CN111269611A - Photo-curing and thermosetting composition and application thereof - Google Patents

Photo-curing and thermosetting composition and application thereof Download PDF

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Publication number
CN111269611A
CN111269611A CN202010220998.1A CN202010220998A CN111269611A CN 111269611 A CN111269611 A CN 111269611A CN 202010220998 A CN202010220998 A CN 202010220998A CN 111269611 A CN111269611 A CN 111269611A
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parts
epoxy resin
resin
aca
thermosetting
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盛星
姚永平
罗啟权
刘继强
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Guangdong Sanqiu Optical Solid Materials Co.,Ltd.
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Sanqiu Deqing Optical Solid Material Co ltd
Guangdong Sanqiu Optical Solid Materials Co ltd
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Priority to CN202010220998.1A priority Critical patent/CN111269611A/en
Publication of CN111269611A publication Critical patent/CN111269611A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C09D201/08—Carboxyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/30—Sulfur-, selenium- or tellurium-containing compounds
    • C08K2003/3045—Sulfates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The invention relates to a photo-curing and thermal-curing composition and application thereof. The composition is prepared from the following raw materials in parts by weight: 100 parts of carboxyl-contained propyl acyloxy copolymer resin; 15-40 parts of epoxy resin; 10-25 parts of acrylate monomers; 60-105 parts of ceramic powder;1-5 parts of a thermosetting accelerator; 12-18 parts of a photoinitiator; 0.1-5 parts of a coupling agent; 5-25 parts of a solvent; 1-5 parts of pigment and 1-10 parts of auxiliary agent. The dielectric loss (D) of the composition is remarkably reduced through the cooperation and synergy of the components in specific proportionsf< 0.015) and dielectric constant (D)kLess than 3.5), the composition shows excellent dielectric property, adhesive force, heat resistance, acid resistance and alkali resistance after being cured, and can be used for preparing high-speed printed circuit boards.

Description

Photo-curing and thermosetting composition and application thereof
Technical Field
The invention relates to the technical field of circuit board printing, in particular to a photocuring and thermosetting composition and application thereof.
Background
Printed Circuit Boards (PCBs) are the basic industry of modern electronic industry, in recent years, signal transmission is rapidly developed towards high frequency and high speed, and how to reduce loss in the signal transmission process and ensure signal integrity is a great challenge for high-speed PCB development. For signal transmission, the speed of signal transmission is determined by the dielectric constant (D) of the insulating layerk) It is determined that the smaller the dielectric constant, the faster the transmission speed. Loss factor (D)f) Is a physical quantity characterizing the electric energy loss of the medium or the signal attenuation capacity of the insulating material, DfThe smaller the power or signal loss.
Conventional FR-4 grade PCB Board DkGenerally 3.9 to 4.5, DfGenerally 0.02, which cannot meet the requirement of high-frequency signal transmission. High-frequency substrates that have been commercialized at present mainly include polytetrafluoroethylene resin (PTFE)/fiberglass cloth, maleimide triazine resin (BT)/fiberglass cloth, thermosetting cyanate ester resin (CE)/fiberglass cloth, thermosetting polyphenylene ether resin (PPE)/fiberglass cloth, polyimide resin (PI)/fiberglass cloth, and the like, DkIs 2.5 to 3.8, DfIs 0.002 to 0.012. Solder resist material for PCBkTypically 3.9, DfGenerally 0.02-0.04, and can meet the performance requirements of common PCBs.
However, for the outer layer circuit of the high-speed PCB, factors affecting the signal transmission loss of the high-speed PCB not only select the PCB substrate, but also select the solder resist material, which has a great influence on the outer layer circuit loss performance. The larger the signal transmission frequency, the greater the effect of the solder resist material on the loss. Solder resist material D used by existing PCBkAnd DfToo high to meet the performance requirements of high speed PCB。
Disclosure of Invention
Based on the above, the invention aims to provide a photo-curing and thermal-curing composition with low dielectric constant and low dielectric loss factor, which is used for preparing solder resist ink and a solder resist coating, further obtaining a printed circuit board with low dielectric loss and is applied to a high-frequency board for 5G communication.
The technical scheme is as follows:
the photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of carboxyl-contained propyl acyloxy copolymer resin; 15-40 parts of epoxy resin; 10-25 parts of acrylate monomers; 60-105 parts of ceramic powder; 1-5 parts of a thermosetting accelerator; 12-18 parts of a photoinitiator; 0.1-5 parts of a coupling agent; 5-25 parts of a solvent; 1-5 parts of pigment and 1-10 parts of auxiliary agent.
In one embodiment, the photo-curing and thermosetting composition is prepared from the following raw materials in parts by weight:
100 parts of carboxyl-contained propyl acyloxy copolymer resin; 20-35 parts of epoxy resin; 12-20 parts of acrylate monomers; 70-95 parts of ceramic powder; 2-4 parts of a thermosetting accelerator; 13-15 parts of a photoinitiator; 0.5-3 parts of a coupling agent; 6-15 parts of a solvent, 1-3 parts of a pigment and 3-8 parts of an auxiliary agent.
In one embodiment, the carboxyl-containing propylacyloxy group-containing copolymer resin is selected from the group consisting of (ACA) Z200M, (ACA) Z230AA, (ACA) Z250, (ACA) Z251, (ACA) Z300, (ACA) Z320, (ACA) Z254F, and at least one of agisyn 9792 and agisyn 9790.
In one embodiment, the epoxy resin is selected from at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, o-cresol novolac epoxy resin, and dicyclopentadiene phenol epoxy resin.
In one embodiment, the ceramic powder is selected from at least one of boron oxide, strontium titanate, barium titanate, calcium titanate, magnesium titanate, boron nitride, aluminum nitride, silicon carbide, and cerium oxide.
In one embodiment, the acrylate monomer is selected from at least one of n-butyl acrylate, β -hydroxyethyl acrylate, 2-phenoxyethyl acrylate, isobornyl acrylate, 1, 6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, ethoxylated bisphenol A dimethacrylate, diethoxylated neopentyl glycol diacrylate, propoxylated neopentyl glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanate tripropylene acrylate, and dipentaerythritol hexaacrylate.
In one embodiment, the thermal curing accelerator is selected from at least one of dicyandiamide, melamine, imidazole compounds, tertiary amines, tertiary amine salts, substituted urea compounds, boron amines, boron amine salts, and boron amine complexes.
In one embodiment, the photoinitiator is selected from the group consisting of 2-hydroxy-2-methyl-1-phenylpropanone-1, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropanone-1, 2-phenyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, isopropylthioxanthone, 2, 4-diethylthioxanthone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide, bis (2, 6-difluoro-3- (1H-pyrrolyl-1) phenyl) titanocene, 9-anthracenemethyl N, N-diethylcarbamate, N-propylthiobenzophenon-1, N-methyl-1-methyl-ethyl-1, N-methyl-ethyl-1-methyl-1-phenyl, At least one of 2- (3-benzoylphenyl) guanidine propionate and 1- (anthraquinone-2-yl) ethylimidazole carboxylate.
In one embodiment, the coupling agent is selected from at least one of 3-aminopropyltriethoxysilane, 3- (2, 3-glycidoxy) propyltrimethoxysilane, 3- (methacryloyloxy) propyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, isopropyl triisostearoyl titanate, dioctyl pyrophosphate glycolate, and ethylene glycol di (dioctyl phosphate) titanate.
The invention also provides a printed circuit board, and the preparation raw materials of the printed circuit board comprise the photocuring thermocuring resin composition in any embodiment.
Compared with the prior art, the invention has the following beneficial effects:
the invention provides a photocuring thermocuring resin composition which is prepared from the following raw materials in parts by weight: 100 parts of carboxyl-contained propyl acyloxy copolymer resin; 15-40 parts of epoxy resin; 60-105 parts of ceramic powder; 1-5 parts of a thermosetting accelerator; 12-18 parts of a photoinitiator; 0.1-5 parts of a coupling agent; 10-25 parts of acrylate monomers; 5-25 parts of a solvent; 1-5 parts of pigment and 1-10 parts of auxiliary agent.
The carboxyl-contained propyl acyloxy group copolymer resin has low polarity and excellent dielectric property; the propyl acyloxy in the copolymer resin structure is used as a photosensitive group to provide photosensitivity and participate in the photocuring process; while the carboxyl groups provide developability as well as reactivity. Epoxy resin is added into the formula, and carboxyl reacts with epoxy groups in the epoxy resin to be crosslinked and cured, so that the heat resistance of the composition can be improved. Meanwhile, ceramic powder is added in the formula as a filler, and is filled in a three-dimensional network of the cross-linked resin, so that the dielectric property of the composition is synergistically improved. Meanwhile, a thermosetting accelerator is added in the formula to promote the reaction of epoxy groups and carboxyl groups; the acrylate monomer and the photoinitiator are added, and the components are matched for use to participate in the photocuring process, so that the crosslinking degree of the resin is improved, and the heat resistance and the photosensitivity of the resin are further improved. In addition, a coupling agent is added in the formula, so that the connection strength of the resin and the filler is increased; and solvent, pigment and auxiliary agent are added in the formula. The dielectric loss (D) of the composition is remarkably reduced through the cooperation and synergy of the components in specific proportionsf< 0.015) and dielectric constant (D)kLess than 3.5), and the composition shows excellent dielectric property, adhesive force, heat resistance and tin resistance after being cured.
The photocuring thermocuring composition with low dielectric constant and low dielectric loss factor is used for preparing solder resist ink, is further used for preparing a solder resist coating with high temperature resistance and low dielectric loss in a high-speed printed circuit board, and has wide application prospect.
Detailed Description
The present invention will be described in further detail with reference to specific examples. The present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of carboxyl-contained propyl acyloxy copolymer resin; 15-40 parts of epoxy resin; 10-25 parts of acrylate monomers; 60-105 parts of ceramic powder; 1-5 parts of a thermosetting accelerator; 12-18 parts of a photoinitiator; 0.1-5 parts of a coupling agent; 5-25 parts of a solvent; 1-5 parts of pigment and 1-10 parts of auxiliary agent.
The carboxyl-contained propyl acyloxy group copolymer resin has low polarity and excellent dielectric property; the propyl acyloxy in the copolymer resin structure is used as a photosensitive group to provide photosensitivity and participate in the photocuring process; while the carboxyl groups provide developability as well as reactivity. Epoxy resin is added in the formula, and carboxyl reacts with epoxy groups in the epoxy resin to be crosslinked and cured, so that the heat resistance of the resin can be improved. Meanwhile, ceramic powder is added in the formula as a filler, and is filled in a three-dimensional network of the cross-linked resin, so that the dielectric property of the resin is synergistically improved. Meanwhile, a thermosetting accelerator is added in the formula to promote the reaction of epoxy groups and carboxyl groups; the acrylate monomer and the photoinitiator are added, and the components are matched for use to participate in the photocuring process, so that the crosslinking degree of the resin is improved, and the heat resistance and the photosensitivity of the resin are further improved. In addition, a coupling agent is added in the formula to increase the connection strength of the resin and the filler, and a solvent, a pigment and an auxiliary agent are added in the formula. The dielectric loss (D) of the composition is remarkably reduced through the cooperation and synergy of the components in specific proportionsf< 0.015) and dielectric constant (D)k< 3.5), which shows excellent mesoporosity after curingElectrical properties, adhesion, heat resistance and tin resistance.
The raw materials of the photocuring thermocuring composition comprise 100 parts of carboxyl-contained propyl acyloxy copolymer resin. Wherein, carboxyl provides developing property, and reacts with epoxy group under high temperature condition for crosslinking and curing; the propylacyloxy groups provide photosensitivity to participate in the photocuring process.
In one embodiment, the carboxyl-containing propylacyloxy copolymer resin is selected from at least one of (ACA) Z200M, (ACA) Z230AA, (ACA) Z250, (ACA) Z251, (ACA) Z300, (ACA) Z320, (ACA) Z254F, and agisyn 9792 and agisyn 9790 of teisman, new forces, taiwan.
Preferably, the carboxyl-containing propylacyloxy group-containing copolymer resin is at least one selected from the group consisting of (ACA) Z250, (ACA) Z320 and AgiSYTM 9792.
The raw materials of the photocuring thermocuring resin composition also comprise 15-40 parts of epoxy resin, so that excellent cohesiveness and high reaction activity are provided. The epoxy group reacts with the carboxyl group in the copolymerization resin containing the carboxyl propyl acyloxy group, and the crosslinking and curing are carried out, so that the heat resistance of the resin is improved.
Preferably, the raw materials of the photo-curing and thermosetting resin composition comprise 20-35 parts of epoxy resin; more preferably, 32 parts of epoxy resin is included.
In one embodiment, the epoxy resin is selected from at least one of bisphenol a type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, o-cresol novolac epoxy resin, and dicyclopentadiene phenol epoxy resin.
Preferably, the epoxy resin is a dicyclopentadiene phenol epoxy resin.
The raw materials of the photocuring thermocuring resin composition also comprise 1-5 parts of a thermocuring accelerator, which is used for promoting the reaction of epoxy groups in epoxy resin and carboxyl groups in carboxyl-containing propyl acyloxy copolymer resin.
Preferably, the photo-curing and thermal-curing resin composition comprises 2-4 parts of a thermal-curing accelerator; more preferably, 3 parts of a heat curing accelerator is included.
In one embodiment, the thermal curing accelerator is selected from at least one of dicyandiamide, melamine, imidazole compounds, tertiary amines, tertiary amine salts, substituted urea compounds, boron amines, boron amine salts, and boron amine complexes.
Preferably, the thermal curing accelerator is at least one selected from dicyandiamide, melamine and substituted urea compounds.
The raw materials of the photocuring thermocuring resin composition also comprise 10-25 parts of acrylate monomers, and the acrylate monomers participate in the photocuring process and are polymerized under the action of a photoinitiator, so that the crosslinking degree of the resin is improved, and the heat resistance and the photosensitivity of the resin are further improved.
Preferably, the photo-curing and thermosetting resin composition comprises 12-20 parts of acrylate monomers; more preferably, 12 parts of an acrylate monomer is included.
In one embodiment, the acrylate monomer is selected from at least one of n-butyl acrylate, β -hydroxyethyl acrylate, 2-phenoxyethyl acrylate, isobornyl acrylate, 1, 6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, ethoxylated bisphenol A dimethacrylate, diethoxylated neopentyl glycol diacrylate, propoxylated neopentyl glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanate tripropylene acrylate, and dipentaerythritol hexaacrylate.
Preferably, the acrylate monomer is dipentaerythritol hexaacrylate.
The raw materials of the photocuring thermocuring resin composition also comprise 12-18 parts of photoinitiator, and the photoinitiator participates in the photocuring process under the irradiation of ultraviolet light to initiate the polymerization of acrylate monomers, improve the crosslinking degree of the resin and further improve the heat resistance and photosensitivity of the resin.
Preferably, the photo-curing and thermosetting resin composition comprises 13-15 parts of a photoinitiator; more preferably, 14 parts of photoinitiator are included.
In one embodiment, the photoinitiator is selected from the group consisting of 2-hydroxy-2-methyl-1-phenylpropanone-1, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropanone-1, 2-phenyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, isopropylthioxanthone, 2, 4-diethylthioxanthone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide, bis (2, 6-difluoro-3- (1H-pyrrolyl-1) phenyl) titanocene, 9-anthracenemethyl N, N-diethylcarbamate, N-propylthiobenzophenon-1, N-methyl-1-methyl-ethyl-1, N-methyl-ethyl-1-methyl-1-phenyl, At least one of 2- (3-benzoylphenyl) guanidine propionate and 1- (anthraquinone-2-yl) ethylimidazole carboxylate.
Preferably, the photoinitiator is selected from at least one selected from the group consisting of 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropanone-1, 2, 4-diethylthioxanthone and 2,4, 6-trimethylbenzoyldiphenylphosphine oxide.
The raw materials of the photocuring thermocuring resin composition also comprise 60-105 parts of ceramic powder, so that excellent dielectric property is provided, and the dielectric loss effect of the material is reduced.
Preferably, the raw materials of the photo-curing and thermosetting resin composition comprise 70-95 parts of ceramic powder; more preferably, 80 parts of ceramic powder is included.
In one embodiment, the ceramic powder is selected from boron oxide (B)2O3) Strontium titanate (SrTiO)3) Barium titanate (BaTiO)3) Calcium titanate (CaTiO)3) Magnesium titanate (Mg)2TiO4) Boron Nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), cerium oxide (CeO)2) At least one of (1).
Preferably, the ceramic powder is selected from one or more of boron nitride, aluminum nitride and silicon carbide.
The raw materials of the photocuring thermocuring resin composition also comprise 0.1-5 parts of coupling agent, so that the connection strength of the ceramic powder filler and the resin is improved.
Preferably, the raw materials of the photo-curing and thermosetting resin composition further comprise 0.5-3 parts of a coupling agent; more preferably, 1 part of coupling agent is included.
In one embodiment, the coupling agent is selected from at least one of a silane coupling agent and a titanate coupling agent.
In one embodiment, the coupling agent is selected from at least one of 3-aminopropyltriethoxysilane, 3- (2, 3-glycidoxy) propyltrimethoxysilane, 3- (methacryloyloxy) propyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, isopropyl triisostearoyl titanate, dioctyl pyrophosphate glycolate, and ethylene glycol di (dioctyl phosphate) titanate.
Preferably, the coupling agent is selected from at least one of 3- (2, 3-glycidoxy) propyltrimethoxysilane and 3- (methacryloyloxy) propyltrimethoxysilane.
The raw materials of the photocuring thermocuring resin composition also comprise 5-25 parts of solvent, and the viscosity of the system is adjusted. Preferably, the raw materials of the photo-curing and thermosetting resin composition further comprise 6-15 parts of a solvent; more preferably, 10 parts of solvent is included.
In one embodiment, the solvent is selected from at least one of dibasic acid methyl ester, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, dipropylene glycol methyl ether, ethylene glycol butyl ether acetate, propylene glycol methyl ether acetate, and aromatic hydrocarbon solvents.
The raw materials of the photocuring thermocuring resin composition also comprise 1-5 parts of pigment, so that the color of the composition can be adjusted, and the requirements of different colors can be met. Preferably, the raw materials of the photo-curing and thermosetting resin composition further comprise 1-3 parts of pigment; more preferably, 1.5 parts of pigment is included.
In one embodiment, the pigment is selected from at least one of phthalocyanine green, phthalocyanine blue, azo yellow, azo red, and carbon black.
The raw materials of the photo-curing thermosetting resin composition also comprise 1-10 parts of an auxiliary agent, and the printing property of the composition can be adjusted. Preferably, the raw materials of the photo-curing and thermosetting resin composition further comprise 3-8 parts of an auxiliary agent; more preferably, 7 parts of adjuvant are included.
In one embodiment, the auxiliary agent is selected from at least one of an antifoaming agent, a leveling agent, a dispersing agent, and a rheological auxiliary agent.
In one preferred embodiment, the adjuvant is at least one selected from KS-66, DS-100 from Foshan land, BYK057, BYK333, BYK354, BYK110, BYK163, BYK405, BYK 410.
The invention also provides solder resist ink, and raw materials for preparing the solder resist ink comprise the light-cured heat-cured resin composition in any embodiment.
The preparation method of the solder resist ink comprises the following steps:
and adding the photocuring thermocuring resin composition into a grinding device, and grinding to obtain the solder resist ink.
Preferably, the content of the organic solvent in the solder resist ink is adjusted, so that the viscosity of the ink can be adjusted to be convenient for coating on the surface of the circuit board. Further preferably, the components are uniformly mixed, ground by a three-roller machine to the fineness of less than 15 μm, and adjusted to 150dpa.s by using a solvent to obtain the liquid photosensitive solder resist ink suitable for coating.
The invention also provides a printed circuit board, and the preparation raw materials of the printed circuit board comprise the solder resist ink.
The printed circuit board can be prepared by the following preparation method:
printing the solder resist ink on the surface of a circuit board through 43T screen printing, placing the printed circuit board in a constant temperature oven to pre-bake for a period of time at 75 ℃, exposing the circuit board by using an ultraviolet exposure machine (a 21-level exposure ruler and a 10-level residual film), developing the circuit board for 60s at the temperature of 30 +/-1 ℃ by using a 1 +/-0.2% sodium carbonate solution, and then placing a sample plate in a constant temperature oven at the temperature of 150 ℃ to bake for 1h to obtain the solder resist ink.
The following are specific examples.
Some of the raw materials used in the following examples were purchased from the following manufacturers and models:
the carboxyl-containing propylacyloxy copolymer resin is available from Daiiluo chemical industries, Japan, and is (ACA) Z320 in CYCLOMER-P series; and agisyn 9792, by taiwan new forces, teisman.
The o-cresol formaldehyde epoxy resin is purchased from chemical and chemical (tin-free) limited company, and has the model of CCR-4959 HW;
dicyclopentadiene phenol epoxy resin was purchased from DIC, Diesen, Japan, and has the model number HP-7200;
the silicon carbide is purchased from Shanghai ink high-tech materials, and is MG-N019;
boron nitride was purchased from Huzhou Yuanqin New materials Co., Ltd, model number YQ-B01;
the silicon nitride is purchased from the meta-Gem environmental protection science and technology GmbH, and the model is nano silicon nitride ceramic powder;
barium sulfate was purchased from Foshan Anyi nanomaterial Co., Ltd, and its model number is AY-JB 53;
dipentaerythritol hexaacrylate was purchased from the changxing chemical industry, model number EM 264;
melamine was purchased from Nanjing Meikai science and technology Co., Ltd;
dicyandiamide was purchased from CVC corporation, usa under the model OMICURE DDA 5;
2-methyl-2- (4-morpholinyl) -1- [4- (methylthio) phenyl ] -1-propanone was purchased from Tianjin Jiu New materials Co., Ltd, and has a model number of JRCURE-1107 (general brand number 907);
isopropyl thioxanthone was purchased from Tianjin Jieshi New materials, Inc. under model JRCURE-1105 (Universal designation ITX);
the silane coupling agent is purchased from United states carbon company, and has the model of A-187;
aromatic solvent S150 was purchased from indometha;
phthalocyanine green purchased from basf, germany, model number K8730;
the dispersant was purchased from Bike chemical Germany, model number BYK-110;
the defoaming agent is purchased from chemical company Limited of south China sea of Foshan, and has the model of DS-100;
dibasic acid ester solvents were purchased from changxing chemicals.
Example 1
The embodiment provides a photo-curing and thermosetting composition and application thereof.
(1) The photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of (ACA) Z320 resin; 32 parts of dicyclopentadiene phenol epoxy resin; 80 parts of silicon carbide; 3 parts of melamine; 12 parts of photoinitiator-1 (JRCURE-1107); 2 parts of photoinitiator-2 (JRCURE-1105); 1 part of a coupling agent (A-187); 12 parts of dipentaerythritol hexaacrylate.
(2) Preparation of solder resist ink and printed circuit board
The composition is uniformly mixed with 10 parts of aromatic hydrocarbon solvent S150, 1.5 parts of phthalocyanine green, 1 part of BYK-110 and 6 parts of DS-100, ground by a three-roll machine until the fineness is less than 15 mu m, and adjusted to 150dPa.s by dibasic acid ester to obtain the solder resist ink suitable for coating.
The solder resist ink is printed on the surface of a circuit board through 43T screen printing, the printed circuit board is placed in a constant temperature oven to be pre-baked for 45min at 75 ℃, then is exposed by an ultraviolet exposure machine (21-level exposure ruler, 10-level residual film), is developed for 60s at the temperature of 30 +/-1 ℃ by using 1 +/-0.2% sodium carbonate solution, and is placed in a constant temperature oven at the temperature of 150 ℃ to be baked for 1 h. The printed wiring board was evaluated for development, adhesion, heat resistance, acid resistance, alkali resistance, dielectric loss, and dielectric constant.
Example 2
The embodiment provides a photo-curing and thermosetting composition and application thereof.
(1) The photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of (ACA) Z320 resin; 32 parts of dicyclopentadiene phenol epoxy resin; 80 parts of boron nitride; 3 parts of melamine; 12 parts of photoinitiator-1 (JRCURE-1107); 2 parts of photoinitiator-2 (JRCURE-1105); 1 part of a coupling agent (A-187); 12 parts of dipentaerythritol hexaacrylate.
(2) Preparation of solder resist ink and printed circuit board
The composition is uniformly mixed with 10 parts of aromatic hydrocarbon solvent S150, 1.5 parts of phthalocyanine green, 1 part of BYK-110 and 6 parts of DS-100, ground by a three-roll machine until the fineness is less than 15 mu m, and adjusted to 150dPa.s by dibasic acid ester to obtain the solder resist ink suitable for coating.
The solder resist ink is printed on the surface of a circuit board through 43T screen printing, the printed circuit board is placed in a constant temperature oven to be pre-baked for 45min at 75 ℃, then is exposed by an ultraviolet exposure machine (21-level exposure ruler, 10-level residual film), is developed for 60s at the temperature of 30 +/-1 ℃ by using 1 +/-0.2% sodium carbonate solution, and is placed in a constant temperature oven at the temperature of 150 ℃ to be baked for 1 h. The printed wiring board was evaluated for development, adhesion, heat resistance, acid resistance, alkali resistance, dielectric loss, and dielectric constant.
Example 3
The embodiment provides a photo-curing and thermosetting composition and application thereof.
(1) The photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of (ACA) Z320 resin; 32 parts of dicyclopentadiene phenol epoxy resin; 80 parts of silicon nitride; 3 parts of melamine; 12 parts of photoinitiator-1 (JRCURE-1107); 2 parts of photoinitiator-2 (JRCURE-1105); 1 part of a coupling agent (A-187); 12 parts of dipentaerythritol hexaacrylate.
(2) Preparation of solder resist ink and printed circuit board
The composition is uniformly mixed with 10 parts of aromatic hydrocarbon solvent S150, 1.5 parts of phthalocyanine green, 1 part of BYK-110 and 6 parts of DS-100, ground by a three-roll machine until the fineness is less than 15 mu m, and adjusted to 150dPa.s by dibasic acid ester to obtain the solder resist ink suitable for coating.
The solder resist ink is printed on the surface of a circuit board through 43T screen printing, the printed circuit board is placed in a constant temperature oven to be pre-baked for 45min at 75 ℃, then is exposed by an ultraviolet exposure machine (21-level exposure ruler, 10-level residual film), is developed for 60s at the temperature of 30 +/-1 ℃ by using 1 +/-0.2% sodium carbonate solution, and is placed in a constant temperature oven at the temperature of 150 ℃ to be baked for 1 h. The printed wiring board was evaluated for development, adhesion, heat resistance, acid resistance, alkali resistance, dielectric loss, and dielectric constant.
Example 4
The embodiment provides a photo-curing and thermosetting composition and application thereof.
(1) The photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of (ACA) Z320 resin; 32 parts of dicyclopentadiene phenol epoxy resin; 80 parts of barium sulfate; 3 parts of melamine; 12 parts of photoinitiator-1 (JRCURE-1107); 2 parts of photoinitiator-2 (JRCURE-1105); 1 part of a coupling agent (A-187); 12 parts of dipentaerythritol hexaacrylate.
(2) Preparation of solder resist ink and printed circuit board
The composition is uniformly mixed with 10 parts of aromatic hydrocarbon solvent S150, 1.5 parts of phthalocyanine green, 1 part of BYK-110 and 6 parts of DS-100, ground by a three-roll machine until the fineness is less than 15 mu m, and adjusted to 150dPa.s by dibasic acid ester to obtain the solder resist ink suitable for coating.
The solder resist ink is printed on the surface of a circuit board through 43T screen printing, the printed circuit board is placed in a constant temperature oven to be pre-baked for 45min at 75 ℃, then is exposed by an ultraviolet exposure machine (21-level exposure ruler, 10-level residual film), is developed for 60s at the temperature of 30 +/-1 ℃ by using 1 +/-0.2% sodium carbonate solution, and is placed in a constant temperature oven at the temperature of 150 ℃ to be baked for 1 h. The printed wiring board was evaluated for development, adhesion, heat resistance, acid resistance, alkali resistance, dielectric loss, and dielectric constant.
Comparative example 1
The present comparative example provides a photocurable and thermosetting composition and its use.
(1) The photocuring thermocuring composition is prepared from the following raw materials in parts by weight:
100 parts of CCR-4959HW resin; 32 parts of dicyclopentadiene phenol epoxy resin; 80 parts of barium sulfate; 3 parts of melamine; 12 parts of photoinitiator-1 (JRCURE-1107); 2 parts of photoinitiator-2 (JRCURE-1105); 1 part of a coupling agent (A-187); 12 parts of dipentaerythritol hexaacrylate.
(2) Preparation of solder resist ink and printed circuit board
The composition is uniformly mixed with 10 parts of aromatic hydrocarbon solvent S150, 1.5 parts of phthalocyanine green, 1 part of BYK-110 and 6 parts of DS-100, ground by a three-roll machine until the fineness is less than 15 mu m, and adjusted to 150dPa.s by dibasic acid ester to obtain the solder resist ink suitable for coating.
The solder resist ink is printed on the surface of a circuit board through 43T screen printing, the printed circuit board is placed in a constant temperature oven to be pre-baked for 45min at 75 ℃, then is exposed by an ultraviolet exposure machine (21-level exposure ruler, 10-level residual film), is developed for 60s at the temperature of 30 +/-1 ℃ by using 1 +/-0.2% sodium carbonate solution, and is placed in a constant temperature oven at the temperature of 150 ℃ to be baked for 1 h. The printed wiring board was evaluated for development, adhesion, heat resistance, acid resistance, alkali resistance, dielectric loss, and dielectric constant.
The compositions of the solder resist inks in examples 1 to 4 of the present invention and comparative example 1 are shown in table 1 in parts by weight:
TABLE 1
Figure BDA0002424463200000151
The printed circuit boards of examples 1 to 4 and comparative example 1 were subjected to performance tests, and the evaluation criteria were as follows:
(1) developability
Pre-baking the printed plate at 75 deg.C for 45, 55, 65, and 75min, and developing to see if there is residue on the substrate. And the product is qualified if no residue exists and unqualified if residue exists.
(2) Adhesion force
Reference is made to GB/T9286-1998 test for cross-hatching of paint and varnish films. The coating is qualified if no shedding occurs, and is unqualified if the shedding occurs.
(3) Heat resistance
And coating the rosin soldering flux on the surface of the circuit board baked at high temperature, and soaking tin for 288 +/-5 ℃ multiplied by 10s multiplied by 3 times. The coating was then pulled 3 times with 3M tape (type 600) and observed for blistering and oil loss. The coating is qualified if no oil is dropped, and is unqualified if the oil is dropped.
(4) Acid resistance
Soaking the circuit board baked at high temperature in H with the volume fraction of 10%2SO4The solution (25 + -1 deg.C) is washed with clear water for 30min, and dried. The coating was pulled 3 times with 3M tape (type 600) and observed for oil loss. The coating is qualified if no oil is dropped, and is unqualified if the oil is dropped.
(5) Alkali resistance
Soaking the circuit board baked at high temperature in 10% NaOH solution (25 + -1 deg.C) for 30min, cleaning with clear water, and drying. The coating was pulled 3 times with 3M tape (type 600) and observed for oil loss. The coating is qualified if no oil is dropped, and is unqualified if the oil is dropped.
(6) Dielectric loss and dielectric constant
The compositions of examples 1, 2,3, 4 and comparative example 1 were placed in immersion tanks, prebaked at 75 ℃ for 60min and exposed to 300mJ/cm of light energy2And then baking at 150 ℃ for 60min to obtain the cured composition. The test was carried out according to the IPC-TM-650-2.5.5.9 method.
The test results are shown in table 2:
TABLE 2
Figure BDA0002424463200000161
Figure BDA0002424463200000171
As can be seen from Table 2, the printed circuit boards in examples 1-3 all had acceptable developability, adhesion, heat resistance, acid resistance, and alkali resistance, dielectric constant was not more than 3.31GHz, dielectric loss was not more than 0.013GHz, and all the indices met the requirements of high frequency PCB; in connection with example 4, it can be seen that if barium sulfate is used as filler, DkAnd DfThe values are higher than those in examples 1 to 3. Combining the results of comparative example 1 and example 4, it is seen that both of them use barium sulfate as a filler, and if o-cresol novolac epoxy resin is used instead of the carboxyl-containing propylacyloxy group-containing copolymer resin, the dielectric properties are deteriorated. The above results fully show that the photocuring thermocuring composition which is composed of specific components according to a specific proportion provided by the invention has excellent dielectric property, heat resistance, developability, adhesion, acid resistance and alkali resistance; the photo-curing and thermosetting composition can be used for preparing solder resist ink, and further used for preparing a solder resist coating with high temperature resistance and low dielectric loss in a high-speed printed circuit board.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The photocuring and thermal curing composition is characterized by being prepared from the following raw materials in parts by weight:
100 parts of carboxyl-contained propyl acyloxy copolymer resin; 15-40 parts of epoxy resin; 10-25 parts of acrylate monomers; 60-105 parts of ceramic powder; 1-5 parts of a thermosetting accelerator; 12-18 parts of a photoinitiator; 0.1-5 parts of a coupling agent; 5-25 parts of a solvent; 1-5 parts of pigment and 1-10 parts of auxiliary agent.
2. The photocurable and thermosetting composition of claim 1, wherein the composition is prepared from the following raw materials in parts by weight:
100 parts of carboxyl-contained propyl acyloxy copolymer resin; 20-35 parts of epoxy resin; 12-20 parts of acrylate monomers; 70-95 parts of ceramic powder; 2-4 parts of a thermosetting accelerator; 13-15 parts of a photoinitiator; 0.5-3 parts of a coupling agent; 6-15 parts of a solvent, 1-3 parts of a pigment and 3-8 parts of an auxiliary agent.
3. The photocurable and thermosetting composition as claimed in any one of claims 1-2, wherein said carboxypropylacyloxy-containing copolymer resin is selected from the group consisting of (ACA) Z200M, (ACA) Z230AA, (ACA) Z250, (ACA) Z251, (ACA) Z300, (ACA) Z320, (ACA) Z254F, and at least one of agisyn 9792 and agisyn 9790.
4. The photocurable and thermosetting composition according to any one of claims 1-2, wherein said epoxy resin is at least one selected from the group consisting of bisphenol a type epoxy resin, bisphenol F type epoxy resin, novolac epoxy resin, o-cresol novolac epoxy resin, and dicyclopentadiene phenol epoxy resin.
5. The photocurable and thermosetting composition according to any of claims 1-2, wherein said ceramic powder is at least one selected from the group consisting of boron oxide, strontium titanate, barium titanate, calcium titanate, magnesium titanate, boron nitride, aluminum nitride, silicon carbide and cerium oxide.
6. The photocurable and thermosetting composition according to any one of claims 1-2, wherein the acrylate monomer is at least one selected from the group consisting of n-butyl acrylate, β -hydroxyethyl acrylate, 2-phenoxyethyl acrylate, isobornyl acrylate, 1, 6-hexanediol diacrylate, dipropylene glycol diacrylate, tripropylene glycol diacrylate, ethoxylated bisphenol a dimethacrylate, diethoxylated neopentyl glycol diacrylate, propoxylated neopentyl glycol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, tris (2-hydroxyethyl) isocyanurate tripropylene acrylate and dipentaerythritol hexaacrylate.
7. The photocurable thermosetting resin composition according to any one of claims 1-2, wherein the thermosetting accelerator is at least one selected from dicyandiamide, melamine, imidazole compounds, tertiary amines, tertiary amine salts, substituted urea compounds, boron amines, boron amine salts, and boron amine complexes.
8. The photocurable and thermosetting composition according to any of claims 1-2, wherein the photoinitiator is selected from the group consisting of 2-hydroxy-2-methyl-1-phenylpropanone-1, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropanone-1, 2-phenyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, isopropylthioxanthone, 2, 4-diethylthioxanthone, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide, bis (2, 6-difluoro-3- (1H-pyrrolyl-1) phenyl) titanocene, bis (2-hydroxy-2-methyl-1-phenylpropanone-1), 2-methyl-1- (4-, At least one of 9-anthracenemethyl N, N-diethylcarbamate, guanidine 2- (3-benzoylphenyl) propionate, and 1- (anthraquinone-2-yl) ethylimidazole carboxylate.
9. The photocurable and thermosetting composition according to any of claims 1-2, wherein the coupling agent is selected from at least one of 3-aminopropyltriethoxysilane, 3- (2, 3-glycidoxy) propyltrimethoxysilane, 3- (methacryloyloxy) propyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, isopropyl triisostearoyltitanate, titanate bis (octylpyrophosphate) glycolate and ethylene glycol bis (dioctylphosphate) titanate.
10. A printed circuit board, characterized in that the raw material for its preparation comprises the photocurable and thermosetting composition according to any one of claims 1 to 9.
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113604099A (en) * 2021-07-08 2021-11-05 江苏海田电子材料有限公司 Low-dielectric-constant solder resist ink and preparation method thereof
CN115894011A (en) * 2022-06-17 2023-04-04 超瓷材料技术(深圳)有限公司 Microwave dielectric ceramic filter and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100261018A1 (en) * 2009-04-10 2010-10-14 Pixeloptics, Inc. Curable Adhesive Compositions
CN104428712A (en) * 2013-06-28 2015-03-18 太阳油墨制造株式会社 Photocurable resin composition, cured product of same and printed wiring board
CN104950573A (en) * 2014-03-31 2015-09-30 太阳油墨（苏州）有限公司 Photocuring and thermosetting resin composition, dry film, cured product and printed circuit board
CN106814538A (en) * 2015-09-30 2017-06-09 太阳油墨制造株式会社 Hardening resin composition, dry film, solidfied material and printed circuit board (PCB)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100261018A1 (en) * 2009-04-10 2010-10-14 Pixeloptics, Inc. Curable Adhesive Compositions
CN104428712A (en) * 2013-06-28 2015-03-18 太阳油墨制造株式会社 Photocurable resin composition, cured product of same and printed wiring board
CN104950573A (en) * 2014-03-31 2015-09-30 太阳油墨（苏州）有限公司 Photocuring and thermosetting resin composition, dry film, cured product and printed circuit board
CN106814538A (en) * 2015-09-30 2017-06-09 太阳油墨制造株式会社 Hardening resin composition, dry film, solidfied material and printed circuit board (PCB)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113604099A (en) * 2021-07-08 2021-11-05 江苏海田电子材料有限公司 Low-dielectric-constant solder resist ink and preparation method thereof
CN115894011A (en) * 2022-06-17 2023-04-04 超瓷材料技术(深圳)有限公司 Microwave dielectric ceramic filter and preparation method thereof
CN115894011B (en) * 2022-06-17 2024-04-26 超瓷材料技术(深圳)有限公司 Microwave dielectric ceramic filter and preparation method thereof

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