CN115426776A - Method for manufacturing PET/PI material etched circuit die-cutting process flexible double-sided board - Google Patents

Method for manufacturing PET/PI material etched circuit die-cutting process flexible double-sided board Download PDF

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Publication number
CN115426776A
CN115426776A CN202211155109.3A CN202211155109A CN115426776A CN 115426776 A CN115426776 A CN 115426776A CN 202211155109 A CN202211155109 A CN 202211155109A CN 115426776 A CN115426776 A CN 115426776A
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CN
China
Prior art keywords
circuit
die
pet
sided
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202211155109.3A
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Chinese (zh)
Inventor
李伟
王国辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinyu Mulinsen Circuit Board Co ltd
Original Assignee
Xinyu Mulinsen Circuit Board Co ltd
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Publication date
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Priority to CN202211155109.3A priority Critical patent/CN115426776A/en
Publication of CN115426776A publication Critical patent/CN115426776A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

The invention discloses a method for manufacturing a flexible double-sided board by adopting a PET/PI material etching circuit die cutting process, which adopts the PET/PI material as a base material and adopts the etching circuit die cutting process, and comprises the following steps: gluing materials, screen printing/roll coating lines, etching, gluing the back of the lines, die cutting combination, writing, baking, surface treatment, inspection and packaging. The etching and die cutting method comprises the whole process flow of the double-sided board of circuit manufacturing and solder mask manufacturing, shortens the production flow of the double-sided flexible circuit board, and improves the production benefit, reduces the product cost and improves the production quality yield when the line width and the line distance of the production line are less than 0.65 mm.

Description

Method for manufacturing flexible double-sided board by using PET/PI material etching circuit die cutting process
Technical Field
The invention relates to the field of manufacturing of flexible circuit boards, in particular to a method for manufacturing a flexible double-sided board by using a PET/PI material etching circuit and die cutting process.
Background
The existing circuit manufacturing technology of the flexible double-sided board mainly has two modes, namely a wiring hot-pressing method and a die cutting process.
Wiring hot pressing method: the copper wire lines are distributed on a PI film or PET film substrate through wiring equipment, then the PI film or PET film substrate is subjected to hot pressing and laminating to enable the copper foil and the substrate to be tightly adhered into a whole, and then the copper wires are cut off by laser burning to enable the copper wire lines to be divided into wire sections with electrical performance, so that a circuit graph is formed. The wiring hot pressing method belongs to a physical process, is environment-friendly, but only simple linear lines can be laid, and a circuit with electrical performance needs to cut off copper wires by using laser, so that oil leakage in a welding prevention process and tin paste leakage in an SMT (surface mount technology) process are caused by cutting through a PI (polyimide) substrate while cutting a copper foil by using laser energy, and the process is immature and cannot be applied in batches.
The die cutting process flow comprises the following steps: die-cutting blind hole → die-cutting open window → die-cutting back circuit → die-cutting forming → material collection. Die cutting of blind holes: on a die-cutting machine, punching the PET/PI circuit board with the glued back surface through a first station blind hole circular knife die, removing copper foil waste in the hole, and forming a circuit via hole; die cutting and windowing: punching a PET/PI film through a second station windowing circular knife die, removing film waste at a windowing position, and forming a windowing pad pattern; die cutting a back circuit: cutting the copper/aluminum plate by a third station back line circular knife mold, removing waste materials at the back line position, and forming a back line pattern; post-press molding: superposing the circuit pattern formed after rolling with a windowing pattern, and performing hot-pressing combination at a fourth station to form a complete flexible double-sided circuit board; meanwhile, a flexible double-sided circuit board product of the single PCS is formed by slitting through a slitting circular knife die at a fourth station; receiving: and rolling and transferring the semi-finished single-sided flexible circuit to the next process.
The die cutting process uses a circular knife die to cut the copper foil into a circuit pattern on the circular knife die cutting machine, and the circuit pattern and the PI film or the PET film are cut into a welding position to be heated and compounded to form the flexible double-sided circuit board. When the line width and the line distance are less than 0.3mm, the die cutting process cannot be used for production, when the line width and the line distance are less than 0.65mm, the production benefit is low, the quality cannot be controlled, the quality exceeds the standard, the quality is abnormal, the quality rejection rate exceeds the standard, and the product cost is greatly increased.
At present, the flexible circuit board industry has matured to produce physically conducted double-sided flexible circuit board products in large batch by using die cutting machine equipment, a circular knife die, PI materials and copper foil materials; the flexible double-sided board product produced by adopting the etching circuit and the die cutting equipment belongs to a chemical and physical method manufacturing process, and the market of the flexible double-sided board product produced by adopting the method also belongs to a blank. The conventional double-sided flexible circuit board is complicated in production process, the whole process flow of the double-sided board including circuit manufacturing and solder mask manufacturing is realized by etching and die cutting, the production flow of the double-sided flexible circuit board is shortened, the production process capability can meet the product requirement, the production efficiency is improved, the cost is reduced, and the product has market competitive advantage.
Disclosure of Invention
The invention provides a method for manufacturing a flexible double-sided board by adopting a PET/PI material etching circuit die cutting process, which adopts the PET/PI material as a base material and adopts the etching circuit die cutting process, and comprises the following steps:
gluing materials, lines, etching, gluing the back of the lines, combining die cutting, writing, baking, surface treating, inspecting and packaging.
Further, the material gluing is to evenly coat a layer of bonding glue on the PET/PI base material by adopting a glue coater, and the bonding glue is baked to form a semi-cured state.
Further, the circuit is formed by printing ink on a material copper foil to directly form a circuit pattern by utilizing screen printing/roll coating of the circuit pattern, and the etching is to etch away an exposed copper layer by acid etching liquid and then remove an exposed dry film layer on the circuit to form the circuit pattern.
Further, the back gluing of the circuit is to uniformly coat a layer of adhesive glue on the back of the PET/PI circuit board by using a glue coater, and the adhesive glue is baked to form a semi-cured state.
Further, the die-cutting combination comprises: on a die cutting machine, punching the PET/PI circuit board with the back coated with the glue through a first station blind hole circular knife die, removing copper foil waste in the hole, and forming a circuit via hole; punching a PET/PI film through a second station windowing circular knife die, removing film waste at a windowing position, and forming a windowing pad pattern; cutting the copper/aluminum plate through a third station back line circular knife die, removing waste materials at the back line position, and forming a back line pattern; superposing the circuit pattern formed after rolling with a windowing pattern, and performing hot-pressing combination at a fourth station to form a complete flexible double-sided circuit board; and simultaneously, a flexible double-sided circuit board product of the single PCS is formed by slitting through a slitting circular knife die at a fourth station.
Further, the baking is baking at 120 ℃, and the material glue and the character printing ink are fully cured to meet the requirement of the service performance of the product.
Further, the characters are printed on the flexible double-sided circuit board after die cutting is finished by adopting silk screen printing to print character marks of the circuit board components.
Further, the surface treatment is to form a layer of organic protective film on the bonding pad of the circuit board by chemically treating the manufactured double-sided flexible circuit board, so that the effects of preventing the oxidation of the bonding pad and assisting the welding of the SMT patch are achieved.
Further, the inspection is appearance and circuit performance inspection, and the package is vacuum package shipment.
A flexible double-sided circuit board prepared according to any one of the methods.
The invention uses the etching circuit and the die cutting process to manufacture the flexible double-sided board of the PI/PET substrate, improves the process capability, can bear more types of orders, widens the market share, and achieves the purposes of reducing the product cost and improving the quality.
Compared with the existing flexible double-sided board circuit manufacturing process, the etching and die cutting process disclosed by the invention comprises the whole process flow of double-sided boards of circuit manufacturing and solder mask manufacturing, so that the production flow of the double-sided flexible circuit board is shortened, and when the line width and line distance of the production line is less than 0.65mm, the production benefit is improved, the product cost is reduced, and the production quality yield is improved.
Drawings
FIG. 1 is an expanded view of a recessed/screen printing of the front circuit of the embodiment of the present invention;
FIG. 2 is an expanded view of the windowing circular knife mold according to the embodiment of the invention;
FIG. 3 is an expanded view of a circular knife mold for a back side circuit according to an embodiment of the present invention;
FIG. 4 is a combination diagram of an embodiment of the present invention;
FIG. 5 is a diagram of a completed product of an embodiment of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention relates to a production method for manufacturing a flexible double plate by adopting a PET/PI material as a base material and adopting an etching circuit and die cutting process.
Examples
The production process of the flexible double-sided die-cutting board sequentially comprises material gluing → screen printing/rolling coating line → etching → gluing of the back of the line, die cutting combination, character-baking-surface treatment-inspection-packaging.
Gluing materials: uniformly coating a layer of bonding glue on the PET/PI substrate by using a glue coating machine, and baking to form a semi-cured state;
a circuit: printing ink on the copper foil by screen printing/roll coating to form circuit pattern (figure 1, width 250 MM);
etching: etching the exposed copper layer by using an acidic etching solution, and removing the exposed dry film layer on the circuit to form a circuit pattern;
gluing the back of the circuit: uniformly coating a layer of bonding glue on the back surface of the PET/PI circuit board by using a glue coating machine, and baking to form a semi-cured state;
die cutting combination:
on a die cutting machine, punching a circuit board coated with glue on the back surface of PET/PI through a first station blind hole circular knife die, removing copper foil waste in a hole, and forming a circuit via hole;
punching a PET/PI film through a second station windowing circular knife die, removing film waste at a windowing position, and forming a windowing pad pattern; (FIG. 2)
Cutting the copper/aluminum plate by a third station back line circular knife mold, removing waste materials at the back line position, and forming a back line pattern; (FIG. 3)
Superposing the circuit pattern formed after rolling with a windowing pattern, and performing hot-pressing combination at a fourth station to form a complete flexible double-sided circuit board; simultaneously, a flexible double-sided circuit board product of the single PCS is formed through slitting by a slitting circular knife die at a fourth station; (FIGS. 4-5)
Baking: baking at 120 ℃, and fully curing the material glue and the character printing ink to meet the requirement of the use performance of the product;
and (3) writing: printing character marks of components of the circuit board on the die-cut flexible double-sided circuit board by adopting screen printing;
surface treatment, namely chemically treating the manufactured double-sided flexible circuit board to form an organic protective film on a bonding pad of the circuit board to play a role in preventing the oxidation of the bonding pad and assisting the welding of an SMT (surface mount technology) patch;
and (4) checking: checking appearance and circuit performance;
and (3) packaging: and (7) carrying out vacuum packaging and delivery.
The key points of the technology of the invention are as follows: the product with the line width/line distance smaller than 0.65mm can be produced, and meanwhile, the die cutting process or the etching line and die cutting process can be selected according to the line width/line distance to produce the product, so that more types of orders can be received and the production cost of the product can be reduced.
The design of the invention is characterized in that: the product with the line width/line distance smaller than 0.65mm is produced by combining the circuit with the die cutting process after independently etching the circuit by adjusting the production process flow.
The invention provides a technical method of the production flow of the etched circuit die cutting process.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (10)

1. The utility model provides a flexible double sided board manufacturing method of PET/PI material etching circuit with die cutting technology which characterized in that adopts the PET/PI material as the substrate, adopts the etching circuit to add the die cutting technology preparation, and the step includes:
gluing materials, lines, etching, gluing the back of the lines, combining die cutting, writing, baking, surface treating, inspecting and packaging.
2. The method of claim 1, wherein the method comprises the steps of: the material gluing step is that a glue coater is adopted to evenly coat a layer of bonding glue on the PET/PI base material, and the bonding glue is baked to form a semi-curing state.
3. The method of claim 2, wherein the method comprises the steps of: the circuit is formed by printing ink on a material copper foil by utilizing a screen printing/roll coating circuit pattern to directly form the circuit pattern, and the etching is to etch an exposed copper layer by acidic etching liquid medicine and then remove an exposed dry film layer on the circuit to form the circuit pattern.
4. The method of claim 3, wherein the method comprises the steps of: the line back gluing step is that a glue coater is adopted to evenly coat a layer of bonding glue on the back of the PET/PI circuit board, and the bonding glue is baked to form a semi-cured state.
5. The method for manufacturing a PET/PI etched circuit and die-cut flexible double-sided board according to any one of claims 1 to 4, wherein: the die-cutting combination comprises: on a die-cutting machine, punching the PET/PI circuit board with the back coated with the glue through a first station blind hole circular knife die, removing copper foil waste in the hole, and forming a circuit via hole; punching a PET/PI film through a second station windowing circular knife die, removing film waste at a windowing position, and forming a windowing pad pattern; cutting the copper/aluminum plate by a third station back line circular knife mold, removing waste materials at the back line position, and forming a back line pattern; superposing the circuit pattern formed after rolling with a windowing pattern, and performing hot-pressing combination at a fourth station to form a complete flexible double-sided circuit board; and simultaneously, a flexible double-sided circuit board product of the single PCS is formed by slitting through a slitting circular knife die at a fourth station.
6. The method of claim 5, wherein the method comprises the steps of: the baking is performed at 120 ℃, and the material glue and the character printing ink are fully cured to meet the requirement of the service performance of the product.
7. The method for manufacturing the PET/PI etched circuit with the die-cutting process flexible double-sided board as claimed in claim 6, wherein: the characters are printed on the flexible double-sided circuit board after die cutting is finished by adopting silk screen printing to print character marks of the circuit board components.
8. The method for manufacturing the PET/PI etched circuit with the die-cutting process flexible double-sided board as claimed in claim 6 or 7, wherein the method comprises the following steps: the surface treatment is to form a layer of organic protective film on the bonding pad of the circuit board by chemically treating the manufactured double-sided flexible circuit board, and the organic protective film plays a role in preventing the oxidation of the bonding pad and the soldering aid of the SMT paster.
9. The method of claim 8, wherein the flexible double-sided board is manufactured by the process of etching the circuit and die-cutting the PET/PI material, and comprises: the inspection is appearance and circuit performance inspection, and the package is vacuum package shipment.
10. The utility model provides a flexible double-sided circuit board which characterized in that: prepared by the process according to any one of claims 1 to 9.
CN202211155109.3A 2022-09-22 2022-09-22 Method for manufacturing PET/PI material etched circuit die-cutting process flexible double-sided board Withdrawn CN115426776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211155109.3A CN115426776A (en) 2022-09-22 2022-09-22 Method for manufacturing PET/PI material etched circuit die-cutting process flexible double-sided board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211155109.3A CN115426776A (en) 2022-09-22 2022-09-22 Method for manufacturing PET/PI material etched circuit die-cutting process flexible double-sided board

Publications (1)

Publication Number Publication Date
CN115426776A true CN115426776A (en) 2022-12-02

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CN202211155109.3A Withdrawn CN115426776A (en) 2022-09-22 2022-09-22 Method for manufacturing PET/PI material etched circuit die-cutting process flexible double-sided board

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Application publication date: 20221202

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