CN111261595A - Base-island-free frame packaging structure and preparation method thereof - Google Patents
Base-island-free frame packaging structure and preparation method thereof Download PDFInfo
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- CN111261595A CN111261595A CN202010063785.2A CN202010063785A CN111261595A CN 111261595 A CN111261595 A CN 111261595A CN 202010063785 A CN202010063785 A CN 202010063785A CN 111261595 A CN111261595 A CN 111261595A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 32
- 239000000853 adhesive Substances 0.000 claims description 63
- 230000001070 adhesive effect Effects 0.000 claims description 63
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 11
- 239000005022 packaging material Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 229920006254 polymer film Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000005457 optimization Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- 239000007769 metal material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The application discloses no base island frame packaging structure and preparation method thereof, wherein, the frame of no base island frame packaging structure has the through-hole that runs through the frame to all sink mounting glue and chip and set up in the through-hole, make mounting glue and chip need not additionally to occupy the space in the vertical direction, thereby realized no base island frame packaging structure's optimization, reduced no base island frame packaging structure's size.
Description
Technical Field
The application relates to the technical field of semiconductor packaging, in particular to a packaging structure without a base island frame and a preparation method thereof.
Background
With the rapid development of electronic information technology, the miniaturization requirement of electronic equipment for a packaging structure is more and more strong, and the ratio of the chip area to the base island (carrier) area is far less than 30% due to the reduction of the chip size in the original design with a base island frame. Therefore, reverse wrapping and separation layers are easy to occur, and because the chip is small and the base island (carrier) is large, the gold wire is long, the wire punching phenomenon is easy to occur, the difficulty and hidden danger are brought to the packaging process and the product quality, and the base island frame-free packaging structure is produced at the right moment.
The packaging structure without the base island frame can reduce the size of the packaging structure to a certain extent because the base island is not needed to be used as a carrier of a chip, and can avoid the problems that a gold thread is long and a wire punching phenomenon is easy to generate due to the fact that the base island is large.
However, in practical applications, it is found that the size of the current packaging structure without a base island frame is difficult to further reduce due to the limitations of the current machine and the manufacturing process capability, and therefore, it is necessary to optimize the structure of the packaging structure without a base island frame to achieve the purpose of further reducing the size of the packaging structure without a base island frame.
Disclosure of Invention
In order to solve the technical problem, the application provides a base-island-free frame packaging structure and a preparation method thereof, so as to achieve the purpose of reducing the size of the base-island-free frame packaging structure.
In order to achieve the technical purpose, the embodiment of the application provides the following technical scheme:
a base-island-free frame package structure, comprising:
a frame including a through hole penetrating the frame and first and second surfaces disposed opposite to each other;
the mounting glue is positioned in the through hole;
the chip is positioned on one side, facing the second surface, of the mounting glue and is electrically connected with the frame;
and filling gaps among the through holes, the mounting glue and the chips, and covering the surfaces of the chips departing from one side of the mounting glue and the protection structures on the second surface of the frame.
Optionally, the surface of the die attach adhesive on the side away from the chip and the first surface are located on the same plane.
Optionally, the method further includes:
and a connecting structure for connecting the chip and the frame.
Optionally, the protection structure is a plastic package structure or a ceramic package structure.
Optionally, a surface of the chip on a side away from the die attach adhesive is flush with the second surface of the frame.
A preparation method of a base-island-free frame packaging structure comprises the following steps:
providing a carrier plate and a frame, wherein the frame is provided with a through hole penetrating through the frame and a first surface and a second surface which are oppositely arranged;
fixing the frame on the surface of the carrier plate, wherein the first surface faces the carrier plate;
arranging a chip mounting adhesive and a chip in the through hole, and electrically connecting the chip with the frame;
forming a protection structure which fills gaps among the through hole, the mounting glue and the chip and covers the surface of one side of the chip, which is far away from the mounting glue, and the second surface of the frame;
and removing the carrier plate after the protective structure is formed.
Optionally, the carrier plate is a metal plate or a non-metal plate or a polymer film.
Optionally, the step of disposing the die attach adhesive and the chip in the through hole and electrically connecting the chip and the frame includes:
sequentially arranging a chip mounting adhesive and a chip in the through hole, and electrically connecting the chip with the second surface of the frame; or
And fixing the chip and the mounting adhesive, arranging the fixed mounting adhesive and the chip in the through hole together, and electrically connecting the chip and the second surface of the frame.
Optionally, the sequentially disposing the die bonding adhesive and the chip in the through hole, and electrically connecting the chip to the second surface of the frame includes:
fixing the mounting glue on the surface of the carrier plate;
fixing the chip on the surface of one side, away from the support plate, of the chip mounting adhesive;
and forming a connecting structure for connecting the chip and the frame.
Optionally, the forming and filling the through hole, the mounting adhesive and the gap between the chips, and the protecting structure covering the chip deviating from the side surface of the mounting adhesive and the second surface of the frame includes:
filling a plastic packaging material into a gap between the through hole and the chip mounting adhesive;
coating a plastic packaging material on the surface of one side of the chip, which is far away from the chip mounting glue, and the second surface of the frame;
and curing the plastic packaging material to obtain a plastic packaging structure.
According to the technical scheme, the embodiment of the application provides a packaging structure without a base island frame and a preparation method thereof, wherein the frame of the packaging structure without the base island frame is provided with a through hole penetrating through the frame, and the chip mounting glue and the chip are arranged in the through hole in a sinking manner, so that the chip mounting glue and the chip do not need to additionally occupy the space in the vertical direction, the optimization of the packaging structure without the base island frame is realized, and the size of the packaging structure without the base island frame is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 and fig. 2 are schematic cross-sectional views of a packaging structure without a base island frame in the prior art;
fig. 3 is a schematic cross-sectional view of a non-base-island frame package structure according to an embodiment of the present application;
fig. 4 and 5 are schematic diagrams of two top-view structures of a base-island-free frame package structure according to an embodiment of the present application;
fig. 6 is a schematic cross-sectional view of a non-base-island frame package structure according to another embodiment of the present application;
fig. 7 is a schematic diagram illustrating a method for manufacturing a non-base-island frame package structure according to an embodiment of the present application;
fig. 8-11 are flow charts illustrating a process for manufacturing a non-base-island frame package structure according to an embodiment of the present application.
Detailed Description
At present, a non-base-island frame packaging structure in the prior art is shown in fig. 1 and fig. 2, and mainly comprises a frame 10, a mounting adhesive 20, a chip 30, a connection structure 40, and a plastic package body 50, in fig. 1, a hollow area is provided in the center of the frame 10, in fig. 2, the hollow area is not provided in the center of the frame 10, and whether the hollow area is provided in the frame 10 or not may be set according to an actual application scenario. In both the structures shown in fig. 1 and 2, the die attach adhesive 20 and the chip 30 are disposed above the frame 10, and the electrical connection with the frame 10 is achieved through the connecting structure 40.
The inventor finds that, in the prior art, the purpose of reducing the size of the padless frame package structure is usually achieved by optimizing the manufacturing process or improving the operation capability of the machine, because the chip 30 is located on the frame 10 and the thickness depends on the upper mold safety distance L1, the thickness L2 of the chip 30 and the die attach adhesive 20, and the thickness L3 of the frame 10, the main idea of reducing the finished package thickness of the chip 30 is to reduce the upper mold safety distance L1, the thickness L2 of the chip 30 and the die attach adhesive 20, and the thickness L3 of the frame 10, but as the operation capability and the manufacturing process capability of the machine approach the limit, it is more and more difficult to reduce the size of the padless frame package structure in this way.
In view of this, an embodiment of the present application provides a base-island-free frame package structure, including:
a frame including a through hole penetrating the frame and first and second surfaces disposed opposite to each other;
the mounting glue is positioned in the through hole;
the chip is positioned on one side, facing the second surface, of the mounting glue and is electrically connected with the frame;
and filling gaps among the through holes, the mounting glue and the chips, and covering the surfaces of the chips departing from one side of the mounting glue and the protection structures on the second surface of the frame.
Still referring to fig. 1 and 2, the thickness of the non-base-island frame package structure in the prior art in the vertical direction is determined by an upper mold safety distance L1, a chip and die bonding adhesive thickness L2, and a frame thickness L3, in this embodiment, the frame of the non-base-island frame package structure has a through hole penetrating through the frame, and the die bonding adhesive and the chip are both sunk in the through hole, so that compared with the non-base-island frame package structure in the prior art, the chip and package structure thickness L2 can be omitted, and the die bonding adhesive and the chip do not need to additionally occupy a space in the vertical direction, thereby optimizing the non-base-island frame package structure and reducing the size of the non-base-island frame package structure.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
An embodiment of the present application provides a base-island-free frame package structure, as shown in fig. 3, fig. 4, and fig. 5, fig. 3 is a schematic cross-sectional structure diagram of the base-island-free frame package structure, and fig. 4 and fig. 5 are schematic top-view structure diagrams of the base-island-free frame package structure; the base-island-free frame packaging structure comprises:
a frame 100, the frame 100 including a through hole TH penetrating the frame 100 and a first surface and a second surface disposed opposite to each other;
the mounting glue 200 is positioned in the through hole TH;
the chip 300 is positioned on one side, facing the second surface, of the mounting adhesive 200, and the chip 300 is electrically connected with the frame 100;
fill the through-hole TH with the gap between the die attach adhesive 200, the chip 300, and cover the chip 300 deviates from the surface of one side of the die attach adhesive 200 and the protection structure 500 of the second surface of the frame 100.
In the package structure without a base island frame, the frame 100 serves to electrically connect the chip 300 in the package structure with an external structure, and may be the frame 100 made of a metal material or the frame 100 made of other conductive materials.
The cross-sectional shape of the through hole TH may be a regular shape such as a rectangle having a small upper opening and a large lower opening as shown in fig. 3, but is not limited thereto as long as the die attach adhesive 200 and the chip 300 can be accommodated therein.
Fig. 4 and 5 show two schematic top-view structures of two possible packaging structures without a base island frame, and the protection structure 500 is not shown in fig. 4 and 5 in order to clearly show a possible structure of the frame 100. In fig. 4, a through hole TH penetrating through the frame 100 is formed in a central region of the frame 100, and in this case, the frame 100 is an integral structure, and the chip 300 can be electrically connected to the frame 100 by at least one connecting structure 400. The connecting structure may be a wire bond or other metal conductor.
In fig. 5, the through hole TH is rectangular, the frame 100 is divided into a left part and a right part by the through hole TH, and at least two connection structures 400 are required to electrically connect the chip 300 and the two parts of the frame 100. Of course, in the actual usage process, the number of the required connection structures 400 is related to the number of pins of the chip 300, the type of the chip 300, and the like, and the number of the connection structures 400 for electrically connecting the chip 300 and the frame 100 is not limited in this application, which is determined according to the actual situation.
In fig. 4 and 5, the through hole TH is illustrated as being located in the central region of the frame 100, but of course, in other embodiments of the present application, the through hole TH may be located in other regions except the central region as needed, which is not limited in the present application, and is determined according to the actual situation.
Optionally, still referring to fig. 3, a surface of the die attach adhesive 200 facing away from the chip 300 is located on the same plane as the first surface, that is, a surface of the die attach adhesive 200 facing away from the chip 300 is exposed without being covered by the protection structure 500, so that a sufficient setting space can be reserved for the chip 300, and the top of the chip 300 is prevented from exceeding the top or the second surface of the frame 100.
Correspondingly, in order to further reduce the size of the packaging structure without the base island frame, on the basis that the surface of the die attach adhesive 200 on the side away from the chip 300 and the first surface are located on the same plane, the second surface of the frame 100 is flush with the surface of the chip 300 on the side away from the die attach adhesive 200, that is, the thickness of the frame 100 is equal to the sum of the thickness of the die attach adhesive 200 and the thickness of the chip 300, so that the thickness of the packaging structure without the base island frame in the vertical direction can be further reduced. Of course, referring to fig. 6, in some application scenarios where the requirement for the thickness of the island-free package structure in the vertical direction is not very high, the surface of the chip facing away from the die attach adhesive may not be flush with the second surface of the frame, so as to reduce the package accuracy requirement.
Optionally, the protection structure 500 is a plastic package structure formed by a plastic package material, and when the plastic package structure is formed by the plastic package material, gaps between the through holes TH and the die attach adhesive 200 and between the through holes TH and the chips 300 can be filled well due to good filling fluidity of the plastic package material, and the chips are shaped by a curing method after the filling is completed.
In the preparation process of the packaging structure without the base island frame, since the die attach adhesive 200 is disposed in the through holes TH, in order to provide a carrier for the die attach adhesive 200, a carrier plate needs to be disposed at the bottom of the frame 100 as a support, and the carrier plate is removed after the preparation of the packaging structure is completed. Optionally, the carrier plate is a metal plate or a non-metal plate or a polymer film and the like having a supporting function.
The following describes a method for manufacturing a package structure without a base island frame provided in an embodiment of the present application, and accordingly, the embodiment of the present application provides a method for manufacturing a package structure without a base island frame, as shown in fig. 7, including:
s101: providing a carrier plate and a frame, wherein the frame is provided with a through hole penetrating through the frame and a first surface and a second surface which are oppositely arranged;
referring to fig. 8, 4 and 5, fig. 8 is a schematic cross-sectional structure of the frame, TH in fig. 8 indicates the through hole, F1 indicates the first surface, F2 indicates the second surface, 100 indicates the frame, and fig. 4 and 5 show schematic top structure of two possible frames;
in the packaging structure without the base island frame, the frame plays a role in realizing the purpose of electrically connecting a chip in the packaging structure with an external structure, and can be a frame made of a metal material or a frame made of other conductive materials.
The cross-sectional shape of the through-hole may be a shape having a small upper opening and a large lower opening as shown in fig. 8, or may be a regular shape such as a rectangle.
In fig. 4, the groove is disposed in the central region of the frame, and the frame is still a whole structure, and the chip can be electrically connected to the frame with at least one connection structure.
In fig. 5, the frame is divided into two parts, i.e., a left part and a right part, by the through hole, and at least two connecting structures are required to electrically connect the chip and the frames of the two parts. Certainly, in the actual using process, the number of the required connection structures is related to the number of pins of the chip, the type of the chip, and the like, and the number of the connection structures for electrically connecting the chip and the frame is not limited in the present application, which is determined according to the actual situation.
S102: fixing the frame on the surface of the carrier plate, wherein the first surface of the frame faces the carrier plate;
referring to fig. 9, fig. 9 is a schematic cross-sectional structure view of the package structure after step S102, after the carrier 600 is fixed on the first surface side of the frame, the carrier 600 can provide support for subsequent formation of die attach adhesive and chip, and optionally, the carrier is a metal plate or a non-metal plate or a polymer film or other structures with support functions. In fig. 9, reference numeral 600 denotes the carrier plate.
S103: arranging a chip mounting adhesive and a chip in the through hole, and electrically connecting the chip with the frame; (ii) a Or
And fixing the chip and the mounting adhesive, arranging the fixed mounting adhesive and the chip in the through hole together, and electrically connecting the chip and the second surface of the frame.
That is, in this embodiment, the process of sequentially disposing the die-bonding adhesive and the chip in the through hole may be to first fix the chip and the die-bonding adhesive, and then to dispose the fixed die-bonding adhesive and the chip in the through hole, or to sequentially dispose the die-bonding adhesive and the chip in the through hole.
Optionally, the sequentially disposing the die bonding adhesive and the chip in the through hole, and electrically connecting the chip to the second surface of the frame includes:
s1031: fixing the mounting glue on the surface of the carrier plate;
s1032: fixing the chip on the surface of one side, away from the support plate, of the chip mounting adhesive;
s1033: and forming a connecting structure for connecting the chip and the frame.
Referring to fig. 10, fig. 10 is a schematic cross-sectional structure diagram of the package structure after step S103, and in fig. 10, a connection structure connecting the second surface of the frame and the chip is shown. In fig. 10, reference numeral 400 denotes the connection structure, 200 denotes the die attach adhesive, and 300 denotes the chip.
Optionally, the connecting structure is that the bonding wire is another metal conductor.
S104: forming a protection structure which fills gaps among the through hole, the mounting glue and the chip and covers the surface of one side of the chip, which is far away from the mounting glue, and the second surface of the frame;
optionally, the forming and filling the through hole, the mounting adhesive and the gap between the chips, and the protecting structure covering the chip deviating from the side surface of the mounting adhesive and the second surface of the frame includes:
s1041: filling a plastic packaging material into a gap between the through hole and the chip mounting adhesive;
s1042: coating a plastic packaging material on the surface of one side of the chip, which is far away from the chip mounting glue, and the second surface of the frame;
s1043: and curing the plastic packaging material to obtain a plastic packaging structure.
When the plastic package material is used for forming a plastic package structure, gaps among the through holes, the chip mounting glue and the chips can be filled well due to good filling fluidity of the plastic package material, and the plastic package material is shaped in a curing mode after filling is completed.
Referring to fig. 11, fig. 11 shows a schematic cross-sectional structure diagram of the package structure after step S104. In fig. 11, reference numeral 500 denotes the protection structure.
S105: and removing the carrier plate after the protective structure is formed.
Referring to fig. 3, fig. 3 shows a schematic cross-sectional structure diagram of the package structure after step S105.
Optionally, still referring to fig. 3, a surface of the die attach adhesive on a side away from the chip and the first surface are located on the same plane, that is, the surface of the die attach adhesive on a side away from the chip is exposed without being covered by a protection structure, so that a sufficient setting space can be reserved for the chip, and the top of the chip is prevented from exceeding the top of the frame.
Correspondingly, in order to further reduce the size of the packaging structure without the base island frame, on the basis that the surface of the mounting adhesive, which is away from one side of the chip, and the first surface are located on the same plane, the second surface of the frame and the surface of the chip, which is away from one side of the mounting adhesive, are flush, that is, the thickness of the frame is equal to the sum of the thickness of the mounting adhesive and the thickness of the chip, so that the thickness of the packaging structure without the base island frame in the vertical direction can be further reduced.
In summary, the embodiment of the present application provides a non-base-island frame packaging structure and a manufacturing method thereof, wherein the frame of the non-base-island frame packaging structure has a through hole penetrating through the frame, and the die bonding glue and the chip are both disposed in the through hole, so that the die bonding glue and the chip do not need to additionally occupy a space in the vertical direction, thereby optimizing the non-base-island frame packaging structure and reducing the size of the non-base-island frame packaging structure.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A non-base-island frame package structure, comprising:
a frame including a through hole penetrating the frame and first and second surfaces disposed opposite to each other;
the mounting glue is positioned in the through hole;
the chip is positioned on one side, facing the second surface, of the mounting glue and is electrically connected with the frame;
and filling gaps among the through holes, the mounting glue and the chips, and covering the surfaces of the chips departing from one side of the mounting glue and the protection structures on the second surface of the frame.
2. The island-free frame package structure of claim 1, wherein a surface of the die attach adhesive on a side away from the chip is on a same plane as the first surface.
3. The island-frame-less package structure according to claim 1, further comprising:
and a connecting structure for connecting the chip and the frame.
4. The island-frame-less package structure according to claim 1, wherein the protection structure is a plastic package structure or a ceramic package structure.
5. The island-free frame package structure of claim 1, wherein a surface of the chip facing away from the die attach adhesive is flush with the second surface of the frame.
6. A preparation method of a base-island-free frame packaging structure is characterized by comprising the following steps:
providing a carrier plate and a frame, wherein the frame is provided with a through hole penetrating through the frame and a first surface and a second surface which are oppositely arranged;
fixing the frame on the surface of the carrier plate, wherein the first surface faces the carrier plate;
arranging a chip mounting adhesive and a chip in the through hole, and electrically connecting the chip with the frame;
forming a protection structure which fills gaps among the through hole, the mounting glue and the chip and covers the surface of one side of the chip, which is far away from the mounting glue, and the second surface of the frame;
and removing the carrier plate after the protective structure is formed.
7. The method for manufacturing a package structure without a base island frame according to claim 6, wherein the carrier is a metal plate or a non-metal plate or a polymer film.
8. The method for preparing the packaging structure without the base island frame according to claim 6, wherein the step of disposing the die attach adhesive and the chip in the through hole and electrically connecting the chip and the frame comprises:
sequentially arranging a chip mounting adhesive and a chip in the through hole, and electrically connecting the chip with the second surface of the frame; or
And fixing the chip and the mounting adhesive, arranging the fixed mounting adhesive and the chip in the through hole together, and electrically connecting the chip and the second surface of the frame.
9. The method for manufacturing the island-free frame package structure according to claim 8, wherein the sequentially disposing the die attach adhesive and the chip in the through hole and electrically connecting the chip to the second surface of the frame comprises:
fixing the mounting glue on the surface of the carrier plate;
fixing the chip on the surface of one side, away from the support plate, of the chip mounting adhesive;
and forming a connecting structure for connecting the chip and the frame.
10. The method for manufacturing the package structure without the base island frame according to claim 6, wherein the forming of the protection structure for filling the gap between the through hole and the die attach adhesive and the gap between the through hole and the die and covering the surface of the die facing away from the die attach adhesive and the second surface of the frame comprises:
filling a plastic packaging material into a gap between the through hole and the chip mounting adhesive;
coating a plastic packaging material on the surface of one side of the chip, which is far away from the chip mounting glue, and the second surface of the frame;
and curing the plastic packaging material to obtain a plastic packaging structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010063785.2A CN111261595A (en) | 2020-01-20 | 2020-01-20 | Base-island-free frame packaging structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010063785.2A CN111261595A (en) | 2020-01-20 | 2020-01-20 | Base-island-free frame packaging structure and preparation method thereof |
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| CN113514298A (en) * | 2021-06-23 | 2021-10-19 | 闳康技术检测(上海)有限公司 | Preparation method of chip detection sample with bare wafer back |
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Application publication date: 20200609 |