CN111326457A - Two-way installation mechanism - Google Patents
Two-way installation mechanism Download PDFInfo
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- CN111326457A CN111326457A CN202010127967.1A CN202010127967A CN111326457A CN 111326457 A CN111326457 A CN 111326457A CN 202010127967 A CN202010127967 A CN 202010127967A CN 111326457 A CN111326457 A CN 111326457A
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- mounting
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- back plate
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- positioning structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention discloses a bidirectional mounting mechanism which comprises a base and a functional piece, wherein the base is used for carrying the functional piece to be mounted with a back plate support from the outer side or the inner side of the back plate support, a mounting hole for the functional piece to pass through is formed in the base, an opening for the functional piece to pass through is correspondingly formed in the back plate support, and a forward mounting positioning structure and a backward mounting positioning structure which are arranged in parallel according to the mounting direction of the functional piece are arranged on the periphery of the functional piece; when the base is required to be installed from the outer side direction or the inner side direction of the back plate support, the forward installation positioning structure or the backward installation positioning structure is correspondingly adopted to be matched with the installation hole, the functional piece is positioned and fixed, and after the base is installed on the back plate support, the relative position of the functional piece in the opening is unchanged. The invention can freely convert the assembly scheme according to different stage requirements or different assembly requirements, realizes the forward assembly and the reverse assembly of the functional parts, reduces the material cost and the labor intensity, and saves the time cost.
Description
Technical Field
The invention relates to the technical field of semiconductor automatic test equipment, in particular to a bidirectional mounting mechanism which can be matched with a back plate bracket from the inner side or the outer side.
Background
As shown in fig. 1, in the field of semiconductor Automated Test (ATE), a board 2 needs to be mounted in a cavity 1 in a test apparatus for testing. When the board card 2 is docked to the test equipment, the board card 2 can communicate with the tested object through a signal transfer device (such as a connector); meanwhile, the position accuracy of the board card 2 needs to be ensured by positioning guide parts (e.g., guide pins), and these signal transfer devices and the positioning guide parts are generally installed on the back plate bracket 3 of the cavity 1 in the testing apparatus, as shown in fig. 2.
Please refer to fig. 2. The back plate bracket 3 is provided with a plurality of rows of openings 4 for installing external parts such as a signal transfer device, a positioning guide part and the like. For ease of assembly, these components of the backplane board support 3 are generally mounted on the outside of the backplane board support 3 (shown as the back of the backplane board support 3), and are connected to the board card 2 in the equipment cavity 1 through the opening 4 of the backplane board support 3.
However, due to the special structure of the device, there are many parts outside the backboard, which easily causes mutual interference during maintenance, and requires a large amount of work to detach the parts on the backboard bracket 3 one by one. Especially, in the test stage, the frequency of assembling and disassembling parts on the back plate bracket 3 is high, and time and labor are wasted.
If these components can be assembled as desired, particularly, mounted on the inner side of the back plate holder 3 (the front side of the back plate holder 3 shown in the figure), the above-mentioned problem of mutual interference can be avoided, the labor intensity of the assembly and disassembly can be remarkably reduced, and the time cost can be saved. However, the inside of the back plate bracket 3 is the deeper equipment cavity 1, so that the assembly of parts is inconvenient, and especially for small-sized equipment, the mass production is not facilitated.
Disclosure of Invention
The present invention is directed to overcoming the above-mentioned drawbacks of the prior art and providing a bi-directional mounting mechanism that can be mounted on either the front (inner) or the back (outer) side of a backplane cradle on a test apparatus.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a bi-directional mounting mechanism comprising: the base is used for carrying the functional piece to be mounted with the back plate support from the outer side or the inner side of the back plate support, a mounting hole for the functional piece to pass through is formed in the base, an opening for the functional piece to pass through is correspondingly formed in the back plate support, a forward mounting positioning structure and a reverse mounting positioning structure are arranged on the periphery of the functional piece, and the forward mounting positioning structure and the reverse mounting positioning structure are arranged in parallel according to the mounting direction of the functional piece; when the base is required to be installed from the outer side direction or the inner side direction of the back plate support, the forward installing and positioning structure or the backward installing and positioning structure is correspondingly adopted to be matched with the installation hole, and the functional piece is positioned and fixed, so that the relative position of the functional piece in the opening is unchanged after the base is installed on the back plate support.
Further, just adorn location structure and anti-dress location structure and locate for encircleing respectively first recess and second recess in the function piece periphery, the base is the amalgamation subassembly, the mounting hole by the amalgamation subassembly amalgamation forms, the mounting hole is used for the card to go into when the amalgamation first recess or second recess, it is right the function piece is fixed a position and is fixed.
Further, the split assembly includes an upper split and a lower split that are split to form the mounting hole.
Furthermore, the upper split part and the lower split part are connected through screws, and a connecting and fixing device used for fixing the bidirectional mounting mechanism to the back plate bracket is arranged on the upper split part or the lower split part.
Furthermore, foolproof structures are respectively arranged between the first groove and the mounting hole and between the second groove and the mounting hole in a matching manner, wherein the foolproof structures are blocking blocks respectively arranged in the first groove and the second groove and corresponding recesses respectively arranged on the inner wall of the mounting hole; the blocking blocks in the first groove and the blocking blocks in the second groove are arranged in a staggered mode and used for fool proofing.
Further, the back plate support and the base are both flat plate members, and the distance between the first groove and the second groove corresponds to the thickness of the back plate support.
Further, the base is provided with an installation direction indicating structure, and the installation direction indicating structure is a turning part which is arranged on the edge of the base and faces away from the installation direction.
Further, encircle the periphery of function piece is equipped with the boss, the boss has press the installation direction parallel arrangement's of function piece first boss face and second boss face, just adorn location structure and do first boss face, it does to adorn location structure instead the second boss face, first boss face with second boss face is used for respectively the function piece passes from equidirectional the function piece supports during the mounting hole and leans on the base, right the function piece is fixed a position, and through locating the fastener of base opposite side, for example fastening nut is right the function piece is fixed.
Further, the back plate support and the base are both flat plate members, and the distance between the first boss face and the second boss face corresponds to the thickness of the back plate support.
Further, the functional part comprises a connector or a guide pin, and the forward mounting positioning structure and the reverse mounting positioning structure are arranged on the periphery of the functional part.
According to the technical scheme, the functional parts and the base are assembled in different modes, the base carrying the functional parts can be arranged on the front side (inner side) of the back plate support, and can also be arranged on the back side (outer side) of the back plate support through simple re-assembly, the assembly scheme can be freely changed according to different stage requirements or different assembly requirements, the forward assembly and the reverse assembly of the functional parts are realized, and the material cost is reduced; meanwhile, the normal installation and the reverse installation can be changed on site, the flexibility of product assembly is improved, the labor intensity under the high-frequency disassembly and assembly condition is reduced, and the time cost is saved.
Drawings
Fig. 1 is a schematic diagram of a structure of a chamber in a conventional semiconductor automated testing apparatus.
Fig. 2 is a front view of the chamber of fig. 1.
FIGS. 3-4 are schematic views illustrating the forward mounting structure of a bi-directional mounting mechanism according to a preferred embodiment of the present invention.
FIGS. 5-6 are schematic views illustrating the reverse-mounted structure of the bi-directional mounting mechanism according to a preferred embodiment of the present invention.
Fig. 7-8 are schematic structural views of a functional element according to a preferred embodiment of the invention.
Fig. 9 is an exploded view of a base according to a preferred embodiment of the present invention.
FIGS. 10-11 are structural views illustrating the forward mounting state of a bi-directional mounting mechanism in accordance with a preferred embodiment of the present invention.
FIGS. 12-13 are schematic views illustrating the reverse-mounted state of a bi-directional mounting mechanism in accordance with a preferred embodiment of the present invention.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
In the following detailed description of the embodiments of the present invention, in order to clearly illustrate the structure of the present invention and to facilitate explanation, the structure shown in the drawings is not drawn to a general scale and is partially enlarged, deformed and simplified, so that the present invention should not be construed as limited thereto.
In the following description of the present invention, please refer to fig. 3-6, wherein fig. 3 shows the structure of the two-way mounting mechanism of the present invention in a forward mounting state when it needs to be mounted with the backboard bracket 3 from the outer (reverse) direction of the backboard bracket 3, and fig. 4 shows a right side view of the two-way mounting mechanism of fig. 3; fig. 5 shows a reverse mounting state structure of a two-way mounting mechanism of the present invention, which requires mounting with the back plate holder 3 from the inside (front) direction of the back plate holder 3, and fig. 6 shows a left side view of the two-way mounting mechanism of fig. 5. The bidirectional mounting mechanism can be applied to the field of Automatic Test Equipment (ATE) of semiconductors, and is used in a test scene when the board card 2 is mounted in the cavity 1 in the test equipment. A two-way mounting mechanism of the present invention comprises a base 9 and a functional member (connector) 6 assembled together. The base 9 is used for carrying the functional component 6 and installing with the back panel bracket 3 shown in fig. 2, for example, to implement installation with the back panel bracket 3 from the outside direction of the back panel bracket 3, as shown in fig. 3-4, or installation with the back panel bracket 3 from the inside direction of the back panel bracket 3, as shown in fig. 5-6, so as to meet the installation requirements of the signal relay device (e.g. connector) and/(or) positioning guide parts (e.g. guide pins) at different testing stages. However, in the conventional mounting technology, because the mounting technology is limited by the special structure of the deeper cavity 1 of the device (refer to fig. 1), it is difficult to mount the signal transfer device and the positioning and guiding parts one by one from the front surface of the back plate bracket 3 (i.e. from the inside of the cavity 1) and the back plate bracket 3, and the mounting technology consumes time and labor because frequent disassembly and assembly are required in the testing stage.
Please refer to fig. 3 and 5. The base 9 is provided with a mounting hole 12 for the functional part 6 to pass through, and the functional part 6 is assembled with the base 9 through the mounting hole 12. When the base 9 is mounted on the backboard bracket 3, the mounting hole 12 corresponds to the position of the opening 4 provided in the backboard bracket 3 for the functional element 6 (signal relay device or positioning guide part) to pass through (refer to fig. 2), and the boundary of the mounting hole 12 falls within the boundary of the opening 4, so that the functional element 6 can be smoothly accommodated in the opening 4 in the backboard bracket 3.
The back plate frame 3 is provided with an opening array consisting of a plurality of openings 4 in rows and columns, as shown in fig. 2. The openings 4 in each row correspond to the board cards 2 in a corresponding layer, so that the requirement of installing a signal transfer device or a positioning guide part in butt joint with the board cards 2 in each layer at the positions of the openings 4 is met.
The bases 9 are arranged in a transverse manner corresponding to the openings 4 arranged in the row direction on the backboard support 3 corresponding to the backboard support 3, and one or more mounting holes 12 may be arranged in the row direction on each base 9 so that one mounting hole 12 corresponds to one opening 4. In the present embodiment, three mounting holes 12 are provided in parallel in one base 9, but the present invention is not limited thereto. Like this, can be according to the test needs, the quantity of the function piece 6 of the respective demand of installation different layer integrated circuit boards 2 on base 9 to make things convenient for whole dismouting, effectively avoided in the past need one carry out the dismouting problem that takes place mutual interference easily, and improved efficiency, practiced thrift test time.
Please refer to fig. 9. In this embodiment, the base 9 takes the form of split assemblies 7 and 8; the split assemblies 7 and 8 may include an upper split 7 and a lower split 8 that are assembled by being split. Wherein, the upper split piece 7 and the lower split piece 8 are respectively provided with a part of hole patterns of the mounting holes 12, and after the upper split piece 7 and the lower split piece 8 are combined together, a complete hole pattern of the mounting holes 12 can be formed by splicing.
The positions of the upper and lower split members 7 and 8 may be changed by interchanging them. For example, the upper and lower split members 7 and 8 in fig. 9 may be reversed to be converted to the lower and upper split members in fig. 5.
Please refer to fig. 7-8. The periphery of the functional part 6 is provided with a forward mounting positioning structure 15 and a reverse mounting positioning structure 14, and the forward mounting positioning structure 15 and the reverse mounting positioning structure 14 are arranged in parallel according to the mounting direction of the functional part 6. Characters such as a, B, C, D are shown on the surface of the functional element 6 in the drawings to indicate orientation, but they are not actually required. For example, the A-B direction is the mounting direction of the functional member 6 with respect to the back plate holder 3, and the D-C direction is the up-down direction of the functional member 6 with respect to the back plate holder 3.
When the base 9 is required to be installed from the outer side direction of the backboard bracket 3, the functional part 6 is correspondingly matched with the installation hole 12 on the base 9 by adopting the upright installation positioning structure 15, and the functional part 6 is positioned and fixed through the installation hole 12. On the contrary, when the base 9 needs to be installed from the inner side direction of the backboard bracket 3, the functional element 6 correspondingly adopts the reversed installation positioning structure 14 to be matched with the installation hole 12 on the base 9, and the functional element 6 is positioned and fixed through the installation hole 12. The purpose of this design is to ensure that the relative orientation of the functional element 6 in the opening 4 remains unchanged after the base 9 has been mounted on the backplane support 3, i.e. that the relative positions of the functional element 6 with the backplane support 3 and the card 2 remain unchanged. For example, when the base 9 needs to be mounted from the outside direction of the backplane bracket 3, the side marked with B on the function 6 is arranged away from the board card 2 in the device (i.e. the side marked with a on the function 6 is arranged towards the board card 2 in the device), as shown in fig. 3; conversely, when the base 9 needs to be mounted from the inner side of the backplane support 3, the side marked with B of the functional component 6 still faces away from the board 2 in the device (i.e., the side marked with a of the functional component 6 faces the board 2 in the device). Meanwhile, the surface marked with D on the functional part 6 is always arranged towards the upper part.
Please refer to fig. 7-8. In this embodiment, the forward mounting positioning structure 15 and the reverse mounting positioning structure 14 are respectively formed by groove structures 15 and 14 which are arranged around the periphery of the functional part 6, that is, the forward mounting positioning structure 15 is a first groove 15 arranged around the periphery of the functional part 6, the reverse mounting positioning structure 14 is a second groove 14 arranged around the periphery of the functional part 6, and the first groove 15 and the second groove 14 are parallel to each other and arranged perpendicular to the a-B direction (mounting direction) on the functional part 6.
When the functional part 6 is assembled with the base 9, the functional part 6 is placed between the upper split part 7 and the lower split part 8, and after the upper split part 7 and the lower split part 8 are split, the inner wall of the formed mounting hole 12 is clamped into the notch of the first groove 15 (the second groove 14), so that the functional part 6 can be positioned and fixed, as shown in fig. 3 or fig. 5.
Since the functional element 6 is not marked with characters such as a, B, C, D on the surface, in order to prevent the installation from being reversed, a fool-proof structure may be further provided between the first groove 15 and the mounting hole 12 and between the second groove 14 and the mounting hole 12. For example, the fool-proof structure may adopt blocking blocks 16 and 17 respectively disposed in the first recess 15 and the second recess 14, as shown in fig. 7 and 8, and corresponding recesses 13 respectively disposed on the inner wall of the mounting hole 12 (only one recess 13 structure is shown on the inner wall of the mounting hole 12), as shown in fig. 3, 5 and 9. The blocking blocks in the first groove 15 and the blocking blocks in the second groove 14 are arranged in a staggered mode for fool-proofing. For example, the blocking block 16 in the first recess 15 can be disposed on the bottom surface ("C" surface) of the functional element 6, while the blocking block 17 in the second recess 14 can be disposed on the top surface ("D" surface) of the functional element 6.
Comparing fig. 4 and 6, it can be seen that when the backplane board support 3 and the base 9 are both flat plate members, the distance between the forward mounting structure (first groove) 15 and the reverse mounting structure (second groove) 14 needs to correspond to the thickness of the backplane board support 3 in order to ensure that the relative positions of the functional member 6 with the backplane board support 3 and the board 2 are kept constant.
In order to facilitate the installation of the base 9 and the back plate support 3 on different surfaces, the base 9 can be further provided with an installation direction indicating structure 5, so that the base 9 is ensured to be installed on the outer side surface or the inner side surface of the back plate support 3, and the same surface of the base 9 is always adopted to face the back plate support 3.
For example, the mounting direction indicating structure 5 may adopt a structure of the turning part 5 facing away from the mounting direction on the edge of the base 9, as shown in fig. 3 to 6 and 9.
Please refer to fig. 9. As an alternative embodiment, the upper and lower split members 7 and 8 may be connected by a screw 10. Meanwhile, a release screw 11 (a screw hole is correspondingly arranged on the backboard bracket 3) for connecting with the backboard bracket 3 can be arranged on the upper split part 7 or the lower split part 8 and is used as a connecting and fixing device for fixing the bidirectional mounting mechanism on the backboard bracket. The base 9 can be installed from the inside of the equipment cavity 1 conveniently by adopting the release screw 11, and time is saved.
In the present embodiment, the functional member 6 is in the form of, for example, a connector 6, and the first groove 15 and the second groove 14 are directly machined on the outer periphery of the connector 6.
The functional element 6 may also be in the form of a combination of a housing over the connector and a first recess 15 and a second recess 14 machined into the outer circumference of the housing.
In the following description of the present invention, reference is made to fig. 10-13. Wherein, fig. 10 shows the structure of the two-way mounting mechanism of the present invention in a forward mounting state when it is required to mount with the backboard bracket 3 from the outside (reverse side) direction of the backboard bracket 3, and fig. 11 shows a left side view of the two-way mounting mechanism of fig. 10; fig. 12 shows a reverse mounting state structure of a two-way mounting mechanism of the present invention, which requires mounting with the back plate holder 3 from the inside (front) direction of the back plate holder 3, and fig. 13 shows a left side view of the two-way mounting mechanism of fig. 12. In this embodiment, the functional element is in the form of, for example, a guide pin 19, the conical head of which 19 is used for the purpose of docking with the card 2. The base takes the form of a base 18 of unitary construction (the mounting connection to the backplate support 3 is not shown on the base 18). The base 18 exemplifies a form provided with three circular mounting holes 20 to be fitted with the guide pins 19, and the guide pins 19 are inserted into the mounting holes 20 to be assembled with the base 18.
Please refer to fig. 10-13. A boss 25 is provided around the outer periphery of the guide pin 19, the boss 25 having a first boss face 22 and a second boss face 24 arranged in parallel in the mounting direction of the guide pin 19, and a side face 23 of the boss 25. Wherein, the first boss surface 22 (close to the tail side of the guide pin 19) is a forward mounting positioning structure, and the second boss surface 24 (close to the head side of the guide pin 19) is a reverse mounting positioning structure 14.
When the base 18 is required to be installed from the outer side direction of the backboard bracket 3, the tail part of the guide pin 19 can be inserted into the installation hole 20 from the front surface (the surface installed with the backboard bracket 3) of the base 18, and at the moment, the first boss surface 22 can be abutted against the front surface of the base 18 to position the guide pin 19; at the same time, the guide pin 19 can be fixed to the base 18 by tightening the nut 21 from the end of the guide pin 19 located on the opposite side of the base 18 toward the base 18. On the contrary, when the base 18 needs to be installed from the inner side direction of the backboard bracket 3, the head of the guide pin 19 can be inserted into the installation hole 20 from the front surface of the base 18, and at the moment, the second boss surface 24 can be abutted against the front surface of the base 18 to position the guide pin 19; at the same time, the guide pin 19 can be fixed to the base 18 by tightening the nut 21 from the head end of the guide pin 19 located on the opposite side of the base 18 toward the base 18.
The boss 25 with the normal and reverse mounting and positioning structures may be machined directly on the outer periphery of the guide pin 19 to form a functional part.
Or a boss with a matching hole can be separately processed, and then the boss is sleeved on the guide pin 19 through the matching hole and fixed to form a functional part.
Comparing fig. 11 and 13, it can be seen that in order to ensure that the relative positions of the guide pins 19 with the backplane carrier 3 and the card 2 remain unchanged, the distance between the first boss surface 22 and the second boss surface 24, i.e. the thickness of the boss 25, needs to correspond to the thickness of the backplane carrier 3.
The first boss face 22 and the second boss face 24 may also be provided separately on two separate bosses, and the above embodiment may be considered as an example when a plurality of bosses are combined into one.
Other structures in the embodiments shown in fig. 10-13 can be understood by referring to the corresponding structures in the embodiments shown in fig. 3-9, and are not repeated.
The above description is only a preferred embodiment of the present invention, and the embodiments are not intended to limit the scope of the present invention, so that all equivalent structural changes made by using the contents of the specification and the drawings of the present invention should be included in the scope of the present invention.
Claims (10)
1. A bi-directional mounting mechanism, comprising: the base is used for carrying the functional piece to be mounted with the back plate support from the outer side or the inner side of the back plate support, a mounting hole for the functional piece to pass through is formed in the base, an opening for the functional piece to pass through is correspondingly formed in the back plate support, a forward mounting positioning structure and a reverse mounting positioning structure are arranged on the periphery of the functional piece, and the forward mounting positioning structure and the reverse mounting positioning structure are arranged in parallel according to the mounting direction of the functional piece; when the base is required to be installed from the outer side direction or the inner side direction of the back plate support, the forward installing and positioning structure or the backward installing and positioning structure is correspondingly adopted to be matched with the installation hole, and the functional piece is positioned and fixed, so that the relative position of the functional piece in the opening is unchanged after the base is installed on the back plate support.
2. The bidirectional mounting mechanism of claim 1, wherein the forward mounting positioning structure and the reverse mounting positioning structure are respectively a first groove and a second groove which are circumferentially arranged on the periphery of the functional piece, the base is a splicing assembly, the mounting hole is formed by splicing the splicing assembly, and the mounting hole is used for being clamped into the first groove or the second groove when being spliced to position and fix the functional piece.
3. The bi-directional mounting mechanism of claim 2 wherein said split assembly comprises an upper split and a lower split that are split to form said mounting aperture.
4. The bi-directional mounting mechanism of claim 3 wherein said upper and lower split members are connected by screws, and wherein said upper or lower split members are provided with attachment means for attaching said bi-directional mounting mechanism to said back plate bracket.
5. The bidirectional mounting mechanism of claim 2 wherein foolproof structures are respectively provided between the first and second grooves and the mounting hole in pairs, the foolproof structures being blocking blocks respectively provided in the first and second grooves and corresponding recesses provided on the inner wall of the mounting hole; the blocking blocks in the first groove and the blocking blocks in the second groove are arranged in a staggered mode and used for fool proofing.
6. The bi-directional mounting mechanism of claim 2 wherein said back plate bracket and said base are both flat plate members, and the distance between said first recess and said second recess corresponds to the thickness of said back plate bracket.
7. The bi-directional mounting mechanism of claim 6 wherein said base is provided with a mounting direction indicating structure, said mounting direction indicating structure being a turn on an edge of said base facing away from a mounting direction.
8. The bi-directional mounting mechanism of claim 1 wherein a boss is provided around the periphery of the functional member, the boss having a first boss face and a second boss face arranged in parallel in the mounting direction of the functional member, the forward mounting and positioning structure being the first boss face, the reverse mounting and positioning structure being the second boss face, the first boss face and the second boss face being respectively configured to abut against the base when the functional member passes through the mounting hole from different directions, to position the functional member, and to fix the functional member by means of a fastener provided on the opposite side of the base.
9. The bi-directional mounting mechanism of claim 8 wherein said back plate bracket and said base are both flat plate members, and the distance between said first boss surface and said second boss surface corresponds to the thickness of said back plate bracket.
10. The bi-directional mounting mechanism of claim 1 wherein said functional element comprises a connector or a guide pin, and said forward mounting location structure and said reverse mounting location structure are provided on an outer periphery of said functional element.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010127967.1A CN111326457B (en) | 2020-02-28 | 2020-02-28 | Bidirectional mounting mechanism |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010127967.1A CN111326457B (en) | 2020-02-28 | 2020-02-28 | Bidirectional mounting mechanism |
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| CN111326457A true CN111326457A (en) | 2020-06-23 |
| CN111326457B CN111326457B (en) | 2023-09-22 |
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| Publication number | Publication date |
|---|---|
| CN111326457B (en) | 2023-09-22 |
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