CN107815286A - A kind of heat conduction embedding silica gel based on phase-change microcapsule and preparation method thereof - Google Patents
A kind of heat conduction embedding silica gel based on phase-change microcapsule and preparation method thereof Download PDFInfo
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- CN107815286A CN107815286A CN201711068139.XA CN201711068139A CN107815286A CN 107815286 A CN107815286 A CN 107815286A CN 201711068139 A CN201711068139 A CN 201711068139A CN 107815286 A CN107815286 A CN 107815286A
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- silica gel
- heat conduction
- heat
- component
- phase
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 239000000741 silica gel Substances 0.000 title claims abstract description 88
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 88
- 239000003094 microcapsule Substances 0.000 title claims abstract description 49
- 238000002360 preparation method Methods 0.000 title claims abstract description 41
- 238000011049 filling Methods 0.000 claims abstract description 73
- 239000000203 mixture Substances 0.000 claims abstract description 37
- 238000004381 surface treatment Methods 0.000 claims abstract description 12
- 229920002554 vinyl polymer Polymers 0.000 claims description 64
- 229920002545 silicone oil Polymers 0.000 claims description 48
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 39
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 32
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 29
- 229910000077 silane Inorganic materials 0.000 claims description 29
- 150000001875 compounds Chemical class 0.000 claims description 26
- 229910017083 AlN Inorganic materials 0.000 claims description 15
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 15
- 239000003054 catalyst Substances 0.000 claims description 15
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052697 platinum Inorganic materials 0.000 claims description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 12
- 229910052739 hydrogen Inorganic materials 0.000 claims description 12
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 12
- 239000007787 solid Substances 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 230000007704 transition Effects 0.000 claims description 10
- 150000001335 aliphatic alkanes Chemical class 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 6
- -1 n-octyl Chemical group 0.000 claims description 6
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 6
- 239000007822 coupling agent Substances 0.000 claims description 5
- 230000007062 hydrolysis Effects 0.000 claims description 5
- 238000006460 hydrolysis reaction Methods 0.000 claims description 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 5
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 5
- 239000001110 calcium chloride Substances 0.000 claims description 4
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 4
- 238000005119 centrifugation Methods 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 239000000395 magnesium oxide Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 3
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 3
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 238000002454 metastable transfer emission spectrometry Methods 0.000 claims description 2
- JPADPHKEIXYMNG-UHFFFAOYSA-N ethenyl(silyloxy)silane Chemical compound [SiH3]O[SiH2]C=C JPADPHKEIXYMNG-UHFFFAOYSA-N 0.000 claims 1
- 238000009825 accumulation Methods 0.000 abstract description 5
- 239000011159 matrix material Substances 0.000 abstract description 4
- 230000000052 comparative effect Effects 0.000 description 25
- 239000012071 phase Substances 0.000 description 18
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 239000012188 paraffin wax Substances 0.000 description 9
- 239000012782 phase change material Substances 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 229910002804 graphite Inorganic materials 0.000 description 7
- 239000010439 graphite Substances 0.000 description 7
- 238000011056 performance test Methods 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 239000003063 flame retardant Substances 0.000 description 5
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000002131 composite material Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000001291 vacuum drying Methods 0.000 description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000000536 complexating effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004134 energy conservation Methods 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 206010020843 Hyperthermia Diseases 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- QYSYEILYXGRUOM-UHFFFAOYSA-N [Cl].[Pt] Chemical compound [Cl].[Pt] QYSYEILYXGRUOM-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical group [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000002135 phase contrast microscopy Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/62—Heating or cooling; Temperature control specially adapted for specific applications
- H01M10/625—Vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/60—Heating or cooling; Temperature control
- H01M10/65—Means for temperature control structurally associated with the cells
- H01M10/653—Means for temperature control structurally associated with the cells characterised by electrically insulating or thermally conductive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The present invention relates to a kind of heat conduction embedding silica gel based on phase-change microcapsule and preparation method thereof, the heat conduction embedding silica gel is made up of bi-component embedding silica gel 50%~90% by percentage to the quality, phase-change microcapsule 5%~25% and surface-treated heat filling 5%~25%.The preparation method includes:The surface treatment of heat filling;The preparation of heat conduction compounded mix;The preparation of component A and B component in bi-component embedding silica gel;The preparation of A1 components and B1 components in heat conduction embedding silica gel;With the preparation of heat conduction embedding silica gel.The present invention is surface-treated in preparation process to heat filling, adds dispersiveness of the heat filling in silica gel matrix, improves the heat conductivility of heat conduction embedding silica gel, and is added phase-change microcapsule and caused heat conduction embedding silica gel to have heat accumulation temperature control performance.The heat conductivility and heat accumulation temperature control performance that heat conduction embedding silica gel in the present invention has had.
Description
Technical field
The present invention relates to battery thermal management technical field, more particularly to a kind of heat conduction embedding silica gel based on phase-change microcapsule
And preparation method thereof.
Background technology
Battery such as secondary cell has widely been acted on the energy source of portable radio device, such as can be used as and be used
In power supply of electric vehicle, hybrid electric vehicle and plug-in hybrid electric vehicle etc., so as to solve by using oil-fired
Caused by vehicle the problems such as such as air pollution, small-sized portable radio device may use one or more battery unit,
And medium-sized or large-scale wireless device such as vehicle may use the medium-sized or large-scale of the multiple battery units for including being connected with each other
Battery module, such medium-sized or large-sized battery module are generally manufactured to have as small as possible size and weight, thus this
The battery unit integrated level stacked in a little battery modules is very high.
During the charging and discharging of battery, battery can produce substantial amounts of heat.Particularly battery module is normal in its surface
The polymeric material of the ground thermal conductivity of coating, it is difficult to be effectively reduced the bulk temperature of battery unit.If battery module is filling
Caused heat fails to be efficiently removed during electricity and electric discharge, then heat can gather in battery module, cause battery mould
Block accelerated deterioration, reduce service life.Sometimes battery module such as possibly even catches fire or exploded at the safety-related event.Cause
This is typically necessary carries out heat management to battery, to control the operating ambient temperature of battery.
At present, the heat management system of battery is generally divided into air cooling and liquid cold type.Air cooling is mainly to adopt at present
Method, air cooling is easier to realize, but cooling effect is bad, and liquid cooling radiating effect is preferable, but structure is answered
Miscellaneous, cost is higher, and cooling medium is easily revealed, poor reliability.
Heat conduction heat accumulation embedding silica gel is a kind of heat conduction bi-component addition type organosilicon embedding silica gel, can with cold curing,
Can heat rapid curing, and with it is good insulate, be shockproof, be water-fast, resistance to ozone, ageing-resistant performance, can effectively prevent steam
Penetrate into, the harmful effect of extraneous factor is preferably minimized.It is widely used in having high-power electronic component, will to radiating and heatproof
The embedding of higher modular power source and wiring board is asked to protect.Such as new-energy automobile dynamic lithium battery, solar panels, electronic component
Waterproof, radiating, buffering embedding.
Traditional Embedding Material capacity of heat transmission is poor, and while protection, heat is not easy to conduct, dissipated when can cause the equipment to work
Hair not in time, forms localized hyperthermia, and then influences equipment normal work and even trigger security incident.
Phase-change material (PCMs) refer to material undergo phase transition allow to absorb or release heat and the material self-temperature
A kind of intellectual material constant or that change is little.Due to functions such as its unique adaptive environment temperature adjustings, thus extensively
For Solar use, industrial exhaust heat Waste Heat Recovery, building energy conservation, constant temperature dress ornament, cold-storage and thermal storage air-conditioning and electrical part constant temperature
The fields such as equal energy source, material, Aero-Space, weaving, electric power, medical instrument, building energy conservation.It is thus proposed that phase transformation material
Material is using in the heat management system of electrokinetic cell.
A kind of heat conductive silica gel composite phase-change material is disclosed in the Chinese patent application of Application No. 201510414903.9,
Comprising:A) 50%~80% heat conductive silica gel, it is common AB bi-component organosilicon embedding silica gel;B) 20%~50% phase
Change composite material, it is 35 DEG C~55 DEG C of paraffin;C) 0%~20% thermal conducting agent, it is expanded graphite;And D) 0%~
20% fire retardant, it is antimony oxide, the one or more in magnesium hydroxide, aluminium hydroxide, wherein heat conductive silica gel, phase transformation
Uniform mixing, vacuum exhaust, the curing molding such as material and thermal conducting agent.But heat conduction in the phase change composite material in the patent application
Agent is expanded graphite, its limited sorption capacity to phase-change material, and reuse can cause phase-change material melting to flow and permeate
The serious problems of migration;In addition, expanded graphite heat filling can have a strong impact on the insulating properties of embedding silica gel, it is unfavorable for conductive field
The embedding application of conjunction, as the heat management system of electrokinetic cell, it has larger shadow to electrokinetic cell overall security and reliability
Ring, be not suitable for popularization and application;Next, the thermal conducting agent used in heat conductive silica gel in the patent application is aluminum oxide, magnesia,
, without surface treatment, compatibility is poor between the filler directly added and silica gel matrix, causes heat filling in silica gel base for it
Thermal resistance increase between uniformly dispersed variation, filler/base body in body at boundary, heat conductivility are deteriorated.
The content of the invention
In order to solve one or more technical problem, the invention provides a kind of heat filling and silica gel matrix dispersiveness
Good, good insulating, heat conductivility and heat accumulation temperature control performance good heat conduction embedding silica gel and its preparation side based on phase-change microcapsule
Method.
The present invention provides a kind of heat conduction embedding silica gel based on phase-change microcapsule, the heat conduction embedding silicon in first aspect
Glue is by bi-component embedding silica gel 50%~90% by percentage to the quality, phase-change microcapsule 5%~25% and surface-treated
Heat filling 5%~25% form.
Especially, the bi-component embedding silica gel includes component A and B component, and the component A includes vinyl silicone oil and platinum
Catalyst, the B component include vinyl silicone oil and containing hydrogen silicone oil;The phase-change microcapsule is that phase transition temperature is 20 DEG C~80
DEG C, latent heat of phase change is 150~220kJ/kg phase-change microcapsule;And/or the heat filling select free zinc oxide, aluminum oxide,
The group that magnesia, aluminium nitride, boron nitride and carborundum form;Preferably, the heat filling is selected from by aluminum oxide, aluminium nitride
With the group of carborundum composition;It is further preferred that the heat filling is selected from the group being made up of aluminum oxide and aluminium nitride.
Especially, the mass percentage content that the phase-change microcapsule accounts for the heat conduction embedding silica gel is 7%~20%, excellent
Elect 7%~15% as;And/or the heat filling account for the heat conduction embedding silica gel mass percentage content be 7%~20%,
Preferably 7%~15%.
Preferably, the vinyl silicone oil is selected from the group being made up of vinyl-terminated silicone fluid and side vinyl silicone oil;The second
The vinyl quantity contained in alkenyl silicone oil is no less than 2;And/or the viscosity of the vinyl silicone oil be 200mPas~
1500mPas, preferably 300mPas~800mPas.
Preferably, heat filling surface treatment coupling agent used is silane coupler;The silane coupler choosing
Free methyl triethoxysilane, n-propyl triethoxysilane, n-octytriethoxysilane and vinyl triethoxyl silicon
The group of alkane composition;Preferably, the silane coupler is selected from by n-octytriethoxysilane and vinyl triethoxyl silicon
The group of alkane composition;It is further preferred that the silane coupler is n-octytriethoxysilane.
The present invention provides a kind of preparation method of the heat conduction embedding silica gel based on phase-change microcapsule in second aspect, described
Method comprises the following steps:
(1) surface treatment of heat filling:Silane coupler, water and ethanol are well mixed, the silane after being hydrolyzed
Coupling agent, then under 50 DEG C~70 DEG C of water bath condition, heat filling is carried out at surface with the silane coupler after hydrolysis
Reason, obtain surface-treated heat filling mixed liquor, by the surface-treated heat filling mixed liquor by centrifuge into
Row separation of solid and liquid, heat filling solid matter is isolated, the heat filling solid matter is dried, surface treatment is made
The heat filling crossed;
(2) preparation of heat conduction compounded mix:By heat filling and phase-change microcapsule surface-treated made from step (1)
It is well mixed, heat conduction compounded mix is made;
(3) in bi-component embedding silica gel component A and B component preparation:Vinyl silicone oil is well mixed with platinum catalyst
Steep side by side, component A is made;Vinyl silicone oil is well mixed with containing hydrogen silicone oil and steeped side by side, B component is made;
(4) in heat conduction embedding silica gel A1 components and B1 components preparation:Component A made from step (3) and step (2) are made
The heat conduction compounded mix obtained is well mixed to be steeped side by side, and A1 components are made;B component made from step (3) and step (2) is obtained
Heat conduction compounded mix is well mixed to be steeped side by side, and B1 components are made;With
(5) preparation of the heat conduction embedding silica gel based on phase-change microcapsule:A1 components made from step (4) are mixed with B1 components
Close uniformly again successively by row's bubble and curing molding, the heat conduction embedding silica gel based on phase-change microcapsule is made.
Preferably, platinum catalyst described in step (3) is platinum-vinyl siloxane complex compound;Methods described is additionally included in
The preparation of platinum-vinyl siloxane complex compound is carried out before step (3):By 1,3- tetramethyl divinyl disiloxanes and chlorine platinum
Acid mixing, obtains mixed liquor, and the mixed liquor is being kept into the condition that the temperature of logical nitrogen and mixed liquor is 100 DEG C~120 DEG C
1~1.5h of lower backflow, obtains platinum-vinyl siloxane complex compound pre-product, and the platinum-vinyl siloxane complex compound is produced in advance
Thing successively through being centrifuged off platinum black the step of, be washed to platinum-vinyl siloxane complex compound pre-product pH be 6.8~7.3
The step of and the step dried, platinum-vinyl siloxane complex compound is made.
Preferably, the mass percent that the dosage of silane coupler accounts for the heat filling dosage described in step (1) is
1%~3%;The dosage of platinum catalyst accounts for the quality percentage of the vinyl silicone oil dosage described in component A made from step (3)
Than for 1%~10%;The dosage of containing hydrogen silicone oil accounts for the matter of the vinyl silicone oil dosage described in B component made from step (3)
It is 1%~10% to measure percentage;And/or the mass percent of A1 amounts of components described in step (5) and the B1 amounts of components
For 1:1.
Preferably, the speed centrifuged described in step (1) is 1200~1600r/min, time of the centrifugation for 5~
8min;It is 70 DEG C~80 DEG C to be dried described in step (1) as vacuum drying, the temperature of the drying, and the time of the drying is
10~14h;Row's bubble described in step (3), step (4) and step (5) is carried out under vacuum;And/or in step (5)
The curing molding is carried out under room temperature or heating condition.
Preferably, in the preparation of platinum-vinyl siloxane complex compound, the solution used in the washing is molten for sodium acid carbonate
Liquid, the concentration of preferably described sodium bicarbonate solution is 2wt%~4wt%;In the preparation of platinum-vinyl siloxane complex compound,
Drier used in the drying is calcium chloride.The present invention at least has the advantages that compared with prior art:
1st, the present invention adds uniform point of heat filling in silica gel matrix by being surface-treated to heat filling
Property is dissipated, heat conduction embedding silica gel viscosity substantially reduces under the same conditions in heat filling addition, or the bar that silica gel viscosity is constant
The addition of heat filling increased under part, the heat conductivility of heat conduction embedding silica gel is further improved.
2nd, the present invention avoids prior paraffin/graphite composite phase-change material and melted in phase transformation by adding phase-change microcapsule
The dynamic serious problems with infiltration migration and graphite of melt flow, and the storage that the heat conduction embedding silica gel in the present invention has been had
The performance of thermal control temperature.
3rd, phase-change microcapsule is contained in heat conduction embedding silica gel of the invention, can be to battery pack, electronic component equitemperature
Regulate and control, make to operate in the range of optimum working temperature, improve equipment overall efficiency.
4th, heat conduction embedding silica gel heat conductivility and heat accumulation temperature control performance of the invention are good, available for great-power electronic member device
Part, high density integrated circuit, solar panels, the battery pack heat management of new-energy automobile dynamic lithium battery and other batteries, when
When electronic component heating power is excessive, cell overheats in battery pack, heat conduction embedding silica gel material can effectively absorb
Heat and rapidly conduction diffusion, ensure the temperature homogeneity between each cell in battery pack.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the embodiment of the present invention, to this hair
Bright technical scheme is clearly and completely described.Obviously, described embodiment is the part of the embodiment of the present invention, and
The embodiment being not all of.Based on the embodiment in the present invention, those of ordinary skill in the art are not making creative work
On the premise of the every other embodiment that is obtained, belong to the scope of protection of the invention.
The present invention provides a kind of heat conduction embedding silica gel based on phase-change microcapsule, the heat conduction embedding silicon in first aspect
Glue by by percentage to the quality bi-component embedding silica gel 50%~90% (such as 50%, 60%, 70%, 80%, 85% or
90%)), phase-change microcapsule 5%~25% (such as 5%, 10%, 13%, 15%, 18%, 20%, 22% or 25%) and surface
Treated heat filling 5%~25% (such as 5%, 7%, 10%, 13%, 15%, 20%, 22% or 25%) composition.This
Invent the bi-component embedding silica gel account for the heat conduction embedding silica gel mass percentage content be preferably 60%~90% (such as
60%th, 70%, 75%, 80%, 85% or 90%), more preferably 70%~85% (such as 70%, 75%, 80% or 85%).
The present invention has no particular limits to the bi-component embedding silica gel, such as can be commercially available pair containing component A and B component
Component organosilicon embedding silica gel.
According to some preferred embodiments, the bi-component embedding silica gel includes component A and B component, the component A bag
Containing vinyl silicone oil and platinum catalyst, the B component includes vinyl silicone oil and containing hydrogen silicone oil;The vinyl silicone oil be selected from by
The group of vinyl-terminated silicone fluid and side vinyl silicone oil composition;The vinyl quantity contained in the vinyl silicone oil is no less than 2, institute
Stating the vinyl contained in vinyl silicone oil can be used to react with silicon bonding;The viscosity of the vinyl silicone oil is 200mPas
~1500mPas (such as 200,300,400,500,600,700,800,1000,1200 or 1500mPas), it is preferably
300mPas~800mPas (such as 300,400,500,600,700 or 800mPas).
According to some preferred embodiments, the phase-change microcapsule be phase transition temperature be 20 DEG C~80 DEG C (such as 20 DEG C,
30 DEG C, 40 DEG C, 50 DEG C, 60 DEG C, 70 DEG C or 80 DEG C), latent heat of phase change be 150~220kJ/kg (such as 150,160,170,180,
190th, 200,210 or 220kJ/kg) phase-change microcapsule.The phase-change microcapsule accounts for the quality percentage of the heat conduction embedding silica gel
Than content be preferably 7%~25% (such as 7%, 8%, 9%, 10%, 12%, 13%, 15%, 18%, 20%, 22% or
25%), more preferably 7%~15% (such as 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14% or 15%).
Heretofore described phase-change microcapsule can be commercially available phase-change microcapsule, for example, can also be using paraffin alkane as
Core, using Lauxite as housing, also contain heat filling, heat filling adds during Lauxite coats paraffin alkane
Add, heat filling addition is 5%~30% low temperature thermal control phase-change microcapsule of paraffin alkane mass percent.The low temperature
The specific preparation method of thermal control phase-change microcapsule, such as can include:The first step, paraffin alkane the pre-heat treatment;Second step, ureaformaldehyde
Resin prepolymer synthesizes;3rd step, styrene maleic resin solution, water and inorganic salts polymerisation;4th step, material mix
Close, obtain mixture;5th step, mixture emulsification pretreatment, obtain solid-liquid phase change performed polymer mixed emulsion;6th step, toward it is solid-
Liquid phase becomes performed polymer mixed emulsion and acid is added dropwise, and starts coating reaction, and regulation pH value is 5~6;7th step, coating reaction progress 1~
After 2 hours, heat filling is added into mixed emulsion, acid is added dropwise after stirring again, regulation pH value is 3~4, proceeds to cladding
Reaction is completed;8th step, filter and obtain low temperature thermal control phase-change microcapsule after drying.
According to some preferred embodiments, heat filling of the present invention select free zinc oxide, aluminum oxide, magnesia,
The group of aluminium nitride, boron nitride and carborundum composition;Preferably, the heat filling is selected from by aluminum oxide, aluminium nitride and carbonization
The group of silicon composition;It is further preferred that the heat filling is selected from the group being made up of aluminum oxide and aluminium nitride.The aluminum oxide is for example
It can be nano aluminium oxide.Especially, the mass percentage content that the heat filling accounts for the heat conduction embedding silica gel is preferably
7%~25% (such as 7%, 8%, 9%, 10%, 12%, 13%, 15%, 18%, 20%, 22% or 25%), more preferably
7%~15% (such as 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14% or 15%).
According to some preferred embodiments, heat filling surface treatment coupling agent used is silane coupler;
The silane coupler be selected from by MTES, n-propyl triethoxysilane, n-octytriethoxysilane and
The group of VTES composition;Preferably, the silane coupler be selected from by n-octytriethoxysilane and
The group of VTES composition;It is further preferred that the silane coupler is n-octytriethoxysilane.
In the embodiment that some are more highly preferred to, the heat conduction embedding silica gel is filled by bi-component by percentage to the quality
Silica gel 70%~85%, surface-treated heat filling 7%~15% and phase-change microcapsule 7%~15% is sealed to form.The matter
Lower its thermal conductivity of the heat conduction embedding silica gel height of amount proportioning, temperature control ability is good, fire resistance is good, and thermal diffusivity is good, waterproof, antidetonation and resistance to
Aging ability is strong.
The present invention provides a kind of preparation method of the heat conduction embedding silica gel based on phase-change microcapsule in second aspect, described
Method comprises the following steps:
(1) surface treatment of heat filling:It is even that silane coupler, water and ethanol are well mixed to the silane after being hydrolyzed
Join agent, then under the water bath condition of 50~70 DEG C (such as 50 DEG C, 55 DEG C, 60 DEG C, 65 DEG C or 70 DEG C), with the silane after hydrolysis
Coupling agent is surface-treated to heat filling, obtains the surface-treated mixed liquor containing heat filling, is contained by described in
The mixed liquor of heat filling carries out separation of solid and liquid by centrifuging, and isolates solid matter, the solid matter is dried, and makes
Obtain surface-treated heat filling;The mass percent that the dosage of the silane coupler accounts for the heat filling dosage is
1%~3% (such as 1%, 2% or 3%);
(2) preparation of heat conduction compounded mix:By the heat filling and phase-change microcapsule after the obtained surface treatment of step (1)
It is well mixed, heat conduction compounded mix is made;
(3) in bi-component embedding silica gel component A and B component preparation:Vinyl silicone oil is well mixed with platinum catalyst
Steep side by side, component A is made;Vinyl silicone oil is well mixed with containing hydrogen silicone oil and steeped side by side, B component is made;In obtained component A
The dosage of the platinum catalyst account for the mass percent of the vinyl silicone oil dosage for 1%~10% (such as 1%, 2%,
3%th, 4%, 5%, 6%, 7%, 8%, 9% or 10%);The dosage of containing hydrogen silicone oil accounts for the ethene described in obtained B component
The mass percent of base silicon oil dosage be 1%~10% (such as 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9% or
10%);
(4) in heat conduction embedding silica gel A1 components and B1 components preparation:Component A made from step (3) and step (2) are made
The heat conduction compounded mix obtained is well mixed to be steeped side by side, and A1 components are made;B component made from step (3) and step (2) is obtained
Heat conduction compounded mix is well mixed to be steeped side by side, and B1 components are made;With
(5) preparation of the heat conduction embedding silica gel based on phase-change microcapsule:By A1 components and B1 groups made from step (4) difference
Divide well mixed again successively by row's bubble and curing molding, the obtained heat conduction embedding silica gel based on phase-change microcapsule;It is such as described
The mass percent of A1 amounts of components and the B1 amounts of components is preferably 1:1.
Especially, the preparation of A1 components and B1 components can also pass through following step in the heat conduction embedding silica gel in the present invention
It is rapid to be made:
Vinyl silicone oil, platinum catalyst are well mixed with heat conduction compounded mix made from step (2) and steeped side by side, A1 is made
Component;Heat conduction compounded mix made from vinyl silicone oil, containing hydrogen silicone oil and step (2) is well mixed and steeped side by side, B1 groups are made
Point.The dosage of the platinum catalyst account for the mass percent of the vinyl silicone oil dosage of the A1 components for 1%~10% (such as
1%th, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9% or 10%);The dosage of the containing hydrogen silicone oil accounts for the second of the B1 components
The mass percent of alkenyl silicon oil dosage be 1%~10% (such as 1%, 2%, 3%, 4%, 5%, 6%, 7%, 8%, 9% or
10%).
According to some preferred embodiments, the platinum catalyst is platinum-vinyl siloxane complex compound;Methods described is also
The preparation of platinum-vinyl siloxane complex compound is carried out before being included in step (3):By 1,3- tetramethyl divinyl disiloxanes
Be mixed to get mixed liquor with chloroplatinic acid, by the mixed liquor the temperature of logical nitrogen and mixed liquor for 100 DEG C~120 DEG C (such as
100 DEG C, 110 DEG C or 120 DEG C) under conditions of flow back 1~1.5h (such as 1h or 1.5h), obtain platinum-vinyl siloxane complexing
Thing pre-product, the platinum-vinyl siloxane complex compound pre-product is passed through to the step of being centrifuged off platinum black successively, is washed to
The step of pH of platinum-vinyl siloxane complex compound pre-product is 6.8~7.3 (such as 6.8,6.9,7.0,7.1,7.2 or 7.3)
With dry step, platinum-vinyl siloxane complex compound is made.
According to some preferred embodiments, the mass ratio of silane coupler, water and ethanol is 1 in step (1):(3~
5):(100~200), such as 1:3:100、1:4:150 or 1:5:200;The speed centrifuged described in step (1) be 1200~
1600r/min (such as 1200,1300,1400,1500 or 1600r/min), time of the centrifugation for 5~8min (such as 5,
6th, 7 or 8min);Dried described in step (1) as vacuum drying, the temperature of the drying is 70~80 DEG C (such as 70 DEG C, 75 DEG C
Or 80 DEG C), the time of the drying is 10~14h (such as 10,11,12,13 or 14h);Bubble is arranged described in step (3) and (4)
Carry out under vacuum;Curing molding is carried out under room temperature or heating condition described in step (4).
According to some preferred embodiments, in the preparation of platinum-vinyl siloxane complex compound, used in the washing
Solution is sodium bicarbonate solution, the concentration of preferably described sodium bicarbonate solution for 2wt%~4wt% (such as 2wt%, 3wt% or
4wt%);In the preparation of platinum-vinyl siloxane complex compound, the drier used in the drying is calcium chloride.
The heat conduction embedding silica gel based on phase-change microcapsule in the present invention, viscosity is tested by GB/T 2794;By ASTM
D5470 tests thermal conductivity factor;By the test densitys of GB/T 2008;Hardness is tested by GB/T 531.1-2008;GB/T 528-2009
Test tensile strength;By GB/ T1692-2008 test volume resistivity;Breakdown voltage strength is tested by GB/T 1695;By UL
94 test flame retardant ratings.
Embodiment 1
1. 7g heat fillings Nano-sized Alumina Powder and 0.07g silane coupler n-octyl triethoxysilicanes are weighed respectively
Alkane, according to mass ratio it is 1 n-octytriethoxysilane and water:3 are configured to solution, add ethanol in proper amount and are well mixed, quiet
Put 20min.Silane coupler solution after hydrolysis is slowly added into heat filling, is stirred well to and is uniformly dispersed, and will
Mixed liquor is placed in heating stirring under 65 DEG C of water bath conditions so that the silane coupler after hydrolysis is carried out at surface to heat filling
Reason, obtains surface-treated heat filling mixed liquor.It is in centrifugal speed by surface-treated heat filling mixed liquor
Centrifuge 6min under conditions of 1500r/min to carry out separation of solid and liquid and isolate heat filling solid matter, by the heat filling
Solid matter is placed in vacuum drying treatment 13.5h in 75 DEG C of drying boxes, and surface-treated heat filling is made after drying.
2. adding 13g phase-change microcapsules into the heat filling of step 1., stirring makes it well mixed, and it is compound to obtain heat conduction
Filler.The phase transition temperature of the phase-change microcapsule is 48 DEG C, latent heat of phase change 185kJ/kg.
3. 1, the 3- tetramethyl divinyl disiloxanes and 2g chloroplatinic acids that weigh 50g mix in three-necked flask, obtain
Mixed liquor, 1h is stirred at reflux under the conditions of being 100 DEG C by the temperature that the mixed liquor keeps leading to nitrogen and mixed liquor, obtains platinum-second
Alkenyl siloxane complex compound pre-product;After the platinum-vinyl siloxane complex compound pre-product is cooled down, removed successively by centrifugation
Platinum black is removed, uses NaHCO3Solution is washed till in pH=7, then uses CaCl2Dry step, platinum-vinyl siloxane complexing is made
Thing.
4. weighing 3. catalyst that 3g steps are prepared, it is added in 100g vinyl-terminated silicone fluids, and is mixed with rotating speed 20r/min
Together under high-speed shearing machine, being sufficiently mixed uniformly, component A is made after vacuumizing and exhausting bubble;3g containing hydrogen silicone oils are weighed, are added to
In 100g vinyl-terminated silicone fluids, and it is mixed under high-speed shearing machine, is sufficiently mixed uniformly, vacuumizing and exhausting with rotating speed 20r/min
B component is made after bubble.It is standby that 40gA, 40gB component are weighed respectively.
5. add 2. heat conduction compounded mix that 10g steps are prepared into 40gA components to be thoroughly mixed uniformly and vacuumize
A1 components are made after exhaust bubble;2. heat conduction compounded mix that 10g steps are prepared is added into 40gB components, is thoroughly mixed
B1 components are made after even and vacuumizing and exhausting bubble.
6. 5. A1 that step is prepared and B1 components in mass ratio 1:1 is uniformly mixed, and is placed in vacuum row's bubble equipment,
Vacuumizing and exhausting bubble 10min or so, maintains vacuum 5min or so, the curing molding under room temperature or heating condition, is made and is based on
The heat conduction embedding silica gel of phase-change microcapsule.
The viscosity of heat conduction embedding silica gel in embodiment 1, thermal conductivity factor, density, hardness, tensile strength, specific insulation, hit
The testing result for wearing voltage strength and flame retardant rating is as shown in table 1.
Embodiment 2-19 is carried out by the way of substantially the same manner as Example 1, and difference is as shown in table 1.
Illustrate, C1 represents that the vinyl silicone oil in component A and B component is vinyl-terminated silicone fluid in form 1;C2
Represent that the vinyl silicone oil in component A and B component is side vinyl silicone oil;E1 represents the micro- glue of phase transformation that phase transition temperature is 48 DEG C
Capsule, E2 represent the phase-change microcapsule that phase transition temperature is 35 DEG C;D represents the paraffin that phase transition temperature is 48 DEG C;F1 is represented by surface
The nano aluminium oxide heat filling of processing, F2 represent surface treated aluminium nitride heat filling;F3 is represented at no surface
The nano aluminium oxide heat filling of reason;F4 represents surface-treated expanded graphite;F5 represent surface-treated aluminium nitride with
Alumina mixture.
Comparative example 1
Comparative example 1 is substantially the same manner as Example 1, and difference is as shown in table 2.
Comparative example 2
Comparative example 2 is substantially the same manner as Example 1, and difference is:Nano-sized Alumina Powder in comparative example 2 does not pass through
Cross surface treatment.
The performance test results of heat conduction embedding silica gel are as shown in table 2 in comparative example 2.
Comparative example 3
Comparative example 3 is substantially the same manner as Example 1, and difference is:The heat filling that comparative example 3 uses is surface treatment
The expanded graphite crossed.
The performance test results of heat conduction embedding silica gel are as shown in table 2 in comparative example 3.
Comparative example 4
Comparative example 4 is substantially the same manner as Example 1, and difference is:Comparative example 4 uses phase transition temperature as 48 DEG C of paraffin
It instead of the phase-change microcapsule in embodiment 1.
Heat conduction embedding silica gel in comparative example 4 carries out viscosity, thermal conductivity factor, density, hardness, tensile strength, volume resistance
During the performance tests such as rate, breakdown voltage strength and flame retardant rating, find to penetrate partial phase change material in heat conduction embedding silica gel.
The performance test results of heat conduction embedding silica gel are as shown in table 2 in comparative example 4.
Comparative example 5
Comparative example 5 is substantially the same manner as Example 1, and difference is:The heat filling of comparative example 5 is surface-treated
Aluminium nitride and aluminum oxide mixture, and the amount ratio of aluminium nitride and aluminum oxide be 2:1.
The performance test results of heat conduction embedding silica gel are as shown in table 2 in comparative example 5.
Comparative example 6
Comparative example 6 is substantially the same manner as Example 1, and difference is:Comparative example 6 uses phase transition temperature as 48 DEG C of paraffin
The phase-change microcapsule in embodiment 1 is instead of, and the heat filling of comparative example 6 is surface-treated aluminium nitride and aluminum oxide
Mixture, the amount ratio of aluminium nitride and aluminum oxide is 2:1.
Heat conduction embedding silica gel in comparative example 6 carries out viscosity, thermal conductivity factor, density, hardness, tensile strength, volume resistance
During the performance tests such as rate, breakdown voltage strength and flame retardant rating, find to penetrate partial phase change material in heat conduction embedding silica gel.
The performance test results of heat conduction embedding silica gel are as shown in table 2 in comparative example 6.
Finally it should be noted that:The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations;Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those within the art that:It still may be used
To be modified to the technical scheme described in foregoing embodiments, or equivalent substitution is carried out to which part technical characteristic;
And these modification or replace, do not make appropriate technical solution essence depart from various embodiments of the present invention technical scheme spirit and
Scope.
Claims (10)
- A kind of 1. heat conduction embedding silica gel based on phase-change microcapsule, it is characterised in that:The heat conduction embedding silica gel is by bi-component embedding silica gel 50%~90%, phase-change microcapsule 5% by percentage to the quality ~25% and surface-treated heat filling 5%~25% composition.
- 2. heat conduction embedding silica gel according to claim 1, it is characterised in that:The bi-component embedding silica gel includes component A and B component, and the component A includes vinyl silicone oil and platinum catalyst, described B component includes vinyl silicone oil and containing hydrogen silicone oil;The phase-change microcapsule is that phase transition temperature is 20 DEG C~80 DEG C, and latent heat of phase change is 150~220kJ/kg phase-change microcapsule; And/orThe heat filling selects the group of free zinc oxide, aluminum oxide, magnesia, aluminium nitride, boron nitride and carborundum composition;It is preferred that , the heat filling is selected from the group being made up of aluminum oxide, aluminium nitride and carborundum;It is further preferred that the heat filling Selected from the group being made up of aluminum oxide and aluminium nitride.
- 3. heat conduction embedding silica gel according to claim 1 or 2, it is characterised in that:The phase-change microcapsule account for the heat conduction embedding silica gel mass percentage content be 7%~20%, preferably 7%~ 15%;And/orThe heat filling account for the heat conduction embedding silica gel mass percentage content be 7%~20%, preferably 7%~ 15%.
- 4. heat conduction embedding silica gel according to claim 2, it is characterised in that:The vinyl silicone oil is selected from the group being made up of vinyl-terminated silicone fluid and side vinyl silicone oil;The vinyl quantity contained in the vinyl silicone oil is no less than 2;And/orThe viscosity of the vinyl silicone oil is 200mPas~1500mPas, preferably 300mPas~800mPas.
- 5. heat conduction embedding silica gel according to claim 1, it is characterised in that:Heat filling surface treatment coupling agent used is silane coupler;The silane coupler is selected from by MTES, n-propyl triethoxysilane, n-octyl triethoxysilicane The group of alkane and VTES composition;Preferably, the silane coupler is selected from by n-octyl triethoxysilicane The group of alkane and VTES composition;It is further preferred that the silane coupler is n-octytriethoxysilane.
- 6. a kind of preparation method of the heat conduction embedding silica gel based on phase-change microcapsule, it is characterised in that methods described includes as follows Step:(1) surface treatment of heat filling:Silane coupler, water and ethanol are well mixed, it is silane coupled after being hydrolyzed Agent, then under 50 DEG C~70 DEG C of water bath condition, heat filling is surface-treated with the silane coupler after hydrolysis, obtained To surface-treated heat filling mixed liquor, the surface-treated heat filling mixed liquor is subjected to solid-liquid by centrifuging Separation, isolates heat filling solid matter, the heat filling solid matter is dried, and is made surface-treated and leads Hot filler;(2) preparation of heat conduction compounded mix:Heat filling surface-treated made from step (1) is mixed with phase-change microcapsule Uniformly, heat conduction compounded mix is made;(3) in bi-component embedding silica gel component A and B component preparation:Vinyl silicone oil is well mixed side by side with platinum catalyst Bubble, component A is made;Vinyl silicone oil is well mixed with containing hydrogen silicone oil and steeped side by side, B component is made;(4) in heat conduction embedding silica gel A1 components and B1 components preparation:Component A made from step (3) and step (2) is obtained Heat conduction compounded mix is well mixed to be steeped side by side, and A1 components are made;By heat conduction made from B component made from step (3) and step (2) Compounded mix is well mixed to be steeped side by side, and B1 components are made;With(5) preparation of the heat conduction embedding silica gel based on phase-change microcapsule:A1 components made from step (4) are mixed with B1 components It is even to pass through row's bubble and curing molding successively again, the heat conduction embedding silica gel based on phase-change microcapsule is made.
- 7. preparation method according to claim 6, it is characterised in that:Platinum catalyst described in step (3) is platinum-vinyl siloxane complex compound;Methods described carries out the preparation of platinum-vinyl siloxane complex compound before being additionally included in step (3):By 1,3- tetramethyls two Vinyl disiloxane is mixed with chloroplatinic acid, obtains mixed liquor, and the mixed liquor is being kept into the temperature of logical nitrogen and mixed liquor For the 1~1.5h that flows back under conditions of 100 DEG C~120 DEG C, platinum-vinyl siloxane complex compound pre-product is obtained, by the platinum-second Alkenyl siloxane complex compound pre-product passes through the step of being centrifuged off platinum black, is washed to platinum-vinyl siloxane complex compound successively The step of pH of pre-product is 6.8~7.3 and the step dried, are made platinum-vinyl siloxane complex compound.
- 8. the preparation method according to claim 6 or 7, it is characterised in that:The mass ratio of silane coupler, water and ethanol is 1 in step (1):(3~5):(100~200);The mass percent that the dosage of silane coupler described in step (1) accounts for the heat filling dosage is 1%~3%;The mass percent that the dosage of platinum catalyst accounts for the vinyl silicone oil dosage described in component A made from step (3) is 1%~10%;The mass percent that the dosage of containing hydrogen silicone oil accounts for the vinyl silicone oil dosage described in B component made from step (3) is 1%~10%;And/orThe mass percent of A1 amounts of components described in step (5) and the B1 amounts of components is 1:1.
- 9. preparation method according to claim 6, it is characterised in that:The speed centrifuged described in step (1) is 1200~1600r/min, and the time of the centrifugation is 5~8min;Dried described in step (1) to be dried in vacuo, the temperature of the drying is 70 DEG C~80 DEG C, and the time of the drying is 10 ~14h;Row's bubble described in step (3), step (4) and step (5) is carried out under vacuum;And/orCuring molding is carried out under room temperature or heating condition described in step (5).
- 10. preparation method according to claim 7, it is characterised in that:In the preparation of platinum-vinyl siloxane complex compound, the solution used in the washing is sodium bicarbonate solution, preferably described The concentration of sodium bicarbonate solution is 2wt%~4wt%;In the preparation of platinum-vinyl siloxane complex compound, the drier used in the drying is calcium chloride.
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CN109135684A (en) * | 2018-09-21 | 2019-01-04 | 贵州梅岭电源有限公司 | A kind of thermal cell composite phase-change material and preparation method thereof |
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CN109749714A (en) * | 2019-01-23 | 2019-05-14 | 深圳航美新材料科技有限公司 | A kind of high enthalpy phase-change heat silicon cream and preparation method thereof |
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Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105348797A (en) * | 2015-10-21 | 2016-02-24 | 中国科学院宁波材料技术与工程研究所 | Graphene-based heat conduction silica gel phase change composite material and preparation method thereof |
CN106833509A (en) * | 2016-12-30 | 2017-06-13 | 常州碳星科技有限公司 | A kind of heat conduction organosilicon rubber battery casting glue and preparation method thereof |
-
2017
- 2017-11-03 CN CN201711068139.XA patent/CN107815286B/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105348797A (en) * | 2015-10-21 | 2016-02-24 | 中国科学院宁波材料技术与工程研究所 | Graphene-based heat conduction silica gel phase change composite material and preparation method thereof |
CN106833509A (en) * | 2016-12-30 | 2017-06-13 | 常州碳星科技有限公司 | A kind of heat conduction organosilicon rubber battery casting glue and preparation method thereof |
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CN111410939A (en) * | 2020-04-09 | 2020-07-14 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
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CN111410939B (en) * | 2020-04-09 | 2021-10-22 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
CN111312675A (en) * | 2020-04-09 | 2020-06-19 | 清华大学深圳国际研究生院 | Heat transfer and heat storage sheet, preparation method thereof and heat dissipation structure |
CN112126393B (en) * | 2020-09-28 | 2021-07-20 | 杭州应星新材料有限公司 | Phase-change heat storage pouring sealant and preparation method thereof |
CN112126393A (en) * | 2020-09-28 | 2020-12-25 | 杭州应星新材料有限公司 | Phase-change heat storage pouring sealant and preparation method thereof |
CN112705702A (en) * | 2020-12-07 | 2021-04-27 | 中国科学院深圳先进技术研究院 | Aluminum powder surface modification method |
CN114062204A (en) * | 2021-10-26 | 2022-02-18 | 浙江理工大学 | Method for detecting migration of phase-change material in heat-storage and temperature-adjustment textile product |
CN114062204B (en) * | 2021-10-26 | 2024-03-01 | 浙江理工大学 | Method for detecting migration of phase change material in heat-accumulating temperature-regulating textile product |
CN114836175A (en) * | 2022-04-13 | 2022-08-02 | 航天特种材料及工艺技术研究所 | Phase change composite material and preparation method thereof |
CN115286923A (en) * | 2022-08-31 | 2022-11-04 | 东莞市德聚胶接技术有限公司 | High-temperature-resistant and low-temperature-resistant heat-conducting silicone grease, and preparation method and application thereof |
CN115433539A (en) * | 2022-09-15 | 2022-12-06 | 矽时代材料科技股份有限公司 | Phase-change latent heat organic silicon pouring sealant and preparation method thereof |
CN116120754A (en) * | 2022-12-27 | 2023-05-16 | 深圳中诺材料技术有限公司 | Preparation method of heat conduction and heat storage structural member of electronic product |
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