CN111294113A - Emitted light power monitoring device and preparation method thereof - Google Patents

Emitted light power monitoring device and preparation method thereof Download PDF

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Publication number
CN111294113A
CN111294113A CN202010085168.2A CN202010085168A CN111294113A CN 111294113 A CN111294113 A CN 111294113A CN 202010085168 A CN202010085168 A CN 202010085168A CN 111294113 A CN111294113 A CN 111294113A
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China
Prior art keywords
detector
pcb
gold
laser
insulating carrier
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CN202010085168.2A
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Chinese (zh)
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CN111294113B (en
Inventor
鲁振华
梁付运
汤金宽
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Yangtze Optical Fibre and Cable Co Ltd
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Yangtze Optical Fibre and Cable Co Ltd
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Priority to CN202010085168.2A priority Critical patent/CN111294113B/en
Publication of CN111294113A publication Critical patent/CN111294113A/en
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Publication of CN111294113B publication Critical patent/CN111294113B/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/07—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems
    • H04B10/075—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal
    • H04B10/079—Arrangements for monitoring or testing transmission systems; Arrangements for fault measurement of transmission systems using an in-service signal using measurements of the data signal
    • H04B10/0795—Performance monitoring; Measurement of transmission parameters
    • H04B10/07955—Monitoring or measuring power
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H04B10/802—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections for isolation, e.g. using optocouplers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
    • H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
    • H04B10/803—Free space interconnects, e.g. between circuit boards or chips
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50—Transmitters
    • H04B10/501—Structural aspects
    • H04B10/503—Laser transmitters

Abstract

The invention belongs to the technical field of optical communication and discloses an emitted light power monitoring device and a preparation method thereof, wherein the device comprises a laser, a detector body, a detector insulating carrier and a PCB; the PCB is provided with differential signal lines and bonding pads; the laser is connected with the laser driver through a differential signal line; the detector insulating carrier is arranged between the laser and the laser driver and is in contact with the PCB; the first partial area of the back surface of the detector body is attached to the second surface of the detector insulating carrier, the photosensitive surface of the detector body faces the backlight end of the laser, and the detector body and the PCB are spaced by a first distance; a gold plating area is arranged on the second surface of the detector insulating carrier; the detector body is connected with the gold-plated area, and the gold-plated area is connected with the bonding pad of the PCB. The invention solves the problem that the emitted light power monitoring scheme in the prior art cannot be applied to optical module products adopting COB packaging technology, and can realize reliable light power monitoring.

Description

Emitted light power monitoring device and preparation method thereof
Technical Field
The invention relates to the technical field of optical communication, in particular to an emitted light power monitoring device and a preparation method thereof.
Background
With the coming and continuous development of the data era, the stability and smoothness of the information transmission channel and the information security are gradually valued. The optical module is used as a key material in an optical communication system, and the performance of the optical module in the system directly influences the stability and safety of the optical communication system. The working state of an optical module in the system is effectively monitored, and the method is an important guarantee for guaranteeing the stability of a communication system. Therefore, regardless of manufacturers of optical modules, manufacturers of devices, or operators, people pay more and more attention to monitoring the operating state of the optical modules, and monitoring the emitted optical power of the optical modules is an important ring for monitoring the operating state of the optical modules.
At present, most manufacturers abandon a relatively mature BOX packaging process with extremely high cost, but adopt a Chip On Board (COB) process, and because the COB process has harsh requirements on space and high-speed signal processing, the high-density parallel optical modules such as 100G CWDM4 are difficult to monitor the emitted light power.
Generally, monitoring of the emitted light power of the optical module is realized by detecting the backlight size of the laser through a detector, and because the proportion between the emitted light power of the optical module and the backlight size of the laser is basically fixed after the optical module is molded, the detector first detects the backlight, and then the emitted light power of the optical module can be calculated through a proportional relation, and a schematic diagram is shown in fig. 1.
Because the traditional BOX packaging process is mostly bare Die, the laser driver can be arranged very close to the laser, the laser driver and the laser are electrically connected through Wire Bonding process, and the TOP surface of the driver is mostly an insulating layer, so the traditional BOX packaging process mostly adopts the mode of placing a detector on the driver, and the schematic diagram is shown in figure 2.
However, since the laser driver of the COB process is generally located relatively far from the laser, placing the probe on the driver results in no light being received by the probe. In addition, the driver and the laser are connected through differential wiring, and the detector cannot be directly placed on the differential wiring, so that the traditional emitted light power monitoring scheme cannot be applied to optical module products adopting a COB packaging scheme.
Disclosure of Invention
The embodiment of the application provides the emitted light power monitoring device and the preparation method thereof, and solves the problem that the emitted light power monitoring scheme in the prior art cannot be applied to optical module products adopting a COB packaging process.
The embodiment of the present application provides an emitted optical power monitoring apparatus, including: the detector comprises a laser, a detector body, a detector insulating carrier and a PCB;
the PCB is provided with differential signal lines and bonding pads;
the laser and the laser driver are connected through the differential signal line;
the probe insulating carrier is arranged between the laser and the laser driver, and a first surface of the probe insulating carrier is in contact with the PCB;
a first partial area of the back surface of the detector body is attached to a second surface of the detector insulating carrier, a photosensitive surface of the detector body faces a backlight end of the laser, and the detector body and the PCB are spaced by a first distance;
a gold-plated area is arranged on the second surface of the detector insulating carrier;
the detector body is connected with the gold-plated area, and the gold-plated area is connected with the bonding pad of the PCB.
Preferably, the gold-plated area is printed with a first line for electrical signal connection between the probe body and the PCB.
Preferably, the gold-plated area comprises a first gold-plated area and a second gold-plated area; the second partial area of the back surface of the detector body is attached to the first gold-plated area through conductive silver adhesive, and the detector body is connected with the second gold-plated area through a gold wire.
Preferably, the detector insulating carrier adopts a ceramic gasket.
Preferably, the gold-plated area is connected with the bonding pad of the PCB through conductive silver adhesive.
Preferably, the monitoring device comprises N paths of monitoring units, each path of monitoring unit comprises one laser, one detector body and one detector insulating carrier, and the N paths of monitoring units share one PCB; the PCB is provided with 2N welding pads.
On the other hand, the embodiment of the present application provides a method for manufacturing the above-mentioned emitted optical power monitoring apparatus, including the following steps:
step 1, presetting a bonding pad and a differential signal wire on a PCB;
step 2, mounting and attaching a detector insulating carrier to the PCB, wherein the bonding pad of the PCB is bonded with the gold-plated area of the detector insulating carrier through conductive silver adhesive;
step 3, attaching the detector body to the detector insulating carrier, wherein the detector body is electrically connected with the gold-plated area of the detector insulating carrier;
and 4, mounting a laser on the PCB, wherein the laser is connected with the differential signal line through a gold wire.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
in the embodiment of the application, under the conditions that the laser position of the optical module is relatively fixed, the laser driver adopting the COB process is far away from the laser, and the laser driver and the laser are connected through differential wiring, by adopting the emitted light power monitoring device provided by the invention, the detector body is electrically connected with the gold-plated area of the detector insulating carrier, and the gold-plated area is connected with the bonding pad of the PCB, so that the connection between the detector signal and the related signal on the PCB can be ensured in the actual working process of the optical module; because the detector insulating carrier can not influence the signal quality of the differential signal line, the detector body can be isolated from the differential signal line through the detector insulating carrier, and further the detector body is ensured not to influence the differential signal line, so that the detector body can be ensured to be close to the laser as far as possible, and reliable optical power monitoring is realized.
Drawings
In order to more clearly illustrate the technical solution in the present embodiment, the drawings needed to be used in the description of the embodiment will be briefly introduced below, and it is obvious that the drawings in the following description are one embodiment of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a schematic diagram illustrating the principle of monitoring the emitted optical power of an optical module in the prior art;
fig. 2 is a schematic diagram illustrating a principle of monitoring a light emitting power of an optical module using a BOX package process in the prior art;
fig. 3 is a schematic structural diagram of an emitted optical power monitoring apparatus according to embodiment 1 of the present invention;
fig. 4 is a schematic diagram of a basic structure of an emitted optical power monitoring apparatus according to embodiment 2 of the present invention;
fig. 5 is a schematic diagram of an optimized structure of an emitted optical power monitoring apparatus according to embodiment 2 of the present invention.
Detailed Description
In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.
Example 1:
the present embodiment provides an apparatus for monitoring emitted optical power, including: the detector comprises a laser, a detector body, a detector insulating carrier and a PCB.
As shown in fig. 3, the PCB is provided with differential signal lines (i.e. two elongated PCB traces in fig. 3), and pads (i.e. two square PCB traces in fig. 3), which are located at two sides of the differential signal lines. The laser and the laser driver are connected through the differential signal line.
The detector insulating carrier is arranged between the laser and the laser driver, and a first surface of the detector insulating carrier is in contact with the PCB.
Because the probe insulation carrier is not electrically conductive near the first surface of the differential signal line, the probe insulation carrier does not affect the signal quality of the differential signal line. In addition, the upper surface of the differential signal wire is covered by green oil, so that the insulation effect between the differential signal wire and the detector insulation carrier can be further increased.
Specifically, the detector insulating carrier can adopt a ceramic gasket, and the ceramic gasket has the advantages of low cost and easiness in processing.
The first partial area of the back surface of the detector body is attached to the second surface of the detector insulating carrier, the photosensitive surface of the detector body faces the backlight end of the laser, and the detector body and the PCB are separated by a first distance, namely the detector body and the PCB are not in contact.
And a gold-plated area is arranged on the second surface of the detector insulating carrier, a first circuit is arranged on the gold-plated area, and the first circuit is used for electric signal connection between the detector body and the PCB. The detector body is connected with the gold-plated area, and the gold-plated area is connected with the bonding pad of the PCB.
In a specific embodiment, the gold-plated region includes a first gold-plated region and a second gold-plated region; the second partial area of the back surface of the detector body is attached to the first gold-plated area through conductive silver adhesive, and the detector body is connected with the second gold-plated area through a gold wire.
The gold-plated area and the detector body are both attached to the second surface of the detector insulating carrier, namely the gold-plated area and the detector body are attached to the same plane, because the back surface of the detector body and the gold-plated area are electrically connected, and the same surface process is easy to realize.
The gold-plated area is connected with the bonding pad of the PCB through conductive silver adhesive.
In a specific scheme, a signal of the detector is connected to the gold-plated area, the gold-plated area is in contact with a bonding pad on the PCB, and the gold-plated area and the bonding pad are connected through silver adhesive, so that the function of fixing the detector insulating carrier on the PCB is achieved on the basis of signal connection.
For example, the probe insulation carrier has a rectangular parallelepiped shape, and the second surface and the first surface of the probe insulation carrier are perpendicular.
The detector comprises a detector body, a detector insulating carrier, a detector signal, a differential signal line, a detector signal and a PCB, wherein the detector insulating carrier is arranged on the detector body, the detector insulating carrier is arranged on the PCB, the detector signal is connected with the signal line on the PCB, the detector insulating carrier is arranged on the detector body, the detector signal is connected with the signal line on the PCB, and the detector insulating carrier is arranged on the detector body.
Example 2:
embodiment 2 provides an emitted optical power monitoring apparatus, which includes N monitoring units, each monitoring unit includes one laser, one probe body, and one probe insulating carrier, and the N monitoring units share one PCB.
In one design, the PCB is provided with 2N of the pads.
In another design, a part of the pads may be shared between some adjacent monitoring units. For example, a device for monitoring generated optical power includes four paths of monitoring units (respectively referred to as a first path, a second path, a third path, and a fourth path), and then only six pads may be disposed on the PCB, one pad may be shared between the first path and the second path of monitoring units, and one pad may be shared between the third path and the fourth path of monitoring units.
The following describes a transmitted optical power monitoring apparatus using a 100G CWDM4 optical module as an example.
Since 100G CWDM4 is a four channel module with four lasers, the four lasers emitted light power monitoring can be satisfied with the solution of example 1 with four sets. The overall structure is schematically shown in fig. 4.
Specifically, the emitted light power monitoring device comprises four monitoring units, each monitoring unit comprises one laser, one detector body and one detector insulating carrier, and the four monitoring units share one PCB. Eight pads are arranged on the PCB, as shown in FIG. 4. In a preferred embodiment, a part of the pads may be shared between some adjacent monitoring units, and six pads are disposed on the PCB, as shown in fig. 5.
For a 100G CWDM4 optical module, since the position of the laser is relatively fixed and the monitoring is more reliable the closer the probe body is to the laser, the probe body needs to be close to the laser, but since there are many differential lines around the laser, it is also necessary to ensure that the probe body does not affect the differential signal lines.
The 100G CWDM4 optical module uses four probe insulation carriers to separate four probe bodies from differential signal lines, and specifically, one probe body is adhered to one probe insulation carrier. Each monitoring unit is the same as the scheme in the embodiment 1, and in the actual working process of the optical module, a detector signal is connected with the PCB.
For example, the required circuit of the probe body is firstly printed on the ceramic gasket by adopting a process of gold plating the ceramic gasket; the detector body is connected with the gold-plated area of the ceramic gasket through a gold wire and conductive silver adhesive, and then the gold-plated area of the ceramic gasket is connected with the PCB through the conductive silver adhesive by a surface mounting process, so that the connection of a detector signal and a related signal on the PCB is realized.
The laser driver is connected with the laser through the differential signal line, which is a universal connection mode of 100G CWMD4 products; the side of the ceramic gasket, which is close to the differential signal wire, is not conductive per se, so that the signal quality of the differential signal wire cannot be influenced per se, and meanwhile, the upper surface of the differential signal wire is covered by green oil to further increase the insulation effect between the ceramic gasket and the ceramic gasket; the detector is adhered to the ceramic gasket through conductive silver adhesive, and the detector is not contacted with the differential signal line, so that the differential line signal is not influenced; the detector signal is connected to the gold-plated area of the ceramic gasket through a gold wire and conductive silver adhesive, the gold-plated area is in contact with the bonding pad on the PCB, and the gold-plated area is connected with the PCB bonding pad through the silver adhesive, so that the ceramic gasket is fixed on the PCB on the basis of signal connection. The ceramic pad with the probe body can be pushed forward to a position closer to the laser, thereby achieving reliable optical power monitoring.
Embodiment 2 can make up for a short board of the 100G CWDM4 optical module that does not transmit optical power monitoring, and implement real-time monitoring of the operating state of the optical module, which is a key device in the communication system, and implement system stability.
Example 3:
embodiment 3 provides a method for preparing the above-mentioned emitted optical power monitoring device (the emitted optical power monitoring device in embodiment 1 or embodiment 2), which mainly includes the following steps:
step 1, presetting a bonding pad and a differential signal wire on a PCB;
step 2, attaching a detector insulating carrier to the PCB, wherein the bonding pad of the PCB is connected with the gold-plated area of the detector insulating carrier through conductive silver adhesive;
step 3, attaching the detector body to the detector insulating carrier, wherein the detector body is electrically connected with the gold-plated area of the detector insulating carrier;
and 4, mounting a laser on the PCB, wherein the laser is connected with the differential signal line through a gold wire.
Taking a 100G CWDM4 optical module as an example, the preparation method of the emitted light power monitoring device comprises the following steps:
step 1, reserving a bonding pad for bonding a ceramic gasket at a corresponding position during PCB design; in consideration of reducing the process difficulty, two adjacent channels can share part of the bonding pad, the design area of the bonding pad can be doubled, and great convenience is brought to the control of the glue amount, the size of the bonding force and the like;
step 2, dispensing silver paste at the position of the bonding pad, wherein the silver paste amount is required to cover the whole plane of the bonding pad, sticking a ceramic gasket, and extruding the silver paste by the ceramic gasket to overflow the silver paste, so that the bonding pad is connected with a gold-plated area on the ceramic gasket;
step 3, after the silver colloid is baked and cured, rotating the PCB by 90 degrees, and sticking the detector body on the ceramic gasket by the same method; and after the silver adhesive is solidified, carrying out gold wire connection on the detector body and the ceramic carrier.
Step 4, after the ceramic gasket and the detector body are adhered, the function of the monitoring part is basically realized, then the laser is adhered, the silver adhesive is dispensed at the position where the laser is reserved and adhered, the laser is adhered, the silver adhesive is baked and cured, and then gold wire connection is carried out;
and 5, after a series of later installation and adjustment tests, the 100G CWDM4 optical module with the function of monitoring the emitted light power can reach a stable working state.
To sum up, the invention develops a device capable of effectively monitoring the emitted light power of the optical module and a corresponding preparation method based on deep research on the COB process and high-speed signal processing, and the device can ensure that the detector body is as close to the laser as possible under the conditions that the laser position of the optical module is relatively fixed, the laser driver adopting the COB process is far away from the laser, and the laser driver and the laser are connected through differential routing, so as to realize reliable light power monitoring.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to examples, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.

Claims (7)

1. An emitted optical power monitoring apparatus, comprising: the detector comprises a laser, a detector body, a detector insulating carrier and a PCB;
the PCB is provided with differential signal lines and bonding pads;
the laser and the laser driver are connected through the differential signal line;
the probe insulating carrier is arranged between the laser and the laser driver, and a first surface of the probe insulating carrier is in contact with the PCB;
a first partial area of the back surface of the detector body is attached to a second surface of the detector insulating carrier, a photosensitive surface of the detector body faces a backlight end of the laser, and the detector body and the PCB are spaced by a first distance;
a gold-plated area is arranged on the second surface of the detector insulating carrier;
the detector body is connected with the gold-plated area, and the gold-plated area is connected with the bonding pad of the PCB.
2. The emitted optical power monitoring device of claim 1, wherein the gold-plated area is printed with a first trace for electrical signal connection between the probe body and the PCB.
3. The emitted optical power monitoring device of claim 1, wherein the gold-plated regions comprise a first gold-plated region, a second gold-plated region; the second partial area of the back surface of the detector body is attached to the first gold-plated area through conductive silver adhesive, and the detector body is connected with the second gold-plated area through a gold wire.
4. The emitted optical power monitoring apparatus of claim 1, wherein the probe insulating carrier is a ceramic spacer.
5. The emitted optical power monitoring device of claim 1, wherein the gold-plated region is connected to the pad of the PCB by a conductive silver paste.
6. The apparatus according to claim 1, comprising N monitoring units, each monitoring unit comprising one of said lasers, one of said probe bodies, and one of said probe insulating carriers, wherein N monitoring units share one of said PCBs; the PCB is provided with 2N welding pads.
7. A method of manufacturing an optical power monitoring device as claimed in any of claims 1 to 6, comprising the steps of:
step 1, presetting a bonding pad and a differential signal wire on a PCB;
step 2, mounting and attaching a detector insulating carrier to the PCB, wherein the bonding pad of the PCB is bonded with the gold-plated area of the detector insulating carrier through conductive silver adhesive;
step 3, attaching the detector body to the detector insulating carrier, wherein the detector body is electrically connected with the gold-plated area of the detector insulating carrier;
and 4, mounting a laser on the PCB, wherein the laser is connected with the differential signal line through a gold wire.
CN202010085168.2A 2020-02-10 2020-02-10 Emitted light power monitoring device and preparation method thereof Active CN111294113B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113676258A (en) * 2021-08-20 2021-11-19 武汉华工正源光子技术有限公司 Optical module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109412697A (en) * 2018-11-06 2019-03-01 何玉亭 A kind of optical-electric module for information one-way transmission
CN208780860U (en) * 2018-08-20 2019-04-23 武汉华工正源光子技术有限公司 Optical module based on the attachment of COB technique
CN208833961U (en) * 2018-08-01 2019-05-07 深圳市易飞扬通信技术有限公司 Optical module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208833961U (en) * 2018-08-01 2019-05-07 深圳市易飞扬通信技术有限公司 Optical module
CN208780860U (en) * 2018-08-20 2019-04-23 武汉华工正源光子技术有限公司 Optical module based on the attachment of COB technique
CN109412697A (en) * 2018-11-06 2019-03-01 何玉亭 A kind of optical-electric module for information one-way transmission

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113676258A (en) * 2021-08-20 2021-11-19 武汉华工正源光子技术有限公司 Optical module
CN113676258B (en) * 2021-08-20 2022-08-19 武汉华工正源光子技术有限公司 Optical module

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