CN111343847A - Ultra-high-speed chip mounting method and chip mounting head - Google Patents

Ultra-high-speed chip mounting method and chip mounting head Download PDF

Info

Publication number
CN111343847A
CN111343847A CN202010341460.6A CN202010341460A CN111343847A CN 111343847 A CN111343847 A CN 111343847A CN 202010341460 A CN202010341460 A CN 202010341460A CN 111343847 A CN111343847 A CN 111343847A
Authority
CN
China
Prior art keywords
grabbing
assembly
component
sub
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010341460.6A
Other languages
Chinese (zh)
Other versions
CN111343847B (en
Inventor
方强
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN202010341460.6A priority Critical patent/CN111343847B/en
Publication of CN111343847A publication Critical patent/CN111343847A/en
Application granted granted Critical
Publication of CN111343847B publication Critical patent/CN111343847B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0406Drive mechanisms for pick-and-place heads, e.g. details relating to power transmission, motors or vibration damping

Abstract

The application discloses hypervelocity paster method and mounting head, the mounting head is including snatching the subassembly, the paster method includes: step A: rotating the grabbing component to the vertical direction; and B: moving the grabbing component to a corresponding material sucking position and pushing away a corresponding flight reach; and C: pressing the grabbing component downwards to complete material suction and closing the flight reach; step D: rotating the grabbing component to the vertical direction; step E: moving the grabbing component to a corresponding patch position; step F: adjusting the paster angle of the grabbing component; step G: and pressing the grabbing component to complete the surface mounting. The chip mounting method is simple in steps, the chip mounting angle of the grabbing component can be adjusted, the chip mounting accuracy is improved, and the chip mounting speed of equipment such as a chip mounter is greatly improved.

Description

Ultra-high-speed chip mounting method and chip mounting head
Technical Field
The application relates to the field of automation equipment, in particular to an ultra-high-speed surface mounting method and a mounting head.
Background
The chip mounter plays an important role in the post-circuit board packaging production and manufacturing process, and is the equipment with the largest investment, the most advanced technology and the largest influence on the production capacity and the production efficiency of an SMT (surface Mounted technology) production line in the current mainstream electronic assembly technology production equipment. In fact, the most frequent failures and speed bottlenecks are largely due to the placement process, and therefore the development of placement machine equipment is most compelling.
In order to break through the speed bottleneck of the chip mounter, the current main chip mounting method has the disadvantages of complicated steps and low efficiency, so that the production cost of the chip mounter is higher and higher, and the cost performance is not high.
Disclosure of Invention
The application aims to provide an ultra-high speed chip mounting method and a chip mounting head, which are high in chip mounting speed and low in production cost.
The application discloses hypervelocity paster method, the paster head includes snatchs the subassembly, the paster method includes:
step A: rotating the grabbing component to the vertical direction;
and B: moving the grabbing component to a corresponding material sucking position and pushing away a corresponding flight reach;
and C: pressing the grabbing component downwards to complete material suction and closing the flight reach;
step D: rotating the grabbing component to the vertical direction;
step E: moving the grabbing component to a corresponding patch position;
step F: adjusting the paster angle of the grabbing component;
step G: and pressing the grabbing component to complete the surface mounting.
Optionally, the number of the grabbing assemblies is n, each group of the grabbing assemblies includes m grabbing sub-assemblies, and a row of grabbing sub-assemblies arranged in the same direction along the axis line direction of the rotating shaft of the horizontal turret assembly is a group, and the step a specifically includes: rotating the ith group of grabbing components to the vertical direction;
the step B specifically comprises the following steps: moving the jth sub-grabbing component of the ith group of grabbing components to the corresponding material sucking position, and pushing away the corresponding flight reach;
the step C is specifically as follows: pressing down the jth sub-grabbing component of the ith group of grabbing components to finish material suction and closing the flight reach;
the step C is followed by: step H: and C, circulating the steps B to C until all the m grabbing components of the ith group of grabbing components finish sucking, wherein j is j +1, and combining the steps B to C into one step when the simultaneous sucking condition is met: pressing down all the sub-grabbing components of the ith group of grabbing components to finish all material suction, and closing the corresponding flight reach;
the step H is followed by: step I: circulating the steps A to H until all the n groups of grabbing components finish sucking materials, wherein i is i-1;
wherein, the initial value of i is n, the initial value of j is 1, and n and m are integers more than 0.
Optionally, the mounting head includes a camera assembly, and the step a is followed by:
step J: when i is less than n, starting the camera assembly, taking a picture of the component sucked by the (i + 1) th group of grabbing assemblies, and performing visual correction;
the step I is followed by:
step K: rotating the 1 st group of grabbing components to the center of the field of view of the camera component;
step L: and starting the camera assembly, taking a picture of the component sucked by the grabbing assembly in the 1 st group, and performing visual correction.
Optionally, the mounting head further includes a downward pressing driving assembly, the downward pressing driving assembly includes a fourth motor and a first driving rod, and the step a is preceded by further including:
and step N: starting the mounting head to enter a material suction working state;
step M: a fourth motor of the press-down driving assembly adjusts the first driving rod to be in the original position;
the step C is specifically as follows: and the fourth motor drives the first driving rod to press down the jth sub-grabbing assembly of the ith group of grabbing assemblies to finish material sucking and close the flight reach.
Optionally, the number of the grabbing assemblies is n, each group of the grabbing assemblies includes m grabbing sub-assemblies, and a row of grabbing sub-assemblies arranged in the same direction along the axis line direction of the rotating shaft of the horizontal turret assembly is a group, and the step D specifically includes: rotating the ith group of grabbing components to the vertical direction;
the step E specifically comprises the following steps: moving the jth sub-grabbing component of the ith group of grabbing components to the corresponding patch position;
the step F specifically comprises the following steps: adjusting the patch angle of the jth sub-grabbing component of the ith group of grabbing components;
the step G specifically comprises the following steps: and pressing the jth sub-grabbing component downwards to finish the paster.
The step G is followed by:
step O: and E-F is circulated until all the m sub-grabbing components of the ith group of grabbing components finish the paster, wherein j is j +1, and the steps E-F can be combined into one step when the condition of simultaneous paster is met: pressing down all the sub-grabbing components of the ith group of grabbing components to finish all the surface mounting;
step P: d, circulating the steps D to O until all the n groups of grabbing components finish the surface mounting, wherein i is i + 1;
wherein, the initial value of i is 1, the initial value of j is 1, and n and m are integers more than 0.
Optionally, the mounting head further includes a downward pressing driving assembly, the downward pressing driving assembly includes a fourth motor and a first driving rod, and the step D further includes, before the step D:
step Q: starting the mounting head to enter a mounting working state;
step R: a fourth motor of the press-down driving assembly adjusts the first driving rod to be in the original position;
the step G specifically comprises the following steps: and the fourth motor drives the first driving rod to press down the jth sub-grabbing component of the ith group of grabbing components to finish the paster.
Optionally, the step G specifically further includes:
the fourth motor drives the first driving rod corresponding to the jth sub-grabbing assembly to return to the original position;
and rotating the jth sub-grabbing assembly to the vertical direction.
Optionally, the mounting head includes a motion controller, and in the steps a to G, the motion controller controls rotation, movement, pressing down, and adjustment of a mounting angle of the grasping assembly.
Optionally, step J specifically includes:
when i is less than n, starting the camera assembly, adjusting the focal length according to the thickness of the chip, and taking a picture of the component sucked by the (i + 1) th group of grabbing assemblies;
calculating the position and angle deviation of the center of the component and the center of the sub-grabbing assembly through an image processing algorithm to finish vision correction;
the step L specifically comprises the following steps:
starting a camera assembly, adjusting the focal length according to the thickness of the chip, and taking a picture of the component sucked by the grabbing assembly in the group 1;
and calculating the position and angle deviation of the center of the component and the center of the sub-grabbing assembly through an image processing algorithm, and performing visual correction.
The application also discloses hypervelocity mounting head, mounting head includes:
the grabbing component is used for rotating, grabbing or mounting components;
a horizontal turret assembly for rotating the gripping assembly to a vertical orientation;
a frame for moving the grasping group;
and the pressing driving assembly is used for pressing the grabbing assembly downwards.
The chip mounting method is simple in steps, the chip mounting angle of the grabbing component can be adjusted, the chip mounting accuracy is improved, and the chip mounting speed of equipment such as a chip mounter is greatly improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a flow chart of a method of patching according to an embodiment of the present application;
FIG. 2 is a suction flow diagram of a patch method according to an embodiment of the present application;
FIG. 3 is a patch flow diagram of a patch method of an embodiment of the present application;
FIG. 4 is a schematic view of a placement head of an embodiment of the present application;
FIG. 5 is an enlarged schematic view of a grasping element of an embodiment of the present application;
FIG. 6 is an enlarged schematic view of a down drive assembly according to an embodiment of the present application;
FIG. 7 is a schematic view of a camera assembly of another embodiment of the present application.
100, a frame; 110. a base; 111. opening a hole; 120. a first upright post; 130. a second upright post; 200. a grasping assembly; 210. a sub-grasping assembly; 211. a turntable; 212. a mounting seat; 213. a drive shaft; 214. a second motor; 215. a second synchronous belt; 216. a rotary joint; 217. a spring; 218. a first pressure bearing sheet; 219. a second pressure bearing sheet; 300. a horizontal turret assembly; 310. a rotating shaft; 320. a first motor; 330. a first synchronization belt; 400. a camera assembly; 410. installing a frame body; 420. a second drive lever; 430. a third motor; 440. a camera; 441. a lens; 442. connecting blocks; 443. a nut block; 450. a first guide rail; 500. a push down drive assembly; 510. a fourth motor; 520. a first drive lever; 530. a bearing; 540. a third synchronous belt; 550. a first connecting member; 560. a second connecting member; 570. a second guide rail.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As another embodiment of the present application, as shown in fig. 1, there is disclosed an ultra high speed pasting method, the pasting head including a grasping assembly, the pasting method including:
step A: rotating the grabbing component to the vertical direction;
and B: moving the grabbing component to a corresponding material sucking position and pushing away a corresponding flight reach;
and C: pressing the grabbing component downwards to complete material suction and closing the flight reach;
step D: rotating the grabbing component to the vertical direction;
step E: moving the grabbing component to a corresponding patch position;
step F: adjusting the paster angle of the grabbing component;
step G: and pressing the grabbing component to complete the surface mounting.
Feeder is a device for providing materials to a mounting head in a chip mounter, and is generally called as a Feeder, a Feeder or a Feeder in the smt (surface mount technology) industry, and is not described herein. The grasping assembly sucks the component from the flight. The chip mounting method is simple in steps, the chip mounting angle of the grabbing component can be adjusted, the chip mounting accuracy is improved, and the chip mounting speed of equipment such as a chip mounter is greatly improved.
The grabbing components are n groups, each group of grabbing components comprises m sub-grabbing components, and a row of sub-grabbing components which are arranged along the axis line direction of the rotating shaft of the horizontal rotating tower component and in the same direction is a group. The step A specifically comprises the following steps: rotating the ith group of grabbing components to the vertical direction. The step B specifically comprises the following steps: and moving the jth sub-grabbing component of the ith group of grabbing components to the corresponding material sucking position, and pushing away the corresponding flight arrival. The step C is specifically as follows: and pressing the jth sub-grabbing component of the ith group of grabbing components to finish material sucking and closing the flight reach.
Specifically, the step C further includes, after the step C: step H: and C, circulating the steps B to C until all the m grabbing components of the ith group of grabbing components finish sucking, wherein j is j +1, and combining the steps B to C into one step when the simultaneous sucking condition is met: pressing down all the sub-grabbing components of the ith group of grabbing components to finish all material suction, and closing the corresponding flight reach; the step H is followed by: step I: and C, circulating the steps A to H until all the n groups of grabbing components finish sucking, wherein i is i-1. Wherein, the initial value of i is n, the initial value of j is 1, and n and m are integers more than 0.
The total number of the grabbing components is n groups, and the value of n can be set into a plurality of groups according to actual needs. Firstly, adjusting the grabbing components of the ith group to be vertical, in the process of material sucking, the value of I is n at the beginning, and in the circulation of the step I, subtracting 1 from the value of I each time to be used as a new value to represent that the next group of grabbing components enters until the 1 st group of grabbing components circularly suck the material (it needs to be correspondingly stated that in the process of patching, the value of I at the beginning is 1, and in the circulation, adding 1 to the value of I each time to be used as a new value). Each group of grabbing components comprises m grabbing components, and the value of j is 1 at first; and D, when the step H is circulated, adding 1 to the value of j every time to serve as a new value, indicating that the next sub-grabbing component in the group enters, and when the m-th sub-grabbing component is circulated to suck materials, completely sucking the materials by all the sub-grabbing components in the group of grabbing components. In this scheme, can snatch a plurality of sub-grabbing subassembly simultaneous control in the subassembly to the multiunit simultaneously and inhale the material, accomplish until whole inhaling the material, inhale that the material is fast, efficient.
Specifically, the mounting head includes a camera assembly, and the step a is followed by: step J: and when i is less than n, starting the camera assembly, adjusting the focal length according to the thickness of the chip, photographing the components sucked by the (i + 1) th group of grabbing assemblies, and performing visual correction. The step I is followed by:
step K: rotating the 1 st group of grabbing components to the center of the field of view of the camera component;
step L: and starting the camera assembly, adjusting the focal length according to the thickness of the chip, taking a picture of the component sucked by the grabbing assembly in the 1 st group, and performing visual correction.
In the scheme, in the process of sucking the materials, the initial value of i is n, when the current i is less than n, the situation that the grabbing assembly which has completed sucking the materials exists before is shown, the grabbing assembly of the (i + 1) th group is shown as the last group of grabbing assembly which is used for grabbing the assembly currently sucking the materials, the last group of grabbing assembly just completes sucking the materials, the camera assembly performs visual correction on the last group, the visual correction is performed after the last group of sucking the materials is ensured, meanwhile, the grabbing assembly of the current group synchronously sucks the materials, the accuracy of the operation steps of sucking the materials is improved, the cycle time of sucking the materials is not occupied, the path of sucking the materials is not increased, the image acquisition and image processing efficiency is improved, and the efficiency of sucking the materials is improved.
Specifically, the mounting head still includes pushes down drive assembly, it includes fourth motor and first actuating lever to push down drive assembly, still include before step A:
and step N: starting the mounting head to enter a material suction working state;
step M: a fourth motor of the press-down driving assembly adjusts the first driving rod to be in the original position;
the step C is specifically as follows: and the fourth motor drives the first driving rod to press down the jth sub-grabbing assembly of the ith group of grabbing assemblies to finish material sucking and close the flight reach.
Before the grabbing component is adjusted, the state of the fourth motor is adjusted, and the pressing operation in the step C is facilitated. As shown in fig. 5, the first drive lever being in the home position means that the end of the first drive lever remote from the fourth motor is between the joint and the rotary shaft. Push down the drive assembly under inoperative condition, first actuating lever is in this initial point position, can not touch joint and pivot, influences the pivot or sub-subassembly of snatching.
Specifically, the step D specifically includes: rotating the ith group of grabbing components to the vertical direction. The step E specifically comprises the following steps: and moving the jth sub-grabbing component of the ith group of grabbing components to the corresponding patch position. The step F specifically comprises the following steps: and adjusting the patch angle of the jth sub-grabbing component of the ith group of grabbing components. The step G specifically comprises the following steps: and pressing the jth sub-grabbing component downwards to finish the paster.
Specifically, the step G further includes, after:
step O: and E-F is circulated until all the m sub-grabbing components of the ith group of grabbing components finish the paster, wherein j is j +1, and the steps E-F can be combined into one step when the condition of simultaneous paster is met: and pressing down all the sub-grabbing components of the ith group of grabbing components to finish all the patches.
Step P: d, the steps D to O are circulated until all the n groups of grabbing components finish the surface mounting, wherein i is i + 1;
wherein, the initial value of i is 1, the initial value of j is 1, and n and m are integers more than 0.
And for the value of i, in the process of sucking the material, the value of i is n at first, and in circulation, the value of i is subtracted by 1 every time to be used as a new value to indicate that the next group of grabbing components is entered. In the process of pasting the patch, the value of i is 1 at the beginning, and in the circulation, 1 is added to the value of i each time to be taken as a new value. Like this, snatch the subassembly and inhaling the in-process of material and paster, the pivoted direction is opposite, prevents to snatch the subassembly and rotate towards same direction always at the in-process of inhaling material and paster and lead to snatching the wire winding scheduling problem of subassembly. In this scheme, can snatch a plurality of sub-grabbing subassembly simultaneous control in the subassembly to the multiunit simultaneously and inhale the material, accomplish until whole inhaling the material, inhale that the material is fast, efficient.
Specifically, the mounting head further comprises a pressing drive assembly, the pressing drive assembly comprises a fourth motor and a first drive rod, and the step D further comprises the following steps:
step Q: starting the mounting head to enter a mounting working state;
step R: a fourth motor of the press-down driving assembly adjusts the first driving rod to be in the original position;
the step G specifically comprises the following steps: and the fourth motor drives the first driving rod to press down the jth sub-grabbing component of the ith group of grabbing components to finish the paster.
Before the grabbing component is adjusted, the state of the fourth motor is adjusted, and the pressing operation in the step C is facilitated.
Specifically, the step G further includes:
the fourth motor drives the first driving rod corresponding to the jth sub-grabbing assembly to return to the original position;
and rotating the jth sub-grabbing assembly to the vertical direction.
The position of the first driving rod and the sub-grabbing component is adjusted, and next material sucking and surface mounting actions are conveniently carried out.
Specifically, the mounting head comprises a motion controller, and in the steps from a to G, the motion controller controls the rotation, movement and pressing of the grabbing component and adjusts the mounting angle of the grabbing component, so that various operation actions of the grabbing component are achieved.
Specifically, the step J specifically includes:
when i is less than n, starting the camera assembly, adjusting the focal length according to the thickness of the chip, and taking a picture of the component sucked by the (i + 1) th group of grabbing assemblies;
calculating the position and angle deviation of the center of the component and the center of the sub-grabbing assembly through an image processing algorithm to finish vision correction;
similarly, the step L specifically includes:
starting a camera assembly, adjusting the focal length according to the thickness of the chip, and taking a picture of the component sucked by the grabbing assembly in the group 1;
and calculating the position and angle deviation of the center of the component and the center of the sub-grabbing assembly through an image processing algorithm, and performing visual correction.
The correction between the center of the component and the center of the sub-grabbing assembly can be simply and conveniently realized through an image processing algorithm, and the accuracy is high.
For the above method, for convenience of understanding, steps a to C of the chip mounting method may be collectively referred to as a suction method, and steps D to G may be collectively referred to as a chip mounting method, and as an example, it is assumed that 4 groups of gripper assemblies (one group of a row of sub gripper assemblies arranged in the same direction along the axis line direction of the rotating shaft of the horizontal turret assembly) are provided, each group of gripper assemblies has 4 sub gripper assemblies, that is, n is 4, m is 4, each sub gripper assembly has a suction nozzle for sucking a component, and there are 12 sub gripper assemblies and suction nozzles in total. Taking this as an example, the specific implementation of the ultra-high speed pasting method of the present application is as follows:
as shown in FIG. 2, the steps A-C of the overall and detailed flow of the method, which are collectively referred to as the suction method, are as follows:
a. starting the mounting head assembly to enter a material suction working state;
b. the motion controller controls all fourth motors of the downward pressing driving components on the mounting heads to drive the first driving rods to return to the original position;
c. the motion controller controls the i-th group of grabbing components on the mounting head to move to the vertical direction; there are 4 sets of grasping elements, so the initial value of i is 4;
d. when i < 4, starting a vision correction thread: the motion controller controls the camera assembly to adjust the focal length and then takes a picture of the components on the (i + 1) th group of grabbing assemblies, and visual correction is completed; for example, when i is 3, the third group is sucking materials, the fourth group is used as the group which starts sucking materials, and the sucking materials are finished, the fourth group is photographed, and the vision correction is finished;
e. the motion controller controls the jth sub-grabbing component of the ith group of the mounting head to move to the material sucking position and push away the corresponding flight reach at the same time; each group of grabbing components has 4 sub grabbing components, and the initial value of j is 1;
f. the motion controller controls a first driving rod corresponding to the jth sub-grabbing component of the mounting head to press down the sub-grabbing component, and a vacuum electromagnetic valve is opened to finish sucking;
g. the motion controller controls a first driving rod corresponding to the jth sub-grabbing component of the mounting head to return to the original point position and close the corresponding flight reach;
h. e-g steps are circulated until all 4 sub-grabbing assemblies on the ith group of sub-grabbing assemblies complete material suction; the value of j is increased by 1 every cycle until the sub-grabbing components completely suck materials;
i. c, the step c to the step h are circulated until all the sub-grabbing assemblies on the 4 groups of grabbing assemblies complete material suction; the value of i is reduced by 1 every cycle until the grabbing component completely sucks the materials;
j. the motion controller controls the 1 st group of grabbing components on the mounting head to the center of the view field of the camera component;
k. starting a vision correction thread: and the motion controller controls the camera assembly to adjust the focal length and then takes a picture of the components on the 1 st group of grabbing assemblies, and visual correction is completed.
As shown in FIG. 3, the steps D-G, collectively referred to as the patch method, are complete and detailed as follows:
1) starting the surface mounting head assembly and entering a surface mounting working state;
2) the motion controller controls all fourth motors of the downward pressing driving components on the mounting heads to drive the first driving rods to return to the original position;
3) the motion controller controls the i-th group of grabbing components on the mounting head to move to the vertical direction; there are 4 sets of grasping elements, so the initial value of i is 1;
4) the motion controller controls the jth sub-grabbing component of the ith group of the mounting head to move to the mounting position and controls the sub-grabbing components to rotate to the mounting angle;
5) the motion controller controls a first driving rod corresponding to the jth sub-grabbing component of the mounting head to press down the sub-grabbing component, and closes the vacuum solenoid valve to complete mounting;
6) the motion controller controls a first driving rod corresponding to the jth sub-grabbing component of the mounting head to return to the original point position, and controls the sub-grabbing components to rotate to the vertical direction;
7) circulating the steps from 4) to 6) until all the 4 sub-grabbing components on the ith group of suction nozzles finish surface mounting; the value of j is increased by 1 every cycle until the sub-grabbing components completely suck materials;
8) circulating the steps 3) to 7) until all the sub-grabbing components on the 4 groups of grabbing components finish the surface mounting; and (4) adding 1 to the value of i once every cycle until the grabbing component completely finishes sucking the materials.
As another embodiment of this application, still disclose a hypervelocity mount head, the mount head includes the subassembly of grabbing that is used for grabbing or pasting the components and parts, is used for rotatory grab subassembly to vertical direction's horizontal capstan head subassembly, be used for moving grab the frame of group, be used for pushing down the drive assembly that pushes down of grabbing the subassembly.
As shown in fig. 4 to 7, as another embodiment of the present application, an ultra-high speed mounting head is disclosed, the mounting head including a frame 100, a grasping assembly 200 for grasping or mounting a component, a horizontal turret assembly 300 provided on the frame 100; the horizontal turret assembly 300 includes a rotating shaft 310, and the gripping assembly 200 is disposed on the rotating shaft 310. Preferably, the rotating shaft 310 may be hollow, and the cable of the grasping assembly 200 and the like may be laid inside the hollow rotating shaft 310.
The mounting head of this application snatchs subassembly 200 and snatchs, transport, pastes dress operation such as to components and parts. The grabbing components 200 are arranged on the rotating shaft 310, and more grabbing components 200 can be arranged along the axial direction of the rotating shaft 310 according to actual needs. According to the mounting head, due to the fact that the special horizontal rotating tower assembly 300 is arranged, the fact that the grabbing assembly 200 is additionally arranged on the rotating shaft 310 can be achieved, and the mounting speed of equipment such as a chip mounter can be greatly improved on the premise that excessive cost is not increased. It should be noted that the mounting head of the present application is not only applicable to a chip mounter, but also applicable to other similar automated equipment fields for assembly and transportation, such as a labeling machine and a reinforcement machine. The mounting head of the application is applied to the fields, can break through the speed bottleneck and can realize ultra-high-speed assembly.
Specifically, the horizontal turret assembly 300 includes a first motor 320, and the first motor 320 is disposed on the frame 100 in a horizontal manner; correspondingly, the rotating shaft 310 is arranged on the rack 100 in a lying manner; the first motor 320 is connected to the rotating shaft 310 and drives the rotating shaft 310 to rotate around the central axis of the rotating shaft 310. The first motor 320 may be connected to the rotation shaft 310 by a first timing belt 330, etc. It should be noted that, as shown in fig. 4, the first motor 320 is disposed horizontally means that the first motor 320 is disposed horizontally on the rack 100, and at this time, the motor shaft of the first motor 320 is also in a horizontal state, rather than in a vertical state with respect to the rack 100. The same reason for the horizontal arrangement of the rotating shaft 310 is not repeated.
The first motor 320 and the pivot 310 of the horizontal turret component 300 of the application are arranged horizontally, the grabbing component 200 is arranged on the pivot 310 arranged horizontally, the grabbing component 200 is vertical to a workbench for grabbing and mounting, therefore, a plurality of groups of grabbing components 200 can be arranged on the pivot 310, and the speed of devices such as a chip mounter is greatly improved.
The frame 100 includes a base 110, a first upright 120, and a second upright 130; the base 110 is respectively connected with the first upright post 120 and the second upright post 130, and the first upright post 120 and the second upright post 130 are oppositely arranged; both ends of the rotating shaft 310 are respectively inserted into the first upright 120 and the second upright 130 in a rotatable manner, and the first motor 320 is connected with one end of the rotating shaft 310. The shaft 310 is inserted into the first and second shafts 120 and 130 and can rotate, and the first motor 320 can rotate the grasping assembly 200 to operate. One or more sets of rotating shafts 310 may be provided as needed, so as to increase the speed of the chip mounter and other equipment. Preferably, there is at least one set of grasping elements 200. Of course, more sets may be provided along the axial direction of the rotating shaft 310 as required.
Specifically, the grabbing assembly 200 comprises a sub grabbing assembly 210 for sucking and pasting materials, and the sub grabbing assembly 210 is arranged on the rotating shaft 310; at least two of the sub-gripper assemblies 210 of each set of gripper assemblies 200. According to the mounting head, a plurality of groups of grabbing components 200 can be arranged on the rotating shaft 310, each group of grabbing components 200 also comprises a sub-grabbing component 210, and each group of grabbing components 200 can be provided with a plurality of sub-grabbing components 210 according to needs, so that the speed of equipment such as a chip mounter can be greatly improved by only increasing the sub-grabbing components 210 without changing the structure of the equipment such as the chip mounter; and the newly-added sub-grabbing component is directly arranged on the original rotating shaft 310, so that the operation is simple and convenient. Preferably, as shown in fig. 6, the sub-grasping assemblies 210 in the same group are arranged on the same plane in the radial direction of the rotating shaft 310, and the sub-grasping assemblies 210 in the same group can grasp or mount components at a time, so that the operation steps and the operation strokes are reduced, and the speed of the chip mounter and other equipment is increased.
The sub-grabbing assembly 210 comprises a turntable 211, a mounting seat 212, a transmission shaft 213 and a second motor 214, wherein the mounting seat 212, the transmission shaft 213 and the second motor 214 are respectively mounted on the turntable 211; the mounting base 212 is used for mounting a grabbing component, the transmission shaft 213 is connected with the second motor 214, and the second motor 214 drives the transmission shaft 213 to rotate around the central axis of the transmission shaft 213 and drives the mounting base 212 to rotate. The drive shaft 213 may be coupled to the second motor 214 via a second timing belt 215, or the like. The second motor 214 drives the mounting base 212 to rotate, so that the angle of the grabbing component on the mounting base 212 can be adjusted, and the grabbing and mounting of the component can be conveniently and accurately carried out. The gripping component can be a suction nozzle, a mechanical arm, etc., but is not limited to these two specific implementations. For example, when the mounting head is used in a placement machine, the pick-up component mounted on the mounting base 212 is typically a suction nozzle. The drive shaft 213 may be a ball spline shaft.
Further, the rack 100 includes a base 110, the mounting head includes a camera assembly 400, the camera assembly 400 is disposed inside the base 110, an opening 111 is disposed on the base 110, the number of the camera assembly 400, the number of the opening 111 and the number of the grabbing assemblies 200 are the same, and the camera assembly 400, the opening 111 and the grabbing assemblies 200 are disposed in a one-to-one correspondence manner. In this scheme, camera module 400, trompil 111 and the one-to-one setting of subassembly 200 of snatching, camera module 400 installs the rear at pivot 310, can be when present a set of subassembly 200 of snatching absorbs components and parts, and last a set of components and parts that snatch on the subassembly 200 of going up on the pivot 310 are shot and the vision is rectified, improves the precision of operating procedure such as paster, neither occupies paster cycle time, can not increase the paster route yet, has improved image acquisition and image processing efficiency.
Specifically, the camera assembly 400 includes a mounting frame 410, a second driving rod 420, a third motor 430, a camera 440, and a first guide rail 450; the motor is connected with the driving rod, the driving rod is connected with the camera 440, and the camera 440 is slidably arranged on the first guide rail 450; the third motor 430 drives the second driving rod 420 to rotate, the second driving rod 420 drives the camera 440 to slide on the first guide rail 450, and the camera 440 corresponds to the opening 111.
The second driving rod 420 can be a screw rod, two ends of the screw rod are installed on the installation frame body 410, the third motor 430 is connected with one end of the screw rod in a transmission mode, the screw rod penetrates through the camera 440, the screw rod is driven by the third motor 430 to rotate, the camera 440 slides on the first guide rail 450, and the focal length adjustment of the camera assembly 400 is achieved. The camera 440 includes a lens 441, and the lens 441 is disposed corresponding to the opening 111. The screw is preferably a ball screw.
Specifically, a connection block 442 is disposed on the top of the camera 440, a nut block 443 is disposed on the connection block 442, the lead screw passes through the nut block 443, and the lead screw may be a ball screw.
The mounting head comprises downward pressing driving components 500, the number of the downward pressing driving components 500 is the same as that of the grabbing components 200, and the downward pressing driving components are arranged above the grabbing components 200 in a one-to-one correspondence mode. The down drive assembly 500 includes a fourth motor 510, a first drive rod 520, and a bearing 530; the fourth motor 510 is mounted on the frame 100, the fourth motor 510 drives the first driving rod 520 to move up and down, and the bearing 530 is mounted at an end of the first driving rod 520 near the rotating shaft 310; the sub-grasping assembly 210 includes a rotary joint 216, a spring 217, and a first bearing piece 218; the bearing plate is arranged on the turntable 211, the transmission shaft 213 penetrates through the first bearing plate 218, the rotary joint 216 is arranged at one end part of the transmission shaft 213 far away from the mounting seat 212, and the spring 217 is arranged between the first bearing plate 218 and the rotary joint 216 and is sleeved on the transmission shaft 213; the bearing 530 is located above the rotary joint 216. The first driving rod 520 presses the rotary joint 216 downwards through the bearing 530, so that the mounting base 212 and the grabbing component move downwards to grab or mount the component, after the action is completed, the first driving rod 520 moves upwards under the driving of the third motor 430, the rotary joint 216 is bounced under the elastic force of the spring 217, and the mounting base 212 and the grabbing part also quickly ascend to complete the action. The setting of bearing 530 can play the cushioning effect, alleviates first actuating lever 520 to rotary joint 216's pressure, guarantees that the components and parts are being difficult to damage in the in-process of snatching or pasting the dress to the snatching part.
When the grabbing part is the suction nozzle, the rotary joint 216 can also be connected with an air pipe used for generating negative pressure and positive pressure, and meanwhile, the air pipe, the rotary joint 216, the transmission shaft 213, the connecting seat and the suction nozzle are communicated with each other to realize that the suction nozzle sucks or loosens components through the negative pressure and the positive pressure generated by the air pipe.
The sub-grasping assembly 210 further includes a second bearing piece 219, and the second bearing piece 219 is mounted on the turntable 211. One end of the transmission shaft 213, which is far away from the rotary joint 216, passes through the second bearing piece 219 and is connected with the mounting seat 212, and the mounting seat 212 is clamped on the second bearing piece 219. When the spring 217 bounces the rotary joint 216, the second bearing piece 219 may limit the position of the mounting base 212 so that the position of the mounting base 212 is maintained at a desired position.
Specifically, as shown in fig. 6, the push down driving assembly 500 further includes a third timing belt 540, a first connector 550, a second connector 560, and a second guide rail 570. The third timing belt 540 is connected to the fourth motor 510, the first connecting member 550 is connected to the third timing belt 540 and the first driving rod 520, the first driving rod 520 is connected to the second connecting member 560, and the second connecting member 560 is slidably connected to the second guide rail 570. In this embodiment, the fourth motor 510 rotates to drive the third synchronous belt 540 and the first connecting member 550, the first connecting member 550 drives the first driving rod 520 to move up and down, and the second connecting member 560 synchronously slides on the second guide rail 570, so as to integrally realize the up and down movement of the first driving rod 520, and then press or loosen the rotary joint 216.
As shown in fig. 4 and 5, the first driving rod 520 extends toward the rotating shaft 310, and one end of the first driving rod 520 close to the rotating shaft 310 is in a zigzag shape so as to bypass the rotating shaft 310 and be located below the rotating shaft 310; wherein an end portion of the first driving lever 520 near an end of the rotation shaft 310 is parallel to the rotation shaft 310, and the bearing 530 is disposed on an end portion of the first driving lever 520 near the end of the rotation shaft 310. This arrangement allows the first driving lever 520 not to obstruct the normal rotation of the sub gripper assembly 210 when the rotary shaft 310 is rotated to switch the sub gripper assembly 210.
In this application, use to apply to the mounter as an example, the pick part of mounter generally adopts the suction nozzle, the complete operation flow that the mounting head absorbs components and parts is: the first motor 320 of the horizontal turret assembly 300 rotates to rotate one sub-gripper assembly 210 of the gripper assemblies 200 to a vertical direction, and at this time, the suction nozzle is also in the vertical direction; then the mounting head moves to the corresponding material sucking position and pushes away the corresponding feeding part to fly (Feeder) at the same time; then, the fourth motor 510 of the downward pressing driving assembly 500 rotates to drive the first driving rod 520 to move downward, so as to press the suction nozzle downward, and the suction nozzle generates negative pressure to suck the component, thereby completing the suction action; then, the fourth motor 510 rotates to drive the first driving rod 520 to move upward to return to the original position, and the corresponding flight path is closed; and so on, repeating the above process for the other sub-gripper assemblies 210 of the group and all the other sub-gripper assemblies 210 of the other group, and finally completing the suction of the nozzles on all the sub-gripper assemblies 210 on the rotating shaft 310. In this process, the camera module 400 synchronously photographs the components on the suction nozzles of the sub-gripper modules 210 of the previous gripper module 200 of the current group, and performs vision correction; when all the sub-grabbing components 210 of the last group of grabbing components 200 completely suck the materials, the camera component 400 photographs the components on the suction nozzles of the sub-grabbing components 210 of the last group of grabbing components 200 and performs vision correction, thereby completing the whole vision correction of the suction nozzles. The complete operation flow of the mounting head for mounting the components is as follows: the steps of patch control are as follows: the first motor 320 of the horizontal turret assembly 300 rotates to rotate one sub-gripper assembly 210 of the gripper assemblies 200 to a vertical direction, and at this time, the suction nozzle is also in the vertical direction; then the mounting head moves to the corresponding mounting position, and simultaneously the third motor 430 rotates the suction nozzle to a proper mounting angle; next, the fourth motor 510 of the downward pressing driving assembly 500 rotates to drive the first driving rod 520 to move downward to press the suction nozzle downward, and mount the component. By analogy, the above process is repeated for the other sub gripper assemblies 210 of the group and all the other sub gripper assemblies 210 of the group, and finally the mounting operation of the nozzles on all the sub gripper assemblies 210 on the rotating shaft 310 is completed. Feeder is a device for providing materials to a mounting head in a chip mounter, and is generally called as a Feeder, a Feeder or a Feeder in the smt (surface mount technology) industry, and is not described herein.
In view of the above-mentioned overall solution, the mounting head of the present application combines the horizontal turret assembly 300 and the camera assembly 400, and has the following advantages:
1) the purpose of expanding a large number of grabbing assemblies 200 is achieved by adding the grabbing assemblies 200 or increasing the number of sub-grabbing assemblies 210 on each group of grabbing assemblies 200 on the rotating shaft 310 of the horizontal turret assembly 300, the working efficiency of equipment of the chip mounter is greatly improved, meanwhile, the equipment does not need to be greatly changed, and the cost is low.
2) The control system of the equipment is simplified, and the cost is saved: taking the example of installing 4 grabbing components 200 on the rotating shaft 310 and installing 4 sub-grabbing components 210 on each grabbing component 200 as an example, only 4 fourth motors 510 and 4 cameras 440 are needed, while a traditional single-row suction nozzle mounting head needs 16 fourth motors 510 and 16 cameras 440, and even if a double-row suction nozzle is used, 8 fourth motors 510 and 8 cameras 440 are needed;
3) the image acquisition and image processing efficiency is improved: the camera assembly 400 installed behind the rotating shaft 310 can photograph and visually correct components on the other group of grabbing assemblies 200 on the rotating shaft 310 while the current group of grabbing assemblies 200 suck chips, so that the time of a chip sticking period is not occupied, and the chip sticking path is not increased.
As another embodiment of the present application, there is also disclosed an ultra-high speed chip mounter including the mounting head as described above.
It should be noted that, the limitations of each step in the present disclosure are not considered to limit the order of the steps without affecting the implementation of the specific embodiments, and the steps written in the foregoing may be executed first, or executed later, or even executed simultaneously, and as long as the present disclosure can be implemented, all the steps should be considered as belonging to the protection scope of the present application.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.

Claims (10)

1. An ultra-high speed pasting method, wherein the pasting head comprises a grabbing component, the pasting method comprises:
step A: rotating the grabbing component to the vertical direction;
and B: moving the grabbing component to a corresponding material sucking position and pushing away a corresponding flight reach;
and C: pressing the grabbing component downwards to complete material suction and closing the flight reach;
step D: rotating the grabbing component to the vertical direction;
step E: moving the grabbing component to a corresponding patch position;
step F: adjusting the paster angle of the grabbing component;
step G: and pressing the grabbing component to complete the surface mounting.
2. The ultra-high speed pasting method according to claim 1, wherein said plurality of said gripping members comprises n groups, each group of said gripping members comprises m sub-gripping members, and a row of sub-gripping members arranged in the same direction along the axial center line of the rotating shaft of said horizontal turret member is a group, said step a is specifically: rotating the ith group of grabbing components to the vertical direction;
the step B specifically comprises the following steps: moving the jth sub-grabbing component of the ith group of grabbing components to the corresponding material sucking position, and pushing away the corresponding flight reach;
the step C is specifically as follows: pressing down the jth sub-grabbing component of the ith group of grabbing components to finish material suction and closing the flight reach;
the step C is followed by: step H: and C, circulating the steps B to C until all the m grabbing components of the ith group of grabbing components finish sucking, wherein j is j +1, and combining the steps B to C into one step when the simultaneous sucking condition is met: pressing down all the sub-grabbing components of the ith group of grabbing components to finish all material suction, and closing the corresponding flight reach;
the step H is followed by: step I: circulating the steps A to H until all the n groups of grabbing components finish sucking materials, wherein i is i-1;
wherein, the initial value of i is n, the initial value of j is 1, and n and m are integers more than 0.
3. The ultra high speed pasting method according to claim 2, wherein said pasting head includes a camera assembly, and said step a is followed by the steps of:
step J: when i is less than n, starting the camera assembly, taking a picture of the component sucked by the (i + 1) th group of grabbing assemblies, and performing visual correction;
the step I is followed by:
step K: rotating the 1 st group of grabbing components to the center of the field of view of the camera component;
step L: and starting the camera assembly, taking a picture of the component sucked by the grabbing assembly in the 1 st group, and performing visual correction.
4. An ultra high speed pasting method according to claim 2 wherein said pasting head further comprises a push-down driving assembly, said push-down driving assembly comprising a fourth motor and a first driving rod, said step a being preceded by:
and step N: starting the mounting head to enter a material suction working state;
step M: a fourth motor of the press-down driving assembly adjusts the first driving rod to be in the original position;
the step C is specifically as follows: and the fourth motor drives the first driving rod to press down the jth sub-grabbing assembly of the ith group of grabbing assemblies to finish material sucking and close the flight reach.
5. The ultra-high speed pasting method according to claim 1, wherein said plurality of said gripper assemblies comprises n groups, each group of said gripper assemblies comprises m sub gripper assemblies, and one row of said sub gripper assemblies arranged in the same direction along the axial center line of said rotating shaft of said horizontal turret assembly is a group, said step D comprises: rotating the ith group of grabbing components to the vertical direction;
the step E specifically comprises the following steps: moving the jth sub-grabbing component of the ith group of grabbing components to the corresponding patch position;
the step F specifically comprises the following steps: adjusting the patch angle of the jth sub-grabbing component of the ith group of grabbing components;
the step G specifically comprises the following steps: pressing the jth sub-grabbing component downwards to finish the surface mounting;
the step G is followed by:
step 0: and E-F is circulated until all the m sub-grabbing components of the ith group of grabbing components finish the paster, wherein j is j +1, and the steps E-F can be combined into one step when the condition of simultaneous paster is met: pressing down all the sub-grabbing components of the ith group of grabbing components to finish all the surface mounting;
step P: d-0 is circulated until all the n groups of grabbing components finish the surface mounting, wherein i is i + 1;
wherein, the initial value of i is 1, the initial value of j is 1, and n and m are integers more than 0.
6. The ultra high speed pasting method according to claim 5 wherein said pasting head further comprises a push-down driving assembly, said push-down driving assembly comprising a fourth motor and a first driving rod, said step D being preceded by:
step Q: starting the mounting head to enter a mounting working state;
step R: a fourth motor of the press-down driving assembly adjusts the first driving rod to be in the original position;
the step G specifically comprises the following steps: and the fourth motor drives the first driving rod to press down the jth sub-grabbing component of the ith group of grabbing components to finish the paster.
7. The ultra high speed pasting method according to claim 6, wherein said step G further comprises:
the fourth motor drives the first driving rod corresponding to the jth sub-grabbing assembly to return to the original position;
and rotating the jth sub-grabbing assembly to the vertical direction.
8. An ultra high speed pasting method according to claim 1, wherein said pasting head comprises a motion controller, and in said steps a to G, said motion controller controls the rotation, movement, pressing down and adjustment of the pasting angle of the gripper assembly.
9. The ultra high speed pasting method according to claim 1, wherein said step J is specifically:
when i is less than n, starting the camera assembly, adjusting the focal length according to the thickness of the chip, and taking a picture of the component sucked by the (i + 1) th group of grabbing assemblies;
calculating the position and angle deviation of the center of the component and the center of the sub-grabbing assembly through an image processing algorithm to finish vision correction;
the step L specifically comprises the following steps:
starting a camera assembly, adjusting the focal length according to the thickness of the chip, and taking a picture of the component sucked by the grabbing assembly in the group 1;
and calculating the position and angle deviation of the center of the component and the center of the sub-grabbing assembly through an image processing algorithm, and performing visual correction.
10. An ultra-high speed mounting head, characterized in that the mounting head comprises:
the grabbing component is used for rotating, grabbing or mounting components;
a horizontal turret assembly for rotating the gripping assembly to a vertical orientation;
a frame for moving the grasping group;
and the pressing driving assembly is used for pressing the grabbing assembly downwards.
CN202010341460.6A 2020-04-26 2020-04-26 Ultra-high-speed chip mounting method and chip mounting head Active CN111343847B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010341460.6A CN111343847B (en) 2020-04-26 2020-04-26 Ultra-high-speed chip mounting method and chip mounting head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010341460.6A CN111343847B (en) 2020-04-26 2020-04-26 Ultra-high-speed chip mounting method and chip mounting head

Publications (2)

Publication Number Publication Date
CN111343847A true CN111343847A (en) 2020-06-26
CN111343847B CN111343847B (en) 2021-06-11

Family

ID=71186491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010341460.6A Active CN111343847B (en) 2020-04-26 2020-04-26 Ultra-high-speed chip mounting method and chip mounting head

Country Status (1)

Country Link
CN (1) CN111343847B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111556706A (en) * 2020-04-26 2020-08-18 方强 Superspeed mounting head and chip mounter
CN114538088A (en) * 2022-02-11 2022-05-27 珠海市运泰利自动化设备有限公司 High-speed high-precision feeding and discharging method based on flying shooting

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101630083B (en) * 2008-07-18 2011-06-22 乐金显示有限公司 Integrated film peeling and mounting device method for manufacturing liquid crystal display device using the same
WO2016059679A1 (en) * 2014-10-14 2016-04-21 富士機械製造株式会社 Component suction position correction system and component suction position correction method for rotary head type component mounting device
CN106982547A (en) * 2017-05-23 2017-07-25 江苏华志珹智能科技有限公司 A kind of SMT chip mounters multi-axial Simultaneous method for fetching control method
CN209546237U (en) * 2018-12-26 2019-10-25 苏州河图电子科技有限公司 A kind of laminator mounting head mechanism with fine position function
CN210351813U (en) * 2019-06-05 2020-04-17 深圳市诺泰自动化设备有限公司 Turret type chip mounter

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004015848A1 (en) * 2004-03-31 2005-10-27 Siemens Ag Method and turret-type placement head for mounting substrates with electrical components
JP2007200914A (en) * 2005-12-26 2007-08-09 Murata Mfg Co Ltd Head and apparatus for packaging component
JP2010028032A (en) * 2008-07-24 2010-02-04 Panasonic Corp Electronic component packaging apparatus
CN102711388B (en) * 2012-04-13 2016-08-31 中国科学院合肥物质科学研究院 A kind of module type high speed mounting head for LED attachment
CN106292525B (en) * 2015-05-14 2019-09-10 广东木几智能装备有限公司 A kind of control system of chip mounting machine and method of the visual identity of both arms bull
JP6500229B2 (en) * 2015-07-31 2019-04-17 パナソニックIpマネジメント株式会社 Electronic component mounting device
US10056278B2 (en) * 2016-08-22 2018-08-21 Asm Technology Singapore Pte Ltd Apparatus and method for transferring electronic devices
CN209787739U (en) * 2019-01-11 2019-12-13 博众精工科技股份有限公司 high-speed high-precision mounting head
CN110213906A (en) * 2019-06-05 2019-09-06 深圳市诺泰自动化设备有限公司 A kind of chip shooter machine
CN110996647A (en) * 2019-12-31 2020-04-10 易瑞璋 Five-axis linkage chip mounter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101630083B (en) * 2008-07-18 2011-06-22 乐金显示有限公司 Integrated film peeling and mounting device method for manufacturing liquid crystal display device using the same
WO2016059679A1 (en) * 2014-10-14 2016-04-21 富士機械製造株式会社 Component suction position correction system and component suction position correction method for rotary head type component mounting device
CN106982547A (en) * 2017-05-23 2017-07-25 江苏华志珹智能科技有限公司 A kind of SMT chip mounters multi-axial Simultaneous method for fetching control method
CN209546237U (en) * 2018-12-26 2019-10-25 苏州河图电子科技有限公司 A kind of laminator mounting head mechanism with fine position function
CN210351813U (en) * 2019-06-05 2020-04-17 深圳市诺泰自动化设备有限公司 Turret type chip mounter

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
张坤: "多头垂直旋转式贴片机贴装工艺优化研究", 《中国优秀硕士学位论文全文数据库信息科技辑》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111556706A (en) * 2020-04-26 2020-08-18 方强 Superspeed mounting head and chip mounter
CN111556706B (en) * 2020-04-26 2021-09-07 方强 Superspeed mounting head and chip mounter
CN114538088A (en) * 2022-02-11 2022-05-27 珠海市运泰利自动化设备有限公司 High-speed high-precision feeding and discharging method based on flying shooting
CN114538088B (en) * 2022-02-11 2024-02-13 珠海市运泰利自动化设备有限公司 High-speed high-precision material taking and placing method based on fly shooting

Also Published As

Publication number Publication date
CN111343847B (en) 2021-06-11

Similar Documents

Publication Publication Date Title
CN111343847B (en) Ultra-high-speed chip mounting method and chip mounting head
CN107305916B (en) A kind of chip mounter and its processing technology of CSP encapsulation LED
CN102324393A (en) Large format is opened dress RFID upside-down mounting pasting method and device
CN109451720B (en) Automatic shaping and plug-in components equipment of DIP chip pin
US8091216B2 (en) Electronic parts mounting apparatus and electronic parts mounting method
CN115249758A (en) Pixel die bonder
CN111148360A (en) Automatic board feeding mechanism based on CCD positioning and circuit board manufacturing equipment
CN115332601A (en) Power battery lamination stacking machine
CN105744756B (en) A kind of flexible cable is tensioned clipping electronic component patch and inserts operation head and its patch insert method
JP2006324395A (en) Surface-mounting machine
CN105611748B (en) A kind of electronic element patch plug and its patch insert method
CN202275808U (en) Large-breadth mounted radio frequency identification device (RFID) flip chip device
CN108455276B (en) Automatic change charging equipment
KR101372503B1 (en) Chip transfer apparatus and method for controlling the apparatus
CN111556706B (en) Superspeed mounting head and chip mounter
CN112917148B (en) Control assembly assembling equipment of environment-friendly air purifier
JP5047772B2 (en) Mounting board manufacturing method
CN113071909A (en) Automatic sheet arranging machine for high-precision prisms
CN206074993U (en) A kind of semi-automatic exposure production line
CN207890060U (en) A kind of microcomponent material place machine
CN107181377B (en) Motor stator plug-in components machine
JP2534410B2 (en) Parts mounting device
JP4628661B2 (en) DIE PICKUP DEVICE AND DIE PICKUP METHOD
JP2863742B2 (en) Electronic component mounting equipment
CN112911921B (en) Assembly process of control assembly of environment-friendly air purifier

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant