CN113566969A - Device and method for measuring the temperature of an object in a space - Google Patents
Device and method for measuring the temperature of an object in a space Download PDFInfo
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- CN113566969A CN113566969A CN202110469641.1A CN202110469641A CN113566969A CN 113566969 A CN113566969 A CN 113566969A CN 202110469641 A CN202110469641 A CN 202110469641A CN 113566969 A CN113566969 A CN 113566969A
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- 238000009529 body temperature measurement Methods 0.000 claims abstract description 156
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
Abstract
The present application relates to a method and apparatus for acquiring temperature. The method comprises the following steps: receiving a first type of temperature measurement and a second type of temperature measurement of an object within a first zone; determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function; obtaining a first type of temperature measurement of the object within a second region; and obtaining a second type of temperature measurement of the object within the second region based on the second temperature function.
Description
Technical Field
The present application relates to the field of measurement technology, and more particularly, to an apparatus and method for measuring the temperature of an object in a space.
Background
The temperature profile (or so-called thermal profile) is the temperature change of the product during the heat treatment. In many thermal processes, such as reflow soldering processes, coating, metal heat treatment and glass heat treatment, the temperature profile is a critical consideration. For example, FIG. 1 shows a typical temperature profile, which describes the change in product temperature over time. The curve can also be described as a function of product temperature as a function of position, line position or angular position if the product is moved using a transmission such as a belt, chain or gear.
In the field of electronics manufacturing, the processing and fabrication of Printed Circuit Assemblies (PCAs) is commonly performed using a reflow soldering process. The temperature profile provides an intuitive way to analyze the temperature variation of the PCA throughout the reflow soldering process during the reflow soldering process, which is useful for obtaining optimal solderability, avoiding component damage due to temperatures outside a predetermined range, and ensuring solder quality.
In the reflow soldering process of PCA, one common method of obtaining a temperature profile is to use a thermocouple thermometer soldered or bonded to the PCA to measure the temperature of the PCA during reflow soldering. Before the method is implemented, it is first necessary to mount a thermocouple thermometer on the PCA, and then subject the PCA mounted thermocouple thermometer to the entire reflow soldering process to generate a temperature profile based on the data of the thermocouple thermometer. This measurement process may be performed every few hours or as deemed necessary by the engineer. It will be appreciated that this method is only capable of measuring PCAs with thermocouple thermometers installed, and is not capable of measuring temperature changes for each PCA. In addition, the measurement requires interruption of the normal operating procedure, requires an engineer to manually install the thermocouple thermometer on the PCA, and all measurement and analysis procedures can only be performed by an experienced engineer. It can be seen that this method for off-line obtaining the temperature curve of the PCA reflow soldering process is very cumbersome and complex.
Accordingly, there is a need to provide an in-line apparatus or method that can accurately and in real-time obtain the temperature of an object (e.g., a PCA) during a thermal processing process (e.g., a reflow soldering process) to obtain a temperature profile of the object.
Disclosure of Invention
It is an object of the present application to provide a method that enables accurate measurement of the temperature of an object in a space, particularly in spaces where some particular type of thermometer cannot be installed.
In an aspect, there is provided a method for acquiring a temperature, the method comprising: receiving a first type of temperature measurement and a second type of temperature measurement of an object within a first zone; determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function; obtaining a first type of temperature measurement of the object within a second region; and obtaining a second type of temperature measurement of the object within the second region based on the second temperature function.
In some embodiments, the method further comprises: causing the first region to heat to a first temperature and the second region to heat to a second temperature, wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object within the second region is not directly obtainable at the second temperature. .
In some embodiments, the method further comprises: causing the object to move from the first region to the second region.
In some embodiments, the object is a printed circuit assembly, and the method further comprises: heating the first region to a first temperature of a reflow soldering process; causing the object to move from the first region to a second region; heating the second region to a second temperature of the reflow soldering process; wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object in the second region is not directly obtainable at the second temperature.
In some embodiments, the method further comprises: determining a first type of temperature measurement of the object within the first area based on one or more first type of temperature readings from one or more first type of thermometers within the first area; and determining a second type of temperature measurement of the object within the first area based on one or more second type of temperature readings from one or more second type of thermometers within the first area.
In some embodiments, determining a first type of temperature measurement of the object within the first region further comprises: receiving the one or more first type temperature readings from the one or more first type thermometers within the first zone; and determining a first type of temperature measurement of the object within the first area based on the one or more first type of temperature readings.
In some embodiments, determining a second type of temperature measurement of the object within the first region further comprises: receiving the one or more second type temperature readings from the second type thermometer within the first zone; and determining a second type of temperature measurement of the object within the first area based on the one or more second type of temperature readings.
In some embodiments, the method further comprises: determining a first type of temperature measurement of the object within the second area based on one or more first type of temperature readings from one or more first type of thermometers within the second area.
In some embodiments, determining a first type of temperature measurement of the object within the second region further comprises: receiving the one or more first type temperature readings from the one or more first type thermometers within the second area; and calculating a first type temperature measurement of the object within the second area based on the one or more first type temperature readings.
In some embodiments, the method further comprises: in response to a region being heated to a different temperature, obtaining a plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements of the object within the region; and determining the first temperature function based on the plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements.
In some embodiments, the method further comprises: simulating a thermal property of the object; and determining the first temperature function based on the thermal property of the object.
In some embodiments, the method further comprises: determining the second temperature function comprises: modifying one or more parameters of the first temperature function based on the first type of temperature measurement and the second type of temperature measurement.
In another aspect of the present application, there is also provided an apparatus for acquiring a temperature, the apparatus comprising a non-transitory computer storage medium storing executable instructions that, when executed by a processor, cause the processor to perform: receiving a first type of temperature measurement and a second type of temperature measurement of an object within a first zone; determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function; obtaining a first type of temperature measurement of the object within a second region; and obtaining a second type of temperature measurement of the object within the second region based on the second temperature function.
In some embodiments, the processor further performs: causing the first region to heat to a first temperature and the second region to heat to a second temperature, wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object within the second region is not directly obtainable at the second temperature.
In yet another aspect of the present application, there is also provided an apparatus for acquiring a temperature, the apparatus including: an enclosed space having a first region and a second region; a first type of thermometer and a second type of thermometer disposed within the first region; a second thermometer of a first type disposed within the second zone; a processor operatively connected to a first and a second type of thermometer disposed within the first zone and a second first type of thermometer disposed within the second zone; and the processor is configured to: determining a first type of temperature measurement of the object within the first area based on one or more first type of temperature readings from the first type of thermometer within the first area when the object is within the first area; determining a second type of temperature measurement of the object within the first area based on one or more second type of temperature readings from the second type of thermometer within the first area while the object is within the first area; determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function; determining a first type of temperature measurement of the object within the second area based on one or more first type of temperature readings from the second first type of thermometer within the second area when the object is within the second area; and obtaining a second type of temperature measurement of the object within the second region based on the second temperature function.
In some embodiments, the apparatus further comprises: a heating module to heat the first zone to a first temperature and the second zone to a second temperature, wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object within the second zone is not directly available at the second temperature.
In some embodiments, the apparatus further comprises: a transport module to move the object through the first region and the second region.
In some embodiments, the processor is further configured to: in response to a region being heated to a different temperature, obtaining a plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements of the object within the region; and determining the first temperature function based on the plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements.
In some embodiments, the processor is further configured to: simulating a thermal property of the object; and determining the first temperature function based on the thermal property of the object.
In some embodiments, the processor is further configured to: determining the second temperature function by modifying one or more parameters of the first temperature function based on the first type of temperature measurement and the second type of temperature measurement.
In a certain aspect, there is provided an apparatus for measuring the temperature of an object in a space, the object being movable through a plurality of regions in the space. The device comprises: a first type of thermometer disposed within a first zone of the plurality of zones and configured to generate a first type of temperature measurement of the object when the object is located within the first zone; two or more second type thermometers disposed within the first zone and one or more second zones of the plurality of zones, respectively, wherein each second type thermometer is configured to generate a second type temperature measurement for the object when the object is within the zone in which that second type thermometer is disposed. The apparatus further comprises a processor configured to: calculating a third type of temperature value for the object when the object is located within the first area by a first function based on a second type of temperature measurement for the object when the object is located within the first area, wherein the first function reflects a first relationship between the second type of temperature measurement and the third type of temperature value; and adjusting the first function to obtain a second function based on a first type of temperature measurement of the object when the object is located within the first area and a second type of temperature measurement for the object when the object is located within the first area, wherein the second function reflects a second relationship between the second type of temperature measurement and the third type of temperature value.
In some embodiments, the first function is adjusted to obtain the second function when a difference between a first type of temperature measurement of the object when the object is located within the first zone and a third type of temperature measurement for the object when the object is located within the first zone exceeds a predetermined value.
In some embodiments, the processor is further configured to calculate a third type of temperature value for the object while the object is within the one or more second zones using a second function based on a second type of temperature measurement generated by a second type of thermometer disposed within the one or more second zones.
In some embodiments, a third type of temperature value of the object while the object is within the one or more second regions is used to generate a temperature profile.
In some embodiments, the first function is generated based on a first type of temperature measurement of the object when the object is located within the first region and a second type of temperature measurement for the object when the object is located within the first region.
In some embodiments, the first function is predetermined.
In some embodiments, the first zone can be heated to a first nominal temperature, one or more of the one or more second zones can be heated to one or more second nominal temperatures, respectively, and the first nominal temperature is less than the one or more second nominal temperatures.
In some embodiments, the first type of thermometer is capable of withstanding the first nominal temperature, but is incapable of withstanding the one or more second nominal temperatures.
In some embodiments, the first type of thermometer is an infrared sensor and the second type of thermometer is a thermocouple thermometer.
In some embodiments, the infrared sensor is configured to detect a surface temperature of the object to generate the first type of temperature measurement.
In some embodiments, the thermocouple thermometer is configured to detect an ambient temperature surrounding the object to generate the second type of temperature measurement.
In some embodiments, the first type of temperature measurement and the second type of temperature measurement of the first region are generated simultaneously.
In some embodiments, each of the first and second types of temperature measurements for the first region comprises one or more readings simultaneously generated when the object is located within the first region.
In some embodiments, the first function is generated based on one or more readings of a first type of temperature measurement of the object while the object is located within the first region and one or more readings of a second type of temperature measurement for the object while the object is located within the first region.
In some embodiments, the apparatus further comprises: a transport module disposed inside the space and configured to move the object through the plurality of zones.
In some embodiments, the apparatus further comprises: a plurality of heating modules disposed within the plurality of zones and configured to heat the plurality of zones to respective nominal temperatures.
In some embodiments, the transport module is further configured to move the object through the plurality of zones such that the object is subjected to a predetermined temperature profile for thermal treatment.
In one aspect, a method for measuring a temperature of an object in a space is provided, wherein the object is movable through a plurality of regions in the space. The method comprises the following steps: generating, by a first type of thermometer disposed within a first zone of the plurality of zones, a first type of temperature measurement of the object when the object is located within the first zone; generating, by each of two or more second type thermometers respectively disposed within the first zone and one or more second zones of the plurality of zones, a second type temperature measurement for the object when the object is within the zone disposed by the second type thermometer; calculating a third type of temperature value for the object when the object is located within the first area by a first function based on a second type of temperature measurement for the object when the object is located within the first area, wherein the first function reflects a first relationship between the second type of temperature measurement and the third type of temperature value; and adjusting the first function to obtain a second function based on a first type of temperature measurement of the object when the object is located within the first area and a second type of temperature measurement for the object when the object is located within the first area, wherein the second function reflects a second relationship between the second type of temperature measurement and the third type of temperature value.
The foregoing is a summary of the application that may be simplified, generalized, and details omitted, and thus it should be understood by those skilled in the art that this section is illustrative only and is not intended to limit the scope of the application in any way. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.
Drawings
The above-described and other features of the present disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. It is appreciated that these drawings depict only several embodiments of the disclosure and are therefore not to be considered limiting of its scope. The present disclosure will be described more clearly and in detail by using the accompanying drawings.
FIG. 1 illustrates a typical temperature profile;
FIG. 2 illustrates an apparatus 10 for measuring the temperature of an object in a space according to an embodiment of the present application;
fig. 3 shows a method 20 for obtaining a temperature according to another embodiment of the present application.
Before any embodiments of the invention are explained in detail, it is to be understood that the invention is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Also, it is to be understood that the phraseology and terminology used herein is for the purpose of description and should not be regarded as limiting.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof. In the drawings, like reference numerals generally refer to like parts throughout the various views unless the context dictates otherwise. The illustrative embodiments described in the detailed description, drawings, and claims are not intended to be limiting. Other embodiments may be utilized, and other changes may be made, without departing from the spirit or scope of the subject matter of the present application. It will be understood that aspects of the present disclosure, as generally described in the present disclosure and illustrated in the figures herein, may be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which form part of the present disclosure.
Fig. 2 shows an apparatus 10 for measuring the temperature of an object in a space according to an embodiment of the present application. The apparatus 10 may be a reflow oven used in a reflow soldering process or an apparatus used in other heat treatment processes. In some embodiments, the apparatus 10 generally forms a space such that an object (e.g., a PCA) can be subjected to high temperature processing in the space. In one embodiment, the space may be a closed space or a semi-closed space. In the embodiment shown in fig. 2, the apparatus 10 is configured to include a reflow oven or the like for heating an object, and the apparatus 10 has integrated therein an apparatus for taking out temperature (not shown in the drawings). The means for acquiring the temperature may comprise a computing device such as a processor to execute corresponding signal/data processing and control algorithms, which will be described in detail below. It will be appreciated that in other embodiments the means for obtaining the temperature may additionally be attached to the means for heat treating the process, such as a controller coupled to the heat treating means by a wired or wireless communication network. It should also be noted that in some other embodiments, the apparatus 10 for measuring the temperature of an object in a space may also be devoid of a heating module for actively heating the interior space or the object.
As shown in fig. 2, the apparatus 10 includes a plurality of different zones, including zone 1, zone 2, zone 3 …, zone 7, zone 8, or more, wherein the space of zone 1 can be heated to 25 ℃, the space of zone 2 can be heated to 120 ℃, the space of zone 3 can be heated to 150 ℃, the space of zone 7 can be heated to 300 ℃, and the space of zone 8 can be heated to 100 ℃. It will be appreciated that some regions, such as regions 4-6 and region 9 or other regions, are omitted from fig. 2 for purposes of simplifying the illustration. Also, one skilled in the art may set different numbers of zones in the device 10 as desired, and different zones may set different temperatures. In certain embodiments, the apparatus 10 may include a plurality of heating modules distributed in respective zones for heating the respective zones to a predetermined nominal temperature. Those skilled in the art will appreciate that the heating module may heat the environment within the corresponding zone to a predetermined temperature by thermal convection, thermal radiation, electrical heating, and other heating means.
In order to heat treat the object and obtain a temperature profile of the object heat treatment process, the object may be placed on a transport module disposed within the apparatus 10 such that the object passes through different zones having different predetermined temperatures under the drive of the transport module to complete the heat treatment process. In certain embodiments, the transport module may be a chain, a conveyor belt, a gear, or other transmission mechanism. It will be appreciated by those skilled in the art that the dwell time of the objects in each zone can be adjusted by controlling the speed of the drive of the transport module so that the objects are heated to a predetermined temperature by the ambient temperature in the respective zone. For example, when an object is transported to zone 1 by the transport module, the object may be heated by the ambient temperature of zone 1 to approximately the ambient temperature of zone 1 (i.e., 25 ℃); as the object is further transported to zone 2 by the transport module, the object may be heated by the ambient temperature of zone 2 to approximately the ambient temperature of zone 2 (i.e., 120 ℃); until the object has passed all areas of the apparatus 10 through the transport module to complete the heat treatment process. It should be noted that, although it is desirable that the object may be heated to the ambient temperature of the region when passing through different regions, the actual temperature of the object itself may not be substantially consistent with the ambient temperature of the region due to various reasons, for example, there may be differences in the temperature distribution of different positions in the same region, or there may be delays or unevenness in heat transfer from one region to the object therein, or there may be differences in the temperature distribution or heat transfer due to different materials of the object itself, the heat capacity and heat resistance of the object itself, the temperature difference between the object and the environment, the heating power of the heating module, and so on. It should be noted that, since it takes a certain time for the object to enter and remain in an area, and the actual temperature of the object varies with the heat treatment conditions, the actual temperature of the object described below refers to a temperature value at which the actual temperature of the object is substantially stable after the object enters an area.
With continued reference to FIG. 2, a thermocouple Thermometer (TC) is provided in each zone of the apparatus 10 for measuring the ambient temperature around an object as it moves through each zone. The temperature values associated with the measured object as measured by the thermocouple thermometer may be considered a first type of temperature measurement, and the thermocouple thermometer may be considered a first type of thermometer; since the thermocouple thermometer is not placed directly on the object to be measured, it is not in direct contact with the object to be measured, which generally corresponds to the ambient temperature in a certain area around the object.
Specifically, a thermocouple thermometer TC 1102 is provided in the area 1 to measure the ambient temperature T around the object moving to the area 1a1(ii) a A thermocouple thermometer TC2202 is provided in the area 2 to measureAmbient temperature T around the object moving to zone 2a2(ii) a A thermocouple thermometer TC 3302 is provided in the area 3 to measure an ambient temperature T around the object moving to the area 3a3(ii) a A thermocouple thermometer TC 7702 is provided in the area 7 to measure the ambient temperature T around the object moving to the area 7a7(ii) a And a thermocouple thermometer TC 8802 is located in zone 8 to measure the ambient temperature T surrounding the objects moving to zone 8a8. In one embodiment, a thermocouple thermometer may be positioned proximate to where an object passes (e.g., on a frame of an actuator) for measuring an ambient temperature T around the proximate objecta. In a certain embodiment, two or more thermocouple thermometers may be provided in each zone, and the measurement of one thermocouple thermometer in the same zone may be used to calibrate the measurement of the other thermocouple thermometers in the same zone. Alternatively, the results of two or more thermocouple thermometer measurements in the same region may be used in combination by averaging or other arithmetic methods. In other words, each first type temperature measurement may be calculated from one or more first type temperature readings. In other embodiments, for a first type of temperature measurement calculated from multiple first type of temperature readings, the multiple readings may also be taken by the same thermocouple thermometer at different times. Determining the first type temperature measurement based on the plurality of first type temperature readings may avoid the effect of measurement noise or error on measurement accuracy.
It will be appreciated that the thermocouple thermometer measures the ambient temperature T surrounding the objectaInstead of measuring the true temperature T of the surface of the objectp. However, the ambient temperature T around the objectaAnd the true temperature T of the objectpThere is a certain functional relationship between them, i.e. Tp＝f(Ta). Functional relation Tp＝f(Ta) It may be a linear functional relationship or other common functional relationships. For example, in one example, the ambient temperature T is for a linear temperature rampaCan always compare the real temperature T of the objectpHeight 5And C. In some embodiments, the aforementioned functional relationship may be determined by experimental measurements, or theoretical computational simulations, common in thermal conductivity applications.
In some embodiments, the functional relationship T may be predeterminedp＝f(Ta). In order to predetermine the functional relationship Tp＝f(Ta) A thermocouple thermometer for calibration may be mounted on the object, and the object with the thermocouple thermometer mounted thereon may be moved by the transport module through various regions of the apparatus 10 to determine the functional relationship T from the object surface temperature data measured by the thermocouple thermometer mounted on the object in the various regions (the ambient temperature of the region of the object may in turn be determined for another thermocouple thermometer of the region, where the thermocouple thermometer may be, for example, the thermocouple thermometers TC1 through TC8 shown in fig. 2)p＝f(Ta). In some embodiments, after obtaining temperature data within the various regions, a data fitting method or other common method may be used to generate functional relationship Tp＝f(Ta). In other embodiments, the object may be placed in only one region, and the real temperature of the object may be determined as a function of the change in the adjusted ambient temperature by adjusting the ambient temperature of the region. In particular, a temperature measurement may be taken of the object at each ambient temperature to generate a plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements. In this way, a plurality of pairs of first type temperature measurements and second type temperature measurements may be used to perform a data fit to generate the first temperature function. It will be appreciated that in determining Tp＝f(Ta) Thereafter, when there is a subsequent object to be heat treated in the apparatus 10, it is only necessary to measure the corresponding ambient temperature T by the thermocouple thermometers installed in the respective zones of the apparatus 10 (i.e., TC 1102 in zone 1, TC2202 in zone 2, etc.)aCan pass through the functional relation Tp＝f(Ta) Calculating to obtain the real temperature T of the object in each areapAnd further obtaining the temperature curve of the object in the heat treatment process. It can be seen that heat is provided in each region of the device 10After the thermocouple thermometer is used, a calibrated thermocouple thermometer does not need to be arranged on an object to be thermally treated any more, but the functional relation T can be usedp＝f(Ta) And calculating to obtain a temperature curve of the object in the heat treatment process.
However, it will be appreciated that the ambient temperature TaAnd true temperature TpFunctional relationship T betweenp＝f(Ta) May change due to changes in actual conditions. For example, the size of the objects, the distance between the objects, the transmission speed of the transport module, the wind speed within the apparatus 10, etc., all affect the aforementioned functional relationships. Thus, the functional relationship T is such that when conditions changep＝f(Ta) Adjustment or calibration is required to improve the functional relationship Tp＝f(Ta) The accuracy of (2). In some embodiments, the previously described manner of re-determining (calibrating) the functional relationship T by mounting a thermocouple thermometer on an object may be repeatedp＝f(Ta)。
In some embodiments, an infrared sensor (IR) may be provided within the device 10 to directly measure the true temperature of the surface passing over the object. The infrared sensor is of a different type than the aforementioned thermocouple thermometer, since its temperature measurement reflects a different temperature characteristic and thus is of a different type. Wherein the temperature measurements of the infrared sensor reflect the true temperature of the object's surface, and the temperature measurements of the thermocouple thermometer within the device 10, which is not in direct contact with the object, reflects the ambient temperature at a distance or location around the object. It is to be understood that the thermocouple sensor may be a first type of thermometer, and the measured temperature value thereof may be a first type of temperature measurement; the infrared sensor may be a second type of thermometer, and the measured temperature value may be a second type of temperature measurement; through the functional relation Tp＝f(Ta) Calculating to obtain the real temperature T of the object in each areapMay be a temperature value of the third type, which is called temperature value of the third type because of the real temperature TpCalculated rather than measured directly, but both the first and third temperature values reflect the true temperature of the object surface, and thusWhich can be considered to be the same type of measurement. In one embodiment, the infrared sensor may be mounted on a ceiling inside the apparatus 10 to face an object being transported past by the transport module. Generally, existing infrared sensors can only operate at temperatures below about 200 ℃. Furthermore, generally, infrared sensors can only be installed inside the device 10; and it is not well suited to specifically install a cooling system for the infrared sensor within the device 10 in view of the size and cost of the device 10. Therefore, it is only appropriate for the apparatus 10 for the heat treatment process to provide the infrared sensor in a low temperature region (for example, below 200 ℃) inside the apparatus 10.
With continued reference to FIG. 2, in some embodiments, an infrared sensor (IR 1104) may be provided within low temperature zone 1(25℃.) of apparatus 10 for directly measuring the surface temperature (T) of objects passing through zone 1IR1). In certain embodiments, the IR 1104 and TC 1102 are configured to simultaneously measure the surface temperature T of the objectIR1And the ambient temperature T around the objecta1. It will be appreciated that the ambient temperature T around the object, measured relative to TC 1102a1Surface temperature T of the object measured by IR 1104IR1Equal to the true temperature T of the object in zone 1p1. It can be seen that by setting IR 1104 in zone 1, the true temperature (T) of the object when the object passes through zone 1 can be accurately obtainedp1＝TIR1). It will be appreciated that for the case described above where each temperature measurement is calculated from multiple readings, the multiple readings of temperature measurements resulting from the IR 1104 measurements may be generated simultaneously with the multiple readings of temperature measurements resulting from the TC 1102 measurements. That is, every time the IR 1104 generates a reading, the TC 1102 also generates a reading at the same time. Measuring the readings of different thermometers simultaneously helps to eliminate the effect of temperature fluctuations over time.
In one embodiment, the functional relationship T is predetermined by experimental measurement as described abovep＝f(Ta) In contrast, the surface temperature T of the object measured by IR 1104 in zone 1 can also be usedIR1And the ambient temperature T around the object measured by TC 1102a1Generate a letterNumber relation Tp＝f(Ta). In this embodiment, a mathematical model of thermal conductivity may be predetermined by simulation based on the conditions of the apparatus 10 and passed through TIR1And Ta1And the determined mathematical model of thermal conductivity to determine Tp＝f(Ta)。
Furthermore, the surface temperature TIR1Can be directly used for forming the temperature curve of the object heat treatment process and can also be used for calibrating or adjusting the functional relation Tp＝f(Ta)。
As previously mentioned, in some embodiments, the functional relationship T is such that when conditions within the device 10 changep＝f(Ta) Will also vary accordingly, e.g. to Tp＝f1(Ta). At this time, the surface temperature T of the object measured by IR 1104IR1Can be used for calibration via Tp＝f(Ta) Calculating the obtained Tp1The accuracy of (2). If T is obtained by the calculationp1Is less accurate (e.g., T)p1And TIR1Exceeds a predetermined value), the ambient temperature T around the object, as measured by TC 1102, may be useda1And the surface temperature T of the object measured by IR 1104IR1To re-determine the functional relationship Tp＝f1(Ta) To use the adjusted functional relation Tp＝f1(Ta) To calculate the true temperature of the object passing through other areas. It will be appreciated that the functional relationship T before adjustment is assumedp＝f(Ta) Is a first temperature function, the adjusted function relation Tp＝f1(Ta) Is a second temperature function that may be different from the first temperature function.
In certain embodiments, the functional relationship Tp＝f(Ta) May be a linear function, e.g. Tp＝a*Ta+ b. Adjusted functional relationship T as conditions of apparatus 10 changep＝f1(Ta) May change into Tp＝a*Ta+ c or Tp＝c*Ta+ b for reflecting the real temperature T of the object after the condition of the device 10 has changedpAnd the ambient temperature T around the objectaThe relationship (2) of (c). In this embodiment, the ambient temperature T around the object as measured by TC 1102a1And the surface temperature T of the object measured by IR 1104IR1Not adapted to the functional relation Tp＝f(Ta)(Tp＝a*Ta+ b) independent and dependent variables, in other words, when Ta1＝TaWhen passing through the functional relation Tp＝f(Ta) Calculating the obtained TpIs not equal to TIR1. On the contrary, when T isa1＝TaThen, through the adjusted functional relation Tp＝f1(Ta) (e.g., may be T)p＝a*Ta+ c or Tp＝c*Ta+ b) calculating the T obtainedp＝TIR1. It can be understood that the functional relationship T is nowp＝a*TaThe parameters a and b of + b are modified to a functional relationship Tp＝a*TaParameters a and c or T in + cp＝c*TaParameters c and b in + b. As will be understood by those skilled in the art, when T isp＝f(Ta) When the function relation is other types, T can be adjusted correspondinglyp＝f(Ta) To obtain an adjusted functional relationship Tp＝f1(Ta)。
With continued reference to FIG. 2, in some embodiments, an infrared sensor IR 2204 may also be provided in zone 2(120℃.) of apparatus 10 for directly measuring the surface temperature T of an object as it moves through zone 2IR2. Similarly, IR 2204 measures the surface temperature T of an objectIR2Equal to the true temperature T of the object in the area 2p2. Surface temperature TIR2Can be used for forming the temperature curve of the object heat treatment process and calibrating or adjusting the functional relation Tp＝f(Ta)。
In one embodiment, the surface temperatures T in the various zones may be used in combinationIR1And TIR2To calibrate the functional relation Tp＝f(Ta). Furthermore, the skilled person may additionally arrange infrared sensors in the areas where they are able to operate (e.g. areas 3 and 7 at temperatures below 200 ℃) for direct useThe surface temperature of the object in these areas is measured. But infrared sensors cannot be placed in these areas, at least for the area 7, which would be heated to more than 200 c. Therefore, for an area where the infrared sensor is not suitably placed due to an excessively high heating temperature, or an area where the infrared sensor is not placed for other reasons, the surface temperature of the object in the area cannot be directly obtained by the infrared sensor. Further, even if the thermocouple thermometers are placed in these areas, the thermocouple thermometers can only measure the ambient temperature around the object due to the object being moved, and cannot measure the actual temperature of the surface of the object, and therefore the thermocouple thermometers also cannot directly obtain the surface temperature of the object in these areas. It should be noted that the infrared sensor and thermocouple thermometer are used herein as exemplary thermometers only to illustrate that in some areas the actual temperature of the surface of the object cannot be obtained directly from the thermometer, or that it is not economical to obtain the actual temperature of the surface of the object directly from the thermometer (e.g., requiring an experienced engineer to manually install the thermocouple thermometer on the PCA as described in the background section). It should be noted that, although the above-mentioned embodiments are described by taking an example in which some high-temperature regions are not suitable for being provided with thermometers for measuring the surface temperature of the object, in some other embodiments, some type of thermometer cannot be provided for measuring the corresponding temperature for other reasons. For example, certain low temperature (e.g., less than-20 ℃ or less) areas may not be suitable for placement of infrared sensors, or certain corrosive environments may not be suitable for placement of thermocouple thermometers, and so forth.
Still referring to FIG. 2, the calibrated function curve Tp＝f1(Ta) May be applied to areas that are not capable of mounting, such as area 7 or other areas having temperatures above 200 c. In this way, even if the areas are not provided with infrared sensors, the actual temperature of the object passing through the areas can be calculated based on the calibrated functional relationship curve (i.e., the second temperature function) by using the ambient temperature Ta measured by the thermocouple thermometers provided in the areas.
In one embodiment, the apparatus 10 may include or be coupled to a processor that may receive data from thermocouple thermometers and infrared sensors in various zones in the manner disclosed herein, and process and calculate the data to obtain an accurate functional relationship between the ambient temperature of the object and the true temperature of the surface. Furthermore, based on the temperature measurement values of the thermocouple thermometers in certain areas and the functional relation, the surface temperature measurement value of the object can be calculated, and then the temperature curve of the object can be obtained.
In some embodiments, more than one thermocouple thermometer may be provided in an area to obtain multiple ambient temperature readings for the same object at the same time, or the measurement may be repeated multiple times by one thermocouple thermometer to obtain multiple readings for the same object. The plurality of ambient temperature readings may then be used to obtain an ambient temperature of the object, i.e., a first type of temperature measurement, based on a mathematical calculation (e.g., average, tolerance, variance, etc.). Likewise, more than one infrared sensor may be provided in a certain area to obtain multiple surface temperatures for the same object at the same time, or the measurement may be repeated multiple times by one thermocouple thermometer to obtain multiple readings for the same object. The plurality of surface temperature readings may then be used to obtain a surface temperature of the object based on a mathematical calculation (e.g., average, tolerance, variance, etc.), i.e., a second type of temperature measurement.
Fig. 3 shows a method 20 for obtaining a temperature according to another embodiment of the present application. In some embodiments, the method 20 may be performed by the apparatus 10 shown in FIG. 2, or may be performed by a processor or the like in cooperation with a temperature processing device similar to the apparatus 10. For example, the apparatus may include a non-transitory computer storage medium for storing executable instructions that, when executed by a processor, may cause the processor to perform the steps of the method 20 shown in fig. 3.
As shown in FIG. 3, method 20 includes step 202 of receiving a first type of temperature measurement and a second type of temperature measurement of an object within a first zone. In some embodiments, the temperature may be based on a first type of temperature from within the first regionOne or more first type temperature readings of a meter (e.g., a thermocouple thermometer) to determine a first type temperature measurement of an object within a first area (e.g., an ambient temperature T of the object)a) (ii) a And a second type of temperature measurement (e.g., a surface temperature T of the object) of the object within the first area may be determined based on one or more second type of temperature readings from a second type of thermometer (e.g., an infrared sensor) within the first areaIR). In some embodiments, the first type of thermometer may be a thermocouple thermometer for generating an ambient temperature reading of the object, and the second type of thermometer may be an infrared sensor for generating a surface temperature reading of the object. Other types of thermometers may be selected by those skilled in the art as either the first type of thermometer or the second type of thermometer in the present application, depending on the circumstances.
A second temperature function indicative of a relationship between the first and second types of temperature measurements for the object is determined based on the first type of temperature measurement, the second type of temperature measurement, and the first temperature function, step 204. As previously described, a first type of temperature measurement (e.g., an ambient temperature T of an object) obtained from a first type of thermometer (e.g., a thermocouple thermometer) may be used where the first temperature function is deemed to need to be adjusted due to a change in actual conditionsa) And a second type of temperature measurement (e.g., surface temperature T of the object) obtained from a second type of thermometer (e.g., an infrared sensor)IR) To adjust the first temperature function Tp＝f(Ta) To obtain a second temperature function Tp＝f1(Ta). In certain embodiments, the first temperature function Tp＝f(Ta) May be a linear function, e.g. Tp＝a*Ta+ b and can be obtained by obtaining the ambient temperature T of the objectaAnd a first temperature function to calculate the surface temperature T of the objectp. In some embodiments, the adjusted second temperature function Tp＝f1(Ta) May change into Tp＝a*Ta+ c or Tp＝c*Ta+ b for reflecting the truth of the object after the condition of the device 10 has changedTemperature T of real surfacepAnd the ambient temperature T around the objectaThe relationship (2) of (c). In one embodiment, the first type of temperature measurement (e.g., the ambient temperature T of the object) may be obtained by the aforementioned measurementa) And a second type of temperature measurement (e.g., surface temperature T of the object)IR) To adjust or calibrate a first temperature function (e.g., T)p＝a*Ta+ b) to obtain a second temperature function (e.g., T) that more accurately reflects the relationship of the ambient temperature and the surface temperature of the objectp＝a*Ta+ c or Tp＝c*Ta+ b). As will be understood by those skilled in the art, when T isp＝f(Ta) When the function relation is other types, T can be adjusted correspondinglyp＝f(Ta) To obtain an adjusted functional relationship Tp＝f1(Ta)。
A first type of temperature measurement of the object in the second region is obtained 206. In some embodiments, a first type of temperature measurement of an object within a second region (e.g., an ambient temperature T of the object) may be determined based on one or more first type of temperature readings from a first type of thermometer (e.g., a thermocouple thermometer) within the second regiona). Likewise, the first type of thermometer may be a thermocouple thermometer or other thermometer used to generate an ambient temperature reading of the object.
And step 208, obtaining a second type of temperature measurement of the object in the second area based on the second temperature function. In one embodiment, the first type of temperature measurement of the object (e.g., the ambient temperature T of the object) obtained in step 206 may be used based on the second type of temperature functiona) A second type of temperature of the object in the second region is calculated, which may be a surface temperature of the object. It will be appreciated that in the event that a second type of temperature measurement of an object within the second region cannot be obtained directly by a second type of thermometer (e.g., an infrared sensor) at the operating temperature of the second region, the second type of temperature measurement may be accurately obtained based on the second temperature function obtained herein.
For more details of the method 20 shown in the embodiment of the present application, reference may be made to the detailed description of the embodiment of the apparatus of the present application, which is not repeated herein.
Other variations to the disclosed embodiments can be understood and effected by those skilled in the art from a study of the specification, the disclosure, the drawings, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the words "a" or "an" do not exclude a plurality. In the practical application of the present application, one element may perform the functions of several technical features recited in the claims. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (20)
1. A method for obtaining a temperature, the method comprising:
receiving a first type of temperature measurement and a second type of temperature measurement of an object within a first zone;
determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function;
obtaining a first type of temperature measurement of the object within a second region; and
a second type of temperature measurement of the object within the second region is obtained based on the second temperature function.
2. The method of claim 1, wherein the method further comprises:
causing the first region to heat to a first temperature and the second region to heat to a second temperature, wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object within the second region is not directly obtainable at the second temperature.
3. The method of claim 1 or 2, wherein the method further comprises:
causing the object to move from the first region to the second region.
4. The method of claim 1, wherein the object is a printed circuit assembly, and the method further comprises:
heating the first region to a first temperature of a reflow soldering process;
causing the object to move from the first region to a second region;
heating the second region to a second temperature of the reflow soldering process;
wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object in the second region is not directly obtainable at the second temperature.
5. The method of any one of claims 1-4, further comprising:
determining a first type of temperature measurement of the object within the first area based on one or more first type of temperature readings from one or more first type of thermometers within the first area; and
determining a second type of temperature measurement of the object within the first area based on one or more second type of temperature readings from one or more second type of thermometers within the first area.
6. The method of claim 5, wherein determining a first type of temperature measurement of the object within the first region further comprises:
receiving the one or more first type temperature readings from the one or more first type thermometers within the first zone; and is
Determining a first type of temperature measurement of the object within the first area based on the one or more first type of temperature readings.
7. The method of claim 5, wherein determining a second type of temperature measurement of the object within the first region further comprises:
receiving the one or more second type temperature readings from the one or more second type thermometers within the first zone; and is
Determining a second type of temperature measurement of the object within the first region based on the one or more second type of temperature readings.
8. The method of any one of claims 1-7, further comprising:
determining a first type of temperature measurement of the object within the second area based on one or more first type of temperature readings from one or more first type of thermometers within the second area.
9. The method of claim 8, wherein determining a first type of temperature measurement of the object within the second region further comprises:
receiving the one or more first type temperature readings from the one or more first type thermometers within the second area; and is
Determining a first type of temperature measurement of the object within the second area based on the one or more first type of temperature readings.
10. The method of any one of claims 1-9, further comprising:
in response to a region being heated to a different temperature, obtaining a plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements of the object within the region; and is
Determining the first temperature function based on the plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements.
11. The method of any one of claims 1-10, further comprising:
simulating a thermal property of the object; and
determining the first temperature function based on a thermal property of the object.
12. The method of any one of claims 1-11, wherein determining the second temperature function comprises: modifying one or more parameters of the first temperature function based on the first type of temperature measurement and the second type of temperature measurement.
13. An apparatus for acquiring a temperature, the apparatus comprising a non-transitory computer storage medium storing executable instructions that, when executed by a processor, cause the processor to perform:
receiving a first type of temperature measurement and a second type of temperature measurement of an object within a first zone;
determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function;
obtaining a first type of temperature measurement of the object within a second region; and
a second type of temperature measurement of the object within the second region is obtained based on the second temperature function.
14. The apparatus of claim 13, wherein the processor further performs:
causing the first region to heat to a first temperature and the second region to heat to a second temperature, wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object within the second region is not directly obtainable at the second temperature.
15. An apparatus for acquiring temperature, the apparatus comprising:
an enclosed space having a first region and a second region;
a first type of thermometer and a second type of thermometer disposed within the first region;
a second thermometer of a first type disposed within the second zone;
a processor operably connected to a first type of thermometer and a second type of thermometer disposed within the first zone and a second first type of thermometer disposed within the second zone, wherein the processor is configured to:
determining a first type of temperature measurement of the object within the first area based on one or more first type of temperature readings from the first type of thermometer within the first area when the object is within the first area;
determining a second type of temperature measurement of the object within the first area based on one or more second type of temperature readings from the second type of thermometer within the first area while the object is within the first area;
determining a second temperature function indicative of a relationship between the first and second types of temperature measurements for the object based on the first and second types of temperature measurements and the first temperature function;
determining a first type of temperature measurement of the object within the second area based on one or more first type of temperature readings from the second first type of thermometer within the second area when the object is within the second area; and
a second type of temperature measurement of the object within the second region is obtained based on the second temperature function.
16. The apparatus of claim 15, wherein the apparatus further comprises:
a heating module to heat the first zone to a first temperature and the second zone to a second temperature, wherein the first temperature is lower than the second temperature and a second type of temperature measurement of the object within the second zone is not directly available at the second temperature.
17. The apparatus of claim 15 or 16, wherein the apparatus further comprises:
a transport module to move the object through the first region and the second region.
18. The apparatus of any one of claims 15-17, wherein the processor is further configured to:
in response to a region being heated to a different temperature, obtaining a plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements of the object within the region; and is
Determining the first temperature function based on the plurality of first type temperature measurements and a corresponding plurality of second type temperature measurements.
19. The apparatus of any one of claims 15-17, wherein the processor is further configured to:
simulating a thermal property of the object; and
determining the first temperature function based on a thermal property of the object.
20. The apparatus of any one of claims 15-19, wherein the processor is further configured to:
determining the second temperature function by modifying one or more parameters of the first temperature function based on the first type of temperature measurement and the second type of temperature measurement.
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| CN114777929A (en) * | 2022-06-17 | 2022-07-22 | 中国飞机强度研究所 | Ground test temperature measurement method based on trajectory in airplane ground heat intensity test |
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| JP3983484B2 (en) * | 2001-02-26 | 2007-09-26 | 三菱電機株式会社 | Reflow furnace temperature profile measurement apparatus and reflow furnace heating capacity diagnosis method using the same |
| CN103674310B (en) * | 2012-09-26 | 2016-01-20 | 中国人民解放军第二炮兵工程大学 | A kind of fuel temperature measurement method based on oil pipe surface temperature measurement |
| CN105784138B (en) * | 2016-05-09 | 2018-10-02 | 南京理工大学 | The contactless online thermometry of one kind and system |
| CN108760082A (en) * | 2018-05-29 | 2018-11-06 | 深圳小辣椒科技有限责任公司 | A kind of smart mobile phone temperature taking method and system |
| CN108775975B (en) * | 2018-07-06 | 2020-03-10 | 珠海格力电器股份有限公司 | Reflow furnace temperature curve intelligent detection system and detection method |
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| CN114777929A (en) * | 2022-06-17 | 2022-07-22 | 中国飞机强度研究所 | Ground test temperature measurement method based on trajectory in airplane ground heat intensity test |
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