CN111309074A - Temperature control device of electronic equipment - Google Patents
Temperature control device of electronic equipment Download PDFInfo
- Publication number
- CN111309074A CN111309074A CN202010220681.8A CN202010220681A CN111309074A CN 111309074 A CN111309074 A CN 111309074A CN 202010220681 A CN202010220681 A CN 202010220681A CN 111309074 A CN111309074 A CN 111309074A
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- Prior art keywords
- module
- heat
- bottom plate
- electronic equipment
- cooling bottom
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- 238000001816 cooling Methods 0.000 claims abstract description 49
- 230000017525 heat dissipation Effects 0.000 claims abstract description 32
- 238000012544 monitoring process Methods 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
- G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature control device of electronic equipment, which comprises a cooling bottom plate module and a heat dissipation module, wherein the cooling bottom plate module comprises a cooling bottom plate, one surface of the cooling bottom plate is contacted with a heating source of the electronic equipment, the other surface of the cooling bottom plate is provided with a thermoelectric module, the first end surface of the thermoelectric module is contacted with the cooling bottom plate, the second end surface of the thermoelectric module is contacted with the heat dissipation module, the cooling bottom plate module also comprises a control module and a thermocouple monitoring module, the control module is connected with the first end surface and the second end surface of the thermoelectric module, and the control module controls the current direction between the first end surface and the second end surface of the thermoelectric module according to temperature information monitored by the thermocouple monitoring module. The invention ensures that the electronic equipment can safely and reliably operate at high temperature or low temperature.
Description
Technical Field
The application belongs to the technical field of electronic equipment temperature control, and particularly relates to a temperature control device of electronic equipment.
Background
Electronic equipment works in some high-temperature and high-humidity environments, generally needs to be sealed structurally, so that heat generated by the electronic equipment cannot be timely and effectively discharged, and stable operation of the electronic equipment is influenced.
In addition, some electronic devices also need to work in a low-temperature environment, and if the electronic devices are not protected at low temperature, the stable operation of the electronic devices can be influenced, and even the electrical performance of electronic components can be damaged.
When the temperature of the external environment is lower than zero, the general measures are to preheat the electronic equipment by the heat generated by the electronic equipment and then operate the electronic equipment. When the ambient temperature is higher, the electronic equipment radiates heat through the radiator, and the stable operation of the electronic equipment is ensured by discharging the redundant heat.
However, there is still a lack of a device that can dissipate heat at a high temperature and can keep the heat generated by the electronic device to preheat at a low temperature.
Disclosure of Invention
The application aims to provide a temperature control device of electronic equipment, which realizes the dual purposes of preheating and radiating the electronic equipment.
In order to achieve the purpose, the technical scheme of the application is as follows:
the utility model provides a temperature control device of electronic equipment, includes cooling bottom plate module and heat dissipation module, the cooling bottom plate module includes cooling bottom plate, the one side of cooling bottom plate and electronic equipment generate heat the source contact, cooling bottom plate's another side is equipped with thermoelectric module, thermoelectric module's first terminal surface with the cooling bottom plate contact, thermoelectric module's second terminal surface and heat dissipation module contact, the cooling bottom plate module still includes control module and thermocouple monitoring module, control module with thermoelectric module's first terminal surface and second terminal surface link to each other, control module is according to the temperature information that thermocouple monitoring module monitored, control the direction of current between thermoelectric module first terminal surface and the second terminal surface.
Furthermore, a sealing cushion pad is arranged between the cooling bottom plate module and the heat dissipation module.
Furthermore, one surface of the cooling bottom plate, which is in contact with a heat generating source of the electronic equipment, is coated with a heat conducting medium.
Furthermore, the first end face of the thermoelectric module is connected with the cooling bottom plate through a heat conducting medium, and the second end face of the thermoelectric module is connected with the heat dissipation module through a heat conducting medium.
Furthermore, the heat dissipation module comprises a radiator, a heat conduction pipe is arranged above the radiator, a heat conduction plate is arranged above the heat conduction pipe, the heat conduction plate is in contact with the second end face of the thermoelectric module, and a fan is arranged at one end of the radiator.
Further, the control module controls the rotating speed of the fan according to the temperature information monitored by the thermocouple monitoring module.
The application provides a temperature control device of electronic equipment, has solved electronic equipment heat difficult derivation in abominable operating mode or special application occasion, the difficult point of heat dissipation difficulty, also avoids electronic equipment problem that the electrical property descends under low temperature environment simultaneously, has guaranteed that electronic equipment can both safe and reliable's operation under high temperature or low temperature.
Drawings
FIG. 1 is a schematic view of an assembly of a temperature control device for an electronic apparatus according to the present application;
FIG. 2 is a schematic view of a cooling floor module according to an embodiment of the present application;
FIG. 3 is a schematic view of a heat dissipation module according to an embodiment of the present disclosure;
FIG. 4 is a schematic cross-sectional view of a temperature control apparatus according to an embodiment of the present application;
fig. 5 is another schematic cross-sectional view of a temperature control device according to an embodiment of the present application.
The reference numerals in the figures are illustrated as follows:
0. a heat generating source of the electronic device; 1. cooling the bottom plate module; 2. a heat dissipation module; 3. sealing the cushion pad; 11. cooling the bottom plate; 12. a thermoelectric module; 13. a control module; 14. a thermocouple monitoring module; 21. a heat conducting plate; 22. a heat conducting pipe; 23. a heat sink; 24. a fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The application relates to a heat dissipation method based on thermoelectric phenomenon, which is based on the Peltier effect of semiconductor materials, and when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series (common galvanic couple materials at two ends are p-type bismuth telluride and n-type bismuth telluride respectively), heat can be absorbed and released at two ends of the galvanic couple respectively, so that double purposes of preheating and heat dissipation of electronic equipment are realized.
In one embodiment, as shown in fig. 1-5, a temperature control apparatus for an electronic device, the temperature control device of the electronic equipment comprises a cooling bottom plate module 1 and a heat dissipation module 2, wherein the cooling bottom plate module 1 comprises a cooling bottom plate 11, one surface of the cooling bottom plate 11 is contacted with a heat source 0 of the electronic equipment, the other surface of the cooling bottom plate 11 is provided with a thermoelectric module 12, a first end face of the thermoelectric module 12 is in contact with the cooling base plate 11, a second end face of the thermoelectric module 12 is in contact with the heat dissipation module 2, the cooling baseboard module 1 further comprises a control module 13 and a thermocouple monitoring module 14, the control module 13 is connected with the first end face and the second end face of the thermoelectric module 12, the control module 13 controls the current direction between the first end surface and the second end surface of the thermoelectric module 12 according to the temperature information monitored by the thermocouple monitoring module 14.
A temperature control device of an electronic device according to this embodiment is used for a heat source of the electronic device, as shown in fig. 1, the temperature control device of this embodiment is in close contact with the heat source of the electronic device to conduct heat well.
Specifically, the temperature control device comprises a cooling bottom plate module 1 and a heat dissipation module 2. As shown in fig. 2, the cooling base plate module 1 of the present embodiment includes a cooling base plate 11, a thermoelectric module 12, a control module 13, and a thermocouple monitoring module 14. One side (downward in fig. 2) of the cooling bottom plate 11 is in close contact with a heat source of the electronic device, an inner groove for placing the control module 13, the thermocouple monitoring module 14 and the thermoelectric module 12 is arranged on the other side (upward in fig. 2), and the control module 13, the thermocouple monitoring module 14 and the thermoelectric module 12 are placed in the corresponding inner grooves, so that the cooling bottom plate module 1 and the heat dissipation module 2 are better and closely matched.
Preferably, the surface of the cooling base plate 11, which is in contact with the heat source of the electronic device, is coated with a heat-conducting medium (common heat-conducting media include heat-conducting silicone grease, heat-conducting glue, heat-conducting pads, and the like), and the thermal contact resistance between the cooling base plate module 1 and the heat source 0 can be reduced by coating the heat-conducting medium.
The thermoelectric module 12 of the present embodiment has a first end surface and a second end surface, which are shown as an upper surface and a lower surface in fig. 2, for example, the first end surface is a downward surface, the second end surface is an upward surface, and it can be seen that the first end surface is in contact with the cooling bottom plate 11, and the second end surface is in contact with the heat dissipation module 2.
In this embodiment, the control module 13 is electrically connected to the first end surface and the second end surface of the thermoelectric module 12, and the control module 13 is further electrically connected to the thermocouple monitoring module 14, so as to receive the temperature information monitored by the thermocouple monitoring module 14 and control the current direction between the first end surface and the second end surface of the thermoelectric module 12. It should be noted that the control module 13 receiving the temperature information to change the current direction between the first end surface and the second end surface of the thermoelectric module 12 and change the rotation speed of the fan 24 in the heat dissipation module 2 are mature technologies that can be completed by a common electronic circuit, and are not described herein again.
Similarly, preferably, a heat conducting medium is also coated between the first end surface of the thermoelectric module 12 and the cooling bottom plate 11, and is connected through the heat conducting medium, and a heat conducting medium is also coated between the second end surface of the thermoelectric module 12 and the heat dissipation module 2, and is connected through the heat conducting medium. The application is not limited to which component the heat transfer medium is specifically coated on, and in practice the heat transfer medium may be coated on either side.
In one embodiment, as shown in fig. 1, a sealing cushion 3 is disposed between the cooling base plate module 1 and the heat dissipation module 2. Place sealed blotter 3 between heat dissipation module 2 and the cooling plate module 1, firstly play the effect of buffering shock attenuation, secondly can do sealed processing with thermoelectric module 12 and external environment.
In another embodiment, as shown in fig. 3, a specific example of the heat dissipation module 2 is given. The present application is not limited to the specific structure of the heat dissipation module 2, as long as the heat can be conducted out. In this example, the heat dissipation module 2 includes a heat sink 23, a heat pipe 22 is disposed above the heat sink 23, a heat conduction plate 21 is disposed above the heat pipe 22, the heat conduction plate 21 contacts with the second end face of the thermoelectric module 12, and a fan 24 is disposed at one end of the heat sink 23.
The heat conducting plate 21 of this embodiment is in contact with the second end surface of the thermoelectric module 12, transfers heat, and conducts heat to the heat sink 23 through the heat conducting pipe 22, and the fan 24 in the heat sink 23 rotates to radiate heat.
In one embodiment, as shown in FIG. 2, the thermoelectric module 12 is divided into a plurality of units, which are divided into two units, left and right units in FIG. 2, to facilitate uniform heat dissipation; the thermocouple monitoring module 14 is also divided into a plurality of monitoring points, so that the temperature of the monitoring points can be conveniently obtained, and the temperature condition of the heating source of the electronic equipment can be accurately mastered.
The application discloses temperature control device of electronic equipment, theory of operation as follows:
the control module 13 obtains the temperature information through the thermocouple monitoring module 14, and controls the rotating speed of the fan 24 according to the temperature information. When the temperature is high, the rotating speed of the fan is increased, and heat dissipation treatment is carried out.
When the electronic device is in a high-temperature environment, the first end face and the second end face of the thermoelectric module 12 are respectively in contact with the cooling base plate 11 and the heat dissipation module 2, the first end face absorbs heat, and the second end face emits heat, so that heat of a heating source can be quickly led out.
When the electronic device is in a low-temperature environment, the current direction of the thermoelectric module 12 is changed, and the first end face and the second end face of the thermoelectric module 12 are interchanged. The second end face absorbs heat, and the first end face emits heat, so that adverse effects of low-temperature environment on the electrical performance of the electronic component can be prevented.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. The temperature control device of the electronic equipment is characterized by comprising a cooling bottom plate module (1) and a heat dissipation module (2), wherein the cooling bottom plate module (1) comprises a cooling bottom plate (11), one surface of the cooling bottom plate (11) is contacted with a heat source of the electronic equipment, a thermoelectric module (12) is arranged on the other surface of the cooling bottom plate (11), a first end surface of the thermoelectric module (12) is contacted with the cooling bottom plate (11), a second end surface of the thermoelectric module (12) is contacted with the heat dissipation module (2), the cooling bottom plate module (1) further comprises a control module (13) and a thermocouple monitoring module (14), the control module (13) is connected with the first end surface and the second end surface of the thermoelectric module (12), and the control module (13) monitors temperature information according to the thermocouple monitoring module (14), controlling a direction of current flow between the first and second end faces of the thermoelectric module (12).
2. The temperature control device of an electronic apparatus according to claim 1, wherein a sealing cushion (3) is provided between the cooling base plate module (1) and the heat dissipation module (2).
3. The temperature control apparatus for electronic equipment according to claim 1, wherein a surface of the cooling substrate (11) that is in contact with a heat generating source of the electronic equipment is coated with a heat conductive medium.
4. The temperature control apparatus of an electronic device according to claim 1, wherein a first end face of the thermoelectric module (12) is connected to the cooling base plate (11) through a heat conducting medium, and a second end face of the thermoelectric module (12) is connected to the heat dissipation module (2) through a heat conducting medium.
5. The temperature control device of an electronic apparatus according to claim 1, wherein the heat dissipation module (2) comprises a heat sink (23), a heat pipe (22) is disposed above the heat sink (23), a heat conductive plate (21) is disposed above the heat pipe (22), the heat conductive plate (21) is in contact with the second end face of the thermoelectric module (12), and a fan (24) is disposed at one end of the heat sink (23).
6. The temperature control apparatus of an electronic device according to claim 4, wherein the control module (13) controls the rotation speed of the fan (24) according to the temperature information monitored by the thermocouple monitoring module (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010220681.8A CN111309074A (en) | 2020-03-25 | 2020-03-25 | Temperature control device of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010220681.8A CN111309074A (en) | 2020-03-25 | 2020-03-25 | Temperature control device of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111309074A true CN111309074A (en) | 2020-06-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010220681.8A Pending CN111309074A (en) | 2020-03-25 | 2020-03-25 | Temperature control device of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111309074A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188317A (en) * | 2015-09-07 | 2015-12-23 | 上海交通大学 | Active thermoelectric cooling system for electronic device in severe working conditions |
| CN106982542A (en) * | 2017-05-23 | 2017-07-25 | 北京小米移动软件有限公司 | Electronic equipment and its heat dissipating method, device |
| CN109144137A (en) * | 2018-07-27 | 2019-01-04 | 北京量子体系科技股份有限公司 | A kind of temperature control equipment and laser |
| CN211741945U (en) * | 2020-03-25 | 2020-10-23 | 中国电子科技集团公司第五十二研究所 | Temperature control device of electronic equipment |
-
2020
- 2020-03-25 CN CN202010220681.8A patent/CN111309074A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188317A (en) * | 2015-09-07 | 2015-12-23 | 上海交通大学 | Active thermoelectric cooling system for electronic device in severe working conditions |
| CN106982542A (en) * | 2017-05-23 | 2017-07-25 | 北京小米移动软件有限公司 | Electronic equipment and its heat dissipating method, device |
| CN109144137A (en) * | 2018-07-27 | 2019-01-04 | 北京量子体系科技股份有限公司 | A kind of temperature control equipment and laser |
| CN211741945U (en) * | 2020-03-25 | 2020-10-23 | 中国电子科技集团公司第五十二研究所 | Temperature control device of electronic equipment |
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