CN111326457B - Bidirectional mounting mechanism - Google Patents
Bidirectional mounting mechanism Download PDFInfo
- Publication number
- CN111326457B CN111326457B CN202010127967.1A CN202010127967A CN111326457B CN 111326457 B CN111326457 B CN 111326457B CN 202010127967 A CN202010127967 A CN 202010127967A CN 111326457 B CN111326457 B CN 111326457B
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- base
- mounting
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- positioning structure
- back plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention discloses a bidirectional mounting mechanism, which comprises a base and functional pieces, wherein the base is used for carrying the functional pieces to mount with a backboard bracket from the outer side or inner side direction of the backboard bracket, the base is provided with mounting holes for the functional pieces to pass through, the backboard bracket is correspondingly provided with openings for the functional pieces to pass through, and the periphery of the functional pieces is provided with a forward mounting positioning structure and a reverse mounting positioning structure which are arranged in parallel according to the mounting direction of the functional pieces; when the base is required to be installed from the outer side direction or the inner side direction of the backboard support, the normal positioning structure or the reverse positioning structure is correspondingly adopted to be matched with the installation hole, and the functional piece is positioned and fixed, so that the relative orientation of the functional piece in the opening is unchanged after the base is installed on the backboard support. The invention can freely change the assembly scheme according to different stage requirements or different assembly requirements, realizes the forward assembly and the reverse assembly of the functional parts, reduces the material cost and the labor intensity and saves the time cost.
Description
Technical Field
The invention relates to the technical field of semiconductor automatic test equipment, in particular to a bidirectional mounting mechanism which can be matched with a backboard support from the inner side or the outer side.
Background
As shown in fig. 1, in the field of semiconductor Automated Testing (ATE), it is necessary to mount a board card 2 into a cavity 1 within a test apparatus for testing. When the board card 2 is docked to the test equipment, the board card 2 needs to communicate with the tested object through a signal transfer device (such as a connector); at the same time, the accuracy of the position of the board 2 needs to be ensured by positioning guide parts (e.g. guide pins), which are typically mounted on the back plate holder 3 of the cavity 1 in the test equipment, as shown in fig. 2.
Please refer to fig. 2. The back plate bracket 3 is provided with a plurality of rows of openings 4 for installing external parts such as a signal transfer device, a positioning guide part and the like. For ease of assembly, these components on the back plate holder 3 are typically mounted on the outside of the back plate holder 3 (the back of the back plate holder 3 is shown) and connected to the board card 2 in the device cavity 1 through the opening 4 in the back plate holder 3.
However, due to the special structure of the apparatus, there are many parts on the outside of the back plate, which causes easy interference during maintenance, and requires a large amount of work to remove the parts on the back plate bracket 3 one by one. Especially in the test stage, the disassembly and assembly frequency of the parts on the backboard support 3 is high, and time and labor are wasted.
If these components can be assembled and mounted as needed, particularly on the inner side of the back plate holder 3 (the front side of the back plate holder 3 is shown), the above-mentioned problem of mutual interference can be avoided, the labor intensity of assembly and disassembly can be remarkably reduced, and the time cost can be saved. However, since the inner side of the back plate bracket 3 is provided with the deeper equipment cavity 1, the assembly of parts is inconvenient, and the mass production is more inconvenient especially for small-sized equipment.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide a bidirectional mounting mechanism which can be mounted on the front (inner side) of a back plate bracket on test equipment or on the back (outer side) of the back plate bracket.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
a bi-directional mounting mechanism comprising: the base is used for carrying the functional piece to be installed with the backboard support from the outer side or the inner side direction of the backboard support, the base is provided with an installation hole for the functional piece to pass through, the backboard support is correspondingly provided with an opening for the functional piece to pass through, the periphery of the functional piece is provided with a normal installation positioning structure and a reverse installation positioning structure, and the normal installation positioning structure and the reverse installation positioning structure are arranged in parallel according to the installation direction of the functional piece; when the base is required to be installed from the outer side direction or the inner side direction of the backboard support, the normal installation positioning structure or the reverse installation positioning structure is correspondingly adopted to be matched with the installation hole, so that the functional piece is positioned and fixed, and the relative position of the functional piece in the opening is unchanged after the base is installed on the backboard support.
Further, the forward mounting positioning structure and the reverse mounting positioning structure are respectively a first groove and a second groove which are arranged on the periphery of the functional piece in a surrounding mode, the base is a splicing assembly, the mounting hole is formed by splicing the splicing assembly, and the mounting hole is used for being clamped into the first groove or the second groove when being spliced, so that the functional piece is positioned and fixed.
Further, the split assembly includes an upper split and a lower split that are split to form the mounting hole.
Further, the upper split piece and the lower split piece are connected through screws, and a connecting and fixing device for fixing the bidirectional mounting mechanism to the backboard support is arranged on the upper split piece or the lower split piece.
Further, foolproof structures are respectively arranged between the first groove and the second groove and the mounting hole in a matching mode, and the foolproof structures are blocking blocks respectively arranged in the first groove and the second groove and recesses correspondingly arranged on the inner wall of the mounting hole; the blocking blocks in the first grooves and the blocking blocks in the second grooves are staggered in position and used for foolproof.
Further, the back plate support and the base are both flat plate pieces, and the distance between the first groove and the second groove corresponds to the thickness of the back plate support.
Further, the base is provided with an installation direction indicating structure, and the installation direction indicating structure is a turning part on the edge of the base, which is opposite to the installation direction.
Further, a boss is arranged around the periphery of the functional piece, the boss is provided with a first boss surface and a second boss surface which are arranged in parallel according to the installation direction of the functional piece, the normal positioning structure is the first boss surface, the reverse positioning structure is the second boss surface, and the first boss surface and the second boss surface are respectively used for abutting against the base when the functional piece passes through the installation hole from different directions, positioning the functional piece, and fixing the functional piece through a fastener such as a fastening nut arranged on the opposite side of the base.
Further, the back plate support and the base are both flat plate pieces, and the distance between the first boss surface and the second boss surface corresponds to the thickness of the back plate support.
Further, the functional piece comprises a connector or a guide pin, and the forward-loading positioning structure and the reverse-loading positioning structure are arranged on the periphery of the functional piece.
According to the technical scheme, the functional parts and the base are assembled in different modes, so that the base carrying the functional parts can be installed on the front side (inner side) of the backboard support, and also can be installed on the back side (outer side) of the backboard support through simple reinstallation, the assembly scheme can be freely converted according to different stage requirements or different assembly requirements, the forward installation and the reverse installation of the functional parts are realized, and the material cost is reduced; meanwhile, the front assembly and the reverse assembly can be changed on site, the flexibility of product assembly is improved, the labor intensity under the condition of high-frequency disassembly and assembly is reduced, and the time cost is saved.
Drawings
Fig. 1 is a schematic view of a cavity structure in a semiconductor automatic test equipment in the prior art.
Fig. 2 is a front view of the chamber of fig. 1.
Fig. 3-4 are schematic illustrations of a forward mounting structure of a bi-directional mounting mechanism according to a preferred embodiment of the present invention.
Fig. 5-6 are schematic views showing a reverse mounting state of a bidirectional mounting mechanism according to a preferred embodiment of the present invention.
Fig. 7-8 are schematic structural views of a functional component according to a preferred embodiment of the present invention.
FIG. 9 is an exploded view of a base assembly according to a preferred embodiment of the present invention.
Fig. 10-11 are schematic illustrations of a forward mounting structure of a bi-directional mounting mechanism according to a preferred embodiment of the present invention.
Fig. 12-13 are schematic views showing a reverse mounting state of a bidirectional mounting mechanism according to a preferred embodiment of the present invention.
Detailed Description
The following describes the embodiments of the present invention in further detail with reference to the accompanying drawings.
In the following detailed description of the embodiments of the present invention, the structures of the present invention are not drawn to a general scale, and the structures in the drawings are partially enlarged, deformed, and simplified, so that the present invention should not be construed as being limited thereto.
In the following embodiments of the present invention, please refer to fig. 3-6, wherein fig. 3 shows a front-mounted state structure of the bi-directional mounting mechanism of the present invention when the bi-directional mounting mechanism is required to be mounted to the back plate bracket 3 from the outside (reverse side) direction of the back plate bracket 3, and fig. 4 shows a right side view of the bi-directional mounting mechanism of fig. 3; fig. 5 shows a reverse mounting state structure of the bi-directional mounting mechanism of the present invention when the bi-directional mounting mechanism is required to be mounted with the back plate bracket 3 from the inside (front) direction of the back plate bracket 3, and fig. 6 shows a left side view of the bi-directional mounting mechanism in fig. 5. The bidirectional mounting mechanism can be applied to the field of semiconductor Automatic Test (ATE), and is used in the field of mounting a board card 2 into a cavity 1 in test equipment for testing. The bidirectional mounting mechanism of the present invention includes a base 9 and a functional member (connector) 6 assembled together. The base 9 is used for carrying the functional component 6 together with the back board support 3 shown in fig. 2, so as to realize the installation of the back board support 3 from the outer direction of the back board support 3, as shown in fig. 3-4, or the installation of the back board support 3 from the inner direction of the back board support 3, as shown in fig. 5-6, so as to meet the installation requirements of the signal transfer device (such as a connector) and/(or) positioning guide parts (such as guide pins) in different testing stages. However, the existing mounting technology is limited by the special structure of the deep cavity 1 (refer to fig. 1), so that it is difficult to mount the signal transfer device and the positioning guide parts one by one from the front side of the back plate bracket 3 (i.e. from the inside of the cavity 1) and the back plate bracket 3, and frequent disassembly and assembly are required in the test stage, which is time-consuming and labor-consuming.
Please refer to fig. 3 and fig. 5. The base 9 is provided with a mounting hole 12 for the functional element 6 to pass through, and the functional element 6 is assembled with the base 9 through the mounting hole 12. When the base 9 is mounted to the back plate holder 3, the mounting hole 12 corresponds to the position of the opening 4 provided on the back plate holder 3 for the functional piece 6 (signal relay device or positioning guide member) to pass through (refer to fig. 2), and the boundary of the mounting hole 12 falls within the boundary of the opening 4 so that the functional piece 6 can be smoothly accommodated in the opening 4 on the back plate holder 3.
The back plate support 3 is provided with an opening array comprising a plurality of openings 4 in a row-column manner, as shown in fig. 2. The openings 4 of each row correspond to the corresponding layer of board cards 2, so as to meet the requirement of installing a signal transfer device or a positioning guide part which is in butt joint with each layer of board card 2 at the position of each opening 4.
Corresponding to the back plate support 3, the bases 9 are in a transverse arrangement corresponding to the openings 4 arranged on the back plate support 3 in the row direction, and a plurality of mounting holes 12 can be arranged on each base 9 in the row direction, so that one mounting hole 12 corresponds to one opening 4. In the present embodiment, three mounting holes 12 are provided in parallel on one base 9, but not limited thereto. Like this, can be according to the test needs, the quantity of the function piece 6 of the respective demand of different plywood cards 2 of installation on base 9 to make things convenient for whole dismouting, effectively avoided in the past need to carry out the easy problem that takes place mutual interference of dismouting one by one, and improved efficiency, practiced thrift test time.
Please refer to fig. 9. In this embodiment, the base 9 takes the form of split components 7 and 8; the split assemblies 7 and 8 may include an upper split 7 and a lower split 8 that are assembled together. Wherein, the upper split piece 7 and the lower split piece 8 are respectively provided with partial hole patterns of the mounting holes 12, and after the upper split piece 7 and the lower split piece 8 are combined together, the complete hole patterns of the mounting holes 12 can be formed by split.
The positions of the upper and lower segments 7, 8 can be changed by interchange. For example, the upper and lower splits 7, 8 in fig. 9 can be inverted in fig. 5 into lower and upper splits.
Please refer to fig. 7-8. On the outer periphery of the functional element 6, a forward-loading positioning structure 15 and a reverse-loading positioning structure 14 are provided, and the forward-loading positioning structure 15 and the reverse-loading positioning structure 14 are arranged in parallel according to the installation direction of the functional element 6. For the purpose of indicating the orientation, the surface of the functional element 6 is shown with words such as a, B, C, D, etc., but this is not actually required. For example, the directions a-B are the mounting directions of the functional elements 6 with respect to the back plate holder 3, and the directions D-C are the up-down directions of the functional elements 6 with respect to the back plate holder 3.
When the base 9 is required to be installed from the outer side direction of the backboard support 3, the functional piece 6 is correspondingly matched with the installation hole 12 on the base 9 by adopting the normal installation positioning structure 15, and the functional piece 6 is positioned and fixed through the installation hole 12. On the contrary, when the base 9 is required to be installed from the inner side direction of the backboard bracket 3, the functional piece 6 correspondingly adopts the reverse installation positioning structure 14 to be matched with the installation hole 12 on the base 9, and the functional piece 6 is positioned and fixed through the installation hole 12. The purpose of this design is to ensure that the relative orientation of the functional element 6 in the opening 4 is unchanged after the base 9 is mounted on the back plate bracket 3, i.e. to ensure that the relative positions between the functional element 6 and the back plate bracket 3 and between the functional element and the board card 2 remain unchanged. For example, when the base 9 is required to be mounted from the outside direction of the back plate bracket 3, the side marked with B on the functional piece 6 is disposed away from the board 2 in the device (i.e., the side marked with a on the functional piece 6 is disposed toward the board 2 in the device), as shown in fig. 3; conversely, when the base 9 is required to be mounted from the inner side of the back plate bracket 3, the side marked with B on the functional piece 6 will still be disposed away from the board card 2 in the device (i.e., the side marked with a on the functional piece 6 is disposed toward the board card 2 in the device). At the same time, the surface of the functional element 6 marked with D is always disposed facing upwards.
Please refer to fig. 7-8. In this embodiment, the front-loading positioning structure 15 and the back-loading positioning structure 14 are formed by adopting groove structures 15 and 14 around the periphery of the functional piece 6, that is, the front-loading positioning structure 15 is a first groove 15 around the periphery of the functional piece 6, the back-loading positioning structure 14 is a second groove 14 around the periphery of the functional piece 6, and the first groove 15 and the second groove 14 are parallel to each other and perpendicular to the a-B direction (mounting direction) on the functional piece 6.
When the functional piece 6 is assembled with the base 9, the functional piece 6 is placed between the upper split piece 7 and the lower split piece 8, and after the upper split piece 7 and the lower split piece 8 are split, the inner wall of the formed mounting hole 12 is clamped into the notch of the first groove 15 (the second groove 14), so that the functional piece 6 can be positioned and fixed, as shown in fig. 3 or fig. 5.
Since the surface of the functional element 6 is not marked with words such as a, B, C, D, etc., in order to prevent reverse installation, foolproof structures may be further provided between the first groove 15 and the mounting hole 12 and between the second groove 14 and the mounting hole 12, respectively. For example, the fool-proof structure may employ the structures of the blocking pieces 16 and 17 provided separately in the first groove 15 and the second groove 14 as shown in fig. 7 and 8, and the structures of the recesses 13 provided separately on the inner wall of the mounting hole 12 (only one of the structures of the recesses 13 is shown on the inner wall of the mounting hole 12) as shown in fig. 3, 5 and 9. Wherein, the blocking blocks in the first groove 15 and the blocking blocks in the second groove 14 are staggered in position for foolproof. For example, the blocking blocks 16 in the first recess 15 may be provided on the bottom surface ("C" surface) of the functional element 6, while the blocking blocks 17 in the second recess 14 may be provided on the top surface ("D" surface) of the functional element 6.
As can be seen by comparing fig. 4 and 6, when the back plate bracket 3 and the base 9 are both flat plates, in order to ensure that the relative positions between the functional element 6 and the back plate bracket 3 and between the functional element and the board card 2 remain unchanged, the distance between the front-loading positioning structure (first groove) 15 and the back-loading positioning structure (second groove) 14 needs to correspond to the thickness of the back plate bracket 3.
For convenience in mounting the base 9 and the different surfaces of the backboard support 3, the mounting direction indicating structure 5 can be further arranged on the base 9, so that the same surface of the base 9 is always adopted to face the backboard support 3 no matter the base 9 is mounted on the outer side surface or the inner side surface of the backboard support 3.
For example, the mounting direction indicating structure 5 may employ a structure of a turning portion 5 on an edge of the base 9 facing away from the mounting direction, as shown in fig. 3 to 6 and 9.
Please refer to fig. 9. As an alternative embodiment, the upper segment 7 and the lower segment 8 may be connected by a screw 10. Meanwhile, a loose screw 11 for connection with the backboard support 3 (a screw hole is correspondingly provided on the backboard support 3) may be provided on the upper split 7 or the lower split 8 as a connection fixing means for fixing the bidirectional mounting mechanism to the backboard support. The base 9 can be mounted in the equipment cavity 1 conveniently by adopting the non-loosening screw 11, and the time is saved.
In the present embodiment, the functional element 6 takes the form of, for example, a connector 6, and the first recess 15 and the second recess 14 are machined directly on the outer circumference of the connector 6.
The functional element 6 may also be in the form of a combination of a housing over the connector and the first recess 15 and the second recess 14 are machined into the outer circumference of the housing.
In the following embodiments of the present invention, please refer to fig. 10-13. Wherein, FIG. 10 shows a front-mounted state structure of the bi-directional mounting mechanism of the present invention when the bi-directional mounting mechanism is required to be mounted with the back plate bracket 3 from the outside (reverse side) direction of the back plate bracket 3, and FIG. 11 shows a left side view of the bi-directional mounting mechanism in FIG. 10; fig. 12 shows a reverse mounting state structure of the bi-directional mounting mechanism of the present invention when the back plate holder 3 is required to be mounted from the inside (front) direction of the back plate holder 3, and fig. 13 shows a left side view of the bi-directional mounting mechanism in fig. 12. In this embodiment the functional elements are in the form of, for example, guide pins 19, the conical heads of which guide pins 19 are intended to interface with the board 2. The base takes the form of a base 18 of unitary construction (the mounting connection between the base 18 and the back plate support 3 is not shown). The base 18 is exemplified by the form of three circular mounting holes 20 which mate with the guide pins 19, and the guide pins 19 are inserted into the mounting holes 20 to be assembled with the base 18.
Please refer to fig. 10-13. Around the outer periphery of the guide pin 19, a boss 25 is provided, the boss 25 having a first boss face 22 and a second boss face 24 arranged in parallel in the mounting direction of the guide pin 19, and a side face 23 of the boss 25. Wherein the first boss 22 (near the tail of the guide pin 19) is a positive-fit positioning structure, and the second boss 24 (near the head of the guide pin 19) is a negative-fit positioning structure 14.
When the base 18 is required to be installed from the outer side direction of the backboard support 3, the tail part of the guide pin 19 can be inserted into the installation hole 20 from the front surface of the base 18 (the surface installed with the backboard support 3), and at the moment, the first raised table 22 can be abutted against the front surface of the base 18 to realize positioning of the guide pin 19; at the same time, the guide pin 19 can be fixed on the base 18 by tightening the fastening nut 21 from the tail end of the guide pin 19 located on the opposite side of the base 18 toward the base 18. On the contrary, when the base 18 is required to be installed from the inner side direction of the backboard bracket 3, the head of the guide pin 19 can be inserted into the installation hole 20 from the front surface of the base 18, and at the moment, the second raised table 24 can be abutted against the front surface of the base 18 to realize positioning of the guide pin 19; at the same time, the guide pin 19 can be fixed to the base 18 by tightening the fastening nut 21 from the head end of the guide pin 19 located on the opposite side of the base 18 toward the base 18.
The boss 25 with the normal and reverse positioning structures may be machined directly on the outer circumference of the guide pin 19 to form a functional piece.
The boss with the matching hole can be processed separately, and then the boss is sleeved on the guide pin 19 through the matching hole and fixed with the guide pin to form the functional piece.
As can be seen by comparing fig. 11 and 13, in order to ensure that the relative positions between the guide pins 19 and the back plate bracket 3 and the board card 2 remain unchanged, the distance between the first boss surface 22 and the second boss surface 24, i.e. the thickness of the boss 25, needs to correspond to the thickness of the back plate bracket 3.
The first land 22 and the second land 24 may be provided separately on two independent lands, and the above embodiment may be regarded as an example when a plurality of lands are combined into one.
Other structures in the embodiments shown in fig. 10-13 may be understood with reference to corresponding structures in the embodiments shown in fig. 3-9, and will not be described again.
The foregoing description is only of the preferred embodiments of the present invention, and the embodiments are not intended to limit the scope of the invention, so that all the equivalent structural changes made in the description and drawings of the present invention are included in the scope of the invention.
Claims (8)
1. A bi-directional mounting mechanism, comprising: the base is used for carrying the functional piece to be installed with the backboard support from the outer side or the inner side direction of the backboard support, the base is provided with an installation hole for the functional piece to pass through, the backboard support is correspondingly provided with an opening for the functional piece to pass through, and the base is used for carrying the functional piece to be installed with the backboard support of the semiconductor automatic test equipment together; the functional piece is a connector for realizing communication between a board card of automatic test equipment and a tested object, a normal positioning structure and a reverse positioning structure are arranged on the periphery of the functional piece, and the normal positioning structure and the reverse positioning structure are arranged in parallel according to the installation direction of the functional piece; when the base is required to be installed from the outer side direction or the inner side direction of the backboard support, the normal installation positioning structure or the reverse installation positioning structure is correspondingly adopted to be matched with the installation hole, and the functional piece is positioned and fixed, so that the relative position of the functional piece in the opening is unchanged after the base is installed on the backboard support; the front mounting positioning structure and the back mounting positioning structure are respectively a first groove and a second groove which are arranged around the periphery of the functional piece, the base is a splicing component, the mounting hole is formed by splicing the splicing component, and the mounting hole is used for being clamped into the first groove or the second groove when being spliced to position and fix the functional piece;
fool-proof structures are respectively arranged between the first groove and the mounting hole in a matching way, and the fool-proof structures are blocking blocks respectively arranged in the first groove and the second groove and depressions correspondingly arranged on the inner wall of the mounting hole; the blocking blocks in the first grooves and the blocking blocks in the second grooves are staggered in position and used for foolproof.
2. The bi-directional mounting mechanism of claim 1 wherein said split assembly includes an upper split and a lower split that are split to form said mounting hole.
3. The bi-directional mounting mechanism of claim 2 wherein said upper and lower split members are connected by screws, said upper or lower split member having attachment fixtures for securing said bi-directional mounting mechanism to said back plate bracket.
4. The bi-directional mounting mechanism of claim 1, wherein the back plate bracket and the base are each a flat plate member, and the distance between the first recess and the second recess corresponds to the thickness of the back plate bracket.
5. The bi-directional mounting mechanism of claim 4 wherein said base is provided with a mounting direction indicating feature, said mounting direction indicating feature being a turn on an edge of said base facing away from a mounting direction.
6. The bidirectional mounting mechanism according to claim 1, wherein a boss is provided around an outer periphery of the functional element, the boss has a first boss surface and a second boss surface arranged in parallel in a mounting direction of the functional element, the normal mounting positioning structure is the first boss surface, the reverse mounting positioning structure is the second boss surface, and the first boss surface and the second boss surface are respectively used for abutting against the base when the functional element passes through the mounting hole from different directions, positioning the functional element, and fixing the functional element by a fastener provided on opposite sides of the base.
7. The bi-directional mounting mechanism of claim 6, wherein the back plate bracket and the base are each a flat plate, and the distance between the first land surface and the second land surface corresponds to the thickness of the back plate bracket.
8. The bi-directional mounting mechanism of claim 1 wherein the functional member comprises a connector or guide pin, the positive and negative mounting locations being provided on an outer periphery of the functional member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010127967.1A CN111326457B (en) | 2020-02-28 | 2020-02-28 | Bidirectional mounting mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010127967.1A CN111326457B (en) | 2020-02-28 | 2020-02-28 | Bidirectional mounting mechanism |
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| Publication Number | Publication Date |
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| CN111326457A CN111326457A (en) | 2020-06-23 |
| CN111326457B true CN111326457B (en) | 2023-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010127967.1A Active CN111326457B (en) | 2020-02-28 | 2020-02-28 | Bidirectional mounting mechanism |
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| CN110534973A (en) * | 2019-08-22 | 2019-12-03 | 上海御渡半导体科技有限公司 | A kind of guiding device |
| CN110716117A (en) * | 2019-09-06 | 2020-01-21 | 上海御渡半导体科技有限公司 | Test board card leading-in device for automatic test equipment |
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|---|---|---|---|---|
| EP1995602B1 (en) * | 2007-05-23 | 2013-08-14 | RRo Holding B.V. | Probe board, test fixture, method for making a probe board, and method for testing a printed circuit board |
| US7936172B2 (en) * | 2008-09-30 | 2011-05-03 | Honeywell International Inc. | Automatic test equipment self test |
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2020
- 2020-02-28 CN CN202010127967.1A patent/CN111326457B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205210125U (en) * | 2015-12-01 | 2016-05-04 | 深圳凌测科技有限公司 | PCBA veneer test platform |
| CN206193177U (en) * | 2016-10-21 | 2017-05-24 | 杨愉铭 | Multiclass circuit function integrated circuit board automatic test equipment |
| CN110534973A (en) * | 2019-08-22 | 2019-12-03 | 上海御渡半导体科技有限公司 | A kind of guiding device |
| CN110716117A (en) * | 2019-09-06 | 2020-01-21 | 上海御渡半导体科技有限公司 | Test board card leading-in device for automatic test equipment |
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| CN111326457A (en) | 2020-06-23 |
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