CN208780860U - Optical module based on the attachment of COB technique - Google Patents
Optical module based on the attachment of COB technique Download PDFInfo
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- CN208780860U CN208780860U CN201821341026.2U CN201821341026U CN208780860U CN 208780860 U CN208780860 U CN 208780860U CN 201821341026 U CN201821341026 U CN 201821341026U CN 208780860 U CN208780860 U CN 208780860U
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Abstract
The utility model relates to field of photoelectric technology, a kind of optical module based on the attachment of COB technique, including pcb board are provided, further includes photoelectric conversion component and heat-conducting piece, pcb board has a perforative through-hole of through-thickness, in at least partially embedded through-hole of heat-conducting piece；Photoelectric conversion component includes laser driver and signal amplifier, and laser driver and signal amplifier are at least partly mounted on the patch face of heat-conducting piece, and are at least partly mounted on pcb board.The utility model passes through being at least partly mounted on laser driver and signal amplifier on heat-conducting piece, at least partly it is mounted on pcb board again, on the one hand the heat of the generation of the biggish laser driver of calorific value and signal amplifier when working can promptly be conducted away by heat-conducting piece, to solve the heat dissipation problem in COB technique, on the other hand this mounting method will not also lead to the failure of device because of expanding with heat and contract with cold, and this mounting method is simply easily achieved, and can effectively improve production efficiency.
Description
Technical field
The utility model relates to field of photoelectric technology, specially a kind of optical module based on the attachment of COB technique.
Background technique
COB (chip on board) technology be it is a kind of using glue by chip it is chip directly placed on PCBA so
The technology of coupling package is carried out afterwards.In recent years, mainstream is increasingly becoming in optical communication data class product scope COB encapsulation scheme
Scheme.Compared to conventional coaxial technology, optical chip is directly adhered on PCB by COB technology, eliminates same axle envelope
TO encapsulation process in technique is filled, therefore has that encapsulating structure is more compact, operating process is simpler, the advantages such as more efficient.
It is big by sensitivity that Lens Coupling in current existing COB technology relies primarily on monitoring optical power and receiving end
Small completion Lens Coupling, it needs constantly to find and adjust in coupling the position of lens, so that coupling efficiency is low, is produced into
This height；Meanwhile with the continuous promotion of optical module rate, laser array, detector array, laser driver, signal amplification
The power consumption of device is continuously increased, and the requirement to heat dissipation design in COB technique is higher and higher, and traditional is laid with copper sheet, chip by PCB
The modes such as envisaged underneath via hole have been unable to meet thermal design demand.
Utility model content
The purpose of this utility model is to provide a kind of optical modules based on the attachment of COB technique, at least can solve existing
Segmental defect in technology.
To achieve the above object, the utility model embodiment provides the following technical solutions: it is a kind of based on COB technique attachment
Optical module, including pcb board, further include photoelectric conversion component and heat-conducting piece, and the pcb board has through-thickness perforative logical
Hole, in at least partially embedded through-hole of heat-conducting piece；The photoelectric conversion component includes laser driver and signal amplification
Device, the heat-conducting piece have exposed radiating surface, also there is the confession laser driver and the signal amplifier to mount
Patch face, the laser driver and the signal amplifier are at least partly mounted on the patch face of the heat-conducting piece,
And it is at least partly mounted on the pcb board.
Further, lens are installed, the photoelectric conversion component further includes laser array and detector on the pcb board
Array, the laser array and the detector array are mounted on the pcb board, the laser driver, it is described swash
In light device array, the detector array and the signal amplifier are respectively positioned in the overlay area of the lens.
Further, the heat-conducting piece, which is embedded in the pcb board, forms an entirety；The heat-conducting piece include size block with
And the small size block in the size block, the small size block is embedded in the through-hole, and the small size block is exposed
Face is the patch face；The exposed face of the size block is radiating surface.
Further, the through-hole is stepped hole, and the stepped hole includes heavy caliber hole and small-diameter hole, the small size
Block is embedded in the small-diameter hole, and the size block is embedded in the heavy caliber hole.
Further, it is additionally provided with several first mounting structures on the pcb board, has on the heat-conducting piece and several described the
One-to-one several first positioning and mounting structures of one mounting structure, the size of each first mounting structure is all larger than each
The size of first positioning and mounting structure；If the lens have one-to-one with several first positioning and mounting structures
Dry third positioning and mounting structure, each first positioning and mounting structure pass through corresponding first mounting structure, and with it is right
The third positioning and mounting structure answered is installed together.
Further, the pcb board is equipped with several second mounting structures, has and several described second on the heat-conducting piece
One-to-one several second positioning and mounting structures of mounting structure, each second positioning and mounting structure and corresponding described the
Two mounting structures are installed together.
Further, the junction of each first positioning and mounting structure and the corresponding third positioning and mounting structure,
And each second positioning and mounting structure is equipped with sealant with the junction of corresponding second mounting structure.
Further, there are several laser transmitting-receiving holes on the laser array, have on the lens and described swash with each
Light receives and dispatches several laser channeling holes that hole corresponds and face cooperates.
Further, the difference in height between the pcb board and the patch face of the heat-conducting piece is less than 15 μm.
Further, the size of the laser driver and the signal amplifier is all larger than the size in the patch face.
Compared with prior art, the utility model has the beneficial effects that
1, it by being at least partly mounted on laser driver and signal amplifier on heat-conducting piece, at least partly mounts again
On pcb board, on the one hand can by heat-conducting piece by work when calorific value biggish laser driver and signal amplifier production
Raw heat promptly conducts away, and to solve the heat dissipation problem in COB technique, on the other hand this mounting method will not also be because of
The failure of device is expanded with heat and contract with cold and caused, and this mounting method is simply easily achieved, production efficiency can be effectively improved.
2, pass through the first positioning and mounting structure, third positioning and mounting structure, Laser output hole, laser pick-off hole and laser
The cooperation positioning of access opening from each other can easily determine that laser array and detector array are listed on pcb board very much
Lens cover is finally again closed in position, can complete lens passive coupling moment, overcome and need to pass through in the prior art
It finds and adjusts the position of lens to complete the defect of coupling, greatly improve the efficiency of coupling.
Detailed description of the invention
Fig. 1 is a kind of explosive view of optical module based on the attachment of COB technique provided in an embodiment of the present invention；
Fig. 2 is pcb board and the heat-conducting piece installation of a kind of optical module based on the attachment of COB technique provided in an embodiment of the present invention
Structural schematic diagram；
Fig. 3 is that laser driver, the signal of a kind of optical module based on the attachment of COB technique provided in an embodiment of the present invention are put
The layout of big device, laser array and detector array；
Fig. 4 is a kind of another face of the pcb board of optical module based on the attachment of COB technique provided in an embodiment of the present invention
Structural schematic diagram；
In appended drawing reference: 100-PCB plate；120- through-hole；1200- heavy caliber hole；1201- small-diameter hole；200- heat-conducting piece；
2000- size block；2001- small size block；210- patch face；The second positioning and mounting structure of 2201-；300- laser driver；
400- laser array；500- detector array；600- signal amplifier；700- lens；The first positioning and mounting structure of 800-；
The second positioning and mounting structure of 801-；802- third positioning and mounting structure；The first mounting structure of 803-；The second mounting structure of 804-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
All other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-4 is please referred to, the embodiment of the present invention also provides a kind of optical module based on the attachment of COB technique, including pcb board
100, photoelectric conversion component and heat-conducting piece 200.Wherein, the pcb board 100 has the perforative through-hole 120 of through-thickness, institute
It states in at least partially embedded through-hole 120 of heat-conducting piece 200；The photoelectric conversion component includes laser driver 300 and signal
Amplifier 600, the heat-conducting piece 200 have exposed radiating surface, also have and supply the laser driver 300 and the signal
The mounted patch face 210 of amplifier 600, the laser driver 300 and the signal amplifier 600 at least partly mount
On the patch face 210 of the heat-conducting piece 200, and at least partly it is mounted on the pcb board 100.In the present embodiment, thermally conductive
The effect of part 200 is just used as passing to heat, and generate heat serious laser driver 300 and signal amplifier 600 when by work
Heat conducts away, to play the role of heat dissipation, but in heat dissipation, need laser driver 300 and signal amplifier 600 with this
The contact of heat-conducting piece 200 just can be with, therefore a pair of of opposite face of the heat-conducting piece 200 is divided into and is defined as radiating surface and patch face 210,
Radiating surface defined in it, radiating surface are contacted by heat-conducting pad with module housing, therefore can play the effect of heat dissipation, and are defined
Patch face 210 is the installation in order to position laser driver 300 and signal amplifier 600, the two devices pass through COB patch work
Skill is attached on the patch face 210, and at least part is also mounted on pcb board 100, and mode that so overlapped can also guarantee
Laser driver 300 and signal amplifier 600 will not fail when expanding with heat and contract with cold, because in the prior art, completely driving laser
Dynamic device 300 and signal amplifier 600 are mounted on heat-conducting piece 200, when expanding with heat and contract with cold, laser driver 300 and laser
Line between array is easy to be torn and fail, and can focus in the quality of line in the prior art, spends big cost
The flexibility of the line is transformed, but hardly realize this virtually to improve the cost of manufacture of this optical module, is unfavorable for industrial hair
Exhibition, and use this programme to ensure that good heat dissipation, and solve because of defect caused by expanding with heat and contract with cold, also reduce production
Cost.In actual design, the size of heat-conducting piece 200 can be larger as far as possible, to obtain the effect of more good heat dissipation,
But to guarantee that the size of through-hole 120 will be matched with heat-conducting piece 200, simultaneously to guarantee the integral installation of optical module.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 1, lens 700 are installed on the pcb board, the light
Electric transition components further include laser array 400 and detector array 500, the laser array 400 and the detector array
Column 500 are mounted on the pcb board 100, the laser driver 300, the laser array 400, the detector array
Column 500 and the signal amplifier 600 are respectively positioned in the overlay area of the lens.In the present embodiment, by Laser Driven
After device 300, the laser array 400, the detector array 500 and the signal amplifier 600 install, then install
Upper lens 700, can be completed passive coupling, extremely convenient.
As the prioritization scheme of the embodiment of the present invention, Fig. 1-Fig. 4 is please referred to, is additionally provided with several first on the pcb board 100
Mounting structure 803, it is fixed with several first mounting structures 803 one-to-one several first to have on the heat-conducting piece 200
Position mounting structure 800, the size of each first mounting structure 803 are all larger than each first positioning and mounting structure 800
Size；The lens 700 have and the one-to-one several third location and installations of several first positioning and mounting structures 800
Structure 802, each first positioning and mounting structure 800 pass through corresponding first mounting structure 803, and with corresponding institute
It states third positioning and mounting structure 802 to be installed together, to complete the coupling assembly of lens 700.In the present embodiment, in order to
Lens 700 are stably installed on pcb board 100, larger-size several first mounting structures 803 are set on pcb board 100,
Size is lesser on heat-conducting piece 200 sets several first positioning and mounting structures 800, these first positioning and mounting structures 800 can be from
It passes through in these first mounting structures 803 (since 803 size of the first mounting structure is big, so the first location and installation will not be interfered
Structure 800), while several third positioning and mounting structures 802 are set on lens 700, lens 700 are covered on pcb board 100
When, by the cooperation of the first positioning and mounting structure 800 and third positioning and mounting structure 802, the stable peace of lens 700 can be completed
Dress and accurate positioning installation.Preferably, these positioning and mounting structures can be hole and correspond to hole, then be connected with external connector
It connects, is also possible to the cooperation of Kong Yuzhu, such as a preferred scheme of the invention, as shown in Figure 1, each first positioning
Mounting structure 800 is that hole is inserted into hole using column, be can be completed then each third positioning and mounting structure 802 is column
The positioning of clamping assembly and lens position.Wherein, the first mounting structure 803 is circular hole structure or square cavernous structure.Preferably,
There are two the quantity of first positioning and mounting structure 800 and third positioning and mounting structure 802 is equal, convenient for positioning and fix.
As the prioritization scheme of the embodiment of the present invention, there are several laser transmitting-receiving holes on the laser array 400, it is described
There are several laser channeling holes with each laser transmitting-receiving hole one-to-one correspondence and face cooperation on lens.Thus it completes
The accurate positioning of mirror is installed.For ease of description, each laser transmitting-receiving hole on laser array 400 is defined as laser hole
Several laser channeling holes on lens with several laser hole A1 cooperation are defined as laser hole A2 by A1.It is excellent as the present invention one
The scheme of choosing, laser transmitting-receiving hole particularly may be divided into Laser output hole and laser pick-off hole, and the quantity of both of which altogether is just
It is equal with the quantity in laser channeling hole, it so completes to correspond, such as the quantity in laser channeling hole has eight, then laser goes out
The quantity in unthreaded hole and laser pick-off hole is just respectively four, and the one-to-one correspondence that so can achieve between four Kong Yusi holes is matched
It sets.If 4 holes, four holes can be enclosed rectangular, be also convenient for selecting the central point of the square configuration.Preferably, eight holes
Can be enclosed it is rectangular, convenient for selecting the central point of the square configuration.
Advanced optimize above scheme, the laser array 400, the detector array 500, the laser driver
300 and the signal amplifier 600 respectively on the pcb board 100 accurate positioning installation the step of are as follows: a is led described
Two the first positioning and mounting structures 800 and two the second positioning and mounting structures 801 are set on warmware, while in the pcb board 100
Two thirds are arranged in two the first mounting structures 803 of upper setting and two the second mounting structures 804 also on the lens 700
The size of each first mounting structure 803 is respectively provided with to be greater than each first positioning and pacified by positioning and mounting structure 802
The size of assembling structure 800；Heat-conducting piece 200 is embedded in the through-hole 120 by b by the back side to the positive direction of the pcb board 100,
It is coupled by each second positioning and mounting structure 801 with corresponding second mounting structure 804, it is described thermally conductive to realize
Positioning of the part 200 on the pcb board 100 and preliminary installation；Each at this time first positioning and mounting structure 800 is by described
The back side of pcb board 100 passes through the front that corresponding first mounting structure 803 arrives the pcb board 100；C, described in two
The reference point when midpoint of first positioning and mounting structure, 800 line is mounted as the laser array 400, and obtain described
Several laser hole A2 on mirror 700 are enclosed the center of shape relative to two 802 lines of third positioning and mounting structure
Midpoint position, to find the mounting position of the laser array 400 on the pcb board 100；Position is mounted determining
When setting, need to guarantee the mounting position of the laser array 400 to two first positioning and mounting structures 800 line
Positional relationship between midpoint and each laser hole A2 are enclosed shape to two 802 lines of third positioning and mounting structure
Positional relationship between midpoint is identical, thus to complete the positioning and attachment of laser array 400；D, with going out for laser array
Light center is reference point, is required according to design size, and the patch of the detector array is completed；E is required according to design size,
It is respectively completed the positioning and attachment of the laser driver 300 and the signal amplifier；The lens 700 are covered on by f
On the pcb board 100, by by each third positioning and mounting structure 802 and corresponding first positioning and mounting structure
Assembly between 800 solves to complete the passive coupling of the lens 700 and also needs seeking by lens in the prior art
It looks for and adjusts position and carry out the true docking location of centering.In the present embodiment, design size require be can be preset, therefore,
Behind the position and attachment for orienting laser array 400, the detector array 500, the laser driver can be completed
300 and the signal amplifier 600 positioning and attachment.Similarly, the position of detector array 500 is oriented, then to position
It other three positions can also be to orient the position of laser driver 300 or signal amplifier 600, then respectively to position it
His three positions can also be with the mode of positioning is same as above.
Certainly, in addition to this is by first completing positioning method of one of device again to position other three devices, lead to
After first positioning two of them device, then can also be with to position the position of remaining two devices, or by first positioning wherein three
A device, then the position of the last one device is good or four devices all use above-mentioned positioning method one certain to position
Position.These types of mode is all feasible, but these embodiments are not intended as restriction of the invention.
When by the way of positioning one by one to position, specific steps are as follows: will be detected for the purposes of convenient for description
Each laser transmitting-receiving hole on device array 500 is defined as laser hole B1, will swash on lens with the several of several laser hole B1 cooperation
Optical channel hole is defined as laser hole B2, each laser transmitting-receiving hole on laser driver 300 is defined as laser hole C1, by lens
Upper several laser channeling holes with several laser hole C1 cooperation are defined as laser hole C2, will be each sharp on signal amplifier 600
Light transmitting-receiving hole is defined as laser hole D1, and several laser channeling holes on lens with several laser hole D1 cooperation are defined as laser hole
D2。
C1, when being mounted using the midpoint of two 800 lines of the first positioning and mounting structure as the detector array 500
Reference point, and obtain several laser hole B2 on the lens 700 and be enclosed the center of shape relative to two described
The position at the midpoint of three positioning and mounting structures, 802 line, to find the detector array 500 on the pcb board 100
Mounting position；When determining mounting position, need to guarantee that the mounting position of the detector array 500 is fixed to two described first
Positional relationship and each laser hole B2 between the midpoint of the line of position mounting structure 800 are enclosed shape to two thirds
Positional relationship between the midpoint of 802 line of positioning and mounting structure is identical；To complete the positioning and attachment of detector array 500；
C2, when being mounted using the midpoint of two 800 lines of the first positioning and mounting structure as the laser driver 300
Reference point, and obtain several laser hole C2 on the lens 700 and be enclosed the center of shape relative to two described
The position at the midpoint of three positioning and mounting structures, 802 line, to find the laser driver 300 on the pcb board 100
Mounting position；When determining mounting position, need to guarantee that the mounting position of the laser driver 300 is fixed to two described first
Positional relationship and each laser hole C2 between the midpoint of the line of position mounting structure 800 are enclosed shape to two thirds
Positional relationship between the midpoint of 802 line of positioning and mounting structure is identical；To complete the positioning and attachment of laser driver 300；
C3, when being mounted using the midpoint of two 800 lines of the first positioning and mounting structure as the signal amplifier 600
Reference point, and obtain several laser hole D2 on the lens 700 and be enclosed the center of shape relative to two described
The position at the midpoint of three positioning and mounting structures, 802 line, to find the signal amplifier 600 on the pcb board 100
Mounting position；When determining mounting position, need to guarantee that the mounting position of the signal amplifier 600 is fixed to two described first
Positional relationship and each laser hole D2 between the midpoint of the line of position mounting structure 800 are enclosed shape to two thirds
Positional relationship between the midpoint of 802 line of positioning and mounting structure is identical；To complete the positioning and attachment of signal amplifier 600；
As the prioritization scheme of the embodiment of the present invention, chip mounter can be used and carry out dress patch, it can be in advance by above-mentioned position
Program is directed respectively into the chip mounter by relationship after finding, and so can more quickly finish attachment, specifically can be with
The path of chip mounter walking is set on X-Y plane.
As the prioritization scheme of the embodiment of the present invention, the pcb board is equipped with several second mounting structures, the heat-conducting piece
It is upper to have and one-to-one several second positioning and mounting structures of several second mounting structures, each second positioning peace
Assembling structure is installed together with corresponding second mounting structure, to realize positioning of the heat-conducting piece on the pcb board
With preliminary installation.In the present embodiment, in order to which heat-conducting piece to be stably installed on pcb board, if the second location and installation knot
Structure and the cooperation of the second mounting structure are cooperated, i.e., when installing heat-conducting piece by the second positioning and mounting structure and the second mounting structure
The stable fixed and positioned accurate installation of achievable heat-conducting piece.Preferably, these positioning and mounting structures can be hole and correspond to hole,
Then it is connected with external connector, is also possible to the cooperation of Kong Yuzhu, such as a preferred scheme of the invention, such as scheme
Shown in 1, each second mounting structure is inserted into hole using column then each second positioning and mounting structure is column for hole
In, the positioning of clamping assembly and heat-conducting piece position can be completed.Preferably, the second positioning and mounting structure and the second mounting structure
There are two quantity is equal, convenient for positioning and fix.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 2, the institute of the pcb board 100 and the heat-conducting piece 200
The difference in height between patch face 210 is stated less than 15 μm.In the present embodiment, such as Fig. 2, pcb board 100 is divided for upper surface and following table
Face is upper surface against this side of paper, and a face with its face is lower surface.Heat-conducting piece 200 close to upper surface this
The face of side is patch face 210, and heat-conducting piece 200 is mounted on the back side of pcb board 100, and the part with patch face 210 can be embedded into
In through-hole 120, such patch face 210 can be come through this side of the upper surface of pcb board.In the size of design heat-conducting piece 200
When, on the one hand it should be noted that it can be embedded into through-hole 120, after on the other hand needing to be embedded in, patch face 210 is wanted and pcb board
Difference in height between 100 upper surface is less than 15 μm, to meet the required precision in COB technique to patch face.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 1, the heat-conducting piece 200 that optimization is above-mentioned.The heat-conducting piece
An entirety is formed in the 200 insertion pcb boards, it is only necessary to control size；The heat-conducting piece 200 includes size block
2000 and the small size block 2001 in the size block 2000, the small size block 2001 be embedded in the through-hole 120,
And the exposed face of the small size block 2001 is the patch face 210；The exposed face of the size block 2000 is radiating surface, from
The lower surface direction of pcb board, which is seen, can just see.In the present embodiment, heat-conducting piece 200, which is similar to, sets one in the upper surface of one piece of square plate
The structure of boss, square plate here refer to size block 2000, and boss refers to small size block 2001.In the above embodiments
In, heat-conducting piece 200 can only be regarded as to the boss in the present embodiment, can be embedded in through-hole 120.And in the present embodiment
In, after advanced optimizing the heat-conducting piece 200, size block 2000 can have bigger heat dissipation area, when small size block 2001 will
After heat is transmitted in size block 2000, it will be able to more promptly scatter away heat, to reach better heat dissipation effect.
Above scheme is advanced optimized, referring to Fig. 4, Fig. 4 is the schematic diagram of 100 lower surface of pcb board.It can be seen that described
The through-hole 120 of pcb board 100 is stepped hole, and the stepped hole includes heavy caliber hole 1200 and small-diameter hole 1201, described
Small size block 2001 is embedded in the small-diameter hole 1201, and the size block 2000 is embedded in the heavy caliber hole 1200.In this reality
Apply in example, by by pcb board 100 be designed to can with the matched stepped hole of heat-conducting piece 200 after above-mentioned optimization, during installation only
The direction by the heat-conducting piece 200 after optimization from the lower surface of pcb board 100 to upper surface is needed to be inserted into stepped hole, it will be able to
After guaranteeing that heat-conducting piece 200 is embedded into the stepped hole of pcb board 100, the either upper surface of pcb board 100 or pcb board 100
Lower surface is capable of forming the plane of an entirety, is more conducive to the installation of finished product entirety.
It is fixed in every one first positioning and mounting structure 800 third corresponding with its as the prioritization scheme of the embodiment of the present invention
The junction of position mounting structure 802 is equipped with sealant, equally, in every one second positioning and mounting structure 801 corresponding with its second
Sealant also is provided at mounting structure 804.In the present embodiment, by mode for dispensing glue, sealant is coated in above, so as to lead
The combination between combination and lens 700 and pcb board 100 between warmware 200 and pcb board 100 is more firm.
As the prioritization scheme of the embodiment of the present invention, referring to Fig. 3, the laser driver 300 and the signal are put
The size of big device 600 is all larger than the size in the patch face 210.In the present embodiment, they two size be optimized for than patch
Unilateral 210 size is big, can so guarantee that more sides of the two devices can touch pcb board 100, avoid contact with not
Product is not available caused by good.
Above scheme is advanced optimized, referring to Fig. 3, being mounted on the laser driver 300 on the heat-conducting piece 200
Wherein three edges extend to outside the patch face 210, and three edges of the laser driver 300 be mounted on it is described
On pcb board 100；Wherein three edges for the signal amplifier 600 being mounted on the heat-conducting piece 200 extend to the patch
Outside unilateral 210, and three edges of the signal amplifier 600 are mounted on the pcb board 100.In the present embodiment, have
Body, guarantee that three edges of the two devices can be overlapped with pcb board 100, avoids the problem that expanding with heat and contract with cold and bring.
As the prioritization scheme of the embodiment of the present invention, the heat-conducting piece 200 is the metal material or non-with the capacity of heat transmission
Metal material.In the present embodiment, as long as heat-conducting piece 200 has the material of good heat conductive ability and material easy to process is
It can.Such as: metal material: copper, aluminium；Nonmetallic materials: graphite flake, carbon nanotube.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (10)
1. a kind of optical module based on the attachment of COB technique, including pcb board, it is characterised in that: further include photoelectric conversion component and
Heat-conducting piece, the pcb board has the perforative through-hole of through-thickness, in at least partially embedded through-hole of heat-conducting piece；Institute
Stating photoelectric conversion component includes laser driver and signal amplifier, and the heat-conducting piece has exposed radiating surface, also has and supply
The patch face of the laser driver and signal amplifier attachment, the laser driver and the signal amplifier
It is at least partly mounted on the patch face of the heat-conducting piece, and is at least partly mounted on the pcb board.
2. a kind of optical module based on the attachment of COB technique as described in claim 1, it is characterised in that: installed on the pcb board
There are a lens, the photoelectric conversion component further includes laser array and detector array, the laser array and the detection
Device array is mounted on the pcb board, the laser driver, the laser array, the detector array and institute
Signal amplifier is stated to be respectively positioned in the overlay area of the lens.
3. a kind of optical module based on the attachment of COB technique as described in claim 1, it is characterised in that: the heat-conducting piece insertion
An entirety is formed in the pcb board；The heat-conducting piece includes size block and the small size in the size block
The exposed face of block, the small size block insertion through-hole, and the small size block is the patch face；Outside the size block
The face of dew is radiating surface.
4. a kind of optical module based on the attachment of COB technique as claimed in claim 3, it is characterised in that: the through-hole is ladder
Hole, the stepped hole include heavy caliber hole and small-diameter hole, and the small size block is embedded in the small-diameter hole, the large scale
Block is embedded in the heavy caliber hole.
5. a kind of optical module based on the attachment of COB technique as claimed in claim 2, it is characterised in that: also set on the pcb board
There are several first mounting structures, it is fixed with several first mounting structures one-to-one several first to have on the heat-conducting piece
Position mounting structure, the size of each first mounting structure are all larger than the size of each first positioning and mounting structure；Institute
State lens have with several first positioning and mounting structures several third positioning and mounting structures correspondingly, each described the
One positioning and mounting structure passes through corresponding first mounting structure, and is mounted on the corresponding third positioning and mounting structure
Together.
6. a kind of optical module based on the attachment of COB technique as claimed in claim 5, it is characterised in that: the pcb board is equipped with
Several second mounting structures, have on the heat-conducting piece and one-to-one several second positioning of several second mounting structures
Mounting structure, each second positioning and mounting structure are installed together with corresponding second mounting structure.
7. a kind of optical module based on the attachment of COB technique as claimed in claim 6, it is characterised in that: each described first is fixed
Position mounting structure and the junction of the corresponding third positioning and mounting structure and each second positioning and mounting structure and
The junction of corresponding second mounting structure is equipped with sealant.
8. a kind of optical module based on the attachment of COB technique as claimed in claim 2, it is characterised in that: the laser array
It is upper that there are several laser transmitting-receiving holes, it is corresponded with each laser transmitting-receiving hole and face cooperation if having on the lens
Dry laser channeling hole.
9. a kind of optical module based on the attachment of COB technique as described in claim 1, it is characterised in that: the pcb board with it is described
Difference in height between the patch face of heat-conducting piece is less than 15 μm.
10. a kind of optical module based on the attachment of COB technique as described in claim 1, it is characterised in that: the laser driver
And the size of the signal amplifier is all larger than the size in the patch face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821341026.2U CN208780860U (en) | 2018-08-20 | 2018-08-20 | Optical module based on the attachment of COB technique |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108761673A (en) * | 2018-08-20 | 2018-11-06 | 武汉华工正源光子技术有限公司 | Optical module and preparation method thereof based on the attachment of COB techniques |
| CN111294113A (en) * | 2020-02-10 | 2020-06-16 | 长飞光纤光缆股份有限公司 | Emitted light power monitoring device and preparation method thereof |
| CN111458815A (en) * | 2020-05-22 | 2020-07-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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2018
- 2018-08-20 CN CN201821341026.2U patent/CN208780860U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108761673A (en) * | 2018-08-20 | 2018-11-06 | 武汉华工正源光子技术有限公司 | Optical module and preparation method thereof based on the attachment of COB techniques |
| CN108761673B (en) * | 2018-08-20 | 2023-07-25 | 武汉华工正源光子技术有限公司 | COB technology-based mounted optical module and manufacturing method thereof |
| CN113093349A (en) * | 2020-01-08 | 2021-07-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113093349B (en) * | 2020-01-08 | 2022-08-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN111294113A (en) * | 2020-02-10 | 2020-06-16 | 长飞光纤光缆股份有限公司 | Emitted light power monitoring device and preparation method thereof |
| CN111294113B (en) * | 2020-02-10 | 2021-01-15 | 长飞光纤光缆股份有限公司 | Emitted light power monitoring device and preparation method thereof |
| CN111458815A (en) * | 2020-05-22 | 2020-07-28 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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