CN111250866A

CN111250866A - Device and method for improving machining quality of hole with any angle by changing laser incidence angle

Info

Publication number: CN111250866A
Application number: CN202010105114.8A
Authority: CN
Inventors: 任乃飞; 范永胜; 任云鹏; 葛亮; 李涛
Original assignee: Jiangsu University
Current assignee: Jiangsu University
Priority date: 2020-02-20
Filing date: 2020-02-20
Publication date: 2020-06-09
Anticipated expiration: 2040-02-20
Also published as: CN111250866B

Abstract

The invention discloses a device and a method for improving the processing quality of holes with any angle by changing the incident angle of laser, which relate to the field of laser drilling and comprise a base, a left positioning support plate, an angle control rotating shaft, a workpiece clamping device, a bolt, a telescopic clamping device, a right positioning support plate, a support shaft, a rotating guide rail, a gear, a positioning fixing bolt hole and a rotating unit; the base angle control unit passes left support plate center and fixes in the location backup pad, the many sizes work piece of the cooperation centre gripping in right side scalable anchor clamps unit and left side, through the corresponding angle of the accurate adjustment of angle rotating unit, through the rotation rate of control below rotating unit gear after confirming the position of spot facing work, make the rotation axis carry out continuous stable rotation along rotatory guide rail, make laser have the inner wall in certain incident angle processing hole, the better unnecessary material of getting rid of, reach and improve inner wall processingquality and reduce tapered effect.

Description

Device and method for improving machining quality of hole with any angle by changing laser incidence angle

Technical Field

The invention relates to the field of laser processing, in particular to a device and a method for improving the processing quality of holes with any angle by changing the incident angle of laser.

Background

Laser drilling is an important application of laser processing technology, and relates to numerous fields, such as: aerospace, automotive industry, medical and chemical industries, etc. With the increasing demands of these fields on the quality of micro-hole and hole-group processing, laser drilling will have greater and greater advantages and status.

Laser drilling has many advantages such as precision height, efficient, no cutter loss, but to the hole on the high-accuracy equipment, it is very high to the tapering and the inner wall quality requirement of hole, like the air film cooling hole on the aeroengine, its tapering if too big will reduce the gas mobility in inside and then directly influence the cooling performance in air film hole to can not satisfy the operation requirement.

In view of the above situation, chinese patent CN20161035099.2 proposes to place a laser reflection device and a reflection adjustment mechanism below a workpiece, and when a laser beam passes through a through hole and falls on the reflection device to cooperate with the reflection adjustment mechanism to eliminate taper, we know that the energy density of the laser at the focal point is the largest, and when the laser beam passes through the through hole, the energy density is already attenuated, the energy reaching the reflection device for reprocessing is greatly reduced, and the energy density of the reflected laser beam is unlikely to remove the material. Chinese patent CN20171073269.7 proposes that the workpiece is rotated 180 ° around the X direction of the hole after the first laser drilling by the rotatable fixture, and the taper is removed by the second machining, this method needs to ensure that the center of the machined hole is on the rotation axis X, which is disadvantageous for group hole machining and has extremely high requirement for the precision of machining and positioning, especially for micro-hole machining, it is difficult to achieve precise positioning.

Disclosure of Invention

Aiming at the defects in the invention, the invention provides a method for improving the processing quality of holes with any angle by changing the laser incidence angle. Meanwhile, the invention also provides a device for improving the processing quality of holes with any angle by changing the incident angle of laser, and the method realizes the functions based on the device.

In order to achieve the purpose, the invention adopts the following technical scheme:

a device for improving the processing quality of holes with any angle by changing the incident angle of laser comprises a base, wherein a left positioning support plate and a right positioning support plate are vertically arranged above the base, two angle rotation positioning shafts are respectively and vertically arranged on the left positioning support plate and the right positioning support plate, the tail end of each angle rotation positioning shaft is provided with an on-shaft clamp device, and the two clamp devices are used for supporting a workpiece and are clamped through a clamping device; the two angle rotation positioning shafts can rotate relative to the left positioning support plate and the right positioning support plate; a first rotating guide rail is arranged below the bottom plate, one end of a rotating shaft can rotate in the first rotating guide rail, the other end of the rotating shaft is vertically welded on a gear, and the gear rotates under the driving of external force; the support shaft is used for supporting the bottom plate and is arranged at the rotating center of the rotating shaft; when the rotating shaft rotates around the first rotating guide rail, the bottom plate can incline.

Furthermore, an angle scale plate is arranged on the left positioning support plate and comprises an outer angle scale plate and an inner angle scale plate; the angle scale plate is characterized in that an angle rotation positioning shaft is arranged at the center of the angle scale plate, an outer angle pointer and an inner angle pointer are arranged on the angle rotation positioning shaft, the angle rotation positioning shaft can rotate by shifting the outer angle pointer or the inner angle pointer, and therefore the relative position of a workpiece changes.

Furthermore, the angle rotation positioning shaft is telescopic, so that the device is suitable for different workpiece sizes.

Furthermore, the gear is arranged on the rotating unit base, a bolt positioning hole is formed in the rotating unit base, and the rotating unit base is positioned and fixed through a bolt.

Furthermore, a second rotating guide rail is arranged above the rotating unit base, and the rotating shaft can rotate around the second rotating guide rail under the driving of the gear.

Furthermore, the support shaft is welded on the rotating unit base, and the support shaft is arranged at the central position of the second rotating guide rail.

Further, the clamping device comprises a pressing plate, a bolt hole formed in the clamping device and a trapezoidal block; the on-shaft clamp device comprises a trapezoidal positioning groove and a supporting table; the two ends of the workpiece are respectively arranged on the two supporting tables, the trapezoidal positioning grooves are matched with the trapezoidal blocks in a clamping mode, holes are formed in the corresponding positions of the bolt holes in the clamping device, the clamping device and the clamping device are connected and fixed together through bolts, and the workpiece is clamped through the pressing plate.

Furthermore, the on-shaft clamp device and the angular rotation positioning shaft are designed integrally.

The laser system provides energy for the workpiece, and the processing quality of the hole is improved by changing the position of laser irradiation on the workpiece in the laser system; the laser system comprises a laser system, laser emitted by the laser system is irradiated on a workpiece after passing through a half-wave plate, a polaroid, a plane reflector, a dichroic mirror and a vibrating lens, and a computer is used for controlling the laser system.

A method for improving the processing quality of holes with any angle by changing the incident angle of laser comprises the following steps:

the method comprises the following steps: clamping a workpiece on an on-shaft clamp device on a moving platform, and clamping and fixing a bolt hole on a clamping device by using a bolt;

step two: determining the inclination angle of the workpiece according to an outer angle pointer and an inner angle pointer on a required machining angle adjusting angle control unit;

step three: starting laser drilling, opening a laser system, feeding a vibration lens downwards along the Z-axis direction, and focusing a to-be-processed area of the workpiece by matching with the image center of a CCD (charge coupled device) lens; laser is emitted from a laser system, passes through a half-wave plate and a polaroid to screen, filter and optimize light and a shutter to reach a plane reflector and a dichroic mirror, and finally passes through a focusing lens in a vibrating lens to focus light beams on the surface of a workpiece to process a through hole;

step four: when the hole is machined by laser, the speed of the gear and the rotating shaft and the speed of laser circular cutting are controlled by the speed control unit, so that the speed of the rotating shaft and the speed of the laser circular cutting are kept consistent, and the improvement of the machining quality of the inner wall of the hole and the reduction of the taper are facilitated.

Compared with the prior art, the invention has the beneficial effects that:

1. the angle rotation positioning shaft is telescopic, so that the processing of workpieces with various sizes is realized.

2. The relative position of the workpiece is changed by rotating the positioning shaft, and the gear drives the rotating shaft to rotate to change the relative position of the workpiece in the machining process, so that the angle of the workpiece needing to be inclined is accurately controlled; meanwhile, the speed of the rotating shaft can be kept consistent with the speed of laser circular cutting, and the improvement of the processing quality of the inner wall of the hole and the reduction of the taper are facilitated.

3. According to the invention, the rotating speed of the gear of the lower rotating unit is controlled, so that the rotating shaft continuously and stably rotates along the rotating guide rail, the laser has a certain incident angle to process the inner wall of the hole, redundant materials are better removed, the effects of improving the processing quality of the inner wall and reducing the taper are achieved, and the speed of the rotating shaft of the rotating unit is the same as the laser circular cutting speed.

4. Through designing the on-shaft clamp device and the clamping device, the workpiece can be stably clamped on the rotary positioning shaft.

Drawings

FIG. 1 is a schematic structural view of a laser drilling apparatus according to the present invention;

FIG. 2 is a schematic diagram of a laser system according to the present invention;

FIG. 3 is a schematic view of the angle dial and the angle indicator according to the present invention;

FIG. 4 is a schematic view of the construction of the on-axis clamp assembly and clamping assembly of the present invention;

FIG. 5 is a schematic view of the telescopic angular rotational positioning shaft and the on-shaft clamp apparatus of the present invention;

FIG. 6 is a schematic view of a rotary unit according to the present invention;

FIG. 7 is a schematic diagram of the speed control of the rotating unit according to the present invention.

The reference numbers are as follows:

1-base, 2-left positioning support plate, 3-angle dial, 4-external angle pointer, 5-internal angle pointer, 6-angle rotation positioning shaft, 7-shaft clamp device, 8-clamp device, 10-right positioning support plate, 11-support shaft, 12-rotation shaft, 13-gear, 14-rotation unit base, 15-bolt positioning hole, 16-rotation guide rail, 21-laser system, 22-half wave plate, 23-polaroid, 24-shutter, 25-plane reflector, 26-dichroic mirror, 27-CCD lens, 28-vibration lens, 29-workpiece, 210-moving platform, 211-computer, 212-five-shaft motion system, 3.1-external angle dial, dial, 3.2-inner angle dial, 7.1-trapezoidal positioning groove, 7.2-supporting table, 8.1-pressing plate, 8.2-rib plate, 8.3-trapezoidal block and 8.4-bolt hole.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The following first describes in detail embodiments according to the present invention with reference to the accompanying drawings

A device for changing the laser incidence angle to improve the processing quality of holes with any angle comprises a base 1, wherein a left positioning support plate 2 and a right positioning support plate 10 are vertically arranged above the base 1, two angle rotation positioning shafts 6 are respectively and vertically arranged on the left positioning support plate 2 and the right positioning support plate 10, an on-shaft clamp device 7 is arranged at the tail end of each angle rotation positioning shaft 6, and the two clamp devices 7 are used for supporting a workpiece 29 and are clamped through a clamping device 8; the two angle rotation positioning shafts 6 can rotate relative to the left positioning support plate 2 and the right positioning support plate 10; a first rotating guide rail is arranged below the bottom plate 1, one end of a rotating shaft 12 can rotate in the first rotating guide rail, the other end of the rotating shaft 12 is vertically welded on a gear 13, and the gear 13 rotates under the driving of external force; the support shaft 11 is used for supporting the base plate 1, and the support shaft 11 is provided at the rotation center position of the rotation shaft 12; the rotation shaft 12 can tilt the base plate 1 while rotating around the first rotation guide.

This kind of structural design can realize the relative motion of work piece position to can realize the processing of laser to arbitrary hole, simultaneously, through the relative change of work piece position, the laser irradiation work piece will process the position and also can change, just so can slow down taper hole in the conventional laser machining process, the serious problem of downthehole burr.

The left positioning support plate 2 is provided with an angle scale plate 3, and the angle scale plate 3 comprises an outer angle scale plate 3.1 and an inner angle scale plate 3.2; an angle rotation positioning shaft 6 is arranged at the center of the angle scale plate 3, an outer angle pointer 4 and an inner angle pointer 5 are arranged on the angle rotation positioning shaft 6, and the angle rotation positioning shaft 6 can be rotated by shifting the outer angle pointer 4 or the inner angle pointer 5, so that the relative position of a workpiece is changed; the angular rotation positioning shaft 6 is telescopic, so that the device is suitable for different workpiece sizes.

The gear 13 is arranged on a rotary unit base 14, a bolt positioning hole 15 is formed in the rotary unit base 14, and the rotary unit base 14 is positioned and fixed through a bolt; a second rotating guide rail 16 is arranged above the rotating unit base 14, and the rotating shaft 12 can rotate around the second rotating guide rail 16 under the driving of the gear 13; the support shaft 11 is welded to the rotary unit base 14, and the support shaft 11 is disposed at the center position of the second rotary rail 16.

The design of the structure enables the bottom plate to support the supporting shaft, and meanwhile, the angle of the bottom plate relative to the ground can be changed under the action of the rotating shaft, so that the relative position of a workpiece is changed, and conditions are prepared for improving the machining precision of a machining position on the workpiece.

The clamping device 8 comprises a pressing plate 8.1, a bolt hole 8.4 formed in the clamping device 8 and a trapezoidal block 8.3; the on-shaft clamp device 7 comprises a trapezoidal positioning groove 7.1 and a supporting table 7.2; two ends of a workpiece 29 are respectively arranged on the two supporting tables 7.2, the trapezoidal positioning grooves 7.1 are matched with the trapezoidal blocks 8.3 in a clamping mode, holes are also formed in the clamp devices 7 at positions corresponding to the bolt holes 8.4, the clamp devices 7 and the clamping devices 8 are connected and fixed together through bolts, and the workpiece 29 is clamped through the pressing plates 8.1. Through designing the on-shaft clamp device and the clamping device, the workpiece can be stably clamped on the rotary positioning shaft.

The on-axis clamp device 7 and the angular rotation positioning shaft 6 are designed into a whole, so that the position of a workpiece is more stable.

Specifically, the present invention will be further described with reference to the accompanying drawings in which:

referring to fig. 1, a device for changing a laser incidence angle to improve the processing quality of a hole with any angle comprises a base 1, a left positioning support plate 2, a right positioning support plate 10, an angle scale plate 3, an outer angle pointer 4, an inner angle pointer 5, an angle rotation positioning shaft 6, an on-shaft clamp device 7, a clamping device 8, a support shaft 11, a rotation shaft 12, a gear 13, a rotation unit base 14, a bolt positioning hole 15 and a rotation guide rail 16; a positioning left support plate 2 and a positioning right support plate 10 are arranged above the base 1, and the angle scale plate 3 is arranged on the side wall of the left positioning support plate 2; the outer angle pointer 4 and the inner angle pointer 5 are arranged on an angle rotation positioning shaft 6, an on-shaft clamp device 7 and a clamping device 8 and are arranged in the center of the left positioning support plate 2; the supporting shaft 11 is arranged between the rotating unit base 14 and the base 1, and one end of the supporting shaft 11 is welded on the rotating unit base 14; the rotating shaft 12 is arranged on the gear 13 and rotates along the rotating guide rail 16, and one end of the rotating shaft is welded on the gear; the bolt positioning hole 15 is used for positioning and fixing the rotary unit base 14.

With reference to fig. 2, the laser processing system includes a laser system 21, a half-wave plate 22, a polarizer 23, a shutter 24, a plane mirror 25, a dichroic mirror 26, a CCD lens 27, a vibration lens 28, a workpiece 29, a moving platform 210, a computer 211, and a five-axis motion system 212; firstly, focusing the area to be processed of the workpiece by matching with the image center of the CCD lens 27; the laser emitted by the laser system 21 is filtered and optimized through the half-wave plate 22 and the polarizer 23, reflected by the plane reflector 24, and finally passes through the focusing lens in the vibrating lens 28, so that the light beam is focused on the surface of the workpiece 29 for processing the through hole.

Combine fig. 3, angle dial 3 includes outer angle dial 3.1, interior angle dial 3.2, outer angle pointer 4 and interior angle pointer 5, according to required processing angle, controls through adjusting outer angle pointer 4 and interior angle pointer 5, and outer angle dial scale is one degree, and interior dial scale is one degree of sixtieth, through mutually supporting accurate angle to required processing.

Referring to fig. 4, the clamping device 8 comprises a pressing plate 8.1, bolt holes 8.4, rib plates 8.2 and a trapezoidal block 8.3, the trapezoidal block 8.3 is embedded into a trapezoidal positioning fixing groove 7.1 for positioning, the bolt is used for connecting an upper clamping unit and a lower clamping unit through the bolt holes 8.4 for clamping, and the rib plates 8.2 are used for improving the stress state of the clamp and preventing the clamp from deforming after long-term use; the pressure plate 8.1 is used to press the workpiece and the support table 7.2. With reference to fig. 5, compared with the on-axis clamp device 7, the telescopic angular rotary positioning shaft 6 increases the axial movement of the clamp to meet the processing requirements of workpieces with different sizes;

referring to fig. 6, the supporting shaft 11 is installed between the rotating unit base 14 and the base 1, and one end of the supporting shaft 11 is welded to the rotating unit base 14; the rotating shaft 12 is installed on the gear 13 and rotates along the rotating guide rail 16, and one end of the rotating shaft is welded on the gear 13; the bolt positioning hole 15 is used for positioning and fixing the rotary unit base 14;

referring to fig. 7, the speed control of the rotating unit mainly includes controlling the rotating speed of the gear and the laser circular cutting speed to be the same. The laser has a certain incident angle to process the inner wall of the hole, so that redundant materials are better removed, and the effects of improving the processing quality of the inner wall and reducing the taper are achieved.

The device and the method for improving the processing quality of holes with any angle by changing the incident angle of laser are characterized by comprising the following steps of:

the method comprises the following steps: and clamping the workpiece 29 to be machined on the on-shaft clamp device 7 on the movable platform 210, and clamping and fixing the workpiece by using bolts to penetrate through bolt holes 8.4 on the clamping device 8.

Step two: the inclination angle of the workpiece 29 is determined by adjusting the outer angle indicator 4 and the inner angle indicator 5 on the angle control unit according to the required machining angle.

Step three: in the laser drilling process, the laser system 21 is started, the vibration lens 28 is fed downwards along the Z-axis direction, and the image center of the CCD lens 27 is matched to focus the region of the workpiece to be processed. The laser beam is emitted from the laser system 21, passes through the half-wave plate 22 and the polarizer 23 for screening, filtering and optimizing, is reflected by the plane reflector 25, and finally passes through the focusing lens in the vibrating lens 28, so that the beam is focused on the surface of the workpiece 29 for through hole processing.

Step four: when the hole is machined by laser, the speed of the gear 13 and the speed of laser circular cutting are controlled by the speed control unit, so that the speeds are kept consistent, and the improvement of the machining quality of the inner wall of the hole and the reduction of the taper are facilitated.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.

Claims

1. The device for improving the processing quality of holes with any angle by changing the laser incidence angle is characterized by comprising a base (1), wherein a left positioning support plate (2) and a right positioning support plate (10) are vertically arranged above the base (1), two angle rotation positioning shafts (6) are respectively and vertically arranged on the left positioning support plate (2) and the right positioning support plate (10), an on-shaft clamp device (7) is arranged at the tail end of each angle rotation positioning shaft (6), and the two clamp devices (7) are used for supporting a workpiece (29) and are clamped by a clamping device (8); the two angle rotation positioning shafts (6) can rotate relative to the left positioning support plate (2) and the right positioning support plate (10);

a first rotating guide rail is arranged below the bottom plate (1), one end of a rotating shaft (12) can rotate in the first rotating guide rail, the other end of the rotating shaft (12) is vertically welded on a gear (13), and the gear (13) rotates under the driving of external force; the supporting shaft (11) is used for supporting the bottom plate (1), and the supporting shaft (11) is arranged at the rotating center position of the rotating shaft (12); when the rotating shaft (12) rotates around the first rotating guide rail, the bottom plate (1) can be inclined.

2. The device for improving the processing quality of holes with any angle by changing the incidence angle of laser according to claim 1, wherein an angle scale plate (3) is arranged on the left positioning support plate (2), and the angle scale plate (3) comprises an outer angle scale plate (3.1) and an inner angle scale plate (3.2); the angle scale plate is characterized in that an angle rotation positioning shaft (6) is arranged at the center of the angle scale plate (3), an outer angle pointer (4) and an inner angle pointer (5) are arranged on the angle rotation positioning shaft (6), and the angle rotation positioning shaft (6) can rotate by stirring the outer angle pointer (4) or the inner angle pointer (5), so that the relative position of a workpiece is changed.

3. The device for improving the processing quality of holes with any angle by changing the incidence angle of laser according to claim 1, wherein the angular rotary positioning shaft (6) is telescopic so as to adapt to different workpiece sizes.

4. The device for improving the processing quality of holes with any angle by changing the incidence angle of laser according to claim 1, wherein the gear (13) is arranged on a rotating unit base (14), the rotating unit base (14) is provided with a bolt positioning hole (15), and the rotating unit base (14) is positioned and fixed by a bolt.

5. The device for improving the processing quality of holes with any angle by changing the incident angle of laser according to claim 4, wherein a second rotating guide rail (16) is provided above the rotating unit base (14), and the rotating shaft (12) can rotate around the second rotating guide rail (16) under the driving of the gear (13).

6. The apparatus for improving the processing quality of holes with arbitrary angles by changing the incidence angle of laser light according to claim 4, wherein the supporting shaft (11) is welded on the rotating unit base (14), and the supporting shaft (11) is disposed at the center position of the second rotating guide rail (16).

7. The device for improving the processing quality of holes with any angle by changing the incidence angle of laser according to claim 1, wherein the clamping device (8) comprises a pressure plate (8.1), a bolt hole (8.4) formed on the clamping device (8) and a trapezoidal block (8.3); the on-shaft clamp device (7) comprises a trapezoidal positioning groove (7.1) and a supporting table (7.2); two ends of a workpiece (29) are respectively arranged on the two supporting tables (7.2), the trapezoidal positioning grooves (7.1) are matched with the trapezoidal blocks (8.3) in a clamping mode, holes are also formed in the corresponding positions of the bolt holes (8.4) of the fixture device (7), the fixture device (7) and the clamping device (8) are fixedly connected together through bolts, and the workpiece (29) is clamped through the pressing plates (8.1).

8. The device for improving the processing quality of holes with any angle by changing the incidence angle of laser according to claim 1, wherein the on-axis clamp device (7) is designed integrally with the angular rotational positioning shaft (6).

9. The apparatus for changing the laser incidence angle to improve the processing quality of an arbitrary-angle hole according to claim 1, further comprising a laser system for supplying energy to the workpiece (29) to improve the processing quality of the hole by changing the position of the laser irradiation on the workpiece (29) in the laser system; the laser system comprises a laser system (21), laser emitted by the laser system (21) is irradiated on a workpiece (29) after passing through a half-wave plate (22), a polaroid (23), a plane reflective mirror (25), a dichroic mirror (26) and a vibration lens (28), and a computer (211) is used for controlling the laser system (21).

10. The method of changing the incidence angle of laser light to improve the processing quality of any angle hole according to any one of claims 1 to 9, comprising the steps of:

the method comprises the following steps: clamping a workpiece (29) on an on-shaft clamp device (7) on a moving platform (210), and clamping and fixing a bolt hole (8.4) on a clamping device (8) by using a bolt;

step two: determining the inclination angle of the workpiece (29) according to an external angle pointer (4) and an internal angle pointer (5) on a required processing angle adjusting angle control unit;

step three: starting laser drilling, opening a laser system (21), feeding a vibration lens (28) downwards along the Z-axis direction, and focusing a to-be-machined area of the workpiece by matching with the image center of a CCD lens (27); laser is emitted from a laser system (21), passes through a half-wave plate (22) and a polaroid (23) to screen, filter and optimize light and a shutter (24) to reach a plane reflector (25) and a dichroic mirror (26), and finally passes through a focusing lens in a vibrating lens (28) to focus light beams on the surface of a workpiece (29) for through hole processing;

step four: when the hole is machined by laser, the speed of the gear (13) and the rotating shaft (12) and the laser circular cutting speed are controlled by the speed control unit, so that the speed of the rotating shaft (12) is consistent with the laser circular cutting speed, and the improvement of the machining quality of the inner wall of the hole and the reduction of the taper are facilitated.