CN112885750B - Spin-drying equipment for wafer cleaning - Google Patents
Spin-drying equipment for wafer cleaning Download PDFInfo
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- CN112885750B CN112885750B CN202110173368.8A CN202110173368A CN112885750B CN 112885750 B CN112885750 B CN 112885750B CN 202110173368 A CN202110173368 A CN 202110173368A CN 112885750 B CN112885750 B CN 112885750B
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- 238000001035 drying Methods 0.000 title claims abstract description 89
- 238000004140 cleaning Methods 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000005096 rolling process Methods 0.000 claims abstract description 6
- 238000007493 shaping process Methods 0.000 claims description 6
- 230000001360 synchronised effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 63
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention belongs to the field of wafer production, and particularly relates to spin-drying equipment for wafer cleaning, which comprises a machine body, a drainage tank, a spin-drying machine door, a door handle, a door body control mechanism, a spin-drying driving mechanism and a wafer fixing mechanism, wherein the wafer fixing mechanism comprises a fixed frame, a water outlet, sliding grooves, a movable bottom plate, rolling wheels, a bottom plate push rod and a front baffle plate, the sliding grooves are arranged on two sides of the lower inner part of the fixed frame, the water outlet is arranged on the side wall and the top of the fixed frame, the movable bottom plate is arranged between the sliding grooves, and the rolling wheels are arranged on two sides of the movable bottom plate. According to the wafer fixing mechanism with the extendable base plate, disclosed by the invention, when a wafer needs to be placed, the base plate is extended, and at the moment, the wafer tray is placed on the base plate from top to bottom, so that the wafer tray is placed into the spin-drying device without extending an arm, the collision risk of the wafer is reduced, and the production yield is improved.
Description
Technical Field
The invention belongs to the field of wafer production, and particularly relates to spin-drying equipment for wafer cleaning.
Background
The wafer needs to undergo cleaning and spin-drying during the production process. The spin-drying equipment for wafers on the market at present needs manpower to stretch the wafer tray into the machine body for placing due to the large size of the spin-drying equipment, the wafer quality is large, and the wafer is damaged and the yield is influenced due to the fact that the wafer tray is collided when the wafer tray is placed.
Disclosure of Invention
The invention aims to provide a spin-drying device for wafer cleaning.
The technical scheme adopted by the invention is as follows:
the spin-drying equipment for wafer cleaning comprises a machine body, a drainage tank, a spin-drying machine door, a door handle, a door body control mechanism, a spin-drying driving mechanism and a wafer fixing mechanism, wherein the wafer fixing mechanism comprises a fixed frame, water draining holes, sliding grooves, a movable bottom plate, rolling wheels, a bottom plate push rod and a front baffle plate, the sliding grooves are formed in two sides of the inner portion below the fixed frame, the water draining holes are formed in the side wall and the top of the fixed frame, the movable bottom plate is arranged between the sliding grooves, the rolling wheels are arranged on two sides of the movable bottom plate, the bottom plate push rod is arranged on one side of the fixed frame, and the front baffle plate is arranged in front of the movable bottom plate.
Preferably: the drainage groove is arranged below the inner portion of the machine body, the spin dryer door is arranged in front of the machine body, and the door handle is arranged on one side in front of the spin dryer door.
Preferably: the fixed frame below shaping has the spout, the last shaping of fixed frame has the outlet, the gyro wheel with the activity bottom plate passes through the bearing and connects, the bottom plate push rod with spout roll connection, the fixed part of bottom plate push rod with fixed frame passes through bolted connection, preceding baffle with the activity bottom plate passes through bolted connection, the pars contractilis of bottom plate push rod with preceding baffle passes through bolted connection.
Preferably: the drainage groove is formed below the machine body, and the spin dryer door is connected with the door handle through a bolt.
Preferably: the door body control mechanism comprises a hinge, a push rod fixing seat, a door body push rod, a door body rotating shaft and a telescopic portion fixing seat, wherein the hinge is arranged on the machine body and one side of the spin dryer door, the push rod fixing seat is arranged at the bottom of the inner side of the machine body, a fixing portion of the door body push rod is arranged above the push rod fixing seat, the door body rotating shaft is arranged on one side of the telescopic portion of the door body push rod, the telescopic portion fixing seat is arranged at the rear portion of the spin dryer door, and the door body rotating shaft is arranged on the inner side of the telescopic portion fixing seat.
Preferably: the hinge with the organism passes through bolted connection, the hinge with the spin dryer door passes through bolted connection, the push rod fixing base with the organism passes through bolted connection, the fixed part of door body push rod with the push rod fixing base passes through the bearing and connects, door body pivot shaping is in on the pars contractilis of door body push rod, pars contractilis fixing base with the spin dryer door passes through bolted connection, door body pivot with the pars contractilis fixing base passes through the bearing and connects.
Preferably: the door body control mechanism comprises a machine body rotating shaft fixing seat, a door body long rotating shaft, a door body connecting seat, a door body motor, a door body driving gear and a door body driven gear, the machine body rotating shaft fixing seat is arranged on one side outside the machine body, the door body long rotating shaft is arranged on the inner side of the machine body rotating shaft fixing seat, the door body connecting seat is arranged on one side of the spin dryer door, the machine body rotating shaft fixing seat is arranged above the machine body rotating shaft, the door body motor is arranged on one side of the machine body, the rear portion of the door body connecting seat is arranged on the other side of the machine body, the door body driving gear is arranged on the outer side of an output shaft of the door body motor, and the door body driven gear is arranged in front of the door body driving gear and outside the door body long rotating shaft.
Preferably: the machine body rotating shaft fixing seat is connected with the machine body through a bolt, the door body long rotating shaft is connected with the machine body rotating shaft fixing seat through a bearing, the door body connecting seat is connected with the spin dryer door through a bolt, the door body long rotating shaft is connected with the door body connecting seat through a bolt, the door body motor is connected with the machine body through a bolt, the door body driving gear is connected with an output shaft key of the door body motor, the door body driven gear is meshed with the door body driving gear, and the door body driven gear is formed in the door body long rotating shaft.
Preferably: the spin-drying driving mechanism comprises a main shaft sleeve, a main shaft, a spin-drying driven gear, a spin-drying driving gear and a spin-drying motor, the main shaft sleeve is arranged at the rear part of the inner side of the machine body, the main shaft is arranged on the inner side of the main shaft sleeve, the spin-drying driven gear is arranged on the outer side of the front of the main shaft, the fixed frame is arranged in the front of the main shaft, the spin-drying driving gear is arranged below the spin-drying driven gear, and the spin-drying motor is arranged behind the spin-drying driving gear.
Preferably: the main shaft sleeve is connected with the machine body through a bolt, the main shaft is connected with the main shaft sleeve through a bearing, the spin-drying driven gear is connected with the main shaft through a key, the fixed frame is connected with the main shaft through a bolt, the spin-drying driving gear is meshed with the spin-drying driven gear, and the spin-drying motor is connected with the spin-drying driving gear through a bolt.
In the structure, when a wafer needs to be dried, the door body push rod is stretched to drive the drying machine door to be opened outwards through rotation of the rotating shaft of the hinge, the wafer fixing mechanism is internally provided with the bottom plate push rod which is stretched to drive the front baffle, the movable bottom plate and the roller wheel to move forwards, the rear half part of the movable bottom plate is kept in the fixed frame, the wafer tray containing the wafer is placed above the movable bottom plate, then the bottom plate push rod is contracted to drive the movable bottom plate, the front baffle, the roller wheel and the wafer above the movable bottom plate to move backwards, the bottom plate push rod stops contracting after the wafer tray moves to a specified position, the door body push rod contracts to drive the drying machine door to rotate along the rotating shaft of the hinge to close the machine body, and then the drying motor rotates to drive the driving gear, the drying motor, The spin-drying driven gear and the main shaft synchronously rotate, and the main shaft drives the wafer fixing mechanism to rotate and spin-dry the wafer in the wafer fixing mechanism by using centrifugal force.
The invention has the beneficial effects that: the wafer fixing mechanism with the stretchable bottom plate is adopted, when a wafer needs to be placed, the bottom plate stretches out, the wafer tray is placed on the bottom plate from top to bottom at the moment, the wafer tray is not required to be placed in the spin-drying device through stretching out the arm, the collision risk of the wafer is reduced, and the production yield is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a perspective view of an embodiment 1 of a spin-drying apparatus for wafer cleaning according to the present invention;
FIG. 2 is a perspective view of an embodiment 2 of a spin-drying apparatus for wafer cleaning according to the present invention;
FIG. 3 is a schematic view of the internal structure of an embodiment 1 of a spin-drying apparatus for wafer cleaning according to the present invention;
FIG. 4 is a schematic internal structural view of an embodiment 2 of a spin-drying apparatus for wafer cleaning according to the present invention;
FIG. 5 is a schematic structural diagram of a door body control mechanism 1 of a spin-drying device for wafer cleaning according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a door body control mechanism 2 of a spin-drying device for wafer cleaning according to an embodiment of the present invention;
FIG. 7 is an exploded view of a wafer holding mechanism of a spin drying apparatus for cleaning wafers according to the present invention;
FIG. 8 is a schematic diagram of the spin-drying driving mechanism of the spin-drying apparatus for wafer cleaning according to the present invention.
The reference numerals are explained below:
1. a body; 2. a water discharge tank; 3. a dryer door; 4. a door handle; 5. a door body control mechanism; 51. a hinge; 52. a push rod fixing seat; 53. a door body push rod; 54. a door body rotating shaft; 55. a telescopic part fixing seat; 511. a machine body rotating shaft fixing seat; 512. a long rotating shaft of the door body; 513. a door body connecting seat; 514. a door motor; 515. a door body driving gear; 516. a door body driven gear; 6. a wafer fixing mechanism; 61. a fixed frame; 62. a water drain hole; 63. a chute; 64. a movable bottom plate; 65. a roller; 66. a bottom plate push rod; 67. a front baffle; 7. a spin-drying driving mechanism; 71. a main shaft sleeve; 72. a main shaft; 73. the driven gear is dried; 74. drying the driving gear; 75. a drying motor.
Detailed Description
The invention is further illustrated by the following examples in conjunction with the accompanying drawings.
Example 1
As shown in fig. 1, 3, 5, 7, 8, a spin-drying device for wafer cleaning comprises a machine body 1, a drainage channel 2, a spin-drying machine door 3, a door handle 4, a door body control mechanism 5, a spin-drying driving mechanism 7, and a wafer fixing mechanism 6, wherein the wafer fixing mechanism 6 comprises a fixed frame 61, drain holes 62, a chute 63, a movable bottom plate 64, rollers 65, a bottom plate push rod 66, and a front baffle plate 67, the chute 63 is arranged on two sides of the lower inner portion of the fixed frame 61, the drain holes 62 are arranged on the side wall and the top of the fixed frame 61, the movable bottom plate 64 is arranged between the chute 63, the rollers 65 are arranged on two sides of the movable bottom plate 64, the bottom plate push rod 66 is arranged on one side of the fixed frame 61, the front baffle plate 67 is arranged in front of the movable bottom plate 64, the drain holes 62 are used for draining water on a wafer when the wafer fixing mechanism 6 rotates, the chute 63 is used for enabling the rollers 65 on two sides of the movable bottom plate 64 to move in the chute 63, so that the movable bottom plate 64 can move forwards Or move backwards, the front baffle 67 is used for connecting the movable bottom plate 64 and the telescopic part of the roller 65 and simultaneously plays a role of fixing the wafer tray, and the bottom plate push rod 66 is used for controlling the front baffle 67 to move forwards and backwards so as to control the movable bottom plate 64 to move forwards and backwards;
a drainage channel 2 is arranged below the inner part of the machine body 1, a spin dryer door 3 is arranged in front of the machine body 1, a door handle 4 is arranged on one side in front of the spin dryer door 3, the door handle 3 is used for opening or closing the machine body 1, and the door handle 4 is used for manually opening or closing the spin dryer door 3 when the door body control mechanism 5 fails;
the door body control mechanism 5 comprises a hinge 51, a push rod fixing seat 52 and a door body push rod 53, the door body rotating shaft 54 and the telescopic part fixing seat 55 are respectively provided with a hinge 51 arranged on one side of the machine body 1 and one side of the spin dryer door 3, the push rod fixing seat 52 is arranged at the bottom of the inner side of the machine body 1, the fixing part of the door body push rod 53 is arranged above the push rod fixing seat 52, the door body rotating shaft 54 is arranged on one side of the telescopic part of the door body push rod 53, the telescopic part fixing seat 55 is arranged at the rear part of the spin dryer door 3, the door body rotating shaft 54 is arranged on the inner side of the telescopic part fixing seat 55, the hinge 51 is used for connecting the spin dryer door 3 and the door handle 4 and enabling the spin dryer door 3 to rotate along the rotating shaft of the hinge 51, the push rod fixing seat 52 is used for fixing the fixing part of the door body push rod 53 and enabling the fixing part of the door body push rod 53 to circumferentially rotate along the connecting shaft at the connecting part with the push rod fixing seat 52, and the door body rotating shaft 54 is used for connecting the door body push rod 53 and the telescopic part fixing seat 55 and capable of rotating inside the telescopic part fixing seat 55;
the spin-drying driving mechanism 7 comprises a main shaft sleeve 71, a main shaft 72, a spin-drying driven gear 73, a spin-drying driving gear 74 and a spin-drying motor 75, wherein the main shaft sleeve 71 is arranged at the rear part of the inner side of the machine body 1, the main shaft 72 is arranged at the inner side of the main shaft sleeve 71, the spin-drying driven gear 73 is arranged at the outer side of the front of the main shaft 72, the fixing frame 61 is arranged at the front of the main shaft 72, the spin-drying driving gear 74 is arranged below the spin-drying driven gear 73, the spin-drying motor 75 is arranged at the rear of the spin-drying driving gear 74, the main shaft sleeve 71 is used for fixing the main shaft 72 and enabling the main shaft 72 to rotate inside the main shaft sleeve 71, the main shaft 72 is used for connecting the spin-drying driven gear 73 with the wafer fixing mechanism 6, the spin-drying motor 75 is used for driving the spin-drying driving gear 74 to rotate, and the spin-drying driving gear 74 is used for driving the spin-drying driven gear 73 and the main shaft 72 to rotate synchronously.
Preferably: a sliding groove 63 is formed below the fixed frame 61, a water drainage hole 62 is formed on the fixed frame 61, a roller 65 is connected with a movable bottom plate 64 through a bearing, a bottom plate push rod 66 is connected with the sliding groove 63 in a rolling manner, the fixed part of the bottom plate push rod 66 is connected with the fixed frame 61 through a bolt, a front baffle plate 67 is connected with the movable bottom plate 64 through a bolt, and the telescopic part of the bottom plate push rod 66 is connected with the front baffle plate 67 through a bolt; a drainage channel 2 is formed below the machine body 1, and a spin dryer door 3 is connected with a door handle 4 through a bolt; the hinge 51 is connected with the machine body 1 through a bolt, the hinge 51 is connected with the spin dryer door 3 through a bolt, the push rod fixing seat 52 is connected with the machine body 1 through a bolt, the fixing part of the door body push rod 53 is connected with the push rod fixing seat 52 through a bearing, the door body rotating shaft 54 is formed on the telescopic part of the door body push rod 53, the telescopic part fixing seat 55 is connected with the spin dryer door 3 through a bolt, and the door body rotating shaft 54 is connected with the telescopic part fixing seat 55 through a bearing; the main shaft sleeve 71 is connected with the machine body 1 through a bolt, the main shaft 72 is connected with the main shaft sleeve 71 through a bearing, the spin-drying driven gear 73 is connected with the main shaft 72 through a key, the fixed frame 61 is connected with the main shaft 72 through a bolt, the spin-drying driving gear 74 is meshed with the spin-drying driven gear 73, and the spin-drying motor 75 is connected with the spin-drying driving gear 74 through a bolt.
In the structure, when a wafer needs to be dried, the door body push rod 53 is stretched to drive the drying machine door 3 to rotate and open outwards along the rotating shaft of the hinge 51, the bottom plate push rod 66 in the wafer fixing mechanism 6 is stretched to drive the front baffle 67, the movable bottom plate 64 and the roller 65 to move forwards, the rear half part of the movable bottom plate 64 is kept in the fixed frame 61, the wafer tray containing the wafer is placed above the movable bottom plate 64, then the bottom plate push rod 66 is contracted to drive the movable bottom plate 64, the front baffle 67, the roller 65 and the wafer above the movable bottom plate 64 to move backwards, the bottom plate push rod 66 stops contracting after the wafer tray moves to a specified position, then the door body push rod 53 contracts to drive the drying machine door 3 to rotate along the rotating shaft of the hinge 51 to close the machine body 1, then the drying motor 75 rotates to drive the drying driving gear 74, the drying driven gear 73 and the main shaft 72 to synchronously rotate, the main shaft 72 drives the wafer fixing mechanism 6 to rotate and utilize centrifugal force to rotate the wafer inside the wafer fixing mechanism 6 And (5) drying.
Example 2
As shown in fig. 2, 4, 6, 7 and 8, the present embodiment is different from embodiment 1 in that: the door body control mechanism 5 comprises a machine body rotating shaft fixing seat 511, a door body long rotating shaft 512, a door body connecting seat 513, a door body motor 514, a door body driving gear 515 and a door body driven gear 516, the machine body rotating shaft fixing seat 511 is arranged on one side outside the machine body 1, the door body long rotating shaft 512 is arranged on the inner side of the machine body rotating shaft fixing seat 511, the door body connecting seat 513 is arranged on one side of the spin dryer door 3 and above the machine body rotating shaft fixing seat 511, the door body motor 514 is arranged on one side of the machine body 1 and behind the door body connecting seat 513, the door body driving gear 515 is arranged on the outer side of an output shaft of the door body motor 514, the door body driven gear 516 is arranged on the outer side of the door body long rotating shaft 512 in front of the door body driving gear 515, the machine body rotating shaft fixing seat 511 is used for fixing the door body long rotating shaft 512 and enabling the latter to rotate inside the former, the door body motor 514 is used for driving the door body driving gear 515 to rotate, and the door body driven gear 516 is used for transmitting the torque transmitted by the door body driving gear 515 to the door body long rotating shaft 512 and the door body connecting seat 513.
Preferably: organism pivot fixing base 511 passes through bolted connection with organism 1, door body long rotating shaft 512 passes through the bearing with organism pivot fixing base 511 and is connected, door body connecting seat 513 passes through bolted connection with drier door 3, door body long rotating shaft 512 passes through bolted connection with door body connecting seat 513, door body motor 514 passes through bolted connection with organism 1, door body driving gear 515 and the output shaft key-type connection of door body motor 514, door body driven gear 516 meshes with door body driving gear 515 mutually, door body driven gear 516 shaping is on door body long rotating shaft 512.
The working principle is as follows: in the structure, when the wafer needs to be spin-dried, the door motor 514 operates to drive the door driving gear 515, the door driven gear 516, the door long rotating shaft 512 and the door connecting seat 513 to rotate synchronously, the door connecting seat 513 drives the spin-dryer door 3 to rotate along the circumferential direction of the door long rotating shaft 512 and open outwards, the bottom plate push rod 66 in the wafer fixing mechanism 6 stretches to drive the front baffle 67, the movable bottom plate 64 and the roller 65 to move forwards, the rear half part of the movable bottom plate 64 is retained in the fixed frame 61, the wafer tray containing the wafer is placed above the movable bottom plate 64, then the bottom plate push rod 66 contracts to drive the movable bottom plate 64, the front baffle 67, the roller 65 and the wafer above the movable bottom plate 64 to move backwards, the bottom plate push rod 66 stops contracting after the wafer moves to the designated position, and then the door motor 514 operates to drive the door driving gear 515 and the door driven gear 516, The door body long rotating shaft 512 and the door body connecting seat 513 rotate synchronously, the door body connecting seat 513 drives the spin dryer door 3 to rotate circumferentially along the door body long rotating shaft 512 to close the machine body 1, then the spin dryer motor 75 rotates to drive the spin dryer driving gear 74, the spin dryer driven gear 73 and the main shaft 72 to rotate synchronously, and the main shaft 72 drives the wafer fixing mechanism 6 to rotate and spin-dry the wafer inside the wafer fixing mechanism 6 by using centrifugal force.
While the preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the spirit of the present invention.
Claims (7)
1. The utility model provides an equipment that spin-dries for wafer cleaning, includes organism (1), water drainage tank (2), drier door (3), door handle (4), door body control mechanism (5), actuating mechanism (7) spin-dries, its characterized in that: the wafer fixing mechanism (6) comprises a fixing frame (61), drain holes (62), sliding grooves (63), a movable bottom plate (64), rollers (65), bottom plate push rods (66) and a front baffle (67), wherein the sliding grooves (63) are formed in two sides of the inner portion below the fixing frame (61), the drain holes (62) are formed in the side wall and the top of the fixing frame (61), the movable bottom plate (64) is arranged between the sliding grooves (63), the rollers (65) are arranged on two sides of the movable bottom plate (64), the bottom plate push rods (66) are arranged on one side of the fixing frame (61), and the front baffle (67) is arranged in front of the movable bottom plate (64);
the sliding groove (63) is formed below the fixed frame (61), the water drainage hole (62) is formed in the fixed frame (61), the roller (65) is connected with the movable bottom plate (64) through a bearing, the bottom plate push rod (66) is in rolling connection with the sliding groove (63), the fixed part of the bottom plate push rod (66) is connected with the fixed frame (61) through a bolt, the front baffle plate (67) is connected with the movable bottom plate (64) through a bolt, and the telescopic part of the bottom plate push rod (66) is connected with the front baffle plate (67) through a bolt;
the spin-drying driving mechanism (7) comprises a main shaft sleeve (71), a main shaft (72), a spin-drying driven gear (73), a spin-drying driving gear (74) and a spin-drying motor (75), wherein the main shaft sleeve (71) is arranged at the rear part of the inner side of the machine body (1), the main shaft (72) is arranged at the inner side of the main shaft sleeve (71), the spin-drying driven gear (73) is arranged at the outer side in front of the main shaft (72), the fixed frame (61) is arranged in front of the main shaft (72), the spin-drying driving gear (74) is arranged below the spin-drying driven gear (73), and the spin-drying motor (75) is arranged behind the spin-drying driving gear (74);
spindle sleeve (71) with organism (1) passes through bolted connection, main shaft (72) with spindle sleeve (71) pass through the bearing and connect, spin-dry driven gear (73) with main shaft (72) pass through the key-type connection, fixed frame (61) with main shaft (72) pass through bolted connection, spin-dry driving gear (74) with spin-dry driven gear (73) mesh mutually, spin-dry motor (75) with spin-dry driving gear (74) pass through bolted connection, and spin-dry motor (75) rotate and drive spin-dry driving gear (74), spin-dry driven gear (73) and main shaft (72) synchronous rotation, and main shaft (72) drive wafer fixed establishment (6) rotate and utilize centrifugal force to spin-dry the inside wafer of wafer fixed establishment (6).
2. A spin-drying apparatus for wafer cleaning as claimed in claim 1, wherein: the drainage groove (2) is arranged below the inner portion of the machine body (1), the spin dryer door (3) is arranged in front of the machine body (1), and the door handle (4) is arranged on one side in front of the spin dryer door (3).
3. A spin-drying apparatus for wafer cleaning as claimed in claim 2, wherein: the drainage groove (2) is formed below the machine body (1), and the spin dryer door (3) is connected with the door handle (4) through bolts.
4. A spin-drying apparatus for wafer cleaning as claimed in claim 1, wherein: door body control mechanism (5) are including hinge (51), push rod fixing base (52), door body push rod (53), door body pivot (54), pars contractilis fixing base (55), hinge (51) set up organism (1) with one side of drier door (3), push rod fixing base (52) set up organism (1) inboard bottom, the fixed part setting of door body push rod (53) is in push rod fixing base (52) top, door body pivot (54) set up pars contractilis one side of door body push rod (53), pars contractilis fixing base (55) set up the drier door (3) rear portion, door body pivot (54) are in pars contractilis fixing base (55) are inboard.
5. The spin-drying apparatus for wafer cleaning according to claim 4, wherein: hinge (51) with organism (1) passes through bolted connection, hinge (51) with drier door (3) pass through bolted connection, push rod fixing base (52) with organism (1) passes through bolted connection, the fixed part of door body push rod (53) with push rod fixing base (52) pass through the bearing and connect, door body pivot (54) shaping is in on the pars contractilis of door body push rod (53), pars contractilis fixing base (55) with drier door (3) passes through bolted connection, door body pivot (54) with pars contractilis fixing base (55) pass through the bearing and connect.
6. A spin-drying apparatus for wafer cleaning as claimed in claim 1, wherein: the door body control mechanism (5) comprises a machine body rotating shaft fixing seat (511), a door body long rotating shaft (512), a door body connecting seat (513), a door body motor (514), a door body driving gear (515) and a door body driven gear (516), the machine body rotating shaft fixing seat (511) is arranged on one side of the outer part of the machine body (1), the door body long rotating shaft (512) is arranged on the inner side of the machine body rotating shaft fixing seat (511), the door body connecting seat (513) is arranged on one side of the spin dryer door (3) above the machine body rotating shaft fixing seat (511), the door body motor (514) is arranged on one side of the machine body (1) and is arranged at the rear part of the door body connecting seat (513), the door body driving gear (515) is arranged on the outer side of an output shaft of the door body motor (514), the door body driven gear (516) is arranged in front of the door body driving gear (515) and outside the door body long rotating shaft (512).
7. A spin-drying apparatus for wafer cleaning as claimed in claim 6, wherein: organism pivot fixing base (511) with organism (1) passes through bolted connection, the long pivot of the door body (512) with organism pivot fixing base (511) passes through the bearing and connects, door body connecting seat (513) with drier door (3) pass through bolted connection, the long pivot of the door body (512) with door body connecting seat (513) pass through bolted connection, door body motor (514) with organism (1) passes through bolted connection, door body driving gear (515) with the output shaft key-type connection of door body motor (514), door body driven gear (516) with door body driving gear (515) mesh mutually, door body driven gear (516) shaping is in on the long pivot of the door body (512).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110173368.8A CN112885750B (en) | 2021-02-09 | 2021-02-09 | Spin-drying equipment for wafer cleaning |
Applications Claiming Priority (1)
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TW201306146A (en) * | 2011-07-25 | 2013-02-01 | Grand Plastic Technology Corp | A method and apparatus of wet processor with fragmental detection in a spin dryer |
TWI456684B (en) * | 2011-06-29 | 2014-10-11 | Grand Plastic Technology Co Ltd | An apparatus of wet processor with wafer cassette automatically transfering from a spin dryer |
CN111312614A (en) * | 2019-11-29 | 2020-06-19 | 福建省福联集成电路有限公司 | Etching and spin-drying integrated machine table and spin-drying mechanism |
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US5221360A (en) * | 1987-04-27 | 1993-06-22 | Semitool, Inc. | Semiconductor processor methods |
TWI456684B (en) * | 2011-06-29 | 2014-10-11 | Grand Plastic Technology Co Ltd | An apparatus of wet processor with wafer cassette automatically transfering from a spin dryer |
TW201306146A (en) * | 2011-07-25 | 2013-02-01 | Grand Plastic Technology Corp | A method and apparatus of wet processor with fragmental detection in a spin dryer |
CN111312614A (en) * | 2019-11-29 | 2020-06-19 | 福建省福联集成电路有限公司 | Etching and spin-drying integrated machine table and spin-drying mechanism |
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