CN114696911B - Optical fiber communication processing module based on heterogeneous encapsulation - Google Patents
Optical fiber communication processing module based on heterogeneous encapsulation Download PDFInfo
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- CN114696911B CN114696911B CN202210329504.2A CN202210329504A CN114696911B CN 114696911 B CN114696911 B CN 114696911B CN 202210329504 A CN202210329504 A CN 202210329504A CN 114696911 B CN114696911 B CN 114696911B
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- 238000004891 communication Methods 0.000 title claims abstract description 84
- 239000013307 optical fiber Substances 0.000 title claims abstract description 81
- 238000012545 processing Methods 0.000 title claims abstract description 53
- 238000005538 encapsulation Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 230000010354 integration Effects 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 4
- 238000012536 packaging technology Methods 0.000 abstract description 3
- 238000013459 approach Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000010365 information processing Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229940125773 compound 10 Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- ZLVXBBHTMQJRSX-VMGNSXQWSA-N jdtic Chemical compound C1([C@]2(C)CCN(C[C@@H]2C)C[C@H](C(C)C)NC(=O)[C@@H]2NCC3=CC(O)=CC=C3C2)=CC=CC(O)=C1 ZLVXBBHTMQJRSX-VMGNSXQWSA-N 0.000 description 1
- 239000011257 shell material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
The invention discloses an optical fiber communication processing module based on heterogeneous encapsulation, which comprises: a substrate, an optical fiber communication processing circuit and a fan-out structure; the substrate comprises a first surface and a second surface which are oppositely arranged; the optical fiber communication processing circuit is arranged on the first surface of the substrate and comprises a processor, a photoelectric detection module and a laser module, wherein the processor is used for controlling the laser module to output optical fiber communication signals and controlling the photoelectric detection module to receive the optical fiber communication signals; the fan-out structure is arranged on the second surface of the substrate and is used for fanning out power pins and signal pins of the processor. The invention integrates the devices such as a processor, a storage, photoelectric/electro-optical conversion, optical fibers and the like through the photoelectric heterogeneous high-density integrated packaging technology, meets the requirements of new generation optical fiber communication electronic equipment on modularization, high integration level, miniaturization, low power consumption and high reliability, and greatly simplifies the processing and transmission design of optical fiber communication electronic equipment signals.
Description
Technical Field
The invention relates to the technical field of optical fiber communication processing, in particular to an optical fiber communication processing module based on heterogeneous packaging.
Background
As the process of silicon-based circuits gradually approaches the limit, moore's law also goes to the end, and the processing power and I/O transmission power of the monolithic circuit approaches the limit. In the field of communication information processing at present, photoelectric transmission/processing of mass data is broken through on a system, and requirements of miniaturization, low power consumption, high-speed transmission processing and the like are simultaneously required.
However, conventional discrete devices, such as a processor+an optical module+a communication interface+storage, are integrated secondarily through a PCB carrier board, which has a large volume, a large weight, and high power consumption, and do not meet the integration requirements of the current communication electronic devices. Therefore, how to improve the integrated packaging capability of the optoelectronic communication module is a technical problem to be solved.
The foregoing is provided merely for the purpose of facilitating understanding of the technical solutions of the present invention and is not intended to represent an admission that the foregoing is prior art.
Disclosure of Invention
The invention mainly aims to provide an optical fiber communication processing module based on heterogeneous packaging, and aims to solve the technical problem that the integrated packaging degree of the existing photoelectric communication module is not high.
In order to achieve the above object, the present invention provides an optical fiber communication processing module based on heterogeneous encapsulation, the optical fiber communication processing module comprising:
a substrate including a first face and a second face disposed opposite to each other;
the optical fiber communication processing circuit is arranged on the first surface of the substrate and comprises a processor, a photoelectric detection module and a laser module, wherein the photoelectric detection module and the laser module are connected with the processor, and the processor is used for controlling the laser module to output optical fiber communication signals and controlling the photoelectric detection module to receive the optical fiber communication signals;
the fan-out structure is arranged on the second surface of the substrate and is used for fanning out power pins and signal pins of the processor.
Optionally, the photodetector module includes a laser and a laser driver, where the laser driver is connected to the processor and the laser, and is configured to control a paranoid working current and a modulating working current of the laser according to a driving signal of the processor.
Optionally, a first height adjusting cavity is disposed at a first position of the substrate, and the laser driver is disposed in the first height adjusting cavity, so as to reduce a bonding point drop between the laser and the laser driver.
Optionally, the photoelectric detection module comprises a photoelectric detector and an amplifier, and the processor controls the working state of the photoelectric detector according to the state signal output by the amplifier.
Optionally, a second height adjusting cavity is disposed at a second position of the substrate, and the amplifier is disposed in the second height adjusting cavity, so as to reduce a bonding point drop between the photodetector and the amplifier.
Optionally, the substrate is a resin packaging substrate, and the first surface of the resin packaging substrate is provided with a mixed plating layer, and the mixed plating layer comprises electroplated thick gold and transition thin gold.
Optionally, metal wires are distributed in the substrate, and the metal wires electrically connect the processor with the power supply pins and the signal pins.
Optionally, the optical fiber communication processing module further includes a communication optical fiber, and the optical fiber communication processing circuit further includes a photoelectric coupling component, where the photoelectric coupling component is used to align the communication optical fiber to the light source of the laser module and the light source of the photodetector respectively.
Optionally, the optical fiber communication processing module further comprises a cover plate, and the cover plate is fixedly connected with the substrate by adopting an adhesion process; the cover plate is made of heat dissipation materials, and the processor is in contact with the cover plate.
Optionally, the cover plate is provided with an optical fiber port, the communication optical fiber passes through the optical fiber port, and the optical fiber port is filled with sealing glue and is cured.
The embodiment of the invention provides an optical fiber communication processing module based on heterogeneous encapsulation, which comprises: a substrate, an optical fiber communication processing circuit and a fan-out structure; the substrate comprises a first surface and a second surface which are oppositely arranged; the optical fiber communication processing circuit is arranged on the first surface of the substrate and comprises a processor, a photoelectric detection module and a laser module, wherein the processor is used for controlling the laser module to output optical fiber communication signals and controlling the photoelectric detection module to receive the optical fiber communication signals; the fan-out structure is arranged on the second surface of the substrate and is used for fanning out power pins and signal pins of the processor. The invention integrates the devices such as a processor, a storage, photoelectric/electro-optical conversion, optical fibers and the like through the photoelectric heterogeneous high-density integrated packaging technology, meets the requirements of new generation optical fiber communication electronic equipment on modularization, high integration level, miniaturization, low power consumption and high reliability, and greatly simplifies the processing and transmission design of optical fiber communication electronic equipment signals.
Drawings
FIG. 1 is a schematic diagram of a front structure of an optical fiber communication processing module according to the present invention;
FIG. 2 is a schematic diagram of the back structure of the optical fiber communication processing module according to the present invention;
FIG. 3 is a schematic side view of the A-A of FIG. 1 in accordance with the present invention;
FIG. 4 is a schematic side view of the B-B of FIG. 1 in accordance with the present invention;
FIG. 5 is a top view of a fiber optic communications processing module according to the present invention;
FIG. 6 is a bottom view of the fiber optic communications processing module of the present invention;
fig. 7 is a side view of a fiber optic communications processing module according to the present invention.
Reference numerals illustrate:
| reference numerals | Name of the name | Reference numerals | Name of the name |
| 1 | Processor and method for controlling the same | 6 | Photoelectric detection module |
| 2 | Photoelectric coupling component | 7 | Substrate board |
| 3 | Memory device | 8 | Fan-out structure |
| 4 | Communication optical fiber | 9 | Cover plate |
| 5 | Laser module | 10 | Sealing glue |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
As the process of silicon-based circuits gradually approaches the limit, moore's law also goes to the end, and the processing power and I/O transmission power of the monolithic circuit approaches the limit. In the field of communication information processing at present, photoelectric transmission/processing of mass data is broken through on a system, and requirements of miniaturization, low power consumption, high-speed transmission processing and the like are simultaneously required.
However, conventional discrete devices, such as a processor+an optical module+a communication interface+storage, are integrated secondarily through a PCB carrier board, which has a large volume, a large weight, and high power consumption, and do not meet the integration requirements of the current communication electronic devices. Therefore, how to improve the integrated packaging capability of the optoelectronic communication module is a technical problem to be solved.
To solve this problem, various embodiments of the heterogeneous package-based optical fiber communication processing module of the present invention are presented. The optical fiber communication processing module based on heterogeneous packaging integrates devices such as a processor, a storage, photoelectric/electro-optical conversion, optical fibers and the like through the photoelectric heterogeneous high-density integrated packaging technology, meets the requirements of new-generation optical fiber communication electronic equipment on modularization, high integration level, miniaturization, low power consumption and high reliability, and greatly simplifies the processing and transmission design of optical fiber communication electronic equipment signals.
The embodiment of the invention provides an optical fiber communication processing module based on heterogeneous packaging, and referring to fig. 1, fig. 1 is a schematic diagram of a front structure of the optical fiber communication processing module based on heterogeneous packaging.
In this embodiment, the optical fiber communication processing module based on heterogeneous packaging includes a substrate 7, an optical fiber communication processing circuit, and a fan-out structure 8.
Specifically, the substrate 7 includes relative first face and the second face that sets up, optical fiber communication processing circuit set up in the first face of substrate 7, optical fiber communication processing circuit includes treater 1 and connection photoelectric detection module 6 and laser module 5 of treater 1, treater 1 is used for control laser module 5 output optical fiber communication signal and control photoelectric detection module 6 receives optical fiber communication signal, fan-out structure 8 set up in the second face of substrate 7, fan-out structure 8 is used for fan-out treater 1's power pin and signal pin.
It should be noted that, in this embodiment, the laser module 5 includes a laser driver and a laser, the photo-detection module 6 includes a photo-detector and an amplifier, the processor 1 may employ an FPGA chip, and configure a corresponding memory 3, i.e. a PLASH chip, for the FPGA chip, for program storage of the FPGA; the photodetector may be a 4-channel PD photodetector; the laser adopts a 4-channel VCSEL laser. The FPGA chip utilizes a self-configured temperature sensor to feedback control the paranoid working current and the modulation working current of the 4-channel VCSEL laser.
On this basis, as shown in fig. 2, the fan-out structure 8 adopts a BGA array, and is used for fanning out the power supply and signals of the FPGA chip, and the connection line of the signal fan-out is electrically connected with the chip on the front side of the substrate 7 through the metal wiring and the via hole inside the substrate 7.
The substrate 7 is a resin package substrate 7, and a first surface of the resin package substrate 7 is provided with a mixed plating layer, and the mixed plating layer includes thick gold plating and thin gold plating. Further, the FPGA chip can be soldered to the resin package substrate 7 by a flip-chip soldering process, and filled with the underfill material for curing.
As shown in fig. 3, in some embodiments, the laser driver is connected to the processor 1 and the laser, and is configured to control a paranoid operating current and a modulation operating current of the laser according to a driving signal of the processor 1. The first position of the substrate 7 is provided with a first height adjusting cavity, and the laser driver is arranged in the first height adjusting cavity so as to reduce the bonding point fall of the laser and the laser driver.
The amplifier is a 4-channel amplifier, and the processor 1 controls the working state of the photodetector according to the state signal output by the 4-channel amplifier. The second position of the substrate 7 is provided with a second height adjusting cavity, and the amplifier is arranged in the second height adjusting cavity so as to reduce the fall of the bonding point of the photoelectric detector and the amplifier.
The laser driver adopts a 4-channel laser driver, and the FPGA chip controls the operation of the laser by driving the laser driver so as to realize the emission of signals. Wherein, the 4-channel VCSEL laser and the 4-channel laser driver, the 4-channel PD photoelectric detector and the 4-channel amplifier are also interconnected by adopting an adhesive gold wire bonding process.
In addition, the optical fiber communication processing module further comprises a cover plate, wherein the cover plate is a SiC cover plate, and the SiC cover plate is fixedly connected with the substrate 7 by adopting an adhesion process; the SiC cover plate is made of a heat dissipation material, and the processor 1 is in contact with the SiC cover plate.
As shown in fig. 4, the SiC cover plate is provided with an optical fiber port, the communication optical fiber 4 passes through the optical fiber port, and the optical fiber port is filled with the sealing compound 10 and is cured.
In another embodiment, the optical fiber communication processing module further comprises a communication optical fiber 4, and the optical fiber communication processing circuit further comprises a photoelectric coupling component 2, wherein the photoelectric coupling component 2 is used for aligning the communication optical fiber 4 with the light source of the laser and the light source of the photoelectric detector respectively.
In a preferred embodiment, as shown in fig. 5-7, dimensions include, but are not limited to, the unit is mm, and the specific dimensions provided in this example are: the case side length d=e=31±0.2, the bga maximum center-to-center distance d1=e1=29±0.1, the bga center-to-center distance e=1±0.01, the bga ball diameter Φb=0.6, the cover 9 height a1=1.9±0.1, the substrate 7 height a2=2±0.1, the total height a=3.9±0.2, and the pigtail length l=25±0.5.
The resin packaging substrate mainly comprises two materials, namely organic resin and copper foil conductor materials; the organic resin material is used for forming and insulating a base material, and the copper foil conductor material is used for wiring interconnection and through hole filling. The resistance of the leading-out terminal is less than or equal to 12 ohms; insulation resistance between adjacent leads without interconnection is more than or equal to 1 multiplied by 10 10 Ω，DC 500V。
The SiC cover plate has low thermal expansion coefficient, high hardness and rigidity, is used as a shell material to protect the internal chip, and meanwhile, has higher thermal conductivity (83.6W/K.m) and can provide a channel for fast heat dissipation for FPGA heat dissipation.
In the invention, the 4-channel VCSEL laser, the 4-channel laser driver, the 4-channel PD photoelectric detector and the 4-channel amplifier can provide the electro-optical/photoelectric conversion capability not lower than 12.5Gbps, the total transceiving bandwidth reaches 100Gbps, and most of communication information processing environments can be satisfied. The Flash chip (3) has the storage capacity of 128Mb and can meet the storage requirement of FPGA programs of the xilinx 7 series.
In this embodiment, an optical fiber communication processing module based on heterogeneous encapsulation is provided, devices such as a processor, a storage, photoelectric/electro-optical conversion, optical fiber and the like are integrated through a photoelectric heterogeneous high-density integrated encapsulation technology, so that requirements of new-generation optical fiber communication electronic equipment on module, high integration level, miniaturization, low power consumption and high reliability are met, and signal processing and transmission design of the optical fiber communication electronic equipment are greatly simplified.
In the present invention, unless explicitly specified and limited otherwise, the terms "disposed," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.
It should be further noted that the above-described apparatus embodiments are merely illustrative, and that the units described as separate units may or may not be physically separate, and that units shown as units may or may not be physical units, may be located in one place, or may be distributed over a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. In addition, in the drawings of the embodiment of the device provided by the invention, the connection relation between the modules represents that the modules have communication connection, and can be specifically implemented as one or more communication buses or signal lines. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
Claims (4)
1. Optical fiber communication processing module based on heterogeneous encapsulation, its characterized in that, optical fiber communication processing module includes:
a substrate including a first face and a second face disposed opposite to each other;
the optical fiber communication processing circuit is arranged on the first surface of the substrate and comprises a processor, a photoelectric detection module and a laser module, wherein the photoelectric detection module and the laser module are connected with the processor, and the processor is used for controlling the laser module to output optical fiber communication signals and controlling the photoelectric detection module to receive the optical fiber communication signals;
the fan-out structure is arranged on the second surface of the substrate and is used for fanning out power pins and signal pins of the processor, metal wires are distributed in the substrate, and the metal wires are used for electrically connecting the processor with the power pins and the signal pins; the connecting wire of the signal fan-out is electrically connected with the chip on the front surface of the substrate through the metal wiring and the via hole in the substrate;
the laser module comprises a laser and a laser driver, wherein the laser driver is connected with the processor and the laser and is used for controlling the paranoid working current and the modulation working current of the laser according to the driving signal of the processor; a first height adjusting cavity is arranged at a first position of the substrate, and the laser driver is arranged in the first height adjusting cavity so as to reduce the fall of a bonding point between the laser and the laser driver;
the photoelectric detection module comprises a photoelectric detector and an amplifier, and the processor controls the working state of the photoelectric detector according to a state signal output by the amplifier; the second position of the substrate is provided with a second height adjusting cavity, and the amplifier is arranged in the second height adjusting cavity so as to reduce the fall of a bonding point between the photoelectric detector and the amplifier;
the optical fiber communication processing module further comprises a cover plate, and the cover plate is fixedly connected with the substrate by adopting an adhesion process; the cover plate is made of heat dissipation materials, and the processor is in contact with the cover plate.
2. The heterogeneous package-based optical fiber communication processing module according to claim 1, wherein the substrate is a resin package substrate, and the first surface of the resin package substrate is provided with a mixed plating layer, and the mixed plating layer comprises thick gold plating and thin gold plating.
3. The heterogeneous package-based optical fiber communication processing module of claim 1, wherein the optical fiber communication processing module further comprises a communication optical fiber, and the optical fiber communication processing circuit further comprises a photoelectric coupling component for aligning the communication optical fiber to the light source of the laser module and the light source of the photoelectric detection module, respectively.
4. The heterogeneous packaging-based optical fiber communication processing module set according to claim 1, wherein the cover plate is provided with an optical fiber opening, the communication optical fiber passes through the optical fiber opening, and the optical fiber opening is filled with sealing glue and is cured.
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| CN202210329504.2A CN114696911B (en) | 2022-03-30 | 2022-03-30 | Optical fiber communication processing module based on heterogeneous encapsulation |
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