CN111343779A

CN111343779A - Back drilling hole performance detection method

Info

Publication number: CN111343779A
Application number: CN202010123920.8A
Authority: CN
Inventors: 张学平; 刘喜科; 戴晖
Original assignee: MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Current assignee: MEIZHOU ZHIHAO ELECTRONIC-TECH CO LTD
Priority date: 2020-02-27
Filing date: 2020-02-27
Publication date: 2020-06-26
Anticipated expiration: 2040-02-27
Also published as: CN111343779B

Abstract

The invention discloses a back drilling hole performance detection method, which comprises the steps of selecting a corresponding three-dimensional simulation model from a model library, wherein the three-dimensional simulation model is provided with a detection hole consistent with the back drilling hole structure of a PCB to be detected; and detecting the back drilling depth of the PCB by adopting the detection hole of the three-dimensional simulation model. The method for detecting the performance of the back drilling hole can accurately judge the quality of the back drilling hole, namely judge whether the back drilling hole has the problem of insufficient back drilling depth or excessive back drilling depth, and ensure that the quality of the back drilling hole is effectively detected and controlled.

Description

Back drilling hole performance detection method

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a back drilling hole performance detection method.

Background

With the continuous push of the information-based industry, the faster and faster transmission speed and higher frequency of digital signals, and the application of high-power supply and discharge devices, the printed circuit board with the traditional design cannot meet the requirement of such high-frequency circuit, so that some switch manufacturers with leading technology begin and pay more attention to the integrity transmission research of signals. Currently, it is proved in research that the part of the PTH (plated Through Hole, or plated Through Hole) without via copper has a great influence on the signal transmission of the PCB. Specifically, in the PCB manufacturing process, the plated through holes can be regarded as lines, and the ends of some plated through holes cannot be connected, which will cause the signal to be folded back, and the resonance thereof will also be reduced, so that the signal transmission may be reflected, scattered, delayed, etc. to affect the signal problem, and finally cause the signal distortion. The back drilling process is proposed to remove the via segment that does not serve any connection or transmission function, so as to solve the signal transmission problem. However, in quality control of the back-drilling process, back-drilling depth control is a critical factor affecting signal integrity. The residual copper in the back drilling hole is expected to be as short as possible, but the depth of the back drilling hole is inevitably deviated due to the inter-axis depth difference, the plate thickness deviation and the like of the drilling machine, and in addition, the problem that the back drilling hole is drilled or not drilled cannot be judged in the actual production of the PCB, namely the quality of the back drilling hole cannot be effectively detected and controlled.

Disclosure of Invention

The invention provides a back drilling hole performance detection method, which aims to overcome the defects in the prior art.

In order to achieve the above purpose, the present invention provides the following technical solutions:

a method of backdrilling performance detection, the method comprising:

selecting a corresponding three-dimensional simulation model from a model library, wherein the three-dimensional simulation model is provided with a detection hole consistent with the back drilling hole structure of the PCB to be detected;

and detecting the back drilling depth of the PCB by adopting the detection hole of the three-dimensional simulation model.

Further, in the back-drilled hole performance detection method, before the step of selecting a corresponding three-dimensional simulation model from a model library, where the three-dimensional simulation model has detection holes consistent with the back-drilled hole structure of the PCB to be detected, the method further includes:

and modeling according to engineering data, manufacturing a three-dimensional simulation model consistent with the PCB structure to be detected in advance, and storing the three-dimensional simulation model in a model library.

Further, in the back drilling hole performance detection method, the step of modeling according to engineering data and manufacturing a three-dimensional simulation model consistent with the structure of the back drilled PCB board includes:

determining the structural layout of each layer according to engineering data, and obtaining a three-dimensional simulation model consistent with the structure of the PCB to be detected through modeling;

manufacturing a detection hole consistent with the back drilling hole structure of the PCB to be detected on the three-dimensional simulation model;

and storing the three-dimensional simulation model into a model library.

Further, in the back-drilling performance detection method, the step of detecting the back-drilling depth of the PCB board by using the detection hole of the three-dimensional simulation model includes:

reading the detection depth of the back drilling hole through the detection hole on the three-dimensional simulation model;

controlling the testing equipment to detect whether the hole wall position in the back drilling hole, which is larger than the detection depth, is short-circuited and to detect whether the hole wall position in the back drilling hole, which is smaller than or equal to the detection depth, is open-circuited;

if the hole wall position detection in the back drill hole which is larger than the detection depth is a short circuit and the hole wall position detection in the back drill hole which is smaller than or equal to the detection depth is an open circuit, determining that the performance of the back drill hole is qualified;

and if the hole wall position detection in the back drilling hole which is larger than the detection depth is not short circuit and/or the hole wall position detection in the back drilling hole which is smaller than or equal to the detection depth is not open circuit, determining that the performance of the back drilling hole is unqualified.

Further, in the back-drilling hole performance detection method, the test equipment performs detection of open circuits and short circuits by using a resistance measurement method.

The method for detecting the performance of the back drilling hole, provided by the embodiment of the invention, can accurately judge the quality of the back drilling hole, namely judge whether the back drilling hole has the problem of insufficient back drilling depth or excessive back drilling depth, and ensure that the quality of the back drilling hole is effectively detected and controlled.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic flow chart of a back hole performance detection method according to an embodiment of the present invention;

FIG. 2 is a diagram of a back drilled hole qualification provided by an embodiment of the invention;

FIG. 3 is an exemplary illustration of a back drilled hole failing according to an embodiment of the present invention;

fig. 4 is an exemplary illustration of a back-drilled hole failing according to an embodiment of the present invention.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the description of the present invention, it is to be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present.

Furthermore, the terms "long", "short", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of describing the present invention, but do not indicate or imply that the referred devices or elements must have the specific orientations, be configured to operate in the specific orientations, and thus are not to be construed as limitations of the present invention.

The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached drawings.

Example one

Referring to fig. 1, a flow chart of a method for detecting a performance of a back drill according to an embodiment of the present invention is shown. The method specifically comprises the following steps:

s101, selecting a corresponding three-dimensional simulation model from a model library, wherein the three-dimensional simulation model is provided with a detection hole consistent with a back drilling hole structure of a PCB to be detected;

s102, detecting the back drilling depth of the PCB by the detection hole of the three-dimensional simulation model.

Preferably, before the step of selecting a corresponding three-dimensional simulation model from the model library, the three-dimensional simulation model having a detection hole consistent with the back drilling structure of the PCB to be detected, the method further includes:

Preferably, the step of modeling according to engineering data and manufacturing a three-dimensional simulation model consistent with the structure of the back-drilled PCB board comprises:

and storing the three-dimensional simulation model into a model library.

Preferably, the step of detecting the back drilling depth of the PCB board by using the detection hole of the three-dimensional simulation model includes:

Preferably, the test device employs resistance measurement for open and short circuit detection, similar to the manner in which a multimeter is manually used for measurement.

Specifically, referring to fig. 2, fig. 2 is an exemplary diagram of a qualified back-drilled hole, in fig. 2, a hole copper from the S-side to the LA +1 layer is drilled away, and a line from the L1 layer to the LA layer on the C-side is reserved, at this time, when the test equipment is controlled to perform open-short circuit detection, the test LA +1 layer is open, the test LA layer is short, and the result is that the back-drilled hole is qualified; for the case of insufficient back drilling depth and too much back drilling depth, reference may be made to fig. 3 and 4, respectively; in fig. 3, when the back drilling depth is not enough, the hole copper of the LA +1 layer is not completely drilled away, which results in short circuit when testing the LA +1 layer, and the LA layer is also short circuit, i.e. the back drilling hole is not qualified as a result; in fig. 4, when the backdrill depth is too old, the line portion of the LA layer is drilled away, resulting in an open circuit when testing the LA layer, and an open circuit when testing the LA +1 layer, i.e., resulting in a failed backdrill hole.

The foregoing description of the embodiments has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the disclosure. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same elements or features may also vary in many respects. Such variations are not to be regarded as a departure from the disclosure, and all such modifications are intended to be included within the scope of the disclosure.

Example embodiments are provided so that this disclosure will be thorough and will fully convey the scope to those skilled in the art. Numerous details are set forth, such as examples of specific parts, devices, and methods, in order to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms and that neither should be construed to limit the scope of the disclosure. In certain example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises" and "comprising" are intended to be inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed and illustrated, unless explicitly indicated as an order of performance. It should also be understood that additional or alternative steps may be employed.

When an element or layer is referred to as being "on" … … "," engaged with "… …", "connected to" or "coupled to" another element or layer, it can be directly on, engaged with, connected to or coupled to the other element or layer, or intervening elements or layers may also be present. In contrast, when an element or layer is referred to as being "directly on … …," "directly engaged with … …," "directly connected to" or "directly coupled to" another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship of elements should be interpreted in a similar manner (e.g., "between … …" and "directly between … …", "adjacent" and "directly adjacent", etc.). As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region or section from another element, component, region or section. Unless clearly indicated by the context, use of terms such as the terms "first," "second," and other numerical values herein does not imply a sequence or order. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

Spatially relative terms, such as "inner," "outer," "below," "… …," "lower," "above," "upper," and the like, may be used herein for ease of description to describe a relationship between one element or feature and one or more other elements or features as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the example term "below … …" can encompass both an orientation of facing upward and downward. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted.

Claims

1. A method of backdrilling performance detection, the method comprising:

2. The backdrilling performance testing method of claim 1, wherein prior to the step of selecting a corresponding three-dimensional simulation model from a model library, the three-dimensional simulation model having test holes that are consistent with the backdrilling configuration of the PCB board to be tested, the method further comprises:

3. The back-drilled hole performance testing method of claim 2, wherein the step of modeling according to engineering data and making a three-dimensional simulation model consistent with the structure of the back-drilled PCB board comprises:

and storing the three-dimensional simulation model into a model library.

4. The method for detecting the back drilling performance of the PCB of claim 1, wherein the step of detecting the back drilling depth of the PCB by using the detection holes of the three-dimensional simulation model comprises the following steps:

5. The backdrilling performance testing method of claim 4, wherein the testing device employs resistance measurements for open and short circuit testing.