CN111312675B - Heat transfer and heat storage sheet, preparation method thereof and heat dissipation structure - Google Patents
Heat transfer and heat storage sheet, preparation method thereof and heat dissipation structure Download PDFInfo
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- CN111312675B CN111312675B CN202010273053.6A CN202010273053A CN111312675B CN 111312675 B CN111312675 B CN 111312675B CN 202010273053 A CN202010273053 A CN 202010273053A CN 111312675 B CN111312675 B CN 111312675B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
Abstract
The invention discloses a heat transfer and storage sheet, comprising: the heat transfer layer comprises a silica gel substrate and heat conducting fillers positioned in the silica gel substrate, wherein the heat conducting fillers comprise one-dimensional materials, two-dimensional materials and three-dimensional materials which are distributed in a directional mode; and the heat storage layer is stacked with the heat transfer layer and is set up, the heat storage layer includes the silica gel base member and is located in the silica gel base member heat conduction filler and phase change material, phase change material includes the phase change material of stereotyping. The heat transfer and storage sheet provided by the invention has the characteristics of small filling amount of filler, high heat conductivity coefficient, good heat transfer performance of a heat storage system, short heat storage and storage time and high heat exchange efficiency. The invention also discloses a preparation method of the heat transfer and storage sheet and a heat dissipation structure.
Description
Technical Field
The invention relates to the technical field of heat transfer and storage materials, in particular to a heat transfer and storage sheet, a preparation method thereof and a heat dissipation structure.
Background
In recent years, with the increasing integration of electronic components such as chips and power devices, the demand for heat dissipation is increasing, the heat dissipation space becomes smaller and smaller, the heat flux density is increasing, and the design requirement for a heat dissipation system is also increasing. At present, an electronic component generally radiates heat by abutting a radiating fin on a heating surface of the electronic component, thermal contact resistance is generated between the surface of a heat source and the contact surface of a radiating piece, and meanwhile, the surface of the heat source and the surface of the radiating piece have certain roughness, so that air exists in the contact interface, and the thermal resistance is increased. In order to reduce the thermal contact resistance between the surface of the heat source and the contact surface of the heat sink and to improve the heat dissipation efficiency, a thermally conductive silicone sheet is generally filled between the heat source and the heat sink.
However, the heat conductive silicone sheet is filled with the heat conductive filler in the silicone matrix to improve the heat conductive performance thereof. The commonly used heat-conducting filler is mainly inorganic powder, and the inorganic powder needs high filling amount to achieve higher heat conductivity, and the high filling amount can seriously influence the mechanical property of the silica gel.
The phase-change heat storage material absorbs or emits a large amount of phase-change latent heat when the state changes, so that heat storage is realized. In the phase change process, the phase change temperature is constant, and the aim of controlling the temperature can be fulfilled. Therefore, the phase-change heat storage material can absorb the heat emitted by the electronic device during operation, and the temperature of the electronic device is maintained near the phase-change temperature of the phase-change material, so that the temperature is controlled in the optimal temperature range for the operation of the electronic device, the stability of the operation of the electronic device is ensured, and the service life of the electronic device is prolonged. However, most phase-change materials have the problem of too low heat conductivity coefficient, so that the heat transfer performance of the heat storage system is poor, the heat storage and heat storage time is long, and the heat efficiency of the system is further reduced.
Disclosure of Invention
In view of the above, the present invention provides a heat transfer and storage sheet, which has the characteristics of small filling amount of filler, high heat conductivity, good heat transfer performance of a heat storage system, short heat storage and storage time and high heat exchange efficiency.
In addition, a preparation method of the heat transfer and storage sheet is also needed to be provided.
In addition, it is necessary to provide a heat dissipation structure including the above heat transfer and storage fin.
The invention provides a heat transfer and storage sheet, comprising:
the heat transfer layer comprises a silica gel substrate and heat conducting fillers positioned in the silica gel substrate, wherein the heat conducting fillers comprise one-dimensional materials, two-dimensional materials and three-dimensional materials which are distributed in a directional mode; and
the heat storage layer, the heat storage layer with the heat transfer layer piles up the setting, the heat storage layer includes the silica gel base member and is located in the silica gel base member heat conduction filler and phase change material, phase change material includes the shape-stabilized phase change material.
The invention also provides a preparation method of the heat transfer and storage sheet, which comprises the following steps:
mixing the heat-conducting filler and the bi-component silica gel to obtain a heat-conducting phase material;
mixing the heat-conducting filler, the micro/nano capsule phase change material and the bi-component silica gel to obtain a heat storage phase material;
respectively transferring the heat transfer phase material and the heat storage phase material into two printing tubes, and respectively vacuumizing the two printing tubes;
connecting the two printing pipes with a printer and alternately printing; and
and curing and die cutting to obtain the heat transfer and storage sheet.
The invention also provides a heat dissipation structure, which comprises the heat transfer and storage sheet, a heating source and a heat dissipation part, wherein the heat transfer and storage sheet is positioned between the heating source and the heat dissipation part.
The heat transfer layer and the heat storage layer are distributed at intervals, so that the structure of the heat transfer and storage sheet is optimized, and meanwhile, the heat transfer layer and the heat storage layer are stacked layer by layer and are sequentially heated and cured, so that interlayer pores are effectively avoided. In addition, the heat storage layer uses the shape-stabilized phase change material, and the shape-stabilized phase change material has the advantages of high energy storage density of the solid-liquid phase change material and no liquid leakage of the solid-solid phase change material. The one-dimensional and two-dimensional materials in the heat transfer layer in the oriented arrangement increase the heat conductivity coefficient of the heat transfer layer, realize the one-way heat rapid transfer, simultaneously improve the heat storage efficiency and speed of the phase change material, and effectively delay the temperature rise speed at the interface. Meanwhile, the heat conduction coefficient of the heat storage layer and the heat exchange efficiency of the heat storage layer are further improved by compounding the heat conduction filler and the phase change material in the heat storage layer.
Drawings
Fig. 1 is a schematic structural view of a heat transfer and storage sheet according to a preferred embodiment of the invention.
Fig. 2 is a flow chart of a process for preparing a heat transfer and storage sheet according to a preferred embodiment of the invention.
Fig. 3 is a schematic structural diagram of a heat dissipation structure according to a preferred embodiment of the invention.
Description of the main elements
Heat transfer and storage fin 100
Heat dissipation member 220
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1, a preferred embodiment of the invention provides a heat transfer and storage sheet 100, which can be applied to the fields of electronic components, battery materials, electric vehicles, building energy conservation, solar energy utilization, industrial waste heat recovery, power peak clipping and valley filling, aerospace and the like. The heat transfer and storage sheet 100 includes a heat transfer layer 10 and a heat storage layer 20.
The heat transfer layer 10 includes a silica gel base and a heat conductive filler in the silica gel base. In this embodiment, the silica gel matrix is a bicomponent silica gel. The dosage proportion of the two components can be adjusted according to the hardness of the silica gel matrix.
In this embodiment, the thermally conductive filler includes a one-dimensional material, a two-dimensional material, and a three-dimensional material that are randomly distributed. Specifically, the heat conductive filler may be inorganic powder, metal particles, and the like. The one-dimensional material comprises at least one of pitch-based carbon fibers, graphite fibers, carbon nanotubes, carbon nanotube fibers and graphene fibers, and the two-dimensional material comprises at least one of graphite, expanded graphite, boron nitride and graphene. The volume ratio of the one-dimensional material and the two-dimensional material in the heat transfer layer is 10-50%. The diameter of the one-dimensional material in the heat transfer layer is 5-15 μm, and the length of the one-dimensional material is 50-500 μm. Preferably, the one-dimensional material in the heat transfer layer has a diameter of 10 μm and a length of 150 μm or 250 μm. The sheet diameter of the two-dimensional material in the heat transfer layer is 10-300 μm.
The three-dimensional material comprises at least one of aluminum oxide powder, zinc oxide powder, magnesium oxide powder, aluminum nitride powder, boron nitride powder, silicon carbide powder, silicon nitride powder, diamond powder and metal powder. Wherein the particle size of the three-dimensional material is 50nm-100 μm. Preferably, the particle size of the powder particles is 500nm-10 μm. The three-dimensional material may be subjected to a surface modification treatment.
The heat storage layer 20 with the layer 10 sets up layer upon layer of heat transfer, the heat storage layer 20 includes the silica gel base member and is located in the silica gel base member heat conduction filler and phase change material. Wherein the volume ratio of the heat-conducting filler in the heat storage layer is 1-50%.
In this embodiment, the volume ratio of the phase change material in the thermal storage layer is 30% to 70%. The phase change material is at least one of a solid-solid phase change material and a solid-liquid phase change material. In this embodiment, the phase change material comprises a shape-stabilized phase change material. Wherein the shape-stabilized phase change material comprises a micro/nano capsule phase change material. The particle size of the micro/nano capsule phase change material is 10nm-100 mu m. Preferably, the micro/nano capsule phase change material has a particle size of 500nm to 50 μm.
In this embodiment, the micro/nano capsule phase change material is a core-shell structure, and the core-shell structure includes a core material and a wall material surrounding the core material. The core material is a phase-change material, and the wall material is a polymer or an inorganic material. Preferably, the wall material is an inorganic material. Wherein, the polymer can be polyethylene, and the inorganic material can be alumina, silicon dioxide and the like.
As shown in fig. 1, in the present embodiment, the heat transfer layer 10 and the heat storage layer 20 in the heat transfer and heat storage sheet 100 are both in an elongated shape and are spaced apart from each other. Wherein, the thickness of the heat transfer and storage piece 100 is 0.3-5 mm.
Referring to fig. 2, a method for manufacturing a heat transfer and storage sheet according to a preferred embodiment of the present invention includes the following steps:
and S11, mixing the heat-conducting filler and the bi-component silica gel to obtain the heat-transfer phase material.
Specifically, weighing a certain mass of heat-conducting filler, carrying out dry mixing, adding the bi-component silica gel after uniform mixing, stirring, carrying out vacuum stirring for 2-4h for defoaming treatment, and pressing by using a pressing machine to obtain the heat-conducting phase material.
And S12, mixing the heat-conducting filler, the micro/nano capsule phase change material and the bi-component silica gel to obtain the heat storage phase material.
Specifically, weighing a certain mass of the heat-conducting filler and the micro/nano capsule phase-change material, carrying out dry mixing, adding the two-component silica gel after uniform mixing, carrying out vacuum stirring for 2-4h after stirring to carry out defoaming treatment, and carrying out material pressing by using a material pressing machine to obtain the heat storage phase material.
And S13, transferring the heat transfer phase material and the heat storage phase material into two printing tubes respectively, and vacuumizing the two printing tubes respectively.
Wherein, the two printing tubes can be vacuumized in a vacuum oven.
And S14, connecting the two printing pipes with a printer and alternately printing.
Specifically, a program of a printer is set, the front and back sequence of discharging of a printer nozzle is controlled, the discharging speed is set, a round and flat nozzle needle head is manufactured for printing, a certain temperature is set, after a first layer of heat transfer phase material is printed, the heat transfer phase material is semi-cured, then the nozzle is replaced to print a heat storage phase material, the gap of the heat transfer phase material is well filled with good fluidity of the heat storage phase material, meanwhile, the heat storage phase material is semi-cured, next layer of heat transfer phase material is printed, and the multi-layer material which is arranged in a stacked mode is obtained through alternate printing.
Wherein, the printer is the 3D printer. In printing, the thermally conductive filler (i.e., one-dimensional material and two-dimensional material) in the heat transfer phase material is oriented during extrusion to align it.
And S15, curing and die cutting to obtain the heat transfer and storage sheet.
In this embodiment, the curing process may be performed in an oven. Wherein the curing temperature is 100-180 ℃. The curing time depends on the size of the product. Specifically, when the multi-layer material is printed in step S14, after curing, the cured multi-layer material block is subjected to die cutting, such as cutting with an ultrasonic cutting knife, so as to obtain the heat transfer and storage sheet 100. In the heat transfer and storage sheet 100, the heat transfer phase material after curing and die cutting is the heat transfer layer 10, and the heat storage phase material after curing and die cutting is the heat storage layer 20.
Wherein the thickness of the multi-layer material block body is 0.3-5 mm. I.e. the thickness of the heat transfer and storage fins 100 is 0.3-5mm, see fig. 1 for details. It is understood that the heat transfer and storage sheet 100 may be cut to any thickness according to actual needs.
Referring to fig. 3, a heat dissipation structure 200 is further provided in the preferred embodiment of the present invention, in which the heat dissipation structure 200 includes a heat source 210, a heat dissipation member 220, and the heat transfer and storage fins 100 located between the heat source 210 and the heat dissipation member 220.
The heat generating source 210 includes at least one of a chip and a battery. Wherein, the battery can be a power battery. The heat dissipation member 220 includes at least one of a heat sink, a graphite film, a graphene film, a heat pipe, and a hot plate. Wherein the hot plate can be a VC hot plate (vacuum cavity vapor chamber).
The present invention will be specifically described below with reference to examples.
Example 1
Firstly, weighing 38g of 300-mesh desulfurized graphite and 34.8g of double-component silica gel, stirring, and then stirring in vacuum for 2-4h to perform deaeration treatment to prepare the heat transfer phase material.
And secondly, weighing 5g of alumina with the particle size of 5 microns and 44g of micro/nano capsule phase change material with the particle size of 5 microns, uniformly mixing, adding 16g of the two-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat storage phase material.
And thirdly, respectively transferring the heat transfer phase material and the heat storage phase material in the first step and the second step into A, B printing tubes, and respectively carrying out vacuum-pumping treatment.
And fourthly, connecting the two printing pipes with a 3D printer for printing, setting a program of the printer and a front-back sequence of discharging, semi-curing the heat transfer phase material after the first layer of heat transfer phase material is printed, then printing the heat storage phase material, semi-curing the heat storage phase material, then printing the next layer of heat transfer phase material, and alternately printing to obtain the stacked multi-layer material. Wherein the discharge speed is set to 40mm/s, and the temperature of the heating table is set to 80 ℃.
And fifthly, transferring the printed semi-solidified heat transfer phase material and the semi-solidified heat storage phase material into an oven for further solidification, setting the solidification temperature to be 130 ℃ and the solidification time to be 5 h.
And sixthly, die cutting, wherein the cutting thickness is 0.5 mm.
Example 2
Firstly, weighing 42g of boron nitride powder with the particle size of 50 mu m, 70g of graphite subjected to desulfurization treatment and 106.6g of double-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat transfer phase material.
And secondly, weighing 17g of graphite with 300 meshes and 115g of micro/nano capsule phase change material with the particle size of 5 mu m, uniformly mixing, adding 55g of the two-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat storage phase material.
The third to fourth steps are the same as those in example 1, please refer to example 1.
The fifth step is different from the fifth step in example 1 in that: the curing temperature was set to 100 ℃ and the curing time was set to 10 h.
The sixth step is the same as the sixth step in example 1, please refer to example 1.
Example 3
Firstly, weighing 20g of boron nitride powder with the particle size of 50 mu m, 10g of desulfurized expanded graphite and 48g of double-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat transfer phase material.
And secondly, weighing 6.8g of graphite with 300 meshes and 49g of micro/nano capsule phase change material with the particle size of 5 mu m, uniformly mixing, adding 18g of the two-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat storage phase material.
The third step is the same as in example 1, please refer to example 1.
The fourth step is different from the fourth step in example 1 in that: the discharge speed was set to 45 mm/s.
The fifth step is different from the fifth step in example 1 in that: the curing time was set to 3 h.
The sixth step is the same as the sixth step in example 1, please refer to example 1.
Example 4
Firstly, weighing 49g of boron nitride powder with the particle size of 30 microns, 5g of pitch-based carbon fiber with the particle size of 150 microns and 39g of double-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare a heat transfer phase material.
And secondly, weighing 5g of graphite with 300 meshes and 53g of micro/nano capsule phase change material with the particle size of 5 mu m, uniformly mixing, adding 18g of the two-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat storage phase material.
The third to sixth steps are the same as those in example 1, please refer to example 1.
Example 5
Firstly, weighing 40g of 1000-mesh desulfurized graphite, 40g of pitch-based carbon fiber with the particle size of 150 mu m and 65g of double-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat transfer phase material.
And secondly, weighing 39.3g of alumina powder with the particle size of 5 microns and 74.5g of micro/nano capsule phase change material with the particle size of 5 microns, uniformly mixing, adding 30g of the two-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat storage phase material.
The third step is the same as in example 1, please refer to example 1.
The fourth step is different from the fourth step in example 1 in that: the discharge speed was set to 45 mm/s.
The fifth step is different from the fifth step in example 1 in that: the curing time was set to 6 h.
The sixth step is the same as the sixth step in example 1, please refer to example 1.
Example 6
Firstly, weighing 40g of boron nitride powder with the particle size of 3-5 microns, 40g of pitch-based carbon fiber with the particle size of 150 microns and 64g of double-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat transfer phase material.
And secondly, weighing 11.2g of 300-mesh desulfurized graphite and 73.7g of micro/nano capsule phase-change material with the particle size of 5 mu m, uniformly mixing, adding 35g of the two-component silica gel, stirring, and then stirring in vacuum for 2-4h for defoaming treatment to prepare the heat storage phase material.
The third step is the same as in example 1, please refer to example 1.
The fourth step is different from the fourth step in example 1 in that: the discharge speed was set to 45 mm/s.
The fifth step is different from the fifth step in example 1 in that: the curing time was set to 6 h.
The sixth step is the same as the sixth step in example 1, please refer to example 1.
Heat transfer and storage sheets prepared in examples 1 to 6 were applied with 1kgf/cm2The load of (2) was thermally tested according to ASTM-D5470, and the test results are shown in Table 1.
Table 1 specific preparation conditions and thermal test results of examples 1 to 6 of the present invention
Therefore, the heat transfer and storage sheets prepared in the examples 1 to 6 of the invention have the thermal conductivity of 5 to 20 w/(m.k) and the storage energy value of 40 to 60 KJ/Kg. That is, the heat transfer and storage sheets of examples 1 to 6 have high thermal conductivity while ensuring high energy storage. In the heat transfer and storage sheets of examples 1 to 6, the volume ratio of the powder particles in the heat transfer layer 10 was substantially 40%. Compared with the situation that the filling amount volume ratio of the inorganic powder in the thermal conductive sheet prepared by the prior art generally exceeds 80%, which causes the loss of the flexibility of the sheet, the thermal conductive and heat storage sheets prepared in examples 1 to 6 have both thermal conductivity and flexibility.
In the invention, the heat transfer layer 10 and the heat storage layer 20 are distributed at intervals, so that the structure of the heat transfer and storage sheet 100 is optimized, and meanwhile, the heat transfer layer 10 and the heat storage layer 20 are formed by printing and curing in sequence, so that interlayer pores are effectively avoided. In addition, the heat storage layer 20 uses a shape-stabilized phase change material, which has the advantages of high energy storage density of the solid-liquid phase change material and no liquid leakage of the solid-solid phase change material. The one-dimensional material and the two-dimensional material which are arranged in the heat transfer layer 10 in an oriented mode increase the heat conduction coefficient of the heat transfer layer 10, unidirectional heat fast transfer is achieved, meanwhile, the heat storage efficiency and the heat storage speed of the phase change material are improved, and the temperature rise speed of the interface is effectively delayed. Meanwhile, the combination of the heat conductive filler and the phase change material in the heat storage layer 20 further improves the heat conductivity of the heat storage layer 20 and the heat exchange efficiency of the heat storage layer 20. Due to the use of the silica gel substrate, the heat transfer and storage plate 100 has good flexibility, and interface attachment can be well realized in a heat dissipation structure. Moreover, the heat transfer and storage sheet 100 is prepared by a dual-nozzle 3D printing technology, and the preparation process is simple and easy to implement.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (8)
1. A heat transfer and storage sheet, comprising:
the heat transfer layer comprises a silica gel substrate and a heat conduction filler positioned in the silica gel substrate, wherein the heat conduction filler comprises a one-dimensional material, a two-dimensional material and a three-dimensional material which are distributed in a directional manner, and the sheet diameter of the two-dimensional material is 50-300 mu m; and
the heat storage layer, the heat storage layer with the heat transfer layer stacks the setting, the heat storage layer includes the silica gel base member and is located in the silica gel base member heat conduction filler and phase change material, phase change material includes the shape stabilized phase change material, the shape stabilized phase change material includes that the capsule phase change material is received to the declining/receiving, the particle diameter that the capsule phase change material is received to the declining/receiving is 10nm-5 μm.
2. A heat transfer and thermal storage sheet according to claim 1, wherein said one-dimensional material comprises at least one of pitch-based carbon fibers, graphite fibers, carbon nanotubes, carbon nanotube fibers and graphene fibers, and said two-dimensional material comprises at least one of graphite, expanded graphite, boron nitride and graphene.
3. A heat transfer and thermal storage sheet according to claim 1, wherein the volume ratio of said one-dimensional material and said two-dimensional material in said heat transfer layer is 10% to 50% in said heat transfer layer.
4. The heat transfer and storage sheet of claim 1, wherein the three-dimensional material comprises at least one of alumina powder, zinc oxide powder, magnesium oxide powder, aluminum nitride powder, boron nitride powder, silicon carbide powder, silicon nitride powder, diamond powder and metal powder, the particle size of the three-dimensional material is 50nm-100 μm, and the three-dimensional material is subjected to surface modification treatment.
5. A heat transfer and thermal storage sheet according to claim 1, wherein the volume ratio of the heat conductive filler in the thermal storage layer is 1% to 50%, and the volume ratio of the phase change material in the thermal storage layer is 30% to 70%.
6. A heat transfer and thermal storage sheet according to claim 1 wherein said silica gel matrix is a bicomponent silica gel.
7. A preparation method of a heat transfer and storage sheet is characterized by comprising the following steps:
mixing the heat-conducting filler and the bi-component silica gel to obtain a heat-conducting phase material;
mixing the heat-conducting filler, the micro/nano capsule phase change material and the bi-component silica gel to obtain a heat storage phase material;
respectively transferring the heat transfer phase material and the heat storage phase material into two printing tubes, and respectively vacuumizing the two printing tubes;
connecting the two printing pipes with a printer and alternately printing: setting a program of a printer, controlling the front and back sequence of discharging of a printer nozzle, setting the discharging speed, self-making a round and flat nozzle needle for printing, semi-curing a heat transfer phase material after the first layer of heat transfer phase material is printed, replacing the nozzle to print a heat storage phase material, semi-curing the heat storage phase material, then printing the next layer of heat transfer phase material, and alternately printing to obtain a plurality of layers of materials which are stacked; and
and curing and die cutting to obtain the heat transfer and storage sheet.
8. A heat dissipation structure, wherein the heat dissipation structure comprises the heat transfer and storage sheet as claimed in any one of claims 1 to 6, and further comprises a heat source and a heat dissipation member, and the heat transfer and storage sheet is located between the heat source and the heat dissipation member.
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Inventor after: Du Hongda Inventor after: Chen Wei Inventor after: Long Qingming Inventor after: Yu Mengxue Inventor after: Kang Feiyu Inventor before: Du Hongda Inventor before: Chen Wei Inventor before: Long Qingming Inventor before: Yu Mengxue Inventor before: Kang Feiyu |