CN111266824A - Carrier probe dismounting device and method - Google Patents
Carrier probe dismounting device and method Download PDFInfo
- Publication number
- CN111266824A CN111266824A CN202010184124.5A CN202010184124A CN111266824A CN 111266824 A CN111266824 A CN 111266824A CN 202010184124 A CN202010184124 A CN 202010184124A CN 111266824 A CN111266824 A CN 111266824A
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- carrier
- probe
- dismounting
- positioning
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- 239000000523 sample Substances 0.000 title claims abstract description 81
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000003825 pressing Methods 0.000 claims abstract description 42
- 238000006073 displacement reaction Methods 0.000 claims abstract description 22
- 238000001514 detection method Methods 0.000 claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
Abstract
The invention provides a carrier probe dismounting device and a carrier probe dismounting method. The positioning mechanism positions a product and comprises a first carrier and an electronic product, the pressing mechanism presses and fixes two ends of the first carrier, when the laser displacement detection mechanism detects the product, the disassembly mechanism disassembles the electronic product from the first carrier, then the electronic product is placed in a second carrier and then is fixed by the positioning mechanism and the pressing mechanism, and the probe disassembly and assembly mechanism assembles a probe to one end of the second carrier and is connected with the electronic product, so that the product can be conveniently detected; after the detection is finished, the probe is disassembled by the probe disassembling mechanism, the electronic product is disassembled from the second carrier by the disassembling mechanism, then the pressing mechanism cancels the pressing, and the product is taken down; the carrier probe dismounting device realizes automatic dismounting of a product carrier and automatic assembling and dismounting of the probe, is convenient and efficient, and cannot cause product damage.
Description
Technical Field
The invention relates to the technical field of electronic product production, in particular to a carrier probe dismounting device and a carrier probe dismounting method.
Background
In the production process of electronic products, such as mobile phones, watches and the like, products need to be detected, during detection, a product assembly carrier needs to be replaced by a product test carrier, after the products are fixedly supported, detection probes are installed in the carrier, after the detection is qualified, the probes and the products are disassembled, the assembly carrier is replaced, and subsequent assembly and processing work is carried out. Therefore, an apparatus is required to perform the disassembling work of the assembling machine.
Disclosure of Invention
The invention provides a carrier probe disassembling and assembling device and a carrier probe disassembling and assembling method.
In order to solve the technical problem, the invention provides a carrier probe disassembling and assembling device which comprises a rack, a positioning mechanism arranged on the rack, a pressing mechanism and a laser displacement detection mechanism arranged on the inner side of the positioning mechanism, a disassembling mechanism arranged at the bottom of the positioning mechanism, and a probe disassembling and assembling mechanism arranged at one end of the positioning mechanism.
Furthermore, the positioning mechanism comprises a positioning carrier plate, a positioning groove arranged on the positioning carrier plate, and a plurality of positioning pins and magnets arranged in the positioning groove.
Furthermore, the pressing and holding mechanism comprises two pressing plates, rotary lifting cylinders for respectively driving the two pressing plates to rotate and lift and limiting columns arranged on the inner sides of the rotary lifting cylinders, and flexible gaskets are respectively arranged below the pressing plates.
Furthermore, the laser displacement detection mechanism comprises a mounting bracket, an adjusting bracket arranged on the mounting bracket and a miniature laser displacement sensor arranged on the mounting bracket, wherein the miniature laser displacement sensor can rotate around the adjusting bracket within a preset angle.
Furthermore, the disassembling mechanism comprises a lifting plate, a jacking cylinder for driving the lifting plate to lift, a flat cylinder arranged at one end of the lifting plate and two pushing hook thimbles arranged at the output end of the parallel cylinder.
Furthermore, the probe disassembling and assembling mechanism comprises two thimble units arranged on the front side and the rear side of the positioning mechanism and a disassembling and assembling unit arranged at one end of the positioning mechanism.
Furthermore, the thimble unit comprises a thimble and a thimble driving cylinder for driving the thimble to move forward and backward.
Furthermore, the dismouting unit include the dismouting mount, the level set up in first slide rail on the dismouting mount, with first slide rail sliding fit's dismouting support, set up in two inboard guide ways of dismouting mount, vertical set up in second slide rail on the first slide rail, with the second slide rail with two guide way sliding fit's dismouting mounting panel, drive the dismouting support is followed the gliding dismouting cylinder of first slide rail and set up in dismouting fixed plate on the dismouting mounting panel.
Furthermore, a fixed cylinder is arranged at one end of the dismounting and mounting fixed plate, and a plurality of positioning columns are arranged on the dismounting and mounting fixed plate; when the dismounting bracket slides along the first slide rail, the dismounting mounting plate slides along the second slide rail and the two guide grooves.
The invention also provides a carrier probe disassembling method, which comprises the carrier probe disassembling equipment as described in any one of the above, and the method comprises the following steps:
A. placing a first carrier with a product on a positioning mechanism for positioning;
B. the pressing mechanism presses and fixes the first carrier;
C. the laser displacement detection mechanism detects whether a product exists or not, and when the product is detected, the disassembly mechanism disassembles the product;
D. resetting the positioning mechanism and the pressing mechanism, taking down the first carrier, replacing the first carrier with a second carrier, and placing the product into the second carrier;
E. the positioning mechanism and the pressing mechanism fix the second carrier;
F. the probe assembling and disassembling mechanism assembles the probe below the second carrier and is connected with the product.
According to the carrier probe dismounting device, the positioning mechanism positions products, the carrier probe dismounting device comprises a first carrier and electronic products arranged in the first carrier, the pressing mechanism presses and fixes two ends of the first carrier, when the laser displacement detection mechanism detects the products, the dismounting mechanism demounts the electronic products from the first carrier, then the electronic products are placed in a second carrier and then fixed by the positioning mechanism and the pressing mechanism, the probe dismounting mechanism mounts the probe to one end of the second carrier and is connected with the electronic products, and the products can be conveniently detected; after the detection is finished, the probe is disassembled by the probe disassembling and assembling mechanism, the electronic product is disassembled from the second carrier by the disassembling mechanism, then the pressing mechanism cancels the pressing, and the product is taken down; the carrier probe dismounting device realizes automatic dismounting of a product carrier and automatic assembling and dismounting of the probe, is convenient and efficient, and cannot cause product damage.
Drawings
FIG. 1 is a schematic view of a carrier probe mounting and dismounting apparatus according to the present invention;
FIG. 2 is a schematic structural diagram of a carrier probe mounting and dismounting apparatus according to the present invention;
FIG. 3 is a schematic view of a positioning mechanism of the carrier probe mounting/dismounting apparatus of the present invention;
FIG. 4 is a schematic view of a disassembling mechanism of the carrier probe disassembling apparatus according to the present invention;
FIG. 5 is a schematic view of a probe mounting/dismounting mechanism of the carrier probe mounting/dismounting apparatus of the present invention;
labeled as: the laser displacement measuring device comprises a rack 1, a positioning mechanism 2, a positioning support plate 21, a positioning groove 22, a positioning needle 23, a magnet 24, a pressing mechanism 3, a pressing plate 31, a rotary lifting cylinder 32, a limiting column 33, a flexible gasket 34, a laser displacement detection mechanism 4, a mounting support 41, an adjusting support 42, a miniature laser displacement sensor 43, a disassembling mechanism 5, a lifting plate 51, a jacking cylinder 52, a flat cylinder 53, a push-hook thimble 54, a probe disassembling and assembling mechanism 6, a thimble unit 61, a thimble 611, a thimble driving cylinder 612, a disassembling and assembling unit 62, a disassembling and assembling fixing frame 621, a first slide rail 622, a disassembling and assembling support 623, a guide groove 624, a second slide rail 625, a disassembling and assembling plate 626, a disassembling and assembling cylinder 627, a disassembling and assembling fixing plate 628, a positioning column 6281.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
The technical solutions provided by the embodiments of the present invention are described in detail below with reference to fig. 1 to 5.
The embodiment provides a carrier probe dismouting equipment, including frame 1, set up in positioning mechanism 2 in the frame 1, set up in 2 inboard pressure of positioning mechanism hold mechanism 3 and laser displacement detection mechanism 4, set up in the mechanism 5 of disassembling of 2 bottoms of positioning mechanism and set up in the probe dismouting mechanism 6 of 2 one ends of positioning mechanism. The positioning mechanism 2 positions products, the products comprise a first carrier and electronic products arranged in the first carrier, the pressing and holding mechanism 3 presses and holds and fixes two ends of the first carrier, when the laser displacement detection mechanism 4 detects the products, the disassembling mechanism 5 disassembles the electronic products from the first carrier, then the electronic products are placed in a second carrier and then are fixed by the positioning mechanism 2 and the pressing and holding mechanism 3, and the probe disassembling and assembling mechanism 6 assembles a probe to one end of the second carrier and is connected with the electronic products, so that the products can be detected conveniently; after the detection is finished, the probe is disassembled by the probe disassembling mechanism 6, the electronic product is disassembled from the second carrier by the disassembling mechanism 5, then the pressing mechanism 3 cancels the pressing, and the product is taken down; the carrier probe dismounting device realizes automatic dismounting of a product carrier and automatic assembling and dismounting of the probe, is convenient and efficient, and cannot cause product damage.
The positioning mechanism 2 comprises a positioning carrier 21, a positioning slot 22 arranged on the positioning carrier 21, and a plurality of positioning pins 23 and magnets 24 arranged in the positioning slot 22. After the positioning slot 22 and the positioning pins 23 position the product, the magnet 24 adsorbs and fixes the product.
The pressing mechanism 3 comprises two pressing plates 31, rotary lifting cylinders 32 for respectively driving the two pressing plates 31 to rotate and lift, and limiting columns 33 arranged on the inner sides of the rotary lifting cylinders 32, wherein flexible gaskets 34 are respectively arranged below the pressing plates 31. The flexible gasket 34 directly contacts with a product to prevent the product from being damaged, the limiting column 33 limits the position of the pressing plate 31 in the rotating process of the rotating lifting cylinder 32, and after the rotating lifting cylinder 32 rotates to a limiting position, the rotating lifting cylinder 32 drives the pressing plate 31 to descend to press and hold the product.
The laser displacement detection mechanism 4 includes a mounting bracket 41, an adjusting bracket 42 disposed on the mounting bracket 41, and a micro laser displacement sensor 43 disposed on the mounting bracket 41, wherein the micro laser displacement sensor 43 can rotate around the adjusting bracket 42 within a preset angle.
The disassembling mechanism 5 comprises a lifting plate 51, a jacking cylinder 52 for driving the lifting plate 51 to lift, a flat cylinder 53 arranged at one end of the lifting plate 51 and two pushing hook thimbles 54 arranged at the output end of the parallel cylinder 53. The jacking cylinder 52 drives the lifting plate 51 and the parallel cylinder 53 to rise, the parallel cylinder 53 drives the two pushing and clamping hook thimbles 54 to open, the clamping piece in the first carrier is pulled open, clamping of the product is cancelled, and the electronic product is convenient to take down.
The probe disassembling and assembling mechanism 6 comprises two thimble units 61 arranged on the front side and the rear side of the positioning mechanism 2 and a disassembling and assembling unit 62 arranged at one end of the positioning mechanism 2. When the probe needs to be disassembled, the two ejector pin units 61 first remove the clamping of the probe clamping piece, and then the disassembling unit 62 performs the disassembling operation.
The ejector pin unit 61 includes an ejector pin 611 and an ejector pin driving cylinder 612 for driving the ejector pin 611 to advance and retreat. The two ejector pin driving cylinders 612 drive simultaneously; the two ejector pins 611 advance, so that the two elastic clamping pieces on the probe can be clamped inwards, the clamping connection between the probe and the second carrier is cancelled, and the disassembling and assembling unit 62 is convenient to disassemble.
The dismounting unit 62 includes a dismounting fixing frame 621, a first slide rail 622 horizontally disposed on the dismounting fixing frame 621, a dismounting bracket 623 slidably fitted to the first slide rail 622, two guide grooves 624 disposed inside the dismounting fixing frame 621, a second slide rail 625 vertically disposed on the first slide rail 622, a dismounting mounting plate 626 slidably fitted to the second slide rail 625 and the two guide grooves 624, a dismounting cylinder 627 for driving the dismounting bracket 623 to slide along the first slide rail 622, and a dismounting fixing plate 628 disposed on the dismounting mounting plate 626. The guide groove 624 includes a horizontal section and an inclined section, a probe is placed on the dismounting fixing plate 628, the dismounting cylinder 627 drives the dismounting bracket 623 to slide along the first slide rail 622, and the dismounting mounting plate 626 slides along the second slide rail 625 and the two guide grooves 624, and is inserted into one end of the second carrier obliquely upwards.
A fixed cylinder 629 is arranged at one end of the dismounting and mounting fixed plate 628, and a plurality of positioning columns 6281 are arranged on the dismounting and mounting fixed plate 628; when the mounting and dismounting bracket 623 slides along the first slide rail 622, the mounting and dismounting plate 626 slides along the second slide rail 625 and the two guide grooves 624. After the probes are preliminarily positioned by the positioning columns 6281, the probes are clamped and fixed by the fixing cylinder 629.
The invention also provides a carrier probe disassembling method, which comprises the carrier probe disassembling equipment as described in any one of the above, and the method comprises the following steps:
A. placing a first carrier with products on a positioning mechanism 2 for positioning;
B. the pressing mechanism 3 presses and fixes the first carrier;
C. the laser displacement detection mechanism 4 detects whether a product exists or not, and when the product is detected, the disassembly mechanism 5 disassembles the product;
D. the positioning mechanism 2 and the pressing mechanism 3 are reset, the first carrier is taken down, the first carrier is replaced by a second carrier, and the product is placed in the second carrier;
E. the positioning mechanism 2 and the pressing mechanism 3 fix the second carrier;
F. the probe assembling and disassembling mechanism 6 assembles the probe below the second carrier and is connected with the product.
According to the carrier probe disassembling and assembling equipment, a product is positioned by the positioning mechanism 2, the product comprises a first carrier and an electronic product arranged in the first carrier, the pressing and holding mechanism 3 presses and holds two ends of the first carrier fixedly, when the laser displacement detection mechanism 4 detects the product, the disassembling mechanism 5 disassembles the electronic product from the first carrier, then the electronic product is placed in a second carrier and is fixed by the positioning mechanism 2 and the pressing and holding mechanism 3, and the probe is assembled at one end of the second carrier by the probe disassembling and assembling mechanism 6 and is connected with the electronic product, so that the product can be detected conveniently; after the detection is finished, the probe is disassembled by the probe disassembling mechanism 6, the electronic product is disassembled from the second carrier by the disassembling mechanism 5, then the pressing mechanism 3 cancels the pressing, and the product is taken down; the carrier probe dismounting device realizes automatic dismounting of a product carrier and automatic assembling and dismounting of the probe, is convenient and efficient, and cannot cause product damage.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and those skilled in the art can make many variations and modifications of the technical solution of the present invention without departing from the scope of the technical solution of the present invention by using the above disclosure, and the technical solution of the present invention is covered by the claims.
Claims (10)
1. A carrier probe dismouting equipment which characterized in that: including the frame, set up in positioning mechanism in the frame, set up in mechanism and laser displacement detection mechanism are held to inboard pressure of positioning mechanism, set up in the mechanism of disassembling of positioning mechanism bottom and set up in the probe dismouting mechanism of positioning mechanism one end.
2. The carrier probe mounting and dismounting apparatus according to claim 1, wherein: the positioning mechanism comprises a positioning support plate, a positioning groove arranged on the positioning support plate, and a plurality of positioning needles and magnets arranged in the positioning groove.
3. The carrier probe mounting and dismounting apparatus according to claim 1, wherein: the pressing and holding mechanism comprises two pressing plates, rotary lifting cylinders and limiting columns, the rotary lifting cylinders are used for driving the two pressing plates to rotate and lift respectively, the limiting columns are arranged on the inner sides of the rotary lifting cylinders, and flexible gaskets are arranged below the pressing plates respectively.
4. The carrier probe mounting and dismounting apparatus according to claim 1, wherein: the laser displacement detection mechanism comprises a mounting bracket, an adjusting bracket arranged on the mounting bracket and a miniature laser displacement sensor arranged on the mounting bracket, wherein the miniature laser displacement sensor can rotate around the adjusting bracket within a preset angle.
5. The carrier probe mounting and dismounting apparatus according to claim 1, wherein: the disassembling mechanism comprises a lifting plate, a jacking cylinder for driving the lifting plate to lift, a flat cylinder arranged at one end of the lifting plate and two pushing hook thimbles arranged at the output end of the parallel cylinder.
6. The carrier probe mounting and dismounting apparatus according to claim 1, wherein: the probe disassembling and assembling mechanism comprises two thimble units arranged on the front side and the rear side of the positioning mechanism and a disassembling and assembling unit arranged at one end of the positioning mechanism.
7. The carrier probe mounting/dismounting apparatus according to claim 6, wherein: the thimble unit comprises a thimble and a thimble driving cylinder for driving the thimble to move forwards and backwards.
8. The carrier probe mounting/dismounting apparatus according to claim 6, wherein: the dismouting unit include dismouting mount, level set up in first slide rail on the dismouting mount, with first slide rail sliding fit's dismouting support, set up in two inboard guide ways of dismouting mount, vertical set up in second slide rail on the first slide rail, with the second slide rail with two guide way sliding fit's dismouting mounting panel, drive the dismouting support is followed the gliding dismouting cylinder of first slide rail and set up in dismouting fixed plate on the dismouting mounting panel.
9. The carrier probe detachment apparatus of claim 8, wherein: a fixed cylinder is arranged at one end of the dismounting and mounting fixed plate, and a plurality of positioning columns are arranged on the dismounting and mounting fixed plate; when the dismounting bracket slides along the first slide rail, the dismounting mounting plate slides along the second slide rail and the two guide grooves.
10. A carrier probe disassembling method is characterized in that: the carrier probe dismounting device comprises any one of the carrier probe dismounting devices, and the method comprises the following steps:
A. placing a first carrier with a product on a positioning mechanism for positioning;
B. the pressing mechanism presses and fixes the first carrier;
C. the laser displacement detection mechanism detects whether a product exists or not, and when the product is detected, the disassembly mechanism disassembles the product;
D. resetting the positioning mechanism and the pressing mechanism, taking down the first carrier, replacing the first carrier with a second carrier, and placing the product into the second carrier;
E. the positioning mechanism and the pressing mechanism fix the second carrier;
F. the probe assembling and disassembling mechanism assembles the probe below the second carrier and is connected with the product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010184124.5A CN111266824B (en) | 2020-03-17 | 2020-03-17 | Carrier probe dismounting device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010184124.5A CN111266824B (en) | 2020-03-17 | 2020-03-17 | Carrier probe dismounting device and method |
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| Publication Number | Publication Date |
|---|---|
| CN111266824A true CN111266824A (en) | 2020-06-12 |
| CN111266824B CN111266824B (en) | 2024-07-19 |
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| CN202010184124.5A Active CN111266824B (en) | 2020-03-17 | 2020-03-17 | Carrier probe dismounting device and method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111906718A (en) * | 2020-07-30 | 2020-11-10 | 固安浩瀚光电科技有限公司 | Semiconductor part disassembling device and using method thereof |
| CN113414736A (en) * | 2021-07-08 | 2021-09-21 | 江苏创源电子有限公司 | Disassembling and assembling equipment |
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| CN111906718A (en) * | 2020-07-30 | 2020-11-10 | 固安浩瀚光电科技有限公司 | Semiconductor part disassembling device and using method thereof |
| CN113414736A (en) * | 2021-07-08 | 2021-09-21 | 江苏创源电子有限公司 | Disassembling and assembling equipment |
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