CN111328211A - Temperature curve prediction system and method - Google Patents
Temperature curve prediction system and method Download PDFInfo
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- CN111328211A CN111328211A CN201811535316.5A CN201811535316A CN111328211A CN 111328211 A CN111328211 A CN 111328211A CN 201811535316 A CN201811535316 A CN 201811535316A CN 111328211 A CN111328211 A CN 111328211A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The temperature curve prediction system obtains a K value corresponding to each temperature measuring point of each temperature measuring plate temperature curve by a lumped thermal capacitance formula through the temperature measured by each temperature measuring point during the period that the offline temperature measuring plate is conveyed from a plate inlet area to a plate outlet area of the reflow soldering machine through a first temperature sensing unit arranged in each temperature area in the reflow soldering machine and a plurality of second temperature sensing units arranged on the offline temperature measuring plate; after the printed circuit board is transmitted to a board outlet area of the reflow soldering machine, reverse calculation is carried out through the K values and the preset initial temperature through a lumped thermal capacitance method formula, so that the predicted temperature of different positions on the printed circuit board at each predicted time point is obtained, and the temperature curves of different positions of each printed circuit board in the reflow soldering process are predicted and recorded.
Description
Technical Field
The present application relates to a prediction system and a method thereof, and more particularly, to a temperature curve prediction system and a method thereof.
Background
Reflow soldering is one of the important links in the process of producing printed circuit boards. In the reflow soldering process, the temperature curve of the key position of the printed circuit board needs to be paid attention to, and the correct temperature curve can ensure good soldering quality. The method for acquiring the temperature curve of the key position of the printed circuit board in the actual production of the printed circuit board at present can comprise the following steps: mounting a temperature measuring line on the same printed circuit board as the printed circuit board expected to be produced at a specific position; connecting the plurality of temperature measuring lines to a temperature measuring instrument to manufacture a temperature measuring plate; welding the temperature measuring plate by a reflow soldering machine according to a normal production flow, and recording a temperature curve of a specific position of the printed circuit board in the reflow soldering process by a thermodetector; and compiling the plurality of temperature curves from the thermodetector.
The method is suitable for regular sampling detection, and the method cannot really record the temperature curve of the specific position of each printed circuit board in the reflow soldering process, so that the produced printed circuit board cannot be ensured to have good soldering quality.
In summary, it is known that the prior art cannot record the temperature curve of each specific position of the pcb during the reflow soldering process, and thus cannot ensure that the produced pcb has good soldering quality, and therefore an improved technical solution is needed to solve the problem.
Disclosure of Invention
The application discloses a temperature curve prediction system and a method thereof.
First, the present application discloses a temperature profile prediction system, comprising: a control module, a temperature measurement module, a processing module and a prediction module. The control module is used for controlling a conveying chain of the reflow soldering machine to convey an offline temperature measuring plate or a printed circuit board from a plate inlet area to a plate outlet area of the reflow soldering machine, wherein the offline temperature measuring plate comprises a plurality of second temperature sensing units, a plurality of temperature measuring time points are arranged during the period that the offline temperature measuring plate is conveyed from the plate inlet area to the plate outlet area of the reflow soldering machine, the time intervals between any two adjacent temperature measuring time points are the same, and each second temperature sensing unit is used for measuring the temperature of the position of the second temperature sensing unit at each temperature measuring time point so as to obtain the corresponding temperatureThe temperature curve of the temperature measuring board has a plurality of prediction time points during the period that the printed circuit board is conveyed from the board inlet area to the board outlet area of the reflow soldering machine, the time intervals between any two adjacent prediction time points are the same, the prediction time points correspond to the temperature measuring time points, and the time intervals between any two adjacent prediction time points are the same as the time intervals between any two adjacent temperature measuring time points. The temperature measuring module comprises a plurality of first temperature sensing units, the first temperature sensing units are arranged in a plurality of temperature zones of the reflow soldering machine in a one-to-one mode, and each first temperature sensing unit is used for measuring the temperature of the corresponding temperature zone at each temperature measuring time point so as to obtain a corresponding first temperature zone temperature curve; and measuring the temperature of the corresponding temperature zone at each predicted time point to obtain a corresponding temperature curve of the second temperature zone. After the off-line temperature measuring board is conveyed to the board outlet area of the reflow soldering machine, the processing module is used for processing the temperature curve of each temperature measuring board through the lumped heat capacity formula
Performing a parameterization procedure to obtain a K value corresponding to each temperature measuring time point, wherein t is the temperature of the temperature zone of each second temperature sensing unit at the next temperature measuring time point, and t is the temperature of the temperature zone of the next temperature measuring time point0The temperature t measured by each second temperature sensing unit at the current temperature measuring time point∞τ is a time interval between two adjacent temperature measurement time points, where τ is a temperature measured by each first temperature sensing unit at the current temperature measurement time point. After the printed circuit board is conveyed to a board outlet area of the reflow soldering machine, the prediction module is used for carrying out reverse calculation through the lumped thermal capacitance method according to a K value corresponding to each temperature measuring time point of each temperature measuring board temperature curve obtained by the processing module and a preset initial temperature so as to obtain the predicted temperature of different positions on the printed circuit board at each predicted time point and further obtain the printed circuit board temperature curves corresponding to different positions on the printed circuit board, wherein the different positions on the printed circuit board are the configuration positions corresponding to the plurality of second temperature sensing units on the offline temperature measuring board.
In addition, the present application discloses a temperature profile preThe measuring method comprises the following steps: providing a temperature curve prediction system which comprises a control module, a temperature measurement module, a processing module and a prediction module, wherein the temperature measurement module comprises a plurality of first temperature sensing units which are arranged in a plurality of temperature areas of the reflow soldering machine in a one-to-one mode; the control module controls a conveying chain of the reflow soldering machine to convey the offline temperature measuring plate from the plate inlet area to the plate outlet area of the reflow soldering machine, wherein the offline temperature measuring plate comprises a plurality of second temperature sensing units, a plurality of temperature measuring time points are arranged during the period that the offline temperature measuring plate is conveyed from the plate inlet area to the plate outlet area of the reflow soldering machine, and the time intervals between any two adjacent temperature measuring time points are the same; each second temperature sensing unit measures the temperature of the position of the second temperature sensing unit at each temperature measuring time point so as to obtain a corresponding temperature curve of the temperature measuring plate; each first temperature sensing unit measures the temperature of the corresponding temperature zone at each temperature measuring time point so as to obtain a corresponding first temperature zone temperature curve; after the off-line temperature measuring plates are conveyed to the plate outlet area of the reflow soldering machine, the processing module group passes the temperature curve of each temperature measuring plate through the lumped heat capacity formula
Performing a parameterization procedure to obtain a K value corresponding to each temperature measuring time point, wherein t is the temperature of each second temperature sensing unit in the temperature zone of the next temperature measuring time point, t is the temperature of each second temperature sensing unit in the temperature zone of the next temperature measuring time point0The temperature t measured by each second temperature sensing unit at the current temperature measuring time point∞Tau is the time interval between two adjacent temperature measuring time points for the temperature measured by each first temperature sensing unit at the current temperature measuring time point; the control module controls the conveying chain of the reflow soldering machine to convey the printed circuit board from the board inlet area to the board outlet area of the reflow soldering machine, wherein a plurality of prediction time points are arranged during the period that the printed circuit board is conveyed from the board inlet area to the board outlet area of the reflow soldering machine, the time intervals between any two adjacent prediction time points are the same, the prediction time points correspond to the temperature measurement time points, and the time intervals between any two adjacent prediction time points are the same as the time intervals between any two adjacent temperature measurement time points; each first temperature sensing unit is arranged inMeasuring the temperature of the corresponding temperature zone at each prediction time point to obtain a corresponding second temperature zone temperature curve; and after the printed circuit board is conveyed to a board outlet area of the reflow soldering machine, the prediction module reversely calculates the K value corresponding to each temperature measuring time point and the preset initial temperature according to each temperature measuring board temperature curve obtained by the processing module through the lumped thermal capacitance method formula so as to obtain the predicted temperature of different positions on the printed circuit board at each predicted time point and further obtain the printed circuit board temperature curves corresponding to different positions on the printed circuit board, wherein the different positions on the printed circuit board are the configuration positions corresponding to the plurality of second temperature sensing units on the offline temperature measuring board.
The system and method disclosed in the present application are different from the prior art in that the K value corresponding to each temperature measuring point of each temperature measuring board temperature curve is obtained by the lumped thermal capacitance formula through the temperature measured at each temperature measuring point during the period that the offline temperature measuring board is conveyed from the board entering area to the board exiting area of the reflow soldering machine by the first temperature sensing unit arranged in each temperature area in the reflow soldering machine and the plurality of second temperature sensing units arranged on the offline temperature measuring board; after the printed circuit board is transmitted to a board outlet area of the reflow soldering machine, reverse calculation is carried out according to the K values and the preset initial temperature through a lumped thermal capacitance method formula, so that the predicted temperature of the printed circuit board at each predicted time point at different positions is obtained.
Through the technical means, the temperature curves of different positions of each printed circuit board in the reflow soldering process can be predicted and recorded.
Drawings
FIG. 1 is a system block diagram of an embodiment of a temperature profile prediction system of the present application;
fig. 2A-2B are flow charts illustrating an embodiment of a method for performing a temperature profile prediction method by the temperature profile prediction system of fig. 1.
Description of reference numerals:
30 first temperature sensing unit
50 board sensor module advances
60 go out board sensing module
70 chain speed sensing module
100 temperature curve prediction system
110 control module
120 temperature measurement module
130 processing module
140 prediction module
Detailed Description
The embodiments of the present application will be described in detail with reference to the drawings and examples, so that how to implement the technical means for solving the technical problems and achieving the technical effects of the present application can be fully understood and implemented.
Referring to fig. 1, fig. 1 is a system block diagram of an embodiment of a temperature profile prediction system 100 according to the present application, which may include: the temperature measuring module 120 is connected with the control module 110, the temperature measuring module 120, the processing module 130 and the prediction module 140, the prediction module 140 is connected with the control module 110 and the temperature measuring module 120, the temperature measuring module 120 comprises a plurality of first temperature sensing units 30, and the plurality of first temperature sensing units 30 are arranged in a plurality of temperature zones of a reflow soldering machine (not drawn) in a one-to-one manner for measuring the temperatures of the corresponding temperature zones. In the present embodiment, the number of the first temperature sensing units 30 may be, but is not limited to, 12, and may be adjusted according to actual requirements. To avoid the complexity of the drawing, only 3 first temperature sensing units 30 are shown in fig. 1.
Referring to fig. 1, fig. 2A and fig. 2B, fig. 2A to fig. 2B are flowcharts illustrating an embodiment of a method for performing a temperature curve prediction method by the temperature curve prediction system of fig. 1, the method comprising: providing a temperature curve prediction system, which comprises a control module, a temperature measurement module, a processing module and a prediction module, wherein the temperature measurement module comprises a plurality of first temperature sensing units, and the first temperature sensing units are arranged in a plurality of temperature areas of the reflow soldering machine in a one-to-one manner (step 210); the control module controls a conveying chain of the reflow soldering machine to convey an offline temperature measuring plate from a plate inlet area to a plate outlet area of the reflow soldering machine, wherein the offline temperature measuring plate comprises a plurality of temperature measuring platesA second temperature sensing unit having a plurality of temperature measurement time points during the period that the offline temperature measurement board is conveyed from the board entering area to the board exiting area of the reflow soldering machine, wherein the time intervals between any two adjacent temperature measurement time points are the same (step 220); each second temperature sensing unit measures the temperature of the position thereof at each temperature measuring time point to obtain a corresponding temperature curve of the temperature measuring plate (step 230); each first temperature sensing unit measures the temperature of the corresponding temperature zone at each temperature measuring time point to obtain a corresponding first temperature zone temperature curve (step 240); after the off-line temperature measuring plates are conveyed to the plate outlet area of the reflow soldering machine, the processing module group passes the temperature curve of each temperature measuring plate through the lumped heat capacity formula
Performing a parameterization procedure to obtain a K value corresponding to each temperature measuring time point, wherein t is the temperature of each second temperature sensing unit in the temperature zone of the next temperature measuring time point, t is the temperature of each second temperature sensing unit in the temperature zone of the next temperature measuring time point0The temperature t measured by each second temperature sensing unit at the current temperature measuring time point∞τ is a time interval between two adjacent temperature measurement time points for the temperature measured by each first temperature sensing unit at the current temperature measurement time point (step 250); the control module controls the conveying chain of the reflow soldering machine to convey the printed circuit board from the board inlet area to the board outlet area of the reflow soldering machine, wherein a plurality of prediction time points are provided during the conveying of the printed circuit board from the board inlet area to the board outlet area of the reflow soldering machine, the time intervals between any two adjacent prediction time points are the same, the prediction time points correspond to the temperature measurement time points, and the time intervals between any two adjacent prediction time points are the same as the time intervals between any two adjacent temperature measurement time points (step 260); each first temperature sensing unit measures the temperature of the corresponding temperature zone at each predicted time point to obtain a corresponding second temperature zone temperature curve (step 270); and after the printed circuit board is conveyed to a board outlet area of the reflow soldering machine, the prediction module carries out reverse calculation through the lumped thermal capacitance method according to the K value corresponding to each temperature measuring point of each temperature measuring board temperature curve obtained by the processing module and the preset initial temperature so as to obtain the printed circuit boardThe predicted temperatures of the different positions on the pcb at each of the predicted time points are obtained, and then the pcb temperature curves corresponding to the different positions on the pcb are obtained, wherein the different positions on the pcb are the positions corresponding to the second temperature sensing units on the offline temperature measuring board (step 280).
In step 220, a second temperature sensing unit may be installed at a specific position of the same pcb as the pcb expected to be produced, and the plurality of second temperature sensing units 30 may be connected to a temperature measuring instrument to manufacture an offline temperature measuring board, so that the offline temperature measuring board is soldered by a reflow soldering machine according to a normal production flow, each second temperature sensing unit of the offline temperature measuring board may record a temperature curve of the specific position of the pcb during the reflow soldering process, and then a user may extract the plurality of temperature curves from the temperature measuring instrument, wherein the installation positions of the plurality of second temperature sensing units may be adjusted according to user requirements. In more detail, during the reflow soldering process, the conveyor chain of the reflow soldering machine can convey the off-line temperature measurement board from the board entering area to the board exiting area of the reflow soldering machine, and there can be a plurality of temperature measurement time points during the off-line temperature measurement board is conveyed from the board entering area to the board exiting area of the reflow soldering machine (i.e. the temperature curve prediction system 100 can plan a plurality of temperature measurement time points for the reflow soldering process, for example, 1 st, 2 nd, 3 rd, 4 th, … th, N seconds after entering the board entering area of the reflow soldering machine), wherein the time intervals between any two adjacent temperature measurement time points are the same (i.e. the temperature measurement is performed at fixed time intervals). In this embodiment, the time interval can be, but is not limited to, 1 second, and can be adjusted according to the user's requirement.
In addition, the temperature profile prediction system 100 may further include: the board feeding sensing module 50, the board discharging sensing module 60 and the chain speed sensing module 70, wherein the board feeding sensing module 50 can be used for sensing whether a board (i.e. an offline temperature measuring board or a printed circuit board) enters a board feeding area of the reflow soldering machine, the board discharging sensing module 60 can be used for sensing whether a board (i.e. an offline temperature measuring board or a printed circuit board) is conveyed to a board discharging area of the reflow soldering machine, and the temperature curve prediction system 100 can know that the board (i.e. the offline temperature measuring board or the printed circuit board) starts and finishes a reflow soldering process through the arrangement of the board feeding sensing module 50 and the board discharging sensing module 60; the chain speed sensing module 70 is used for sensing the chain speed of the conveying chain of the reflow soldering machine, wherein the chain speed is a fixed value, and when the time for measuring the temperature is obtained (for example, 1 st, 2 nd, 3 th, 4 th, … th, N seconds after entering the board entering area of the reflow soldering machine), the distance of the board (i.e., the off-line temperature measuring board or the printed circuit board) moving in the reflow soldering machine can be obtained by multiplying the chain speed by the time for measuring the temperature, so as to determine which temperature zone the board (i.e., the off-line temperature measuring board or the printed circuit board) is located in, and even which temperature zone each second temperature sensing unit is located in.
In step 230, since the off-line thermal plate moves along with the conveyor chain during the reflow soldering process, each second temperature sensing unit can measure the temperature of the location at each temperature measuring time point, and the temperatures measured by each second temperature sensing unit are connected to obtain the corresponding temperature curve of the thermal plate (i.e. the temperature curve of each specific location during the reflow soldering process).
In step 240, each first temperature sensing unit 30 can measure the temperature of the corresponding temperature zone at each temperature measuring time point, and the temperatures measured by each first temperature sensing unit 30 are connected to obtain the corresponding first temperature zone temperature curve (i.e. the temperature curve of each temperature zone during the reflow soldering process of the off-line temperature measuring board).
In step 250, after the offline thermal pads are transferred to the pad-out area of the reflow soldering machine (i.e. after the offline thermal pads complete the reflow soldering process), the processing module 130 may use the temperature curves obtained in steps 230 and 240 to determine the lumped heat capacity formula
And carrying out a parameterization program to obtain the K value corresponding to each temperature measuring point of each temperature measuring plate temperature curve. Wherein the parameterization program comprises: (a) selecting one of the temperature curves of the plurality of temperature measuring plates; (b) obtaining the temperature of any current temperature measuring time point and the temperature of the next temperature measuring time point of the selected temperature curve of the temperature measuring plate; (c) according to the obtained currentAcquiring which temperature zone of the off-line temperature measuring plate in the reflow soldering machine at the current temperature measuring time point according to the temperature curve of the first temperature zones, and acquiring the temperature of the off-line temperature measuring plate in the temperature zone at the current temperature measuring time point; (d) obtaining the time interval between any two adjacent temperature measuring time points; (e) obtaining a K value corresponding to the selected temperature measuring plate temperature curve at the current temperature measuring time point by using a lumped thermal capacity formula according to the temperature of the current temperature measuring time point of the selected temperature measuring plate temperature curve and the temperature of the next temperature measuring time point, the temperature of the temperature zone of the offline temperature measuring plate at the current temperature measuring time point and the time interval between any two adjacent temperature measuring time points; (f) repeating the steps (b) to (e) to obtain a K value corresponding to each temperature measuring time point of the temperature curve of the selected temperature measuring plate; and (g) obtaining the K value corresponding to each temperature measuring point of each temperature measuring board temperature curve after each temperature measuring board temperature curve is subjected to the steps (a) to (f).
In step 260, the predicted time points and the temperature measurement time points correspond to each other, which means that the predicted time points are the same as the temperature measurement time points, for example, the predicted time points and the temperature measurement time points can all be 1 st, 2 nd, 3 th, 4 th, … th, and N th seconds after entering the board entering area of the reflow soldering machine.
In step 270, each first temperature sensing unit 30 can measure the temperature of the corresponding temperature zone at each predicted time point, and the plurality of temperatures measured by each first temperature sensing unit 30 are connected to obtain the corresponding second temperature zone temperature curve (i.e. the temperature curve of each temperature zone during the reflow soldering process of the pcb).
In step 280, since the same pcb as the pcb expected to be produced can be used for manufacturing the offline thermal board, the temperature of different positions on the pcb (which correspond to the positions of the second temperature sensing units on the offline thermal board) can be predicted according to the K value corresponding to each temperature measuring time point of each temperature measuring board temperature curve obtained in step 250. More specifically, after the pcb is transported to the board-out area of the reflow soldering machine (i.e., after the pcb completes the reflow soldering process), the prediction module 140 may perform back calculation on the K value corresponding to each temperature measurement point of the temperature curve of each temperature measurement board obtained in step 250 and the temperature curves of the plurality of second temperature zones obtained in step 270 by the lumped heat capacity method to obtain the predicted temperature of different positions on the pcb at each prediction point. The back calculation of the prediction module 140 according to the K value corresponding to each temperature measuring point of each temperature measuring board temperature curve obtained by the processing module 130 and the preset initial temperature by the lumped thermal capacitance formula includes: (A) acquiring K values of different positions on the printed circuit board at any current prediction time point according to the K value corresponding to each temperature measurement time point of each temperature measurement plate temperature curve acquired by the processing module; (B) acquiring which temperature zone of the printed circuit board in the reflow soldering machine according to the acquired current prediction time point and the chain speed of the conveying chain of the reflow soldering machine, and further acquiring the temperature of the current temperature zones at different positions on the printed circuit board according to the plurality of second temperature zone temperature curves; (C) obtaining a preset initial temperature or temperatures of different positions on the printed circuit board at the current prediction time point; (D) obtaining the time interval between any two adjacent prediction time points; (E) calculating by using the lumped heat capacity formula according to the preset initial temperature obtained in the steps (A) to (D) or the temperature of the printed circuit board at the current prediction time point, the temperature of the temperature region of the printed circuit board at the current prediction time point, the K value of the printed circuit board at the current prediction time point and the time interval between any two adjacent prediction time points so as to obtain the predicted temperature of the printed circuit board at the next prediction time point; (F) repeating the steps (A) to (E) to obtain the predicted temperature of the PCB at each predicted time point; and (G) obtaining the temperature curves of the printed circuit board corresponding to different positions on the printed circuit board.
Through the steps 210 to 280, the technical effect of predicting and recording the temperature curves of different positions of each printed circuit board in the reflow soldering process can be achieved. When the temperature curve of different positions of each printed circuit board in the reflow soldering process can be recorded, the temperature curve of different positions of each printed circuit board can be tracked to represent the soldering quality. In addition, when the number of the temperature curves of different positions of the printed circuit board recorded in an accumulated mode is enough, the predicted maintenance action of the reflow soldering machine can be achieved according to the change of the data, and problems are prevented from occurring in advance.
Wherein the processing module 130 passes the temperature curve of each temperature measuring plate through the lumped thermal capacitance formula
Before performing the parameterization, the temperature curve prediction method may further include: the processing module aligns a curve turning point of each temperature measuring plate temperature curve with the junction of the heating area and the cooling area of the reflow soldering machine so as to adjust each temperature measuring plate temperature curve, wherein each curve turning point is the first turning point from positive to negative of the slope of the temperature curve where the curve turning point is located, and the measured position of the curve turning point is close to the position of the temperature area with the highest temperature in the reflow soldering machine. Through the steps, the temperature curve of each temperature measuring plate can be finely adjusted, so that the measured temperature change can correspond to the relationship between the heating area and the cooling area of the reflow soldering machine, and the temperature curve of each temperature measuring plate is more accurate.
In summary, it can be seen that the difference between the present application and the prior art is that the K value corresponding to each temperature measuring point of each temperature measuring board temperature curve is obtained by using the lumped thermal capacitance formula according to the temperature measured by the first temperature sensing unit disposed in each temperature zone of the reflow soldering machine and the plurality of second temperature sensing units disposed on the offline temperature measuring board at each temperature measuring point during the period that the offline temperature measuring board is transported from the board entering zone to the board exiting zone of the reflow soldering machine; after the printed circuit board is transmitted to a board outlet area of the reflow soldering machine, the K values and the preset initial temperature are used for carrying out reverse calculation through the lumped thermal capacitance method formula to obtain the predicted temperature of each predicted time point at different positions on the printed circuit board.
Although the present application has been described with reference to the foregoing embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the present application, and therefore, the scope of the present application should be determined only by the appended claims.
Claims (10)
1. A temperature profile prediction system, comprising:
a control module for controlling a conveyor chain of a reflow soldering machine to convey an off-line temperature measurement board or a printed circuit board from an input board area to an output board area of the reflow soldering machine, wherein the off-line temperature measurement board comprises a plurality of second temperature sensing units, a plurality of temperature measurement time points are provided during the period that the off-line temperature measurement board is conveyed from the input board area to the output board area of the reflow soldering machine, the time interval between any two adjacent temperature measurement time points is the same, each second temperature sensing unit is used for measuring the temperature of the position thereof at each temperature measurement time point to obtain a corresponding temperature measurement board temperature curve, a plurality of prediction time points are provided during the period that the printed circuit board is conveyed from the input board area to the output board area of the reflow soldering machine, the time interval between any two adjacent prediction time points is the same, and the plurality of prediction time points correspond to the plurality of temperature measurement time points, the time interval between any two adjacent prediction time points is the same as the time interval between any two adjacent temperature measurement time points;
the temperature measuring module comprises a plurality of first temperature sensing units, the first temperature sensing units are arranged in a plurality of temperature areas of the reflow soldering machine in a one-to-one mode, and each first temperature sensing unit is used for measuring the temperature of the corresponding temperature area at each temperature measuring time point so as to obtain a corresponding first temperature area temperature curve; measuring the temperature of the corresponding temperature zone at each of the predicted time points to obtain a corresponding second temperature zone temperature curve;
a processing module for transmitting each temperature curve of the temperature measuring plate to the plate outlet area of the reflow soldering machine after the off-line temperature measuring plate is transmitted to the plate outlet area of the reflow soldering machine
Performing a parameterization procedure to obtain a K value corresponding to each temperature measuring time point, wherein t is the temperature of each second temperature sensing unit in the temperature zone of the next temperature measuring time point, and t is the temperature of the temperature zone of the next temperature measuring time point0The temperature t measured by each second temperature sensing unit at the current temperature measuring time point∞Tau is the time interval between two adjacent temperature measuring time points for the temperature measured by each first temperature sensing unit at the current temperature measuring time point; and
and the prediction module is used for carrying out reverse calculation through the lumped thermal capacitance method according to the K value corresponding to each temperature measuring point of each temperature measuring plate temperature curve obtained by the processing module after the printed circuit board is conveyed to the plate outlet area of the reflow soldering machine, so as to obtain the predicted temperature of different positions on the printed circuit board at each predicted point, and further obtain a printed circuit board temperature curve corresponding to different positions on the printed circuit board, wherein the different positions on the printed circuit board are the configuration positions corresponding to the plurality of second temperature sensing units on the off-line temperature measuring plate.
2. The system of claim 1, further comprising a chain speed sensing module configured to sense a chain speed of the conveyor chain of the reflow soldering machine.
3. The temperature profile prediction system of claim 2, wherein the parameterization comprises:
(a) selecting one of the temperature curves of the plurality of temperature measuring plates;
(b) obtaining the temperature of any current temperature measuring time point and the temperature of the next temperature measuring time point of the selected temperature curve of the temperature measuring plate;
(c) acquiring which temperature zone of the reflow soldering machine the offline temperature measurement plate is in at the current temperature measurement time point according to the acquired current temperature measurement time point and the chain speed of the conveying chain of the reflow soldering machine, and further acquiring the temperature of the offline temperature measurement plate in the temperature zone of the current temperature measurement time point according to the plurality of first temperature zone temperature curves;
(d) obtaining the time interval between any two adjacent temperature measuring time points;
(e) obtaining the K value corresponding to the current temperature measuring time point of the selected temperature measuring plate temperature curve by using the lumped thermal capacitance formula according to the temperature of the current temperature measuring time point of the selected temperature measuring plate temperature curve and the temperature of the next temperature measuring time point, the temperature of the temperature zone of the offline temperature measuring plate at the current temperature measuring time point and the time interval between any two adjacent temperature measuring time points;
(f) repeating the steps (b) to (e) to obtain the K value corresponding to the temperature curve of the selected temperature measuring plate at each temperature measuring time point; and
(g) and (c) after the temperature curves of the temperature measuring plates are subjected to the steps (a) to (f), obtaining the K value corresponding to each temperature measuring time point of each temperature measuring plate temperature curve.
4. The system of claim 2, wherein the predicting module performs back estimation according to the lumped thermal capacitance equation based on the K value and the preset starting temperature corresponding to each temperature measuring time point of each temperature measuring plate temperature curve obtained by the processing module, and comprises:
(A) acquiring K values of different positions on the printed circuit board at any current prediction time point according to the K value corresponding to each temperature measurement time point of each temperature measurement plate temperature curve acquired by the processing module;
(B) acquiring which temperature zone of the printed circuit board in the reflow soldering machine is according to the acquired current prediction time point and the chain speed of the conveying chain of the reflow soldering machine, and further acquiring the temperatures of the temperature zones of the printed circuit board which are not positioned at the current prediction time point according to the plurality of second temperature zone temperature curves;
(C) obtaining the preset initial temperature or the temperatures of different positions on the printed circuit board at the current prediction time point;
(D) obtaining the time interval between any two adjacent prediction time points;
(E) calculating the preset initial temperature or the temperature of the printed circuit board at the current prediction time point, the temperature of a temperature area of the printed circuit board at the current prediction time point, the K value of the printed circuit board at the current prediction time point and the time interval between any two adjacent prediction time points according to the preset initial temperature or the temperature of the printed circuit board at the current prediction time point, the temperature of the printed circuit board at the temperature area of the printed circuit board at the current prediction time point, the K value of the printed circuit board at the current prediction time point and the time interval between any two adjacent prediction time points through the lumped heat capacity formula so as to obtain the predicted temperature of the printed circuit board at the next;
(F) repeating the steps (A) to (E) to obtain the predicted temperature of the PCB at each of the predicted time points; and
(G) and obtaining the temperature curves of the printed circuit board corresponding to different positions on the printed circuit board.
5. The system of claim 1, wherein the processing module passes each of the temperature profiles of the plurality of temperature pads through the lumped thermal capacitance equation
Before the parameterization program is carried out, the processing module aligns a curve turning point of each temperature measuring plate temperature curve with the junction of the heating area and the cooling area of the reflow soldering machine so as to adjust each temperature measuring plate temperature curve, and the curve turning point is used for adjusting the temperature of each temperature measuring plateEach curve turning point is the turning point of the first positive and negative slope of the temperature curve where the curve turning point is located, and the measured position of the curve turning point is close to the position of a temperature zone with the highest temperature in the reflow soldering machine.
6. A method for predicting a temperature profile, comprising:
providing a temperature curve prediction system, which comprises a control module, a temperature measurement module, a processing module and a prediction module, wherein the temperature measurement module comprises a plurality of first temperature sensing units, and the first temperature sensing units are arranged in a plurality of temperature areas of a reflow soldering machine in a one-to-one manner;
the control module controls a conveying chain of the reflow soldering machine to convey an off-line temperature measuring plate from a plate inlet area to a plate outlet area of the reflow soldering machine, wherein the off-line temperature measuring plate comprises a plurality of second temperature sensing units, a plurality of temperature measuring time points are arranged during the period that the off-line temperature measuring plate is conveyed from the plate inlet area to the plate outlet area of the reflow soldering machine, and the time intervals between any two adjacent temperature measuring time points are the same;
each second temperature sensing unit measures the temperature of the position of the second temperature sensing unit at each temperature measuring time point so as to obtain a corresponding temperature curve of the temperature measuring plate;
each first temperature sensing unit measures the temperature of the corresponding temperature zone at each temperature measuring time point so as to obtain a corresponding first temperature zone temperature curve;
after the off-line temperature measuring plate is conveyed to the plate outlet area of the reflow soldering machine, the processing module passes each temperature measuring plate temperature curve through a lumped thermal capacitance formula
Performing a parameterization procedure to obtain a K value corresponding to each temperature measuring time point, wherein t is the temperature of each second temperature sensing unit in the temperature zone of the next temperature measuring time point, and t is the temperature of the temperature zone of the next temperature measuring time point0Each second temperature sensing unit is measured at the current temperature measuring time pointTemperature of arrival, t∞Tau is the time interval between two adjacent temperature measuring time points for the temperature measured by each first temperature sensing unit at the current temperature measuring time point;
the control module controls the conveying chain of the reflow soldering machine to convey a printed circuit board from the board inlet area to the board outlet area of the reflow soldering machine, wherein a plurality of prediction time points are provided during the conveying of the printed circuit board from the board inlet area to the board outlet area of the reflow soldering machine, the time intervals between any two adjacent prediction time points are the same, the prediction time points correspond to the temperature measurement time points, and the time intervals between any two adjacent prediction time points are the same as the time intervals between any two adjacent temperature measurement time points;
each first temperature sensing unit measures the temperature of the corresponding temperature zone at each predicted time point so as to obtain a corresponding second temperature zone temperature curve; and
after the printed circuit board is conveyed to the board outlet area of the reflow soldering machine, the prediction module performs back calculation through the lumped thermal capacitance method according to the K value corresponding to each temperature measurement point of each temperature measurement board temperature curve obtained by the processing module and a preset initial temperature so as to obtain the predicted temperature of different positions on the printed circuit board at each prediction point, and further obtain a printed circuit board temperature curve corresponding to different positions on the printed circuit board, wherein the different positions on the printed circuit board are the configuration positions corresponding to the plurality of second temperature sensing units on the off-line temperature measurement board.
7. The method as claimed in claim 6, wherein the temperature profile prediction system further comprises a chain speed sensing module for sensing a chain speed of the conveyor chain of the reflow soldering machine.
8. The method of predicting a temperature profile of claim 7, wherein the parameterizing procedure comprises:
(a) selecting one of the temperature curves of the plurality of temperature measuring plates;
(b) obtaining the temperature of any current temperature measuring time point and the temperature of the next temperature measuring time point of the selected temperature curve of the temperature measuring plate;
(c) acquiring which temperature zone of the reflow soldering machine the offline temperature measurement plate is in at the current temperature measurement time point according to the acquired current temperature measurement time point and the chain speed of the conveying chain of the reflow soldering machine, and further acquiring the temperature of the offline temperature measurement plate in the temperature zone of the current temperature measurement time point according to the plurality of first temperature zone temperature curves;
(d) obtaining the time interval between any two adjacent temperature measuring time points;
(e) obtaining the K value corresponding to the current temperature measuring time point of the selected temperature measuring plate temperature curve by using the lumped thermal capacitance formula according to the temperature of the current temperature measuring time point of the selected temperature measuring plate temperature curve and the temperature of the next temperature measuring time point, the temperature of the temperature zone of the offline temperature measuring plate at the current temperature measuring time point and the time interval between any two adjacent temperature measuring time points;
(f) repeating the steps (b) to (e) to obtain the K value corresponding to the temperature curve of the selected temperature measuring plate at each temperature measuring time point; and
(g) and (c) after the temperature curves of the temperature measuring plates are subjected to the steps (a) to (f), obtaining the K value corresponding to each temperature measuring time point of each temperature measuring plate temperature curve.
9. The method of claim 7, wherein the step of the prediction module performing back-calculation according to the lumped thermal capacitance formula on the K value and the preset starting temperature corresponding to each temperature measuring time point of each temperature measuring plate temperature curve obtained by the processing module comprises:
(A) acquiring K values of different positions on the printed circuit board at any current prediction time point according to the K value corresponding to each temperature measurement time point of each temperature measurement plate temperature curve acquired by the processing module;
(B) acquiring which temperature zone of the printed circuit board in the reflow soldering machine is according to the acquired current prediction time point and the chain speed of the conveying chain of the reflow soldering machine, and further acquiring the temperatures of the temperature zones of the printed circuit board which are not positioned at the current prediction time point according to the plurality of second temperature zone temperature curves;
(C) obtaining the preset initial temperature or the temperatures of different positions on the printed circuit board at the current prediction time point;
(D) obtaining the time interval between any two adjacent prediction time points;
(E) calculating the preset initial temperature or the temperature of the printed circuit board at the current prediction time point, the temperature of a temperature area of the printed circuit board at the current prediction time point, the K value of the printed circuit board at the current prediction time point and the time interval between any two adjacent prediction time points according to the preset initial temperature or the temperature of the printed circuit board at the current prediction time point, the temperature of the printed circuit board at the temperature area of the printed circuit board at the current prediction time point, the K value of the printed circuit board at the current prediction time point and the time interval between any two adjacent prediction time points through the lumped heat capacity formula so as to obtain the predicted temperature of the printed circuit board at the next;
(F) repeating the steps (A) to (E) to obtain the predicted temperature of the PCB at each of the predicted time points; and
(G) and obtaining the temperature curves of the printed circuit board corresponding to different positions on the printed circuit board.
10. The method of claim 6, wherein the processing module passes the temperature profile of each of the plurality of temperature pads through the lumped thermal capacitance equation
Before the parameterization program is executed, the temperature curve prediction method further comprises the following steps:
the processing module aligns a curve turning point of each temperature measuring plate temperature curve with the junction of the heating area and the cooling area of the reflow soldering machine so as to adjust each temperature measuring plate temperature curve, wherein each curve turning point is the turning point of the first positive and negative slope of the temperature curve where the curve turning point is located, and the measured position of the curve turning point is close to the position of the temperature area with the highest temperature in the reflow soldering machine.
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