layer to be measured according to the first reflection data or the first transmission data.

依据第一反射数据或第一透射数据,通过包络线法计算得出待测膜层的光学常数,将这些计算得出的光学常数记录保存,通过光学设计软件结合这些材料光学常数计算得出待测膜层的检测厚度。参阅图3所示,在第二实施例的基础上,提出本发明的第三实施例,依据第一反射数据或第一透射数据,计算得出待测膜层的检测厚度的步骤S22,包括:According to the first reflection data or the first transmission data, calculate the optical constants of the film to be measured by the envelope method, record and save these calculated optical constants, and calculate the optical constants of these materials through the optical design software. The detection thickness of the film to be measured. Referring to FIG. 3 , on the basis of the second embodiment, a third embodiment of the present invention is proposed. According to the first reflection data or the first transmission data, the step S22 of calculating the detection thickness of the film layer to be tested includes: :

步骤S220,依据第一反射数据或第一透射数据,获得光波长与反射率或光波长与透射率的第一光学曲线;具体地,不同光波长在待测膜层上的反射率或透射率不同,依据第一反射数据或第一透射数据,在光波长由小到大的范围内生成连续的光波长与反射率的反射曲线,或者光波长与透射率的透射曲线,所述反射曲线和透射曲线即为第一光学曲线。光波长的范围一般紫外到红外,例如350nm至1150nm。Step S220, according to the first reflection data or the first transmission data, obtain the first optical curve of light wavelength and reflectivity or light wavelength and transmittance; specifically, the reflectivity or transmittance of different light wavelengths on the film to be measured Differently, according to the first reflection data or the first transmission data, a continuous reflection curve of light wavelength and reflectivity, or a transmission curve of light wavelength and transmittance is generated in the range of light wavelength from small to large, the reflection curve and The transmission curve is the first optical curve. Light wavelengths generally range from ultraviolet to infrared, eg, 350 nm to 1150 nm.

步骤S221,依据第一光学曲线,计算得出待测膜层的检测厚度。Step S221, calculating the detected thickness of the film layer to be measured according to the first optical curve.

同样的,依据第一光学曲线,通过包络线法计算得出待测膜层的光学常数,将这些计算得出的光学常数记录保存,通过光学软件结合这些光学常数计算得出待测膜层的检测厚度。Similarly, according to the first optical curve, the optical constants of the film to be measured are calculated by the envelope method, the optical constants obtained by these calculations are recorded and saved, and the film to be measured is calculated by combining these optical constants with optical software. detection thickness.

参阅图4所示,在第三实施例的基础上,提出本发明的第四实施例,依据第一光学曲线,计算得出待测膜层的检测厚度的步骤S221,包括:Referring to FIG. 4 , on the basis of the third embodiment, a fourth embodiment of the present invention is proposed. According to the first optical curve, the step S221 of calculating the detection thickness of the film layer to be measured includes:

步骤S221a,选取第一光学曲线的波峰和/或波谷,获得波峰和/或波谷对应的折射率与消光系数;第一光学曲线并不是一条平滑的曲线,就是说第一光学曲线自身是有上下波动的,由此形成若干波峰和波谷,波峰是指第一光学曲线波动的高点,波谷是指第一光学曲线波动的低点。通常来说,待测膜层的厚度越厚,形成第一光学曲线中包括的波峰和波谷数量越多,由此可以选择的数据点也越多,测量的结果也将更加准确。Step S221a, select the peaks and/or troughs of the first optical curve, and obtain the refractive index and extinction coefficient corresponding to the peaks and/or troughs; the first optical curve is not a smooth curve, that is, the first optical curve itself is up and down. fluctuating, thereby forming several peaks and troughs, the peaks refer to the high points of the fluctuation of the first optical curve, and the troughs refer to the low points of the fluctuations of the first optical curve. Generally speaking, the thicker the thickness of the film to be measured, the more peaks and troughs are included in the formation of the first optical curve, the more data points can be selected, and the more accurate the measurement result will be.

步骤S221b,依据波峰和/或波谷对应的光波长、折射率以及消光系数,计算得出待测膜层的检测厚度。具体地,光学常数包括波峰或波谷的光波长,以及光波长对应的折射率和消光系数。可选择波峰对应的光波长,也可以选择波谷对应的光波长,还可以选择波峰和波谷结合起来对应的光波长,将对应的光波长、折射率以及消光系数带入到光学软件中,进而计算得出检测厚度。参照表一所示,第一光学曲线波峰或波谷对应折射率和消光系数,待测膜层的测试厚度为400nm,通过光学软件计算得出的检测厚度为392.62nm。In step S221b, the detection thickness of the film layer to be measured is calculated according to the wavelength of light, the refractive index and the extinction coefficient corresponding to the peaks and/or troughs. Specifically, the optical constants include the light wavelengths of the peaks or troughs, and the refractive index and extinction coefficient corresponding to the light wavelengths. You can choose the light wavelength corresponding to the peak, the light wavelength corresponding to the trough, or the light wavelength corresponding to the combination of the peak and the trough, and bring the corresponding light wavelength, refractive index and extinction coefficient into the optical software, and then calculate Get the detection thickness. Referring to Table 1, the peak or trough of the first optical curve corresponds to the refractive index and extinction coefficient, the thickness of the film to be tested is 400 nm, and the thickness calculated by the optical software is 392.62 nm.

表一Table I

波长(nm)Wavelength (nm) 折射率refractive index 消光系数Extinction coefficient 414.85414.85 2.614992.61499 0.002110.00211 446.94446.94 2.559182.55918 0.001440.00144 491.32491.32 2.494952.49495 0.000760.00076 548.55548.55 2.438002.43800 0.000470.00047 628.23628.23 2.407642.40764 0.000430.00043 742.12742.12 2.403772.40377 0.000340.00034 915.79915.79 2.399842.39984 0.000290.00029

参阅图5所示,在第三实施例的基础上,提出本发明的第五实施例,膜层镀制在透明基板表面;Referring to FIG. 5 , on the basis of the third embodiment, a fifth embodiment of the present invention is proposed, and the film layer is plated on the surface of the transparent substrate;

依据第一光学曲线,计算得出待测膜层的检测厚度的步骤S221之前,包括:Before step S221 of calculating the detected thickness of the film layer to be measured according to the first optical curve, the method includes:

步骤S50,对透明基板的镀膜面进行光谱检测,获得透明基板的镀膜面的第二反射数据或第二透射数据;一般光学膜层不是单独存在的,通常依附在基板表面,而镀膜的基板通常为透明基板,光源在经过镀制的膜层表面时光学特征也会产生变化,因此为了能够准确计算检测厚度,需要对透明基板进行光谱检测,以获得透明基板的镀膜面的第二反射数据或第二透射数据,所述透明基板可以是透明玻璃,还可以是透明树脂材料;在利用膜面反射数据和基板反射数据时,镀膜用基板也可以是不透明的,如硅片。需要说明的是,透过率测量时,从基板的两面测量均可以,测量单面反射时,要注意膜面和非膜面。In step S50, spectral detection is performed on the coating surface of the transparent substrate to obtain second reflection data or second transmission data of the coating surface of the transparent substrate; generally, the optical film layer does not exist alone, and is usually attached to the surface of the substrate, while the coated substrate usually As a transparent substrate, the optical characteristics of the light source will also change when the surface of the coated film layer is coated. Therefore, in order to accurately calculate the detection thickness, it is necessary to perform spectral detection on the transparent substrate to obtain the second reflection data of the coated surface of the transparent substrate or For the second transmission data, the transparent substrate may be transparent glass or transparent resin material; when using film surface reflection data and substrate reflection data, the coating substrate may also be opaque, such as a silicon wafer. It should be noted that when measuring the transmittance, it can be measured from both sides of the substrate. When measuring the reflection on one side, pay attention to the film surface and the non-film surface.

步骤S60,依据第二反射数据或第二透射数据获得第二光学曲线;将第一光学曲线和第二光学曲线拟合在一起,通过拟合在一起的图形,能够确定得出第一光学曲线在波峰或者波谷对应的第二光学曲线位置。Step S60, obtaining a second optical curve according to the second reflection data or the second transmission data; fitting the first optical curve and the second optical curve together, and determining the first optical curve through the fitted graphs at the position of the second optical curve corresponding to the wave crest or wave trough.

参阅图9所示,a1表示第二光学曲线,a2表示第一光学曲线,依据第一光学曲线,计算得出待测膜层的检测厚度的步骤S221,还包括:Referring to Fig. 9, a1 represents the second optical curve, a2 represents the first optical curve, and according to the first optical curve, the step S221 of calculating the detected thickness of the film layer to be measured further includes:

步骤S221c,将第一光学曲线和第二光学曲线结合,计算得出待测膜层的检测厚度。通过将第一光学曲线和第二光学曲线结合,进而得出透明基板对应在第一光学曲线位置的相应数据值,将所述相应数据值代入至光学软件中,能够更加准确的计算得出待测膜层的检测厚度。Step S221c, combining the first optical curve and the second optical curve to calculate the detection thickness of the film layer to be measured. By combining the first optical curve and the second optical curve, the corresponding data value of the transparent substrate corresponding to the position of the first optical curve can be obtained, and the corresponding data value can be substituted into the optical software, which can be calculated more accurately. Measure the thickness of the film layer.

参阅图6所示,在第一实施例至第五实施例的任一实施例的基础上,提出本发明的第六实施例,设定膜层的测试厚度,依据测试厚度进行镀膜,获得待测膜层的步骤S10之前,包括:Referring to FIG. 6 , on the basis of any one of the first to fifth embodiments, a sixth embodiment of the present invention is proposed. The test thickness of the film layer is set, and the film is coated according to the test thickness to obtain the Before step S10 of measuring the film layer, it includes:

步骤S70,设定镀膜设备的第一运行参数;具体地,第一运行参数包括真空度达到的条件,采用的材质,加热的温度,镀膜的速率等。另外镀膜的原理相同,例如采用真空溅射或蒸镀的方式。由于不同的镀膜设备自身的性能差异,镀膜的设备为同一设备。Step S70 , setting the first operating parameters of the coating equipment; specifically, the first operating parameters include conditions for reaching the vacuum degree, materials used, heating temperature, coating rate, and the like. In addition, the principle of coating is the same, such as vacuum sputtering or evaporation. Due to the performance differences of different coating equipment, the coating equipment is the same equipment.

依据比例因子确定镀膜时设定的膜厚数值的步骤S40之前,包括:Before step S40 of determining the film thickness value set during coating according to the scale factor, the steps include:

步骤S80,设定镀膜设备的第二运行参数,确定第一运行参数和第二运行参数一致。具体地,再次通过镀膜设备进行镀膜时同样需要设定运行参数,即第二运行参数,运行参数若变化,易影响测量结果的准确性,为此,通过确认第二运行参数的设置,使第二运行参数和第一运行参数保持一致,且第二运行参数和第一运行参数中的设置内容也是相同的。Step S80, setting the second operating parameter of the coating equipment, and determining that the first operating parameter is consistent with the second operating parameter. Specifically, the operating parameters, that is, the second operating parameters, also need to be set when the coating is performed by the coating equipment again. If the operating parameters change, it will easily affect the accuracy of the measurement results. Therefore, by confirming the settings of the second operating parameters, the first The second operation parameter is consistent with the first operation parameter, and the setting contents of the second operation parameter and the first operation parameter are also the same.

参阅图7所示,在第一实施例至第五实施例的任一实施例的基础上,提出本发明的第七实施例,依据比例因子确定镀膜时设定的膜厚数值的步骤S40,包括:Referring to FIG. 7 , on the basis of any one of the first embodiment to the fifth embodiment, a seventh embodiment of the present invention is proposed. The step S40 of determining the film thickness value set during coating according to the scale factor, include:

步骤S41,设计膜层的设计厚度,将设计厚度和比例因子结合确定镀膜时设定的膜厚数值。Step S41 , design the design thickness of the film layer, and combine the design thickness and the scale factor to determine the film thickness value set during film coating.

其中,比例因子的数值一般是固定不变的,例如,设定的膜层测试厚度为400nm,实际检测获得的检测厚度为392.62nm,则,T=400nm/392.62nm=1.019,其中T代表比例因子。通过膜系设计软件,设计膜层的设计厚度d1为40nm,则d2=d1*T=40nm*1.019=40.76nm,d2为设定的膜厚数值。再者还可以依据膜系设计软件,设计膜层的设计厚度d1为20nm,则d2=d1*T=20nm*1.019=20.38nm。还可以设计膜层的设计厚度d1为16nm,则d2=d1*T=16nm*1.019=216.304nm。Among them, the value of the scale factor is generally fixed. For example, the set test thickness of the film layer is 400nm, and the actual detection thickness obtained by the test is 392.62nm, then, T=400nm/392.62nm=1.019, where T represents the ratio factor. Through the film system design software, the design thickness d1 of the designed film layer is 40nm, then d2=d1*T=40nm*1.019=40.76nm, and d2 is the set film thickness value. Furthermore, according to the film system design software, the design thickness d1 of the designed film layer can be 20 nm, then d2=d1*T=20nm*1.019=20.38nm. The design thickness d1 of the film layer can also be designed to be 16 nm, then d2=d1*T=16nm*1.019=216.304nm.

参阅图8所示,在第一实施例至第五实施例的任一实施例的基础上,提出本发明的第八实施例,依据比例因子确定镀膜时设定的膜厚数值的步骤S40之后,包括:Referring to FIG. 8 , on the basis of any one of the first to fifth embodiments, an eighth embodiment of the present invention is proposed, after step S40 of determining the film thickness value set during coating according to the scale factor ,include:

步骤S90,依据设定的膜厚数值拟合形成第一光谱曲线;例如,第一光谱曲线包括透射曲线,通过光学软件或者膜系设计软件,将第一光谱曲线呈现在显示界面中。Step S90 , a first spectral curve is formed by fitting according to the set film thickness value; for example, the first spectral curve includes a transmission curve, and the first spectral curve is presented on the display interface through optical software or film system design software.

步骤S91,对依据设定的膜厚数值镀膜的膜层进行光谱检测,获得第二光谱曲线;同样,第二光谱曲线也包括透射曲线,通过光学软件或者膜系设计软件,将第二光谱曲线呈现在显示界面中。In step S91, spectral detection is performed on the film layer coated according to the set film thickness value to obtain a second spectral curve; similarly, the second spectral curve also includes a transmission curve, and the second spectral curve is calculated by optical software or film system design software. presented in the display interface.

步骤S92,将第一光谱曲线和第二光谱曲线对比分析,检测镀制膜层厚度是否符合要求。通过直观的对比,或者软件分析,判断镀膜结果是否符合设计要求。Step S92, compare and analyze the first spectral curve and the second spectral curve to detect whether the thickness of the coating film meets the requirements. Through intuitive comparison or software analysis, it is judged whether the coating results meet the design requirements.

在图10中,设计厚度为40nm的第一光谱曲线,第一光谱曲线为虚线,第二光谱曲线为实际测量结果。In FIG. 10 , a first spectral curve with a thickness of 40 nm is designed, the first spectral curve is a dotted line, and the second spectral curve is an actual measurement result.

在图11中,设计厚度为40nm的第一光谱曲线,第一光谱曲线为虚线,第二光谱曲线为实际测量结果。In FIG. 11 , a first spectral curve with a thickness of 40 nm is designed, the first spectral curve is a dotted line, and the second spectral curve is an actual measurement result.

在图12中,设计厚度为40nm的第一光谱曲线,第一光谱曲线为虚线,第二光谱曲线为实际测量结果。In FIG. 12 , the design thickness of the first spectral curve is 40 nm, the first spectral curve is a dotted line, and the second spectral curve is the actual measurement result.

本发明还提供一种镀膜设备,所述镀膜设备包括:存储器、处理器及存储在所述存储器上并可在所述处理器上运行的膜层厚度控制程序;所述膜层厚度控制程序被所述处理器执行时实现如上文所述的膜层厚度控制方法的步骤。The present invention also provides a coating device, comprising: a memory, a processor, and a film thickness control program stored on the memory and running on the processor; the film thickness control program is The processor implements the steps of the film thickness control method as described above when executed.

本发明镀膜设备具体实施方式可以参照上述膜层厚度控制方法各实施例,在此不再赘述。For the specific implementation of the coating apparatus of the present invention, reference may be made to the above-mentioned embodiments of the film thickness control method, and details are not described herein again.

本实施例还提供一种计算机可读存储介质,所述计算机可读存储介质上存储有膜层厚度控制程序,所述膜层厚度控制程序被处理器执行时实现如上文所述的膜层厚度控制方法的步骤。This embodiment also provides a computer-readable storage medium, where a film thickness control program is stored on the computer-readable storage medium, and when the film thickness control program is executed by a processor, the film thickness as described above is realized The steps of the control method.

本发明计算机可读存储介质具体实施方式可以参照上述膜层厚度控制方法各实施例,在此不再赘述。For the specific implementation manner of the computer-readable storage medium of the present invention, reference may be made to the above-mentioned embodiments of the film thickness control method, which will not be repeated here.

需要说明的是,在本文中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者系统不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者系统所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括该要素的过程、方法、物品或者系统中还存在另外的相同要素。It should be noted that, herein, the terms "comprising", "comprising" or any other variation thereof are intended to encompass non-exclusive inclusion, such that a process, method, article or system comprising a series of elements includes not only those elements, It also includes other elements not expressly listed or inherent to such a process, method, article or system. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article or system that includes the element.

上述本发明实施例序号仅仅为了描述,不代表实施例的优劣。The above-mentioned serial numbers of the embodiments of the present invention are only for description, and do not represent the advantages or disadvantages of the embodiments.

通过以上的实施方式的描述,本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现,当然也可以通过硬件,但很多情况下前者是更佳的实施方式。基于这样的理解,本发明的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来,该计算机软件产品存储在如上所述的一个存储介质(如ROM/RAM、磁碟、光盘)中,包括若干指令用以使得一台终端设备(可以是手机,计算机,服务器,或者网络设备等)执行本发明各个实施例所述的方法。From the description of the above embodiments, those skilled in the art can clearly understand that the method of the above embodiment can be implemented by means of software plus a necessary general hardware platform, and of course can also be implemented by hardware, but in many cases the former is better implementation. Based on such understanding, the technical solutions of the present invention can be embodied in the form of software products in essence or the parts that make contributions to the prior art, and the computer software products are stored in a storage medium (such as ROM/RAM) as described above. , magnetic disk, optical disc), including several instructions to make a terminal device (which may be a mobile phone, a computer, a server, or a network device, etc.) execute the methods described in the various embodiments of the present invention.

以上仅为本发明的优选实施例,并非因此限制本发明的专利范围,凡是在本发明的发明构思下,利用本发明说明书及附图内容所作的等效结构变换,或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the description and drawings of the present invention, or directly/indirectly applied to other All relevant technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. A film layer thickness control method, characterized in that the control method comprises the steps of:
setting the test thickness of the film layer, and coating the film according to the test thickness to obtain a film layer to be tested;
detecting the film layer to be detected to obtain the detection thickness of the film layer to be detected;
comparing the test thickness with the detection thickness to obtain a scale factor;
and determining the film thickness value set during film coating according to the scale factor.
2. The film thickness control method of claim 1, wherein the step of detecting the film to be detected to obtain the detected thickness of the film to be detected comprises:
performing spectrum detection on the film layer to be detected to obtain first reflection data or first transmission data of the film layer to be detected;
and calculating the detection thickness of the film layer to be detected according to the first reflection data or the first transmission data.
3. The film thickness control method of claim 2, wherein the step of calculating the detected thickness of the film to be measured according to the first reflection data or the first transmission data comprises:
obtaining a first optical curve of the optical wavelength and the reflectivity or the optical wavelength and the transmissivity according to the first reflection data or the first transmission data;
and calculating the detection thickness of the film layer to be detected according to the first optical curve.
4. The method for controlling film thickness according to claim 3, wherein the step of calculating the detected thickness of the film to be detected according to the first optical curve comprises:
selecting a peak and/or a trough of the first optical curve to obtain a refractive index and an extinction coefficient corresponding to the peak and/or the trough;
and calculating the detection thickness of the film layer to be detected according to the optical wavelength corresponding to the wave crest and/or the wave trough, the refractive index and the extinction coefficient.
5. The film thickness control method of claim 3, wherein the film is coated on the surface of a transparent substrate;
before the step of calculating the detection thickness of the film layer to be detected according to the first optical curve, the method comprises the following steps:
performing spectrum detection on the film coating surface of the transparent substrate to obtain second reflection data or second transmission data of the film coating surface of the transparent substrate;
obtaining a second optical curve according to the second reflection data or the second transmission data;
the step of calculating the detection thickness of the film layer to be detected according to the first optical curve further includes:
and combining the first optical curve and the second optical curve, and calculating to obtain the detection thickness of the film layer to be detected.
6. The method for controlling film thickness according to any one of claims 1 to 5, wherein the step of setting a test thickness of the film and performing the coating according to the test thickness to obtain the film to be tested comprises:
setting a first operating parameter of the coating equipment;
before the step of determining the film thickness value set during film coating according to the scale factor, the method comprises the following steps:
and setting a second operation parameter of the coating equipment, and determining that the first operation parameter is consistent with the second operation parameter.
7. The method for controlling film thickness according to any one of claims 1 to 5, wherein the step of determining the film thickness value set during the film plating according to the scaling factor comprises:
and designing the design thickness of the film layer, and combining the design thickness and the scale factor to determine the film thickness value set during film coating.
8. The method for controlling the thickness of the film layer according to any one of claims 1 to 5, wherein the step of determining the film thickness value set during the film coating according to the scale factor comprises the following steps:
fitting according to the set film thickness value to form a first spectrum curve;
performing spectrum detection on the film coated according to the set film thickness value to obtain a second spectrum curve;
and comparing and analyzing the first spectral curve and the second spectral curve, and detecting whether the thickness of the plated film layer meets the requirement.
9. A plating apparatus, characterized by comprising: the device comprises a memory, a processor and a film thickness control program which is stored on the memory and can run on the processor; the film thickness control program, when executed by the processor, implements the steps of the film thickness control method of any one of claims 1 to 8.
10. A computer-readable storage medium, having a film thickness control program stored thereon, which when executed by a processor, implements the steps of the film thickness control method of any one of claims 1 to 8.
CN202010205938.2A 2020-03-20 2020-03-20 Film thickness control method, device, device and computer readable storage medium Pending CN111351442A (en)

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