CN111312614A - Etching and spin-drying integrated machine table and spin-drying mechanism - Google Patents
Etching and spin-drying integrated machine table and spin-drying mechanism Download PDFInfo
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- CN111312614A CN111312614A CN201911196366.XA CN201911196366A CN111312614A CN 111312614 A CN111312614 A CN 111312614A CN 201911196366 A CN201911196366 A CN 201911196366A CN 111312614 A CN111312614 A CN 111312614A
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- 230000007246 mechanism Effects 0.000 title claims abstract description 128
- 238000001035 drying Methods 0.000 title claims abstract description 90
- 238000005530 etching Methods 0.000 title claims abstract description 19
- 238000006243 chemical reaction Methods 0.000 claims description 37
- 239000013078 crystal Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 abstract description 11
- 235000012431 wafers Nutrition 0.000 description 64
- 239000000126 substance Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 239000003814 drug Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000001960 triggered effect Effects 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010981 drying operation Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses an etching and spin-drying integrated machine table and a spin-drying mechanism. Firstly, a guide rail at the bottom of the spin-drying mechanism extends out of the fixed frame and is used for placing the wafer boat. And then the boat with the wafer is moved into the fixed frame together through the guide rail, and then the control mechanism, the guide rail, the fixed frame and the wafer boat positioned in the fixed frame rotate together through the work of the power mechanism, so that the residual liquid on the wafer is dried. Through mutually supporting of power unit, control mechanism, guide rail, mount will promote the efficiency of spin-drying of wafer by a wide margin, the scalable setting of guide rail will improve the conveying efficiency of brilliant boat simultaneously.
Description
Technical Field
The invention relates to the field of wafer processing equipment, in particular to an etching and spin-drying integrated machine table and a spin-drying mechanism.
Background
Wet etching is to etch the part of the material not covered by the photoresist by using chemical solution to etch the depth and pattern required by us. In this etching step, how to spin-dry the chemical solution from the wafer is also an important step. The existing steps of removing liquid medicine on the wafer and spin-drying are as follows: after the wafer boat is etched from the chemical liquid tank, the wafer boat is grabbed to the output end by a mechanical arm, and then an operator opens a machine table door and takes the wafer boat to a spin dryer for spin drying and cleaning. In the process of implementing the invention, the inventor finds that the following problems exist in the prior art: if the operator is not present, the wafer cannot be cleaned and dried in time. An operator holds the wet wafer boat by hand, on one hand, the wafer boat is slippery due to wetting, and the wafer breakage accident is easily caused; on the other hand, when the operator directly holds the boat with hands, some chemical liquid medicine may exist on the surface, which is dangerous for the personal safety of the operator. Meanwhile, the operation needs longer time and has lower efficiency.
Disclosure of Invention
Therefore, an etching and spin-drying integrated machine table and a spin-drying mechanism are needed to avoid the situations that wafers are broken and chemical liquid medicine hurts human bodies when crystal boats are manually grabbed; and the process efficiency is improved.
To achieve the above object, the inventor provides a spin-drying mechanism comprising: a power mechanism, a control mechanism, a guide rail and a fixing frame;
the power mechanism is connected with the control mechanism and used for providing power;
the fixing frame is arranged on one side of the control mechanism and used for fixing the position of the wafer boat, and a hole for accommodating the wafer boat is further formed in the fixing frame; the guide rail is arranged on one side of the control mechanism in a telescopic mode, is in sliding connection with the fixing frame and is used for placing the wafer boat.
Further, still include: the arm rod is provided with a handle,
the arm rod is arranged on the control mechanism in a telescopic and rotatable manner; and a clamping plate is further arranged at one end of the arm rod, which is far away from the control mechanism, and is used for fixing the wafer boat.
Further, the arm lever further includes: and the soft film is used for adhering and firmly holding the crystal boat.
Furthermore, the guide rail is two guide rail rods, the distance between the two guide rail rods is the distance between the bottom support parts of the wafer boat, and the guide rail rods are respectively used for accommodating the two support parts at the bottom of the wafer boat.
Further, still include: a first sensor; the first sensor is arranged on one side, close to the fixed frame, of the spin-drying mechanism and used for sensing position signals of the crystal boat, and when the guide rail extends out, the first sensor is located above the first sensor.
Further, still include: a second sensor; the second sensor is arranged on the guide rail and used for sensing position signals of the crystal boat.
Further, still include: a dryer door; the drying machine door is arranged on the fixing frame in a lifting mode.
The inventor provides an etching and integrative board of spin-drying, includes: the invention provides a spin-drying mechanism, a machine arm and a chemical reaction tank in any embodiment;
the chemical reaction tank is arranged on one side of the spin-drying mechanism, and the machine arm is arranged on one side of the chemical reaction tank and used for conveying and grabbing the wafer boat.
Further, still include: the device comprises a loading end, an output end, a first shutter and a second shutter;
the loading end is arranged on one side of the chemical reaction tank, which is far away from the spin-drying mechanism, the output end is arranged on the side of the spin-drying mechanism, which is far away from the chemical reaction tank, and the chemical reaction tank, the loading end and the output end are positioned on the same horizontal line;
the first shutter is arranged between the loading end and the chemical reaction tank and used for separating the loading end from the chemical reaction tank, and the second shutter is arranged between the spin-drying mechanism and the chemical reaction tank and used for separating the spin-drying mechanism from the chemical reaction tank.
Further, still include: a controller; the controller is connected with the etching and spin-drying integrated machine table and is used for executing the following method steps:
driving the machine arm to grab the wafer boat to the chemical reaction tank;
driving the machine arm to grab the wafer boat in the chemical reaction tank after the process is finished and move to the position above the first sensor;
the controller receives a first sensor signal and drives the spin dryer door to open;
driving the guide rail to extend out, and driving the machine table arm to place the wafer boat on the guide rail;
the controller receives a second sensor signal to drive the arm rod to extend out, and then the arm rod is driven to rotate;
the driving arm rod and the guide rail extend into the spin-drying mechanism together and drive the spin-drying machine door to close;
the driving power mechanism works;
the arm rod and the guide rail are driven to extend out, the machine table arm is driven to grab the wafer boat, and the wafer boat is moved out of the spin-drying mechanism.
Different from the prior art, the technical scheme realizes the spin-drying of the wafer through the mutual matching of the power mechanism, the control mechanism, the guide rail and the fixing frame. In actual operation, firstly, the guide rail at the bottom of the spin-drying mechanism extends out of the fixed frame and is used for placing the crystal boat. It should be noted that the guide rail may be a plate telescopically arranged on the control mechanism, or may be another container capable of accommodating the boat; meanwhile, the length of the guide rail is greater than the thickness of the fixing frame, is less than or equal to the thickness of the control mechanism plus the thickness of the fixing frame, and the crystal boat can be stably placed on the guide rail, so that the distance that the guide rail can extend out is the length in the control mechanism; specifically, when the wafer boat needs to be placed, the guide rail extends out of the fixing frame and is used for placing the wafer boat. And then, the boat with the wafer is moved into the fixing frame together through the guide rail, wherein the fixing frame is used for fixing and limiting the position of the boat, so that the boat cannot shake relative to the fixing frame when being dried. And then the wafer boat rotates together with the control mechanism, the guide rail, the fixing frame and the wafer boat positioned in the fixing frame through the work of the power mechanism, so that the residual liquid on the wafer is dried. Through mutually supporting of power unit, control mechanism, guide rail, mount will promote the efficiency of spin-drying of wafer by a wide margin, the scalable setting of guide rail will improve the conveying efficiency of brilliant boat simultaneously.
Drawings
FIG. 1 is a structural view of a guide rail extending spin-drying mechanism;
FIG. 2 is a view showing a structure in which a boat is placed as a guide rail;
FIG. 3 is a structural view of the arm lever extending spin-drying mechanism;
FIG. 4 is a diagram illustrating a structure of the engagement between the arm and the boat;
FIG. 5 is a structural diagram of the boat placed in the spin-drying mechanism;
FIG. 6 is a diagram of a machine with integrated etching and spin-drying functions;
FIG. 7 is a block diagram of an arm lever;
fig. 8 is a structural view of the rail bar.
Description of reference numerals:
1. a spin-drying mechanism;
101. a power mechanism;
102. a control mechanism;
103. a guide rail;
104. a fixed mount;
105. an arm lever;
1051. clamping a plate;
1052. a soft film;
106. a first sensor;
107. a second sensor;
108. a dryer door;
2. a machine arm;
3. a chemical reaction tank;
4. a loading end;
5. an output end;
6. a first shutter;
7. a second shutter;
8. a wafer boat;
801. a support portion.
Detailed Description
To explain technical contents, structural features, and objects and effects of the technical solutions in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 to 5, in the present embodiment, the inventor provides a spin-drying mechanism, including: a power mechanism 101, a control mechanism 102, a guide rail 103 and a fixing frame 104; the power mechanism 101 is connected with the control mechanism 102 and used for providing power; the fixing frame 104 is arranged on one side of the control mechanism 102 and used for fixing the position of the wafer boat 8, and the fixing frame 104 is further provided with a hole for accommodating the wafer boat 8; the guide rail 103 is telescopically arranged on one side of the control mechanism 102, and is slidably connected with the fixing frame 104 for placing the boat 8. According to the technical scheme, the wafer is dried through the mutual matching of the power mechanism 101, the control mechanism 102, the guide rail 103 and the fixing frame 104. In actual operation, the guide rail 103 at the bottom of the spin-drying mechanism 1 is connected with the fixing frame 104 in a sliding manner, and the guide rail 103 extends out of the fixing frame 104 for placing the boat 8. It should be noted that the guide rail 103 may be a plate telescopically disposed on the control mechanism 102, or may be another container capable of accommodating the boat 8; meanwhile, the length of the guide rail 103 should be greater than the thickness of the fixing frame 104, and less than or equal to the thickness of the control mechanism 102 plus the thickness of the fixing frame 104, and the boat 8 can be stably placed on the guide rail 103, so that the distance that the guide rail 103 can extend out is the length in the control mechanism 102; specifically, when the boat 8 needs to be placed, the guide rail 103 extends out of the fixing frame 104 for placing the boat 8. When the boat 8 is not in use, one end of the guide rail 103 far away from the control mechanism 102 is flush with the fixed frame 104. When the wafer boat 8 is moved thereon by other mechanisms or manually, the wafer boat 8 is then moved into the fixing frame 104 together via the guide rail 103 until the end of the guide rail 103 away from the control mechanism 102 is flush with the fixing frame 104. It should be noted that the fixing frame 104 is used for fixing and limiting the position of the boat 8, so that the boat 8 does not shake relative to the fixing frame 104 during spin-drying, specifically, the fixing frame 104 is provided with a hole for accommodating the boat 8, the hole corresponds to the size and shape of the boat 8, when the guide rail 103 with the boat 8 retracts into the fixing frame 104, the boat 8 is just embedded into the fixing frame 104, and it is further ensured that the boat 8 does not move relative to the spin-drying mechanism 1 during spin-drying, thereby avoiding damage to the wafer. Then, by the operation of the power mechanism 101, the control mechanism 102, the guide rail 103, the fixing frame 104 and the boat 8 in the fixing frame 104 will rotate together to spin-dry the liquid remaining on the wafer. The power mechanism 101 may be a motor directly connected to the control mechanism 102. The wafer drying efficiency is greatly improved through the mutual matching of the power mechanism 101, the control mechanism 102, the guide rail 103 and the fixing frame 104, and meanwhile, the transportation efficiency of the wafer boat 8 is further improved through the telescopic arrangement of the guide rail 103.
Referring to fig. 2 to 4, in the present embodiment, the spin-drying mechanism further includes: the arm lever 105 is telescopically and rotatably arranged on the control mechanism 102; referring to fig. 7, a clamping plate 1051 is further disposed on an end of the arm lever 105 away from the control mechanism 102 for fixing the boat 8. After the boat 8 is stably placed on the guide rail 103, the arm lever 105 extends out of the fixed frame 104 until the clamping plate 1051 reaches the end of the boat 8, and then the arm lever 105 rotates, so that the clamping plate 1051 is originally arranged outwards, rotates towards the boat 8 to the rear of the boat 8, and moves the boat 8 into the fixed frame 104 together with the guide rail 103. The arm lever 105 and the chucking plate 1051 further assist in fixing and moving the boat 8, and do not contact the boat 8 when the chucking plate 1051 is disposed outward. Meanwhile, the arm bar 105 further includes: a soft film 1052, wherein the soft film 1052 is used for attaching and holding the crystal boat 8. Referring to fig. 2 to 4 and fig. 7, the soft film 1052 is disposed in the same direction as the chuck plate 1051, specifically, when the arm lever 105 extends, the soft film 1052 and the chuck plate 1051 are disposed outward together without contacting with the wafer boat 8, and then rotated by the arm lever 105, so as to drive the soft film 1052 and the chuck plate 1051 to rotate together in the direction of the wafer boat 8 until being engaged with the wafer boat 8, so as to fix the wafer boat 8, and further ensure that the wafer boat 8 does not move relative to the spin-drying mechanism 1 during spin-drying, thereby avoiding damage to the wafer.
Referring to fig. 8, in the present embodiment, the guide rail 103 is two guide rail rods, the distance between the two guide rail rods is the distance between the bottom support portions 801 of the wafer boat 8, and the guide rail rods are respectively used for accommodating the two support portions 801 at the bottom of the wafer boat 8. It should be noted that, referring to fig. 4, the two guide rails correspond to the supporting portions 801 at the bottom of the wafer boat 8, when the wafer boat 8 is moved onto the supporting portions 801 by other mechanisms or manually, the two supporting portions 801 at the bottom of the wafer boat 8 are placed on the two guide rails, respectively, and when the guide rails move towards the fixing frame 104, the wafer boat 8 moves towards the fixing frame 104 together with the guide rails. The telescopic arrangement of the guide rail 103 further improves the transportation efficiency of the boat 8, and saves the production and manufacturing cost.
Referring to fig. 6, in the present embodiment, the spin-drying mechanism further includes: a first sensor 106; the first sensor 106 is disposed on a side of the spin-drying mechanism close to the fixing frame 104, and is configured to sense a position signal of the boat 8, and is located above the first sensor 106 when the guide rail 103 extends out. The first sensor 106 is used for sensing the position of the boat 8, when the boat 8 is conveyed to the position above the first sensor 106 by an external machine or manually, the first sensor 106 senses the boat 8, and then the guide rail 103 is extended to receive the boat 8. It should be noted that the height of the sensing area of the first sensor 106 is matched with the height of the spin-drying mechanism 1. When the boat 8 is higher than the spin-drying mechanism 1, the first sensor 106 cannot sense the position of the boat 8, and the guide rail 103 cannot work; on the contrary, when the boat 8 is at the height of the spin-dry mechanism 1, the first sensor 106 senses the position of the boat 8, and the guide rail 103 extends to receive the boat 8. The arrangement of the first sensor 106 greatly increases the degree of mechanization of the apparatus, and also increases the efficiency of the wafer manufacturing process.
Referring to fig. 8, in the present embodiment, the spin-drying mechanism further includes: a second sensor 107; the second sensor 107 is disposed on the guide rail 103 and is configured to sense a position signal of the boat 8. The second sensor 107 is used for sensing the position of the boat 8, when the boat 8 is transported onto the guide rail 103 by an external machine or manually, the second sensor 107 senses the boat 8, and then the guide rail 103 is retracted into the fixing frame 104. It should be noted that when the boat 8 is placed on the guide rail 103 and the second sensor 107 senses the position of the boat 8, the guide rail 103 is retracted, and the boat 8 is carried into the fixing frame 104. On the contrary, when the second sensor 107 does not sense the position of the boat 8, the guide rail 103 is not retracted. The second sensor 107 can greatly improve the mechanization of the apparatus, and improve the mechanization and process efficiency.
Referring to fig. 6, in the present embodiment, the spin-drying mechanism further includes: a dryer door 108; the dryer door 108 is arranged on the fixing frame 104 in a lifting manner. The dryer door 108 is of the lift type and is controlled by the first sensor 106. When the first sensor 106 is activated, the dryer door 108 opens. The guide rail 103 in the spin drying mechanism 1 can freely extend. And a position sensor is installed at the top end of the dryer door 108, so that when an external mechanism grabs the boat 8 to the upper end, the position state of the external connecting mechanism can be sensed. The arrangement of the dryer door 108 will protect the personal safety of the operator while preventing damage to the drying mechanism 1 from external mechanisms.
With the above embodiment, the spin-drying mechanism 1 is composed of the fixed frame 104, two arm bars 105, and two guide rail bars. The fixing frame 104 is used for clamping the position of the wafer boat 8, the position of the fixing frame is consistent with the position of the wafer boat 8 extending into the fixing frame, the fixing frame plays a role in fixing, and the two arm rods 105 and the two guide rail rods are controlled by the control mechanism 102 and can flexibly extend and retract. When an external mechanism or a manual work grabs the boat 8 to the position above the first sensor 106, the position is triggered to sense, the drying machine door 108 is opened, the two guide rail rods extend out of the inside of the drying mechanism 1, then the external mechanism or the manual work places the boat 8 on the guide rails, so that the second sensor 107 on the guide rails is triggered, the two arm rods 105 above the drying mechanism 1 extend out, and after the boat reaches a certain position, the arm rods 105 rotate angularly to clamp the boat 8 at one end with the clamping plate 1051. Then the four rods simultaneously extend into the interior of the spin dryer, and the door automatically rises and closes. The power mechanism 101 drives the equipment to rotate and clean.
Referring to fig. 6, in the present embodiment, an etching and spin-drying integrated machine is provided, including: a spin-drying mechanism 1, a machine arm 2 and a chemical reaction tank 3; the chemical reaction tank 3 is arranged on one side of the spin-drying mechanism 1, and the machine arm 2 is arranged on one side of the chemical reaction tank 3 and used for conveying and grabbing the crystal boat 8. The chemical reaction tank 3 includes a plurality of chemical agent tanks, water tanks, and the like. It should be noted that the machine arm 2 is a mechanical arm and is responsible for moving the wafer boat 8. In this embodiment, the etching and spin-drying integrated machine further includes: the device comprises a loading end 4, an output end 5, a first shutter 6 and a second shutter 7; the carrying-in end 4 is arranged on one side of the chemical reaction tank 3, which is far away from the spin-drying mechanism 1, the output end 5 is arranged on the spin-drying mechanism 1, which is far away from the chemical reaction tank 3, and the chemical reaction tank 3, the carrying-in end 4 and the output end 5 are positioned on the same horizontal line; the first shutter 6 is arranged between the loading end 4 and the chemical reaction tank 3 and used for separating the loading end 4 from the chemical reaction tank 3, and the second shutter 7 is arranged between the spin-drying mechanism 1 and the chemical reaction tank 3 and used for separating the spin-drying mechanism 1 from the chemical reaction tank 3. It should be noted that the etching and spin-drying integrated machine further comprises a housing, and the loading end 4, the first shutter 6, the chemical reaction tank 3, the second shutter 7, the first sensor 106, and the output end 5 are sequentially disposed in the housing. The machine arm 2 is arranged on one side of the shell, the shell is further provided with a hole for conveying the crystal boat 8 into the spin-drying mechanism 1, and the hole is formed in one side, close to the spin-drying mechanism 1, of the first sensor 106. An etching and integrative board that spin-dries still includes: a controller; the controller is connected with the etching and spin-drying integrated machine, during actual operation, the wafer boat 8 is placed at the loading end 4, parameters of the machine are selected, the manufacturing process is started, and the controller drives the first shutter 6 to open. The controller drives the machine arm 2 to grab the wafer boat 8 and move the wafer boat to the chemical liquid and the water tank for etching. After the chemical tank etching is finished, the controller drives the second shutter 7 to open, and simultaneously drives the machine arm 2 to grab the wafer boat 8 to the second shutter 7. The position sensor at the upper end of the spin dryer door 108 and the first sensor 106 sense the crystal boat 8, the spin dryer door 108 automatically descends, the guide rail 103 at the lower end in the spin dryer mechanism 1 extends out, and the machine arm 2 places the crystal boat 8 on the guide rail 103. The second sensor 107 on the guide rail 103 senses the crystal boat 8, the two arm rods 105 at the upper end in the spin-drying mechanism 1 extend out, then the crystal boat 8 is clamped by the rotation angles of the arm rods 105, after the crystal boat 8 is firmly grabbed, the arm rods 105 and the guide rail rods extend into the spin-drying mechanism 1 together, the spin-drying machine door 108 is automatically closed, and the crystal boat 8 rotates and is cleaned. After the spin-drying is completed, the spin-dryer door 108 is automatically opened, and the wafer boat 8 is conveyed out by the arm rods 105 and the guide rail rods. The machine arm 2 takes the goods to the output end 5. The invention designs a machine platform integrating an etching tank and a spin-drying mechanism, namely wafers are conveyed to an induction area after the operation of a chemical liquid tank, a water tank and the like is finished, and then the wafers are grabbed by an arm and automatically stretched into the spin-drying mechanism 1 for spin-drying operation, so that the automation of the machine platform can be realized without manual operation in the process. The chemical liquid tank and the drying machine are integrated, so that personnel are not required to transfer, and dangerous factors are reduced. The risk of direct contact of personnel with chemical liquid medicine is reduced, and the safety is higher. Meanwhile, the operation time of personnel is shortened, the machine is automatic, and the efficiency is improved.
It should be noted that, although the above embodiments have been described herein, the invention is not limited thereto. Therefore, based on the innovative concepts of the present invention, the technical solutions of the present invention can be directly or indirectly applied to other related technical fields by making changes and modifications to the embodiments described herein, or by using equivalent structures or equivalent processes performed in the content of the present specification and the attached drawings, which are included in the scope of the present invention.
Claims (10)
1. A spin-drying mechanism, comprising: a power mechanism, a control mechanism, a guide rail and a fixing frame;
the power mechanism is connected with the control mechanism and used for providing power;
the fixing frame is arranged on one side of the control mechanism and used for fixing the position of the wafer boat, and a hole for accommodating the wafer boat is further formed in the fixing frame; the guide rail is arranged on one side of the control mechanism in a telescopic mode, is in sliding connection with the fixing frame and is used for placing the wafer boat.
2. The spin mechanism of claim 1, further comprising: the arm rod is provided with a handle,
the arm rod is arranged on the control mechanism in a telescopic and rotatable manner; and a clamping plate is further arranged at one end of the arm rod, which is far away from the control mechanism, and is used for fixing the wafer boat.
3. The spin mechanism of claim 2, wherein the arm lever further comprises: and the soft film is used for adhering and firmly holding the crystal boat.
4. The spin drying mechanism according to claim 1, wherein the guide rail is two guide rail rods, the distance between the two guide rail rods is the distance between the two support parts at the bottom of the wafer boat, and the two guide rail rods are respectively used for accommodating the two support parts at the bottom of the wafer boat.
5. The spin mechanism of claim 1, further comprising: a first sensor; the first sensor is arranged on one side, close to the fixed frame, of the spin-drying mechanism and used for sensing position signals of the crystal boat, and when the guide rail extends out, the first sensor is located above the first sensor.
6. The spin mechanism of claim 1, further comprising: a second sensor; the second sensor is arranged on the guide rail and used for sensing position signals of the crystal boat.
7. The spin mechanism of claim 5, further comprising: a dryer door; the drying machine door is arranged on the fixing frame in a lifting mode.
8. The utility model provides an etching and integrative machine that spin-dries which characterized in that includes: a spin-drying mechanism, a machine arm, a chemical reaction tank, as claimed in any one of claims 1 to 7;
the chemical reaction tank is arranged on one side of the spin-drying mechanism, and the machine arm is arranged on one side of the chemical reaction tank and used for conveying and grabbing the wafer boat.
9. The integrated machine of claim 8, further comprising: the device comprises a loading end, an output end, a first shutter and a second shutter;
the loading end is arranged on one side of the chemical reaction tank, which is far away from the spin-drying mechanism, the output end is arranged on the side of the spin-drying mechanism, which is far away from the chemical reaction tank, and the chemical reaction tank, the loading end and the output end are positioned on the same horizontal line;
the first shutter is arranged between the loading end and the chemical reaction tank and used for separating the loading end from the chemical reaction tank, and the second shutter is arranged between the spin-drying mechanism and the chemical reaction tank and used for separating the spin-drying mechanism from the chemical reaction tank.
10. The integrated machine of claim 8, further comprising: a controller; the controller is connected with the etching and spin-drying integrated machine table and is used for executing the following method steps:
driving the machine arm to grab the wafer boat to the chemical reaction tank;
driving the machine arm to grab the wafer boat in the chemical reaction tank after the process is finished and move to the position above the first sensor;
the controller receives a first sensor signal and drives the spin dryer door to open;
driving the guide rail to extend out, and driving the machine table arm to place the wafer boat on the guide rail;
the controller receives a second sensor signal to drive the arm rod to extend out, and then the arm rod is driven to rotate;
the driving arm rod and the guide rail extend into the spin-drying mechanism together and drive the spin-drying machine door to close;
the driving power mechanism works;
the arm rod and the guide rail are driven to extend out, the machine table arm is driven to grab the wafer boat, and the wafer boat is moved out of the spin-drying mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911196366.XA CN111312614A (en) | 2019-11-29 | 2019-11-29 | Etching and spin-drying integrated machine table and spin-drying mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911196366.XA CN111312614A (en) | 2019-11-29 | 2019-11-29 | Etching and spin-drying integrated machine table and spin-drying mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111312614A true CN111312614A (en) | 2020-06-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911196366.XA Pending CN111312614A (en) | 2019-11-29 | 2019-11-29 | Etching and spin-drying integrated machine table and spin-drying mechanism |
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| Country | Link |
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| CN (1) | CN111312614A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112885750A (en) * | 2021-02-09 | 2021-06-01 | 江苏亚电科技有限公司 | Spin-drying equipment for wafer cleaning |
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| CN210925955U (en) * | 2019-11-29 | 2020-07-03 | 福建省福联集成电路有限公司 | Etching and spin-drying integrated machine table and spin-drying mechanism |
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| CN209029348U (en) * | 2018-11-20 | 2019-06-25 | 冠礼控制科技（上海）有限公司 | A kind of gaily decorated basket and wafer for wet process equipment automatically transports transmission mechanism |
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| CN112885750A (en) * | 2021-02-09 | 2021-06-01 | 江苏亚电科技有限公司 | Spin-drying equipment for wafer cleaning |
| CN112885750B (en) * | 2021-02-09 | 2022-04-22 | 江苏亚电科技有限公司 | Spin-drying equipment for wafer cleaning |
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