CN111253714A - 一种覆铜板胶液及低透光黑色覆铜板 - Google Patents

一种覆铜板胶液及低透光黑色覆铜板 Download PDF

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CN111253714A
CN111253714A CN202010255360.1A CN202010255360A CN111253714A CN 111253714 A CN111253714 A CN 111253714A CN 202010255360 A CN202010255360 A CN 202010255360A CN 111253714 A CN111253714 A CN 111253714A
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clad plate
epoxy resin
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罗龙华
杨虎
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Xiamen Yinglewei New Material Technology Co Ltd
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Abstract

本发明属于覆铜板技术领域,具体是一种覆铜板胶液及低透光黑色覆铜板,所述覆铜板胶液按重量份数计,由以下各组分组成,10~85份环氧树脂、1~45份环氧树脂固化剂、0.01~1份固化促进剂、0~100份填料、10~90份含氮树脂和有机溶剂。将增强织物浸入覆铜板胶液后取出干燥获得粘结片,粘结片叠合后与铜箔在热压下压合获得所述低透光黑色覆铜板,外观为黑色,透光率低,层间附着力高的特点,可在电子领域广泛应用。

Description

一种覆铜板胶液及低透光黑色覆铜板
技术领域
本发明属于覆铜板技术领域,涉及一种覆铜板胶液及低透光黑色覆铜板。
背景技术
覆铜板,又称为覆铜箔层压板(Copper Clad Laminate,CCL),是制造印制线路板(Printed Circuit Board,简称PCB)的基础材料,PCB是电子工业的重要部件之一。几乎每种电子设备,小到电子手表、计算器,大到计算机,通讯电子设备,军用武器系统,只要有集成电路等电子元器件,都要使用印制板。为了赋予预浸料和覆铜板以黑色和低透光率特性,目前业界较常使用炭黑等材料添加到热固性树脂组合物中以赋予其黑色低透光率功能。如CN102010578A公开了一种制作覆铜板的黑色无卤树脂组合物,其含有色素炭黑,功能性的赋予覆铜板以黑色特性。但炭黑为可导电物质,加入会显著影响覆铜板的绝缘性能。如上所述,由于已有技术中均采用将炭黑等黑色颗粒添加到热固性树脂组合物中以赋予覆铜板黑色功能,而热固性树脂组合物中导电物质的加入会裂化覆铜板的绝缘性能,所以该方法存在一定的局限性。CN103483622A公开了一种制作黑色层压板的方法,其是使用石墨烯或氧化石墨烯包覆处理生产预浸料所使用的增强材料(7628玻璃布)从而达到赋予层压板黑色的功能。该方法是使用黑色石墨烯或氧化石墨烯包覆处理增强材料,最终赋予层压板黑色的功能。但是由于石墨烯或氧化石墨烯为纳米级的材料,使用其对玻璃纤维布进行包覆处理工艺比较复杂,同时会对层压板的层间粘合力产生显著的负面影响,最终限制层压板的使用。
CN103571156B公开一种热固性树脂组合物及其用途,其通过添加采石墨烯或氧化石墨烯包覆处理无机填料制备黑色覆铜板,但是该方法需要优先将填料使用石墨烯或氧化石墨烯进行包覆,增加了黑色覆铜板的工艺流程,无形中增加黑色覆铜板的制造成本。
CN110202870A采用夹心结构,中间层添加石墨烯为材料提供黑色功能,然后表面使用常规配方为材料提供绝缘性能。此技术由于石墨烯加入环氧树脂中其分散工艺较为复杂,同时石墨烯的加入在一定程度上降低了材料的绝缘性。
因此,寻找一种既可以赋予绝缘板低透光黑色功能,又不会劣化覆铜板的绝缘性能和粘合性能的方法,同时操作工艺简单实用是本领域需要解决的技术问题。
发明内容
本发明的一个目的在于克服现有技术缺陷,提供一种覆铜板胶液。
本发明的另一个目的在于提供一种低透光黑色覆铜板。
本发明的技术方案如下:
一种覆铜板胶液,按重量份数计,由以下各组分组成,10~85份环氧树脂、1~45份环氧树脂固化剂、0.01~1份固化促进剂、0~100份填料、10~90份含氮树脂和有机溶剂;所述有机溶剂的使用量以使所述胶液的固含量为65~75%。所述有机溶剂不做特别限制,只要能较好的溶解各原料组分就可以,具体的可以选自丙酮、丁酮、甲乙酮、环己酮、乙二醇甲醚、丙二醇甲醚和丙二醇甲醚醋酸酯中的一种或几种。
优选的,所述环氧树脂选自双酚A型环氧树脂、联苯环氧树脂、苯酚酚醛型环氧树脂、邻甲酚醛型环氧树脂、双酚A型酚醛环氧树脂和双环戊二烯苯酚型环氧树脂中的一种或几种。更优选的,所述环氧树脂的重量为10~50份,进一步优选的,所述环氧树脂的重量为15~30份。
优选的,所述环氧树脂固化剂选自双氰胺、4,4-二氨基二苯砜、酚醛树脂、酸酐和活性酯中的至少一种。
优选的,所述固化促进剂为咪唑类固化促进剂,选自2-甲基咪唑、1-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑和2-苯基4-甲基咪唑中的至少一种。更优选的,所述固化促进剂的重量为0.02~0.5份。
优选的,所述填料选自无机填料或有机填料中的一种或几种。所述无机填料选自氢氧化铝、氢氧化镁、沸石、硅灰石、二氧化硅、氧化镁、硅酸钙、碳酸钙、粘土、滑石粉和云母中的一种或几种。所述有机填料为含氮的有机填料,选自三聚氰胺和三聚氰胺氰尿酸盐中的一种或两种。更优选的,所述填料的重量为5~20份。
优选的,所述含氮树脂为含有多个腈基的高分子体,结构如式(Ⅰ)所示,
Figure BDA0002437093150000021
其中,Ar为式(Ⅱ)~式(Ⅸ)所示的任意一种结构,
Figure BDA0002437093150000022
Figure BDA0002437093150000031
更优选的,所述含氮填料的重量为50~80份。
一种低透光黑色覆铜板,由上述任一实施方案所述的覆铜板胶液制备获得。
优选的,所述制备为将增强织物浸入所述覆铜板胶液中,取出,在180~210℃下加热5~25分钟,获得粘结片;将一张或数张所述粘结片叠合后在垂直于叠合方向的侧边的一侧或两侧覆上铜箔,热压下压合,获得所述低透光黑色覆铜板。
更优选的,所述增强织物选自天然纤维织物、有机合成纤维织物和无机纤维织物中的至少一种。
本发明的有益效果是:本发明提供一种覆铜板胶液,不使用具有导电性能的填料或者石墨烯修饰的填料,获得的覆铜板颜色为黑色,且具有较低的光线透过率、良好的电气绝缘性以及良好的粘合力,生产工艺简单,成本低廉。
具体实施方式
以下通过具体实施方式对本发明的技术方案进行进一步的说明和描述。
如无特别指明,以下实施方案中的份数都为重量份数。
实施例1~6和对比例1~5的覆铜板胶液各成分及重量如表1所示,其中
(A)环氧树脂,环氧当量在170g/eq~950g/eq,选自
(A-1)GESN901,环氧当量459g/eq
(A-2)Olin,商品名DER593
(B)双氰胺
(C)2-甲基咪唑
(D)填料,选自
(D-1)硅微粉(平均粒径为1至10μm,纯度99%以上)
(D-2)氢氧化铝(平均粒径为1至5μm,纯度99%以上)
(D-3)德固萨碳黑粉FW200
(E)含氮树脂,溶解在DMF中,溶液固含量为75%
(F)石墨烯
表1覆铜板胶液配方/份数
Figure BDA0002437093150000041
Figure BDA0002437093150000051
实施例1~6和对比例1~5的覆铜板胶液的制备方法:将填料分散在有机溶剂中,加入环氧树脂,搅拌至环氧树脂溶解,加入含氮树脂溶液,搅拌均匀,加入固化促进剂,搅拌均匀,加入固化促进剂,搅拌均匀,获得。
低透光黑色覆铜板的制备方法为:将玻璃纤维织物浸入上述任一实施例和对比例的覆铜板胶液中,取出,在180~210℃下加热5~20分钟,获得粘结片;将一张或数张所述粘结片叠合后在垂直于叠合方向的侧边的一侧或两侧覆上铜箔,热压机下层压压合,获得单面或双面覆铜板。层压压合条件为:(1)层压的升温速率控制在1.0~3.0℃/分钟;(2)层压的压力设置,外层料温不超过100℃时施加满压,满压压力为300±30psi;(3)固化时,控制料温在220℃保温120分钟,压力为满压压力的70~85%。
其中,实施例1的覆铜板由3张粘结片叠合;
实施例2的覆铜板由2张粘结片叠合;
实施例3的覆铜板由3张粘结片叠合;
实施例4的覆铜板由4张粘结片叠合;
实施例5的覆铜板由3张粘结片叠合;
实施例6的覆铜板由3张粘结片叠合;
对比例1~5的覆铜板分别由3张粘结片叠合;
由上述覆铜板胶液获得的覆铜板的性能如表2所示。
表2覆铜板性能
Figure BDA0002437093150000052
因此,由本发明的覆铜板胶液获得的覆铜板具有黑色、透光率低、绝缘性好、层间粘结力较高的特点,可在电子电器领域广泛应用。
以上所述,显示和描述了本发明的基本原理、主要特征和优点。本领域技术人员应该了解本发明不受上述实施例的限制,上述实施例仅为本发明的较佳实施例而已,不能依此限定本发明实施的范围,即依本发明专利范围及说明书内容所作的等效变化与修饰,皆应仍属本发明涵盖的范围内。本发明要求保护范围由所附的权利要求书及其等同物界定。

Claims (9)

1.一种覆铜板胶液,其特征在于,按重量份数计,由以下各组分组成,10~85份环氧树脂、1~45份环氧树脂固化剂、0.01~1份固化促进剂、0~100份填料、10~90份含氮树脂和有机溶剂;所述有机溶剂的使用量以使所述胶液的固含量为65~75%。
2.根据权利要求1所述的覆铜板胶液,所述环氧树脂选自双酚A型环氧树脂、联苯环氧树脂、苯酚酚醛型环氧树脂、邻甲酚醛型环氧树脂、双酚A型酚醛环氧树脂和双环戊二烯苯酚型环氧树脂中的一种或几种。
3.根据权利要求1所述的覆铜板胶液,所述环氧树脂固化剂选自双氰胺、4,4-二氨基二苯砜、酚醛树脂、酸酐和活性酯中的至少一种。
4.根据权利要求1所述的覆铜板胶液,所述固化促进剂为咪唑类固化促进剂,选自2-甲基咪唑、1-甲基咪唑、2-乙基-4-甲基咪唑、2-苯基咪唑、2-十一烷基咪唑和2-苯基4-甲基咪唑中的至少一种。
5.根据权利要求1或所述的覆铜板胶液,所述填料选自无机填料或有机填料中的一种或几种。
6.根据权利要求1所述的覆铜板胶液,所述含氮树脂为含有多个腈基的高分子体,结构如式(Ⅰ)所示,
Figure FDA0002437093140000011
其中,Ar为式(Ⅱ)~式(Ⅸ)所示的任意一种结构,
Figure FDA0002437093140000012
Figure FDA0002437093140000021
7.一种低透光黑色覆铜板,其特征在于,由权利要求1-6任一项所述的覆铜板胶液制备获得。
8.根据权利要求7所述的低透光黑色覆铜板,所述制备为将增强织物浸入所述覆铜板胶液中,取出,在180~210℃下加热5~25分钟,获得粘结片;将一张或数张所述粘结片叠合后在垂直于叠合方向的侧边的一侧或两侧覆上铜箔,热压下压合,获得所述低透光黑色覆铜板。
9.根据权利要求8所述的低透光黑色覆铜板,所述增强织物选自天然纤维织物、有机合成纤维织物和无机纤维织物中的至少一种。
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CN101323698A (zh) * 2007-06-15 2008-12-17 比亚迪股份有限公司 一种阻燃性组合物和覆铜板以及它们的制备方法
CN101376735A (zh) * 2008-09-26 2009-03-04 广东生益科技股份有限公司 无卤阻燃环氧树脂组合物以及用其制作的粘结片与覆铜箔层压板
CN101851480A (zh) * 2010-05-11 2010-10-06 华烁科技股份有限公司 一种用于挠性覆铜板的无卤无磷阻燃合成树脂胶粘剂
CN102115600A (zh) * 2010-11-26 2011-07-06 苏州生益科技有限公司 一种热固性树脂组合物、半固化片及层压板
CN110202870A (zh) * 2019-06-10 2019-09-06 厦门聚力强新材料有限公司 一种低透光率覆铜板及制备方法

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CN101323698A (zh) * 2007-06-15 2008-12-17 比亚迪股份有限公司 一种阻燃性组合物和覆铜板以及它们的制备方法
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