CN111295048A - Manufacturing method of multilayer copper-based sandwich bent plate - Google Patents
Manufacturing method of multilayer copper-based sandwich bent plate Download PDFInfo
- Publication number
- CN111295048A CN111295048A CN201811502188.4A CN201811502188A CN111295048A CN 111295048 A CN111295048 A CN 111295048A CN 201811502188 A CN201811502188 A CN 201811502188A CN 111295048 A CN111295048 A CN 111295048A
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- Prior art keywords
- copper
- sandwich
- plate
- manufacturing
- temperature glue
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 88
- 239000010949 copper Substances 0.000 title claims abstract description 88
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 63
- 239000003292 glue Substances 0.000 claims abstract description 52
- 238000003825 pressing Methods 0.000 claims abstract description 50
- 238000005452 bending Methods 0.000 claims abstract description 49
- 238000005520 cutting process Methods 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 230000002035 prolonged effect Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 230000006698 induction Effects 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000003801 milling Methods 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a multilayer copper-based sandwich bent plate, which comprises the steps of respectively cutting a sandwich copper base and an FR4 plate, manufacturing an inner layer circuit of the FR4 plate, pasting high-temperature glue, pressing, drilling, plating a copper plate, manufacturing an outer layer circuit, electroplating a pattern, etching the outer layer, detecting an outer layer A01, green oil, forming, tearing the high-temperature glue, FQC1, depositing tin, bending the copper base, FQC2 and finally packaging. The process simplifies the cost of the FR4 plate, improves the production efficiency and the yield of the plate, reduces the production cost and simplifies the manufacturing process of the sandwich copper-based bending plate.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a manufacturing method of a multilayer copper-based sandwich bending plate.
Background
In the printed circuit board manufacturing industry, the processing technology of common copper substrates has mature processing technology, but the processing of multilayer copper-based sandwich bending plates (the thickness of a copper-based sandwich is less than or equal to 1.5MM, and the plate is a four-layer copper-based sandwich bending plate) lacks mature processing technology, and the processing method of common four-layer copper substrates is generally adopted for processing, so that the problems of complex manufacturing process, low production efficiency, high manufacturing cost, low quality yield and the like in the processing process are caused.
Disclosure of Invention
The invention aims to provide a method for manufacturing a multilayer copper-based sandwich bending plate, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a manufacturing method of a multilayer copper-based sandwich bending plate comprises the following steps:
the method comprises the following steps: taking a large copper plate, taking the designed CNC graph as a reference according to engineering requirements, and completing the processes of cutting, punching and notching by a numerical control die stamping machine at one time;
step two: cutting the FR4 board by adopting an automatic cutting machine according to the cutting size designed according to engineering requirements;
step three: manufacturing an inner layer circuit of an FR4 board, wherein the L2 and L3 layer circuits measure films before manufacturing, and ensure that the size deviation of two layers of films is within 0.03 mm;
step four: the manual dry film pressing machine with the infrared induction system is used for pasting high-temperature glue at the bending position of the sandwich copper base, and the specific operation process is as follows: firstly, high-temperature glue with a preset size is arranged on an upper film pressing wheel and a lower film pressing wheel and is fixed, then the high-temperature glue pressing process is carried out, the high-temperature glue pressing process is started when the first infrared ray senses that copper at the copper-based bending part of the sandwich core passes through, and the high-temperature glue pressing process is stopped when the second infrared ray senses that no copper passes through;
step five: browning each sandwiched copper base pasted with the high-temperature glue and two cut FR4 boards, and then pressing according to a specific pressing procedure;
step six: sequentially drilling a hole, depositing a copper plate, plating an outer layer circuit, electroplating a pattern, etching the outer layer, detecting the outer layer A01 and performing a green oil process on the laminated sandwich copper substrate;
step seven: designing a V-CUT line according to the boundary line of high-temperature glue attached to the sandwiched copper-based bending position according to engineering requirements, then cutting and separating the high-temperature glue and the FR4 board at the bending position from a normal board V of a customer, and routing the board according to a CNC (computer numerical control) figure designed according to the engineering requirements after the V cutting and separation are completed;
step eight: inserting a sheet clamp between the bending position of the sandwich copper-based plate and the high-temperature glue, and tearing off the high-temperature glue and the FR4 plate on the bending position;
step nine: carrying out FQC1 and tin precipitation surface treatment process;
step ten: performing numerical control bending according to a V secant at the sandwich copper-based bending position;
step eleven: FQC2 and final packaging process are performed.
Preferably, in the fourth step of the manufacturing method of the multilayer copper-based sandwich bending plate, the infrared system added on the manual dry film laminator specifically comprises two pairs of infrared emission lamps and infrared receiving lamps, and the two pairs of infrared emission lamps and the two pairs of infrared receiving lamps are respectively arranged on two sides of the upper film pressing wheel and the lower film pressing wheel.
Preferably, for the manufacturing method of the multilayer copper-based sandwich bending plate, the specific procedure in the fifth step specifically includes:
a. the speed of the sandwich copper base is reduced by 50% when the copper base is subjected to browning;
b. the prepreg used in the browning process is a prepreg with the glue content of 90%;
c. the time of the low temperature section in the pressing process is prolonged by 80 min;
d. after the semi-solidified glue is fully melted and flows into the holes and the slotted holes of the sandwich copper base, the high pressure of a press is increased by 16 percent;
e. the total time of pressing is prolonged by 40 min.
Preferably, in the seventh step of the manufacturing method of the multilayer copper-based sandwich bending plate, the V-CUT separation is performed by using a large plate V-CUT machine, and the V-CUT depth needs to be controlled within 0.05mm during the V-CUT.
Preferably, in the seventh step of the manufacturing method of the multilayer copper-based sandwich bending plate, when the plate is milled, milling parameters are reduced by 60%, and the service life of a milling cutter is controlled within 5 m.
Compared with the prior art, the invention has the beneficial effects that:
1. the invention directly uses the numerical control die to finish the cutting of the copper-based core plate and the forming of the slotted hole at one time, thereby avoiding the copper plate cutting of the common method and the slotted hole washing by using the milling machine. The hole and the groove hole are directly filled by adopting a high-adhesive prepreg in the pressing process, the common processing method is replaced, the common processing method is that according to the size and the shape of the hole and the groove hole of the sandwich copper base and the thickness of the copper base, an FR4 board with the board thickness being small and the copper base thickness being 0.1 mm is selected to be provided with a filling module of the corresponding hole and the groove hole, and when the sandwich copper base is pressed, the corresponding filling module is placed in the corresponding hole and the groove hole and then pressed to manufacture the sandwich copper-based composite material. The method saves the placing process of FR4 cutting, FR4 routing and FR4 filling module pressing, saves the cost of FR4 plate, improves the production efficiency and quality yield of the plate and reduces the production cost.
2. The method adopts a high-glue prepreg with 90 percent of glue content, prolongs the time of a low-temperature section by 80 minutes in the pressing process, fully melts and flows the prepreg glue into holes and slotted holes of the sandwich copper base, then improves the high-pressure of a press by 16 percent, fully fills the glue of the prepreg glue into the holes and the slotted holes, and simultaneously prolongs the total pressing time by 40 minutes to ensure that the pressing quality of each pressure section and temperature section meets the requirement.
3. The numerical control punching die is adopted to cut, punch and punch the slot hole of the sandwich copper base at one time according to CNC data, the phenomena of burrs and burrs generated in the process of cutting and routing the slot hole are avoided, the method can completely solve the phenomena of burrs and burrs of the cutting and routing the slot hole and the hole of the sandwich copper base, and meanwhile, the production efficiency of the plate is improved.
4. The milling parameters during milling are reduced by 60%, and the quality of the milled product is ensured to have no undesirable phenomena such as flash, burr and the like.
5. A copper-based bending technology is provided, and the specific method comprises the following steps: firstly, sticking high-temperature glue on a bent copper-based area before pressing, so as to prevent a prepreg from being directly pressed on a sandwich copper base in the pressing process; secondly, in the forming process, V-CUT technology is adopted on the boundary line of the high-temperature glue stuck by the lamination of the sandwich copper base, and V-CUT is carried out on the depth control of the FR4 board on the outer layer; thirdly, tearing off the high-temperature glue and the FR4 board on the high-temperature glue after routing (copper-based bending area); and fourthly, carrying out numerical control bending after tin immersion surface treatment, wherein the bending angle is 90 degrees.
Detailed Description
The present invention will be further described with reference to specific examples so that those skilled in the art can better understand the present invention and can practice the present invention, but the examples are not intended to limit the present invention.
The invention provides a method for manufacturing a multilayer copper-based sandwich bending plate, which comprises the following steps of:
the method comprises the following steps: the method comprises the following steps of taking a large copper plate, taking a CNC (computer numerical control) graph designed according to engineering requirements as a reference, and finishing the processes of cutting, punching and notching at one time by adopting a numerical control die stamping machine, compared with the common method that the copper plate is cut and then a groove hole is notched by using a milling machine, so that the poor quality phenomena such as burrs and burrs generated in the process of cutting, milling and notching can be avoided;
step two: cutting the FR4 board by using an automatic cutting machine according to the cutting size designed according to engineering requirements, wherein the copper surface is prevented from being scratched during cutting;
step three: manufacturing an inner layer circuit of an FR4 board, wherein the films of the L2 layer circuit and the L3 layer circuit are measured before manufacturing, the size deviation of the two layers of films is ensured to be within 0.03mm, pressing is carried out according to the measurement, the L2 layer and the L3 layer can be ensured not to have layer deviation after pressing, and in addition, the manufacturing of other layers of circuits is carried out according to the manufacturing process of the conventional circuit layer;
step four: the manual dry film pressing machine with the infrared induction system is used for pasting high-temperature glue at the bending position of the sandwich copper base, and the specific operation process is as follows: firstly, high-temperature glue with a preset size is arranged on an upper film pressing wheel and a lower film pressing wheel and is fixed, then a high-temperature glue pressing process is carried out, the high-temperature glue pressing process is started when first infrared rays sense that copper at a bending position of a sandwich copper base passes through, the high-temperature glue pressing process is stopped when second infrared rays sense that no copper passes through, an infrared system is arranged to calibrate the position where the high-temperature glue is pasted, the high-temperature glue is respectively pasted on the upper film pressing wheel and the lower film pressing wheel, and when a sandwich copper base passes through between the upper film pressing wheel and the lower film pressing wheel, the high-temperature glue can be pasted on the bending position of the copper base after the film pressing wheel rolls at the bending position of the;
step five: browning each sandwiched copper base pasted with the high-temperature glue and two cut FR4 boards, and then pressing according to a specific pressing procedure;
step six: sequentially performing drilling, copper plate plating, outer layer circuit, pattern electroplating, outer layer etching, outer layer A01 detection and green oil processes on the laminated sandwich copper base, wherein the processes are all processed by adopting conventional processes in the prior art;
step seven: designing a V-CUT line according to the boundary line of high-temperature glue attached to the sandwiched copper-based bending position according to engineering requirements, then cutting and separating the high-temperature glue and the FR4 board at the bending position from a normal board V of a customer, and routing the board according to a CNC (computer numerical control) figure designed according to the engineering requirements after the V cutting and separation are completed;
step eight: inserting a sheet clamp between the bending position of the sandwich copper-based plate and the high-temperature glue, and tearing off the high-temperature glue and the FR4 plate on the bending position;
step nine: carrying out FQC1 and tin precipitation surface treatment processes, wherein the two processes refer to the conventional process for treatment;
step ten: performing numerical control bending according to a V secant at the sandwich copper-based bending position;
step eleven: the FQC2 and final packaging process were performed, the next two processes being processed with reference to existing conventional processes.
In another embodiment, in the fourth step, the infrared system added to the manual dry film laminator specifically includes two pairs of infrared emission lamps and infrared receiving lamps, and the two pairs of infrared emission lamps and infrared receiving lamps are respectively arranged on two sides of the upper and lower laminating wheels, the bending position of the sandwiched copper base passes through between the upper and lower laminating wheels, and when the bending position enters the range of the laminating wheels, a shielding is formed, so that the infrared receiving lamp on the side no longer receives the infrared signal sent by the infrared emission lamps, the laminator is driven to operate by the signal conversion, and then the lamination starts.
In another embodiment, the specific procedure in the step five specifically includes:
a. the speed of the sandwich copper base is reduced by 50% when the copper base is subjected to browning;
b. the prepreg used in the browning process is a prepreg with the glue content of 90%;
c. the time of the low temperature section in the pressing process is prolonged by 80 min;
d. after the semi-solidified glue is fully melted and flows into the holes and the slotted holes of the sandwich copper base, the high pressure of a press is increased by 16 percent;
e. the total time of pressing is prolonged by 40 min.
The above changes to the parameters including speed reduction, time extension, pressure increase, etc. are all made based on the corresponding parameters in the conventional circuit board manufacturing process.
In another embodiment, in the seventh step, the V-CUT separation is performed by using a large-plate V-CUT machine, and when performing the V-CUT, the V-CUT depth needs to be controlled within 0.05mm, so that the high-temperature glue and the sandwiched copper base on the high-temperature glue FR4 can be torn manually at a high speed and cannot damage the bending part in the later stage.
In another embodiment, in the seventh step, when performing routing, the routing parameter is reduced by 60%, and the service life of the routing knife is controlled within 5 m. The lower regulation of the routing parameters is carried out by taking the routing parameters in the conventional circuit board manufacturing as the reference. Meanwhile, when a copper substrate is milled by using a common milling machine, the power of the movement of the platform of the milling machine cannot meet the requirement, and the milling machine is easy to damage, so that the milling process is preferably performed by using a high-power milling machine.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (5)
1. The manufacturing method of the multilayer copper-based sandwich bent plate is characterized by comprising the following steps of:
the method comprises the following steps: taking a large copper plate, taking the designed CNC graph as a reference according to engineering requirements, and completing the processes of cutting, punching and notching by a numerical control die stamping machine at one time;
step two: cutting the FR4 board by adopting an automatic cutting machine according to the cutting size designed according to engineering requirements;
step three: manufacturing an inner layer circuit of an FR4 board, wherein the L2 and L3 layer circuits measure films before manufacturing, and ensure that the size deviation of two layers of films is within 0.03 mm;
step four: the manual dry film pressing machine with the infrared induction system is used for pasting high-temperature glue at the bending position of the sandwich copper base, and the specific operation process is as follows: firstly, high-temperature glue with a preset size is arranged on an upper film pressing wheel and a lower film pressing wheel and is fixed, then the high-temperature glue pressing process is carried out, the high-temperature glue pressing process is started when the first infrared ray senses that copper at the copper-based bending part of the sandwich core passes through, and the high-temperature glue pressing process is stopped when the second infrared ray senses that no copper passes through;
step five: browning each sandwiched copper base pasted with the high-temperature glue and two cut FR4 boards, and then pressing according to a specific pressing procedure;
step six: sequentially drilling a hole, depositing a copper plate, plating an outer layer circuit, electroplating a pattern, etching the outer layer, detecting the outer layer A01 and performing a green oil process on the laminated sandwich copper substrate;
step seven: designing a V-CUT line according to the boundary line of high-temperature glue attached to the sandwiched copper-based bending position according to engineering requirements, then cutting and separating the high-temperature glue and the FR4 board at the bending position from a normal board V of a customer, and routing the board according to a CNC (computer numerical control) figure designed according to the engineering requirements after the V cutting and separation are completed;
step eight: inserting a sheet clamp between the bending position of the sandwich copper-based plate and the high-temperature glue, and tearing off the high-temperature glue and the FR4 plate on the bending position;
step nine: carrying out FQC1 and tin precipitation surface treatment process;
step ten: performing numerical control bending according to a V secant at the sandwich copper-based bending position;
step eleven: FQC2 and final packaging process are performed.
2. The method for manufacturing the multilayer copper-based sandwich bending plate according to claim 1, wherein in the fourth step, an infrared system added on a manual dry film laminator specifically comprises two pairs of infrared emission lamps and infrared receiving lamps, and the two pairs of infrared emission lamps and infrared receiving lamps are respectively arranged on two sides of the upper film pressing wheel and the lower film pressing wheel.
3. The method for manufacturing the multilayer copper-based sandwich bending plate according to claim 1, wherein the specific pressing procedure in the fifth step specifically comprises:
a. the speed of the sandwich copper base is reduced by 50% when the copper base is subjected to browning;
b. the prepreg used in the browning process is a prepreg with the glue content of 90%;
c. the time of the low temperature section in the pressing process is prolonged by 80 min;
d. after the semi-solidified glue is fully melted and flows into the holes and the slotted holes of the sandwich copper base, the high pressure of a press is increased by 16 percent;
e. the total time of pressing is prolonged by 40 min.
4. The method for manufacturing the multilayer copper-based sandwich bending plate according to claim 1, wherein in the seventh step, V-CUT separation is performed by using a large plate V-CUT machine, and the V-CUT depth is controlled within 0.05mm when performing V-CUT.
5. The manufacturing method of the multilayer copper-based sandwich bending plate according to claim 1, wherein in the seventh step, the routing parameters are reduced by 60% during routing, and the service life of a routing knife is controlled within 5 m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811502188.4A CN111295048A (en) | 2018-12-10 | 2018-12-10 | Manufacturing method of multilayer copper-based sandwich bent plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811502188.4A CN111295048A (en) | 2018-12-10 | 2018-12-10 | Manufacturing method of multilayer copper-based sandwich bent plate |
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| Publication Number | Publication Date |
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| CN111295048A true CN111295048A (en) | 2020-06-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811502188.4A Pending CN111295048A (en) | 2018-12-10 | 2018-12-10 | Manufacturing method of multilayer copper-based sandwich bent plate |
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| KR20040083152A (en) * | 2003-03-21 | 2004-10-01 | 주식회사 에스아이 플렉스 | Manufacturing method for Multi-layer Flexible Printed Circuit Board |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
| CN107548244A (en) * | 2017-08-30 | 2018-01-05 | 景旺电子科技(龙川)有限公司 | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based |
-
2018
- 2018-12-10 CN CN201811502188.4A patent/CN111295048A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040083152A (en) * | 2003-03-21 | 2004-10-01 | 주식회사 에스아이 플렉스 | Manufacturing method for Multi-layer Flexible Printed Circuit Board |
| CN102523692A (en) * | 2011-12-30 | 2012-06-27 | 深圳崇达多层线路板有限公司 | Stepped circuit board manufacturing process |
| CN106304697A (en) * | 2016-08-24 | 2017-01-04 | 江门崇达电路技术有限公司 | A kind of manufacture method of false rigid-flex combined board |
| CN107484356A (en) * | 2017-08-01 | 2017-12-15 | 深圳明阳电路科技股份有限公司 | A kind of preparation method of the sandwich aluminium base of thick copper |
| CN107548244A (en) * | 2017-08-30 | 2018-01-05 | 景旺电子科技(龙川)有限公司 | The preparation method to be insulated between a kind of two-sided sandwich copper base inside is copper-based |
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