CN109163590A - A kind of graphene phase change material device - Google Patents
A kind of graphene phase change material device Download PDFInfo
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- CN109163590A CN109163590A CN201810965310.5A CN201810965310A CN109163590A CN 109163590 A CN109163590 A CN 109163590A CN 201810965310 A CN201810965310 A CN 201810965310A CN 109163590 A CN109163590 A CN 109163590A
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- phase
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
- F28D20/0056—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using solid heat storage material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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Abstract
The invention discloses graphene phase change material devices, including phase-change material, graphene thermal conduction skeleton and encapsulating housing；The phase-change material and graphene thermal conduction skeleton are arranged in encapsulating housing；The graphene thermal conduction skeleton and phase-change material arranged stacked, one layer of graphene, one layer of phase-change material.The graphene phase change material device of the design is according to the demand of high heat flux density phase-change thermal storage technology, for existing deficiency, introduce novel highly heat-conductive material, optimization design phase-change thermal storage structure and high hot material arrangement and encapsulating housing type of attachment, the phase change material device of a kind of efficient heat transfer performance, low cost is provided, the high heat flow density occasion phase-change thermal storages, heat dissipation problem such as missile-borne phased-array radar are solved.
Description
Technical field
The present invention relates to electronic equipment thermal control field, especially avionics equipment thermal controls, missile-borne radar heat control system.
Background technique
Phase change material device is mainly used in avionics equipment thermal control, missile-borne radar heat control system, generally by phase transformation material
Material, heat transfer skeleton and encapsulating housing form, and in work, phase-change material phase transformation at a set temperature becomes liquid from solid-state, can
The heat that electronic equipment generates is absorbed, and there is preferable uniform temperature, electronic equipment temperature is maintained to stablize.Conduction skeleton is used to change
The heating conduction of kind phase change device, makes phase-change material fast melt, reduces heat-storing device itself temperature difference.Conduction skeleton performance be
Influence the key factor of phase change material device performance.
Currently, phase change material device conduction skeleton generally uses the materials such as foamed aluminium, foam copper, foamy graphite, foamed aluminium
Equivalent heat conductivity about 2W/mK, the equivalent heat conductivity of foam copper about 5W/mK, foamy graphite is in vertical direction equivalent
Thermal coefficient about 100W/mK, in the horizontal direction equivalent heat conductivity about 50W/mK.Bone is conducted based on foamed aluminium, foam copper
The phase change material device of frame is generally only applicable to low-heat current density (heat flow density about 0.5W/cm2) occasion, such as avionics equipment
Deng
With the increase of missile-borne phased-array radar power, the following radar heat flow density need to be adopted up to tens, W/cm2 up to a hundred
Radiating requirements are just able to satisfy with the phase transformation thermal controls apparatus based on highly heat-conductive materials such as foamy graphites.Foamy graphite cost is high
(about 600 yuan of every gram of price of import foamy graphite, about 160 yuan of domestic price), and influenced by technology, equipment etc., it is domestic
Foamy graphite production capacity is limited, and performance also has a certain distance compared with external product.It is limited by above-mentioned by external condition, is based on foam
The phase change material device of graphite is only in conceptual phase at present.
Summary of the invention
Problem to be solved by this invention is, for it is above-mentioned in the prior art the shortcomings that, innovation scheme is proposed, according to high fever
The demand of current density phase-change thermal storage technology introduces novel highly heat-conductive material, optimization design phase-change thermal storage structure for existing deficiency
And high hot material arrangement, with encapsulating housing type of attachment, the phase-change thermal storage dress of a kind of efficient heat transfer performance, low cost is provided
It sets, solves the high heat flow density occasion phase-change thermal storages, heat dissipation problem such as missile-borne phased-array radar.
To solve the above problems, the scheme that the present invention uses is as follows: a kind of graphene phase change material device, feature exist
In, including phase-change material, graphene thermal conduction skeleton and encapsulating housing；The phase-change material and graphene thermal conduction skeleton setting
In encapsulating housing；The graphene thermal conduction skeleton and phase-change material arranged stacked, one layer of graphene, one layer of phase-change material.
Further, the graphene phase change material device according to above-mentioned design scheme, which is characterized in that the graphene thermal
It conducts and is connected between skeleton and encapsulating housing by mechanical crimp, splicing or welding manner.
Further, the graphene phase change material device according to above-mentioned design scheme, which is characterized in that the phase-change material
For paraffin or barium hydroxide.
Further, the graphene phase change material device according to above-mentioned design scheme, which is characterized in that the encapsulating housing
For copper, aluminium or macromolecule nonmetallic materials.
Further, the graphene phase change material device according to above-mentioned design scheme, which is characterized in that the graphene thermal
The complex method for conducting skeleton and phase-change material includes: setting tooling, and graphene platelet is alternatively arranged, thawing is then placed in
Phase-change material, phase-change material are filled into the interval of two layers of graphene, reduce temperature, and phase-change material solidifies and is bonded with graphene
To together；Or one layer of graphene is first placed, one layer of phase-change material is then brushed, then places one layer of stone again on top of the phase change material
Black alkene, then brush phase-change material repeats above-mentioned work, realizes the compound of graphene thermal conduction skeleton and phase-change material.
Further, the graphene phase change material device according to above-mentioned design scheme, which is characterized in that the phase-change thermal storage
Device packing forms include: first to conduct filling phase-change material in skeleton in graphene thermal, then again by the graphite containing phase-change material
Alkene heat transfer skeleton is packed into shell, is packaged；Or graphene thermal conduction skeleton is first packed into encapsulating housing, it is packaged,
Then filling phase-change material again.
A kind of phase change material device based on graphene thermal conduction skeleton, mainly conducts bone by phase-change material, graphene thermal
Frame and encapsulating housing composition.Graphene thermal, which is conducted, to be connected between skeleton and encapsulating housing by mechanical crimp, splicing or welding manner
It connects, graphene thermal conduction skeleton and phase-change material arranged stacked, one layer of graphene, one layer of phase transformation material inside phase change material device
Material.The main heat transfer direction that graphene thermal conducts skeleton is X, Y-direction, makes full use of its X, Y-direction high thermal conductivity.
It conducts skeleton and uses grapheme material, graphene has thermal coefficient height, and (X, Y-direction thermal coefficient are up to 1700W/
MK, Z-direction thermal coefficient about 10~15W/mK), the features such as stable chemical performance.
The inorganic material such as the organic materials such as paraffin or barium hydroxide can be used in phase-change material.
The metal materials such as copper, aluminium, macromolecule nonmetallic materials etc. can be used in encapsulating housing.
Graphene is alternatively arranged in phase change material device based on graphene thermal conduction skeleton, and the thickness design of graphene is
0.1~0.3mm, graphene interval width (at filling phase-change material) 0.5~1mm can guarantee the heat transfer property of graphene, again
It can guarantee the filling weight of phase-change material.
Two ways can be used in graphene thermal conduction skeleton and the compound of phase-change material: first is that setting tooling, by graphene
Thin slice is alternatively arranged, and is then placed in the phase-change material of thawing, and phase-change material is filled into the interval of two layers of graphene, reduces temperature
Degree, phase-change material solidify and fit to together with graphene；Second is that first placing one layer of graphene, then using the method brushed
One layer of phase-change material is brushed, then places one layer of graphene again on top of the phase change material, then brush phase-change material, repeats above-mentioned work
Make, realize graphene thermal conduction skeleton and phase-change material it is compound.
There are two types of forms for phase change material device encapsulation: first is that the first filling phase-change material in graphene thermal conduction skeleton, so
The graphene thermal conduction skeleton containing phase-change material is packed into shell again afterwards, is packaged；Graphene thermal first can also be conducted into bone
It is rack-mounted enter encapsulating housing, be packaged, then vacuumize, then filling phase-change material.
Mechanical connection, splicing or welding can be passed through between graphene thermal conduction skeleton and encapsulating housing.
Technical effect of the invention is as follows: the arrangement form that the present invention rationally designs graphene takes full advantage of graphene XY
The high thermal conductivity in direction, the equivalent heat conductivity of the phase change material device through simulation analysis based on graphene skeleton about 80W/
MK~100W/mK, performance is suitable with the phase change material device based on foamy graphite heat transfer skeleton, can effectively solve missile-borne
The high heat flow density occasion phase-change thermal storage such as phased-array radar, heat dissipation problem；
The present invention conducts skeleton using graphene, at low cost, only the 1/10 of foamy graphite conduction skeleton.
Detailed description of the invention
Fig. 1 is the phase change material device cross section structure schematic diagram that skeleton is conducted based on graphene thermal.
Fig. 2 is phase change material device schematic diagram.
Fig. 3 is two structural schematic diagram of embodiment.
Wherein, 1 it is phase-change material, 2 be graphene thermal conduction skeleton, 3 be encapsulating housing, 4 be electronic equipment, 5 is filling
Mouthful.
Specific embodiment
The present invention is described in further details with reference to the accompanying drawing.
Embodiment one:
A kind of phase change material device composition based on graphene thermal conduction skeleton that this patent proposes is as shown in Figure 1, main
Including phase-change material 1, graphene thermal conduction skeleton 2 and encapsulating housing 3.Graphene thermal conducts skeleton 2 inside phase change material device
With 1 arranged stacked of phase-change material, one layer of graphene, one layer of phase-change material 2.The graphene thermal of filling phase-change material 1 conducts skeleton 2
It is connect between encapsulating housing 3 by mechanical crimp, splicing or welding manner, graphene thermal conducts the main heat transfer side of skeleton 2
To for X, Y-direction, its X, Y-direction high thermal conductivity are made full use of.
It conducts skeleton 2 and uses grapheme material.
The inorganic material such as the organic materials such as paraffin or barium hydroxide can be used in phase-change material 1.
The metal materials such as copper, aluminium, macromolecule nonmetallic materials etc. can be used in encapsulating housing 3.
Two ways can be used in graphene thermal conduction skeleton 2 and the compound of phase-change material 1: first is that setting tooling, by graphite
Alkene is alternatively arranged, and is then placed in the phase-change material 1 of thawing, and phase-change material 1 is filled into the interval of two layers of graphene, reduces temperature
Degree, phase-change material 1 solidify and fit to together with graphene；Second is that first placing one layer of graphene, then using the method brushed
One layer of phase-change material 1 is brushed, then places one layer of graphene again on phase-change material 1, then brush phase-change material 1, is repeated above-mentioned
Work, realization graphene thermal conduction skeleton 2 are compound with phase-change material 1.
Working principle based on the phase change material device of graphene thermal conduction skeleton is as shown in Figure 2:
Electronic equipment 4 is mounted on phase change material device surface, generates heat in 4 course of work of electronic equipment, heat is through warm
Phase change material device is passed to, then rapidly transmits heat inside phase transformation thermal controls apparatus through graphene conduction skeleton 2
It opens, meanwhile, the phase-change material 1 in phase change material device absorbs heat, becomes liquid from solid-state, phase change material device temperature maintains
Near 1 phase transformation temperature points of phase-change material, 4 function of temperature control of electronic equipment is realized.
Embodiment two:
Embodiment two is that the assemble flow of phase change material device is different from the difference of embodiment one, and other parts are equal
It is identical, as shown in Figure 3.
Assemble flow are as follows: graphene conduction skeleton 2 is welded with encapsulating housing 3 or is glued onto together first, is reserved filling
The fill port 5 of phase-change material 1, then vacuumizes encapsulating housing 3, and vacuum degree reaches again that phase-change material 1 is filling after setting value
To inside encapsulating housing 3, so that phase-change material 1 is conducted skeleton 3 with graphene and combine closely.
The above described is only a preferred embodiment of the present invention, being not the limit for making any other form to the present invention
System, and made any modification or equivalent variations according to the technical essence of the invention, still fall within present invention model claimed
It encloses.
Claims (6)
1. a kind of graphene phase change material device, which is characterized in that including phase-change material, graphene thermal conduction skeleton and encapsulating shell
Body；The phase-change material and graphene thermal conduction skeleton are encapsulated in encapsulating housing；The intracorporal graphene thermal of encapsulating shell passes
Lead skeleton and phase-change material arranged stacked.
2. graphene phase change material device according to claim 1, which is characterized in that the graphene thermal conduction skeleton and envelope
It fills between shell through mechanical crimp, splicing or welding manner connection.
3. graphene phase change material device according to claim 1, which is characterized in that the phase-change material is paraffin or eight water
Barium hydroxide.
4. graphene phase change material device according to claim 1, which is characterized in that the encapsulating housing is copper, aluminium or height
Molecule nonmetallic materials.
5. graphene phase change material device according to claim 1, which is characterized in that graphene thermal conducts skeleton and phase transformation material
The mode that is stacked of material includes: setting tooling, and graphene platelet is alternatively arranged, is then placed in the phase-change material of thawing,
Phase-change material is filled into the interval of two layers of graphene, reduces temperature, and phase-change material solidifies and fits to together with graphene；Or
Person first places one layer of graphene, then brushes one layer of phase-change material, then places one layer of graphene again on top of the phase change material, then brush
Phase-change material is applied, above-mentioned work is repeated, realizes the compound of graphene thermal conduction skeleton and phase-change material.
6. graphene phase change material device according to claim 1, which is characterized in that the packing forms packet of phase change material device
It includes: the first filling phase-change material in graphene thermal conduction skeleton, then again by the graphene thermal conduction skeleton dress containing phase-change material
Enter shell, is packaged；Or graphene thermal conduction skeleton is first packed into encapsulating housing, it is packaged, then filling phase transformation again
Material.
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| CN201810965310.5A CN109163590A (en) | 2018-08-22 | 2018-08-22 | A kind of graphene phase change material device |
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| CN201810965310.5A CN109163590A (en) | 2018-08-22 | 2018-08-22 | A kind of graphene phase change material device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312675A (en) * | 2020-04-09 | 2020-06-19 | 清华大学深圳国际研究生院 | Heat transfer and heat storage sheet, preparation method thereof and heat dissipation structure |
| CN111725396A (en) * | 2020-01-19 | 2020-09-29 | 中国科学院上海微系统与信息技术研究所 | Graphene-phase change material structure, memory unit and preparation method thereof |
| CN112693636A (en) * | 2020-12-28 | 2021-04-23 | 上海卫星工程研究所 | Light-weight thermal control device for satellite and manufacturing method thereof |
| CN113395873A (en) * | 2020-03-13 | 2021-09-14 | 奈创科技股份有限公司 | Heat storage/dissipation structure, heat storage/dissipation device and electronic device |
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| CN207168632U (en) * | 2017-01-10 | 2018-04-03 | 常州富烯科技股份有限公司 | A kind of phase-change thermal storage hand warmer |
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Patent Citations (4)
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| CN102516953A (en) * | 2011-11-16 | 2012-06-27 | 常州碳元科技发展有限公司 | Heat radiation material with graphite film and graphene composite structure and realization method thereof |
| US20140284020A1 (en) * | 2012-01-24 | 2014-09-25 | The Boeing Company | Energy storage and thermal management using phase change materials in conjunction with heat pipes and foils, foams or other porous media |
| CN106374162A (en) * | 2016-11-02 | 2017-02-01 | 上海工程技术大学 | Battery module heat management method and apparatus based on thermo-electric effect |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111725396A (en) * | 2020-01-19 | 2020-09-29 | 中国科学院上海微系统与信息技术研究所 | Graphene-phase change material structure, memory unit and preparation method thereof |
| CN113395873A (en) * | 2020-03-13 | 2021-09-14 | 奈创科技股份有限公司 | Heat storage/dissipation structure, heat storage/dissipation device and electronic device |
| CN111312675A (en) * | 2020-04-09 | 2020-06-19 | 清华大学深圳国际研究生院 | Heat transfer and heat storage sheet, preparation method thereof and heat dissipation structure |
| CN111312675B (en) * | 2020-04-09 | 2021-09-28 | 清华大学深圳国际研究生院 | Heat transfer and heat storage sheet, preparation method thereof and heat dissipation structure |
| CN112693636A (en) * | 2020-12-28 | 2021-04-23 | 上海卫星工程研究所 | Light-weight thermal control device for satellite and manufacturing method thereof |
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