CN111500253A - Organic silicon phase change pouring sealant for mobile phone charger and preparation method thereof - Google Patents
Organic silicon phase change pouring sealant for mobile phone charger and preparation method thereof Download PDFInfo
- Publication number
- CN111500253A CN111500253A CN202010236070.2A CN202010236070A CN111500253A CN 111500253 A CN111500253 A CN 111500253A CN 202010236070 A CN202010236070 A CN 202010236070A CN 111500253 A CN111500253 A CN 111500253A
- Authority
- CN
- China
- Prior art keywords
- parts
- silicone oil
- phase
- component
- stirring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention provides an organic silicon phase change pouring sealant for a mobile phone charger, which belongs to the technical field of organic silicon pouring sealants and comprises a component A and a component B; wherein the component A comprises: 10-40 parts of vinyl silicone oil, 1-10 parts of diluent, 10-30 parts of heat-conducting reinforcing filler, 20-60 parts of phase-change material and 0.1-2.0 parts of catalyst; the component B comprises: 10-40 parts of vinyl silicone oil, 5-20 parts of cross-linking agent, 10-30 parts of heat-conducting reinforcing filler, 20-60 parts of phase-change material and 0.1-1.0 part of inhibitor; and the coupling agent is used for improvement, the reaction is carried out in a reaction kettle, the stirring, the cooling, the stirring again, the cooling again and the preparation according to the proportion to obtain a finished product. The phase change pouring sealant can play a good heat transfer effect, and can quickly absorb most of heat generated by an electronic device of a charger, so that the temperature of the charger during charging is effectively reduced, the charging efficiency and the energy are improved, and the phase change pouring sealant has the characteristics of moderate viscosity and stable storage.
Description
Technical Field
The invention relates to the technical field of pouring sealant, and particularly belongs to phase-change pouring sealant for a mobile phone charger and a preparation method thereof.
Background
In recent years, the charging speed of the smart phone is higher and higher, the size of the charger is smaller and smaller, the density of electronic components in the charger is increased gradually, the heating rate of some electronic devices in the charger is increased under the condition that the smart phone is charged quickly, and heat is not easy to dissipate in time due to the effect of the charger shell. The temperature peak value of the electronic device in the charger can reach 80-100 ℃ in the rapid charging process, the temperature peak value of the shell of the charger can reach more than 70 ℃, and the heat which is not dissipated in time can cause the temperature of the electronic device to rise, thereby reducing the service life of the charger and the charging efficiency. Therefore, if the charging temperature of the charger can be reduced, the service life of the charger can be prolonged, the charging efficiency can be improved, and energy can be saved.
The current common heat dissipation method is to inject heat-conducting pouring sealant of organic silicon into the shell of the mobile phone charger, so that heat can be quickly transferred to the surface of the charger shell, and heat dissipation is accelerated. However, the common heat-conducting potting adhesive can only perform the function of heat transfer, and there is thermal resistance in the process of heat transfer, and the temperature is still difficult to reduce or slow to reduce at the place where the potting adhesive is in contact with the electronic device.
It has therefore been proposed to develop phase change materials to address this problem. Although phase change materials have more applications, they are rarely used in the field of silicone potting adhesives. Because the compatibility of the existing phase-change material and an organic silicon system is poor, the stability of the prepared product is poor, the phase-change material is easy to separate out, the thixotropy of the glue added with the phase-change material is large, and the application scene is greatly limited. Although the phase change pouring sealant is prepared in patent with application number CN201711443193.8, in the patent, especially the embodiment, the problem of viscosity of the prepared finished product is not mentioned, and a corresponding technical scheme for reducing the viscosity of the finished product is not made, and the internal space of the mobile phone charger is narrow, if the viscosity of the pouring sealant prepared in the patent is high, it is difficult to achieve the effect of pouring and sealing the electronic device of the charger, which restricts popularization and application.
As a high-quality pouring sealant, one of the important characteristics is that the pouring sealant has good fluidity, so that the pouring sealant can better play a role in pouring and protecting electronic devices, and the requirement on the viscosity of the pouring sealant is higher due to the narrow space in a mobile phone charger, so that the pouring sealant can well flow only when the viscosity of the pouring sealant is less than or equal to 3500mPa & s, and the gap is filled by the gravity of the pouring sealant, thereby really playing a role in heat conduction and pouring.
Disclosure of Invention
Aiming at the defects and shortcomings in the background art, the invention provides the organic silicon phase change pouring sealant for the mobile phone charger, which has a good heat transfer effect, can temporarily and quickly absorb most of heat generated by an electronic device in the charging process of the charger, and slowly releases the heat after the charging is finished, so that the temperature in the charging process of the charger can be effectively reduced, the charging efficiency is improved, and the energy is saved.
The invention also aims to provide a preparation method of the organic silicon phase change pouring sealant for the mobile phone charger, the performance of the prepared pouring sealant can be effectively improved by the preparation method, the temperature of the charger during charging can be rapidly reduced in the charging process of the charger, the charging efficiency is improved, and the organic silicon phase change pouring sealant has the characteristics of moderate viscosity and stable storage.
In order to realize the purpose, the invention adopts the following technical scheme to realize the purpose:
an organic silicon phase change pouring sealant for a mobile phone charger comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 1-10 parts of diluent, 10-30 parts of heat-conducting reinforcing filler, 20-60 parts of phase-change material and 0.1-2.0 parts of catalyst;
the component B comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 5-20 parts of cross-linking agent, 10-30 parts of heat-conducting reinforcing filler, 20-60 parts of phase-change material and 0.1-1.0 part of inhibitor;
the vinyl silicone oil is one or a mixture of more of double-end vinyl silicone oil, single-end vinyl silicone oil and side chain vinyl silicone oil, and the viscosity is 50-200mPa & s;
the diluent is dimethyl silicone oil, and the viscosity is 20-100mPa & s;
the heat-conducting reinforcing filler is one or a mixture of more of aluminum hydroxide, silicon micropowder, aluminum oxide, zinc oxide and white carbon black;
the cross-linking agent is one or a mixture of a plurality of substances of terminal hydrogen-containing silicone oil, side hydrogen-containing silicone oil or terminal hydrogen-containing silicone oil, and the viscosity is 50-150mPa & s;
the phase-change material is one or a mixture of polyethylene glycol and phase-change microcapsules, and is subjected to surface chemical modification;
the catalyst is a platinum catalyst;
the inhibitor is one or a mixture of several of methylbutynol, ethynl cyclohexanol and polyvinyl compound.
Further measures taken are: the vinyl silicone oil is double-end vinyl silicone oil with the viscosity of 150mPa & s.
Further measures taken are: the viscosity of the simethicone is 50 mPa.s.
Further measures taken are: the particle sizes of the aluminum hydroxide and the silicon micro powder are 10-20 mu m, the aluminum oxide is spherical aluminum oxide, and the white carbon black is surface hydrophobic white carbon black.
Further measures taken are: the shell of the phase-change microcapsule is made of inorganic materials, the core of the phase-change microcapsule is made of paraffin, and the phase-change temperature is 40-60 ℃.
A preparation method of an organic silicon phase change pouring sealant for a mobile phone charger comprises the following steps:
1) putting all parts of phase-change materials into the same modifying machine, organically treating the surfaces of the phase-change materials by using a coupling agent, preserving heat for 10min, discharging, collecting, and dividing the phase-change materials into a component A and a component B in corresponding parts for later use;
2) adding the vinyl silicone oil, the diluent and the heat-conducting reinforcing filler in the component A in corresponding parts into a first reaction kettle, stirring for 60min, suspending, adding the phase-change material in corresponding parts of the component A treated in the step 1) when the temperature is reduced to below 40 ℃, stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 40 ℃, adding the catalyst in the corresponding part of the component A, stirring for 10min, and stopping stirring to obtain a finished product A;
4) adding the double-end vinyl silicone oil, the cross-linking agent and the heat-conducting filler in the component B in corresponding parts into a second reaction kettle, stirring for 60min, suspending, adding the phase-change material in corresponding parts of the component B treated in the step 1) when the temperature is reduced to below 40 ℃, continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 40 ℃, adding the inhibitor of the component B in a corresponding part, stirring for 10min, and stopping stirring to obtain a finished product B;
6) when in use, the mass ratio of the finished product A to the finished product B is 1:1, mixing uniformly, and then using.
Further measures taken are: in the step 1), the modifier of the phase-change material is a silane coupling agent, and comprises one or a mixture of more of KH-550, KH-560, KH-570, A-151, A-171 and A-172.
Further measures taken are: in the modification process of the step 1), the rotating speed of the modification machine is 500-2000r/min, the modification temperature is 40-70 ℃, and the modifier is sprayed into the modification machine within 2min through an atomizing spray head.
Further measures taken are: in the step 2) and the step 4), after the substances are added into the corresponding reaction kettle, stirring is carried out for 60min at a stirring speed of 400-1000 r/min; and the temperature of the materials in the reaction kettle is controlled below 80 ℃.
Through the technical scheme, compared with the prior art, the invention has the following beneficial effects:
1. according to the invention, the phase-change material is subjected to surface chemical treatment, so that the compatibility of the phase-change material and an organic silicon system is improved, and the stability of the glue is greatly improved, thereby improving the storage stability of the pouring sealant and sufficiently meeting the requirements of a mobile phone charger on the pouring sealant.
2. The pouring sealant has low viscosity which is less than or equal to 3200mPa & s, and the highest working temperature of a charger electronic device using the pouring sealant is 10-15 ℃ lower than that of the common heat-conducting pouring sealant under the condition of the same pouring sealant amount by comparison test in a mobile phone charger of the same model, so that the cooling effect is obvious, the effects of saving energy and prolonging the service life of the electronic device are achieved, and the pouring sealant is suitable for popularization and application.
3. The pouring sealant has good fluidity, can fill gaps by the self gravity, conducts heat, and performs pouring, so that the pouring sealant can better perform the pouring protection effect on electronic devices.
Detailed Description
In order to clearly understand the technical solutions adopted by the present invention, the following description is made on the preferred embodiments of the present invention, and it should be understood that the embodiments described herein are only used for illustrating and explaining the present invention, and are not used to limit the present invention.
Example 1: an organic silicon phase change pouring sealant for a mobile phone charger comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 39.4 parts of double-end vinyl silicone oil; 10 parts of dimethyl silicone oil; 30 parts of aluminum hydroxide; 20 parts of polyethylene glycol; 0.6 part of platinum catalyst.
The component B comprises the following substances in parts by weight: 35 parts of double-end vinyl silicone oil; side hydrogen-containing silicone oil 14.8 parts; 30 parts of aluminum hydroxide; 20 parts of polyethylene glycol; 0.2 part of methylbutinol.
And is prepared by the following steps:
1) putting all parts of polyethylene glycol into the same modifying machine, spraying 0.25 part of mixed modifier of KH-560 and A-171 within 2min through an atomizing spray head when the rotating speed of the modifying machine is 800r/min and the temperature of the modified material is 45 ℃, wherein the mixing ratio of KH-560 to A-171 is 2:8, then preserving heat at 50 ℃ for 10min, discharging and collecting, and dividing into two groups of 20 parts of polyethylene glycol for later use;
2) adding 39.4 parts of double-end vinyl silicone oil with the viscosity of 200 mPas, 10.0 parts of dimethyl silicone oil and 30 parts of aluminum hydroxide into a first reaction kettle, stirring at the rotation speed of 500r/min for 60min, suspending, adding 20 parts of phase change microcapsules treated in the step 1) when the temperature is reduced to be below 40 ℃, then stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 40 ℃, adding 0.6 part of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A1;
4) adding 35 parts of double-end vinyl silicone oil with the viscosity of 150 mPas, 14.8 parts of hydrogen-containing silicone oil on the 100 mPas side and 30 parts of aluminum hydroxide into a second reaction kettle, stirring at the rotating speed of 500r/min for 60min, suspending, adding 20 parts of phase-change microcapsules treated in the step 1) when the temperature is reduced to be below 40 ℃, continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 40 ℃, adding 0.2 part of inhibitor methylbutinol, stirring for 10min, and stopping stirring to obtain a finished product B1;
when in use, the mass ratio of the prepared finished product A1 to the finished product B1 is 1:1, mixing uniformly, and then using.
Example 2: an organic silicon phase change pouring sealant for a mobile phone charger comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 32 parts of side chain vinyl silicone oil; 6.7 parts of dimethyl silicone oil; 20 parts of aluminum oxide; 40 parts of phase change microcapsules; 1.3 parts of platinum catalyst.
The component B comprises the following substances in parts by weight: 20 parts of side chain vinyl silicone oil; 19.6 parts of lateral hydrogen-containing silicone oil; 20 parts of aluminum oxide; 40 parts of phase change microcapsules; 0.4 part of ethynl cyclohexanol.
And is prepared by the following steps:
1) putting all parts of phase-change microcapsules into the same modifying machine, spraying 0.48 part of mixed modifier of KH-560 and A-171 within 2min through an atomizing spray head when the rotating speed of the modifying machine is 1200r/min and the temperature of the modified material is 50 ℃, wherein the mixing ratio of KH-560 to A-171 is 3:7, then preserving heat at 55 ℃ for 10min, discharging and collecting, and dividing into two groups of 40 parts of phase-change microcapsules for later use;
2) adding 32 parts of double-end vinyl silicone oil with the viscosity of 150 mPas, 6.7 parts of dimethyl silicone oil and 20 parts of aluminum hydroxide into a first reaction kettle, stirring at the rotating speed of 800r/min for 60min, suspending, adding 40 parts of phase change microcapsules treated in the step 1) when the temperature is reduced to be below 40 ℃, then stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 40 ℃, adding 1.3 parts of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A2;
4) adding 25 parts of double-end vinyl silicone oil with the viscosity of 150 mPas, 14.8 parts of hydrogen-containing silicone oil on the 70 mPas side and 20 parts of aluminum hydroxide into a second reaction kettle, stirring at the rotating speed of 800r/min for 60min, suspending, adding 40 parts of phase-change microcapsules treated in the step 1), continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 40 ℃, adding 0.4 part of inhibitor ethynl cyclohexanol, stirring for 10min, and stopping stirring to obtain a finished product B2;
when in use, the mass ratio of the prepared finished product A2 to the finished product B2 is 1:1, mixing uniformly, and then using.
Example 3: an organic silicon phase change pouring sealant for a mobile phone charger comprises a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 20 parts of double-end vinyl silicone oil; 5 parts of single-end vinyl silicone oil; 3.2 parts of dimethyl silicone oil; 10 parts of silicon dioxide; 55 parts of phase change microcapsules; 5 parts of polyethylene glycol; 1.8 parts of platinum catalyst.
The component B comprises the following substances in parts by weight: 18 parts of double-end vinyl silicone oil; 3 parts of single-end vinyl silicone oil; 8.2 parts of hydrogen-containing silicone oil on the end side; 10 parts of silicon dioxide; 55 parts of phase change microcapsules; 5 parts of polyethylene glycol; 0.8 part of methylbutinol.
And is prepared by the following steps:
1) putting all parts of phase-change microcapsules and polyethylene glycol into the same modifying machine, spraying 0.72 part of mixed modifier of KH-560 and A-171 within 2min through an atomizing spray head when the rotating speed of the modifying machine is 1500r/min and the temperature of the modified material is 50 ℃, wherein the mixing ratio of KH-560 to A-171 is 1:1, then preserving heat at 60 ℃ for 10min, discharging and collecting, and dividing into two groups of 60 parts of mixture of phase-change microcapsules and polyethylene glycol;
2) adding 20 parts of double-ended vinyl silicone oil with the viscosity of 100 mPas, 5 parts of single-ended vinyl silicone oil, 3.2 parts of dimethyl silicone oil and 10 parts of silicon dioxide into a first reaction kettle, stirring at the rotating speed of 1200r/min for 60min, pausing, adding 60 parts of phase change microcapsules treated in the step 1) and 5 parts of polyethylene glycol with the molecular weight of 10000 when the temperature is reduced to below 40 ℃, then stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 40 ℃, adding 1.8 parts of platinum catalyst, stirring for 10min, and stopping stirring to obtain a finished product A3;
4) adding 18 parts of double-ended vinyl silicone oil with the viscosity of 100mPa & s, 3 parts of single-ended vinyl silicone oil, 8.2 parts of 50mPa & s hydrogen-containing silicone oil and 10 parts of silicon dioxide into a second reaction kettle, stirring at the rotating speed of 1200r/min for 60min, pausing, then adding 55 parts of phase-change microcapsules treated in the step 1) and 5 parts of polyethylene glycol with the molecular weight of 10000, continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 40 ℃, adding 0.8 part of inhibitor methylbutinol, stirring for 10min, and stopping stirring to obtain a finished product B3;
when in use, the mass ratio of the prepared finished product A3 to the finished product B3 is 1:1, mixing uniformly, and then using.
The performance parameters of the samples prepared in example 1, example 2 and example 3 were measured, and the measurement results are shown in table 1 below:
table 1: EXAMPLES tables for measuring Property parameters of samples
| Basic Properties | Example 1 sample | Example 2 sample | Example 3 sample |
| Heat conduction (W/(m.K)) | 0.52 | 0.50 | 0.51 |
| Viscosity (mPa. s) | 2100 | 2600 | 3200 |
| Enthalpy (J/g) | 30 | 60 | 93 |
The organic silicon phase-change pouring sealant for the common mobile phone charger in the market is selected as a comparison sample, and the comparison test of full-load charging is carried out on the comparison sample and the samples prepared in the 3 embodiments of the invention.
In the case that the ambient temperature is 25 ℃, the input voltage is 220V, the frequency is 50HZ, and the full-load time is 30min for a certain domestic 24W mobile phone quick charger using the comparative sample, the sample of example 1, the sample of example 2, and the sample of example 3, the temperatures of the main electronic devices in the charger and the surface of the charger housing are measured, and the data are recorded and summarized, and the results are shown in the following table 2:
table 2: test data result comparison table of full-load charging test:
as is apparent from the data results in tables 1 and 2 above, the temperature measurement values of the electronic devices in the charger corresponding to the samples in 3 embodiments are significantly lower than those of the electronic devices in the charger corresponding to the comparative sample, wherein the temperature measurement results of the electronic devices in the charger corresponding to the samples in embodiment 3 are lower than those of the comparative sample by more than 10 ℃, and the temperature difference effect is more significant.
Under the full-load condition of the quick charger, the heating value is large in a short time, a part of the heat is absorbed by the colloid in the process of outward diffusion, the temperature of the place where the colloid is contacted with the electronic device is reduced, the temperature of the whole electronic device is reduced, the power loss is reduced, and the service life of the charger is prolonged. The contrast sample is common pouring sealant with the same heat conduction, and although the heat conduction effect can be achieved, in the heat conduction process, the pouring sealant only has the heat transfer effect and cannot absorb heat, so that the temperature of the pouring sealant contacting with the electronic device is increased along with the temperature increase of the electronic device.
Therefore, the invention has good heat transfer and heat absorption effects and moderate viscosity, can effectively reduce the temperature of components in the charger during charging, improves the charging efficiency, saves energy and is suitable for popularization and application.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. An organic silicon phase change pouring sealant for a mobile phone charger is characterized by comprising a component A and a component B;
wherein the component A comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 1-10 parts of diluent, 10-30 parts of heat-conducting reinforcing filler, 20-60 parts of phase-change material and 0.1-2.0 parts of catalyst;
the component B comprises the following substances in parts by weight: 10-40 parts of vinyl silicone oil, 5-20 parts of cross-linking agent, 10-30 parts of heat-conducting reinforcing filler, 20-60 parts of phase-change material and 0.1-1.0 part of inhibitor;
the vinyl silicone oil is one or a mixture of two-terminal vinyl silicone oil, single-terminal vinyl silicone oil and side chain vinyl silicone oil, and the viscosity is 50-200mPa & s;
the diluent is dimethyl silicone oil, and the viscosity is 20-100mPa & s;
the heat-conducting reinforcing filler is one or a mixture of more of aluminum hydroxide, silicon micropowder, aluminum oxide, zinc oxide and white carbon black; the particle sizes of the aluminum hydroxide and the silicon micro powder are 10-20 mu m, the aluminum oxide is spherical aluminum oxide, and the white carbon black is surface hydrophobic white carbon black;
the cross-linking agent is one or a mixture of a plurality of substances of terminal hydrogen-containing silicone oil, side hydrogen-containing silicone oil or terminal hydrogen-containing silicone oil, and the viscosity is 50-150mPa & s;
the phase-change material is one or a mixture of polyethylene glycol and phase-change microcapsules, and is subjected to surface chemical modification;
the catalyst is a platinum catalyst;
the inhibitor is one or a mixture of several of methylbutynol, ethynl cyclohexanol and polyvinyl compound.
2. The organic silicon phase change pouring sealant for the mobile phone charger as claimed in claim 1, wherein: the vinyl silicone oil is double-end vinyl silicone oil with the viscosity of 150mPa & s.
3. The organic silicon phase change pouring sealant for the mobile phone charger as claimed in claim 1, wherein: the viscosity of the dimethyl silicone oil is 50 mPas.
4. The organic silicon phase change pouring sealant for the mobile phone charger as claimed in claim 1, wherein: the particle sizes of the aluminum hydroxide and the silicon micro powder are 10-20 mu m, the aluminum oxide is spherical aluminum oxide, and the white carbon black is surface hydrophobic white carbon black.
5. The organic silicon phase change pouring sealant for the mobile phone charger as claimed in claim 1, wherein: the shell of the phase-change microcapsule is made of inorganic materials, the core of the phase-change microcapsule is made of paraffin, and the phase-change temperature is 40-60 ℃.
6. The preparation method of the organic silicon phase change pouring sealant for the mobile phone charger as claimed in any one of claims 1 to 5, characterized in that: the method comprises the following steps:
1) putting all parts of phase-change materials into the same modifying machine, organically treating the surfaces of the phase-change materials by using a coupling agent, preserving heat for 10min, discharging, collecting, and dividing the phase-change materials into a component A and a component B in corresponding parts for later use;
2) adding the vinyl silicone oil, the diluent and the heat-conducting reinforcing filler in the component A in corresponding parts into a first reaction kettle, stirring for 60min, suspending, adding the phase-change material in corresponding parts of the component A treated in the step 1) when the temperature is reduced to below 40 ℃, stirring for 30min, stopping stirring, and cooling;
3) when the temperature of the mixture treated in the step 2) is reduced to below 40 ℃, adding the catalyst in the corresponding part of the component A, stirring for 10min, and stopping stirring to obtain a finished product A;
4) adding the double-end vinyl silicone oil, the cross-linking agent and the heat-conducting filler in the component B in corresponding parts into a second reaction kettle, stirring for 60min, suspending, adding the phase-change material in corresponding parts of the component B treated in the step 1) when the temperature is reduced to below 40 ℃, continuing stirring for 30min, stopping stirring, and cooling;
5) when the temperature of the mixture treated in the step 4) is reduced to below 40 ℃, adding the inhibitor of the component B in a corresponding part, stirring for 10min, and stopping stirring to obtain a finished product B;
6) when in use, the mass ratio of the finished product A to the finished product B is 1:1, mixing uniformly, and then using.
7. The preparation method of the organic silicon phase change pouring sealant for the mobile phone charger according to claim 6, characterized in that: in the step 1), the modifier of the phase-change material is a silane coupling agent, and comprises one or a mixture of more of KH-550, KH-560, KH-570, A-151, A-171 and A-172.
8. The preparation method of the organic silicon phase change pouring sealant for the mobile phone charger according to claim 7, characterized in that: in the modification process of the step 1), the rotating speed of the modification machine is 500-2000r/min, the modification temperature is 40-70 ℃, and the modifier is sprayed into the modification machine within 2min through an atomizing spray head.
9. The preparation method of the organic silicon phase change pouring sealant for the mobile phone charger according to claim 6, characterized in that: in the step 2) and the step 4), after the substances are added into the corresponding reaction kettle, stirring is carried out for 60min at a stirring speed of 400-1000 r/min; and the temperature of the materials in the reaction kettle is controlled below 80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010236070.2A CN111500253A (en) | 2020-03-30 | 2020-03-30 | Organic silicon phase change pouring sealant for mobile phone charger and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010236070.2A CN111500253A (en) | 2020-03-30 | 2020-03-30 | Organic silicon phase change pouring sealant for mobile phone charger and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111500253A true CN111500253A (en) | 2020-08-07 |
Family
ID=71865945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010236070.2A Pending CN111500253A (en) | 2020-03-30 | 2020-03-30 | Organic silicon phase change pouring sealant for mobile phone charger and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111500253A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112409942A (en) * | 2020-11-19 | 2021-02-26 | 杭州福斯特应用材料股份有限公司 | Heat dissipation type packaging adhesive film and preparation method thereof |
| CN112625452A (en) * | 2020-12-31 | 2021-04-09 | 南昌大学 | Phase change energy storage silicone grease gasket for electronic equipment and preparation method thereof |
| CN115433539A (en) * | 2022-09-15 | 2022-12-06 | 矽时代材料科技股份有限公司 | Phase-change latent heat organic silicon pouring sealant and preparation method thereof |
| CN117004231A (en) * | 2023-08-24 | 2023-11-07 | 常州宏巨电子科技有限公司 | Low-volatility quick-curing phase-change heat-conducting gasket and preparation method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000136307A (en) * | 1998-08-24 | 2000-05-16 | Shin Etsu Chem Co Ltd | Silicone rubber composition for high-voltage electrical insulator, sealing material for polymeric insulator, and repairing material for polymeric insulator |
| CN101565600A (en) * | 2008-05-14 | 2009-10-28 | 广州市回天精细化工有限公司 | Low-hardness high-flexibility double-component condensed type organic silicon potting adhesive composition |
| CN101643583A (en) * | 2009-09-10 | 2010-02-10 | 合肥凯蒙新材料有限公司 | Dual composition addition type room temperature silicon disulfide rubber containing phase transformation material |
| CN104031604A (en) * | 2014-06-27 | 2014-09-10 | 上海回天新材料有限公司 | Organic silicon pouring sealant with thixotropy |
| CN107815286A (en) * | 2017-11-03 | 2018-03-20 | 航天特种材料及工艺技术研究所 | A kind of heat conduction embedding silica gel based on phase-change microcapsule and preparation method thereof |
| CN108130040A (en) * | 2017-12-27 | 2018-06-08 | 深圳航美新材料科技有限公司 | A kind of modified double components casting glue and preparation method thereof |
| CN109627773A (en) * | 2018-12-29 | 2019-04-16 | 湖北回天新材料股份有限公司 | A kind of single-component room-temperature-vulsilicone silicone rubber and preparation method |
| CN110564363A (en) * | 2019-09-23 | 2019-12-13 | 广州回天新材料有限公司 | low-viscosity high-heat-conductivity bonding pouring sealant and preparation method thereof |
-
2020
- 2020-03-30 CN CN202010236070.2A patent/CN111500253A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000136307A (en) * | 1998-08-24 | 2000-05-16 | Shin Etsu Chem Co Ltd | Silicone rubber composition for high-voltage electrical insulator, sealing material for polymeric insulator, and repairing material for polymeric insulator |
| CN101565600A (en) * | 2008-05-14 | 2009-10-28 | 广州市回天精细化工有限公司 | Low-hardness high-flexibility double-component condensed type organic silicon potting adhesive composition |
| CN101643583A (en) * | 2009-09-10 | 2010-02-10 | 合肥凯蒙新材料有限公司 | Dual composition addition type room temperature silicon disulfide rubber containing phase transformation material |
| CN104031604A (en) * | 2014-06-27 | 2014-09-10 | 上海回天新材料有限公司 | Organic silicon pouring sealant with thixotropy |
| CN107815286A (en) * | 2017-11-03 | 2018-03-20 | 航天特种材料及工艺技术研究所 | A kind of heat conduction embedding silica gel based on phase-change microcapsule and preparation method thereof |
| CN108130040A (en) * | 2017-12-27 | 2018-06-08 | 深圳航美新材料科技有限公司 | A kind of modified double components casting glue and preparation method thereof |
| CN109627773A (en) * | 2018-12-29 | 2019-04-16 | 湖北回天新材料股份有限公司 | A kind of single-component room-temperature-vulsilicone silicone rubber and preparation method |
| CN110564363A (en) * | 2019-09-23 | 2019-12-13 | 广州回天新材料有限公司 | low-viscosity high-heat-conductivity bonding pouring sealant and preparation method thereof |
Non-Patent Citations (4)
| Title |
|---|
| YI LI等: "Recent advances of conductive adhesives as a lead-free", 《MATERIALS SCIENCE AND ENGINEERING R》 * |
| 张万鲲 主编: "《电子信息材料手册》", 31 May 2001 * |
| 晏华 等: "石蜡微胶囊相变蓄热砂浆力学性能的影响因素研究", 《第七届中国功能材料及其应用学术会议论文集》 * |
| 汪多仁 等: "《绿色轻工助剂》", 28 February 2006 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112409942A (en) * | 2020-11-19 | 2021-02-26 | 杭州福斯特应用材料股份有限公司 | Heat dissipation type packaging adhesive film and preparation method thereof |
| CN112409942B (en) * | 2020-11-19 | 2022-05-31 | 杭州福斯特应用材料股份有限公司 | Heat dissipation type packaging adhesive film and preparation method thereof |
| CN112625452A (en) * | 2020-12-31 | 2021-04-09 | 南昌大学 | Phase change energy storage silicone grease gasket for electronic equipment and preparation method thereof |
| CN115433539A (en) * | 2022-09-15 | 2022-12-06 | 矽时代材料科技股份有限公司 | Phase-change latent heat organic silicon pouring sealant and preparation method thereof |
| CN117004231A (en) * | 2023-08-24 | 2023-11-07 | 常州宏巨电子科技有限公司 | Low-volatility quick-curing phase-change heat-conducting gasket and preparation method thereof |
| CN117004231B (en) * | 2023-08-24 | 2024-04-05 | 常州宏巨电子科技有限公司 | Low-volatility quick-curing phase-change heat-conducting gasket and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111500253A (en) | Organic silicon phase change pouring sealant for mobile phone charger and preparation method thereof | |
| CN111423842B (en) | Low-dielectric-constant organic silicon pouring sealant and preparation method thereof | |
| CN106634809B (en) | Anti-poisoning anti-settling high-bonding heat-conducting silica gel for packaging LED power supply | |
| CN109575860B (en) | low-temperature fast-curing conductive silver adhesive and preparation method thereof | |
| CN109705804B (en) | High enthalpy value phase-change silica gel gasket and preparation method thereof | |
| CN103436019A (en) | High-heat-conductivity electric-insulation heat-conducting silica gel gasket and preparation method thereof | |
| CN112280526A (en) | High-thermal-conductivity self-leveling modified ceramic liquid encapsulating material and preparation method thereof | |
| CN102093838A (en) | High-temperature cured two-component pouring sealant and preparation method thereof | |
| CN102952403A (en) | Additive organosilicon heat-conducting electronic potting adhesive and manufacturing method thereof | |
| CN112457817A (en) | Pouring sealant and preparation method thereof | |
| CN111269689A (en) | Flame-retardant, insulating and reliable pouring sealant based on phase-change microcapsules and preparation method thereof | |
| CN104178081B (en) | A kind of patch red glue | |
| CN112473579B (en) | Metal phase change microcapsule with thermal expansion cavity and preparation method thereof | |
| CN108912688A (en) | A kind of new energy car battery Embedding Material and preparation method thereof | |
| CN113698910A (en) | Low-specific-gravity deflagration-proof pouring sealant for new energy battery and preparation method thereof | |
| CN112029199A (en) | High enthalpy flame-retardant phase-change material and preparation method thereof | |
| CN105855748A (en) | Chip packaging die bonding tin paste and preparation method and using process thereof | |
| CN111518392A (en) | High-thermal-conductivity flame-retardant silicone gel and preparation method thereof | |
| CN113024164A (en) | Preparation method of single-component high-fluidity high-thermal-conductivity gel | |
| CN101307132B (en) | Epoxy resins modified by silanol hydroxyl or alkoxyl blocking silicone resin and method for preparing same | |
| CN115926474A (en) | Low-modulus high-elongation organic silicon heat-conducting gel | |
| CN111286307A (en) | Curable two-component heat-conducting heat-storing silicone gel | |
| CN113604190B (en) | Ultraviolet light curing type heat conduction pouring sealant and preparation method and application thereof | |
| CN114276686B (en) | High-mechanical-strength high-heat-conduction heat-dissipation silicone rubber gasket and preparation method thereof | |
| CN115785677A (en) | Single-component phase-change organic silicon heat-conducting gel and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200807 |