TWI393603B - Cutting device - Google Patents

Description

Cutting device

The invention relates to a cutting device. More particularly, the invention relates to a cutting device that achieves low center of gravity of a structural portion of a table holding mechanism and a low center of gravity of a structural portion of a spindle holding mechanism to improve cutting performance.

The cutting device moves the rotating blade relative to the workpiece such as the semiconductor or electronic component material to be processed, and relatively moves in the cutting direction, the cutting feed direction, and the index feeding direction, and the workpiece is cut into squares. Shape (wafer) device.

Here, for convenience of explanation, a Cartesian coordinate system composed of X axes, Y axes, and Z axes orthogonal to each other is set as follows with respect to the cutting device. That is, the cutting direction is the Z-axis direction, the indexing feed direction is the Y-axis direction, and the cutting feed direction is the X-axis direction. The plunging direction is a direction in which the rotary blade is cut into a cutting depth with respect to a workpiece such as a semiconductor wafer. The indexing feed direction is a direction parallel to the rotation axis of the rotary blade.

The cutting process of a workpiece such as a semiconductor wafer is performed by moving the rotary blade along the rotation axis by the length of one side of the wafer every time a cutting groove is formed. By repeating the above operations, a plurality of parallel cutting grooves are formed. After forming all the cutting grooves in one direction, the workpiece is rotated by 90°, and a plurality of parallel cutting grooves are also formed, thereby forming a wafer. In the wafer forming process, the direction in which the rotary blade is moved along the rotation axis by the length of one side of the wafer is the indexing feed direction.

In addition, the spindle is the rotating shaft. In the cutting device, in order to distinguish the main shaft from the main shaft housing that surrounds the rotating shaft so that the rotating shaft can rotate, the structure including the main shaft (rotating shaft) and the main shaft housing is called a main shaft. unit. However, such strict distinction is not necessary in the following description, so the main shaft unit is collectively referred to as a main shaft as expressed in a plurality of technical documents. Further, when it is necessary to particularly indicate the rotation shaft on which the rotary blade is mounted, it is described as a rotation axis of the main shaft or a rotation axis of the rotary blade.

In the cutting device of the early 1980s, the θ rotation mechanism and the Z-axis moving mechanism are assembled on the table holding mechanism side (see, for example, Patent Document 1). In the dicing apparatus of the mid-1980s, in order to cope with the large diameter of the wafer and the miniaturization of the wafer (the narrowing of the wafer interval), the θ-axis direction is required to be orthogonal to the X-Y plane with higher precision. In addition, precise control of the depth of cut-in is required, and precise control of the Z-axis motion is strongly required.

In response to such a demanding cutting device, the θ rotation mechanism and the X-axis moving mechanism are provided on the table holding mechanism side of the holding table, and the Z-axis moving mechanism and the Y-axis moving mechanism are provided on the spindle holding mechanism side of the holding spindle. By arranging the Z-axis moving mechanism and the Y-axis moving mechanism on the spindle holding mechanism side, a structure capable of moving the rotary blade in the cutting direction and the index feeding direction with respect to the workpiece is formed (for example, refer to Patent Documents 2 and 3). In addition, the operation of each moving mechanism is further refined.

The cutting device is often disposed in a clean room as a processing device for semiconductor manufacturing. Since the construction cost per unit floor area of the clean room is high, miniaturization of a semiconductor manufacturing apparatus such as a dicing apparatus is an important issue. In addition, semiconductor manufacturing equipment is still necessary to manufacture at low cost as usual. Furthermore, there is a need to continuously pursue devices that are fast in processing, high in performance, and highly reliable.

Patent Document 1: Japanese Laid-Open Patent Publication No. SHO 56-155534

Patent Document 2: Japanese Patent No. 3918149

Patent Document 3: Japanese Patent No. 4517269

Patent Document 4: Japanese Patent No. 4037947

The cutting device for a sheet material described in Patent Document 1 and an operating device thereof are characterized in that the θ rotation mechanism and the Z-axis moving mechanism are included on the table holding mechanism side. Patent Document 1 describes that a "turret" 18 receives the vertical shaft 20 so that the vertical arbor 20 is slidably movable, and the upper end 68 of the shaft receives the table. In other words, the device described in Patent Document 1 only discloses the direction in which the θ rotation axis is adjusted by the structure of the machine.

However, in the cutting device, as will be described later, if the orthogonality of the θ rotation axis to the XY plane deviates by 0.001°, 3.5 μm is generated at both ends of the 8-inch wafer (= 8 inches × sin 0.001 ° = Height difference of 200mm × sin 0.001 °). In the current cutting device, an accuracy of about 2 μm is necessary for the depth of cut, and the direction orthogonal to the X-Y plane must be within 0.0005° for the direction of the θ axis of rotation. Controlling the orthogonality between the θ-axis direction and the X-Y plane to within 0.0005° is difficult to achieve only by a mechanical structure. If the precise direction adjustment mechanism and the adjustment method of the θ rotation axis are not established, the accuracy cannot be achieved.

The requirement for high precision orthogonal to the θ rotation axis and the X-Y plane is particularly important as the diameter of the wafer to be processed is larger. In the cutting device for 8-inch wafer cutting, a precise direction adjustment mechanism equipped with a θ rotation axis and an established adjustment method are required. In the 12-inch wafer cutting apparatus, it is necessary to adjust the orthogonality of the θ rotation axis and the X-Y plane with higher precision than the 8-inch wafer cutting apparatus.

Further, in the cutting device having only the mechanical mechanism, the cutting direction after the rotation by 90° is deviated from the Y direction of the workpiece, so that defective products are easily formed during cutting. In particular, in recent years, the production amount of a 12-inch wafer has also been expanded. Therefore, a cutting device that rotates the table by 90° only by a mechanical mechanism having poor operation accuracy cannot sufficiently ensure the cutting accuracy. The allowable value of the Y-direction deviation in the cutting device is at most about 2 μm. As the accuracy of the θ rotation, it is necessary to form an angular shift of 3.5 μm at both ends of the 8-inch wafer and an angular shift of 5.3 μm at both ends of the 12-inch wafer within 0.0005° (for example, when offset by 0.001°). That is, when it is rotated by 90° only by a mechanical mechanism, accuracy within 0.0005° cannot be achieved. Further, in Patent Document 1, it is described that 90° rotation is performed by a Geneva drive, and in the conventional cutting device, precise centering is performed, and processing for realizing an accurate rotation angle is performed (for example, Refer to Patent Document 4). Further, in the device disclosed in Patent Document 1, the total height of the θ rotation mechanism and the Z-axis movement mechanism is large, and it is not suitable for high speed and miniaturization.

At present, a generally widely used cutting device employs a structure in which a spindle is moved in the Z-axis direction and the Y-axis direction by a spindle holding mechanism. The cutting device described in Patent Document 2 and Patent Document 3 employs a structure in which a main shaft is suspended from above along the Z axis. According to this configuration, a cutting device having a high height in the Z-axis direction is obtained.

Further, in order to improve productivity, the cutting device requires the X-axis moving mechanism and the Y-axis moving mechanism to move as high as possible. However, for a device having a high height, if each axis operates at a high speed, vibration is likely to occur. Furthermore, by fixing the heavy-weight spindle by the Z-axis moving mechanism, it is easy to cause vibration. When vibration occurs in the cutting device, a blade or the like is likely to occur, and the cutting performance is deteriorated.

The cutting device described in Patent Document 2 and Patent Document 3 has a structure in which a spindle that is heavy and rotates at a high speed is moved at a high speed and with high precision in the Z-axis direction and the Y-axis direction. Therefore, the mechanical configuration of the cutting device is complicated. Further, since the main shaft that rotates at a high speed moves in the Z-axis direction orthogonal to the rotation axis, dynamic instability of the main shaft that moves in the Z-axis direction is likely to occur. In order to check the dynamic stability of the spindle, it is necessary to perform the work of confirming (adjusting) the movement accuracy of the spindle for a long time in the manufacturing process of the cutting device.

As described above, the currently widely used cutting device is complicated in the mechanical structure for moving the spindle, and must be performed while adjusting the operation of the spindle holding mechanism at the manufacturing stage, which takes a long time. Thus, the manufacturing cost of the cutting device is increased.

The inventors of the present application considered that the θ rotation mechanism is surrounded by the Z-axis moving mechanism. Therefore, it is conceivable to configure a table holding mechanism having a Z-axis-θ axis mechanism in which the total height of the two moving mechanisms is reduced and integrated.

Further, if the table holding mechanism employs the Z-axis-θ axis mechanism, the configuration in which the spindle holding mechanism is moved in the Z-axis direction is no longer required. Since there is no movement in the Z-axis direction, the dynamic instability caused by the screwing of the spindle generated when moving in the Z-axis direction is also eliminated. Further, by omitting the Z-axis moving mechanism in the spindle holding mechanism, it is possible to simplify and reduce the structural portion of the holding spindle. Moreover, it is also thought that the center of gravity of the overall device can be reduced.

Accordingly, it is an object of the present invention to provide a small-sized cutting device that realizes a reduction in the center of gravity of a device, does not require movement of the spindle in the Z-axis direction, and simplifies the spindle holding mechanism.

According to the gist of the present invention based on the above concept, the following cutting device is provided.

The first cutting device of the present invention includes a spindle holding mechanism for holding a spindle unit on which a rotary blade is mounted, and a table holding mechanism for holding a table that carries the workpiece. The spindle holding mechanism has a Y-axis moving mechanism. The Y-axis moving mechanism is for moving in the index feed direction parallel to the rotation axis of the rotary blade, that is, in the Y-axis direction.

The table holding mechanism includes a Z-axis moving mechanism and a θ rotating mechanism on the X-axis moving mechanism. The X-axis moving mechanism is used to perform a movement in the cutting feed direction with respect to the workpiece, that is, in the X-axis direction. The Z-axis moving mechanism is used to perform the cutting direction, that is, the movement in the Z-axis direction. The θ rotation mechanism is for performing rotation of the rotation axis in a direction parallel to the Z-axis direction.

The θ rotation mechanism is configured to be enclosed in the Z-axis moving mechanism. The position of the center of gravity of the table holding mechanism is lowered as compared with the case where the Z-axis moving mechanism and the θ rotating mechanism are simply overlapped with each other by the X-axis moving mechanism configured as described above.

In the Z-axis-θ axis mechanism, a mechanism having a mechanism capable of appropriately adjusting the inclination in the θ-axis direction and the Z-axis direction is formed. The direction of the θ rotation axis and the direction of the Z axis can be adjusted so as to have high orthogonality with the X-Y plane.

The second cutting device of the present invention includes a spindle holding mechanism and a table holding mechanism.

The table holding mechanism includes an X-Y moving mechanism in which an X-axis moving mechanism and a Y-axis moving mechanism are combined, and a Z-axis moving mechanism and a θ rotating mechanism are disposed on the X-Y moving mechanism.

Like the first cutting device, the θ rotation mechanism is enclosed in the Z-axis moving mechanism. By configuring the X-Y moving mechanism as described above, the center of gravity of the table holding mechanism is lowered as compared with the case where the Z-axis moving mechanism and the θ rotating mechanism are simply overlapped.

The second cutting device is different from the first cutting device in that the Y-axis moving mechanism is disposed on the spindle holding mechanism side in the first cutting device, and the Y-axis moving mechanism is disposed on the table holding mechanism side in the second cutting device .

Effect of the invention

In the first and second cutting devices of the present invention, since the Z-axis moving mechanism is eliminated in the spindle holding mechanism, the cutting device can generally reduce the Z-axis direction as compared with the conventional cutting device having the structure of the Z-axis moving mechanism. the height of. In addition, since the weight of the spindle holding mechanism can be reduced, the center of gravity of the entire cutting device can be reduced.

The lower the center of gravity of the cutting device, the more the amplitude of the vibration generated in the cutting device can be reduced when the spindle is rotated at a high speed. In addition, the probability of generating vibration is also reduced. Further, when the table moves at a high speed along the X-axis, the Y-axis, the Z-axis, and the θ-axis direction, the amplitude of vibration generated in the cutting device can be reduced, and the probability of occurrence of vibration is also reduced. Vibrations generated in the cutting device can cause scratches and adversely affect the cutting performance. The smaller the amplitude of the vibration, the higher the cutting process can be ensured. Further, since the probability of generating vibration is also reduced, the cutting performance can be further improved.

In the cutting device in which the Z-axis moving mechanism is provided on the spindle holding mechanism side, a structure in which the spindle is moved in the Z-axis direction by the Z-axis moving mechanism and moved in the Y-axis direction by the Y-axis moving mechanism is employed. . In any of the Z-axis direction and the Y-axis direction, the high-speed movement is at an important position in the cutting device. Therefore, the spindle holding mechanism having the Z-axis moving mechanism and having a heavy weight is inevitably a large-sized structure.

On the other hand, the first and second cutting devices of the present invention do not have a Z-axis moving mechanism in the spindle holding mechanism. Therefore, since the weight reduction of the spindle holding mechanism corresponds to the weight of the Z-axis moving mechanism, it is possible to achieve downsizing without requiring a large-sized structure to the extent that the spindle holding mechanism of the conventional cutting device is formed. Moreover, the manufacturing cost of the spindle holding mechanism can be reduced.

In the first and second cutting apparatuses of the present invention, each time a line is to be cut, the table is moved up and down by a Z-axis moving mechanism assembled to the table holding mechanism. On the other hand, in the conventional cutting device, the spindle is moved up and down by the Z-axis moving mechanism incorporated in the spindle holding mechanism. When the Z-axis moving mechanism assembled to the table holding mechanism moves the table up and down as compared with the case where the spindle is moved up and down, the table holding mechanism having a relatively light weight is moved, so that the operating speed can be increased.

In the first and second cutting apparatuses of the present invention, it is not necessary to move the main shaft in the Z-axis direction, so that no precession is generated on the main shaft (the rotating shaft of the rotating insert). The reason is as follows.

When the spindle is moved in the Z-axis direction while the rotary blade is rotating at a high speed (for example, a rotational speed of 30,000 to 60,000 rpm), the spindle is spun. Due to the precession, the direction of the rotation axis before the rotation axis of the rotary blade moves around the Z axis is a three-dimensional rotation. This three-dimensional rotation of the rotating shaft of the rotary blade, which is generated by this rotation, makes it difficult to accurately control the depth of cut at the cutting end of the rotary blade. Also, due to the three-dimensional rotation of the rotating shaft of the rotary blade, vibration is generated in the cutting device.

The precession of the main shaft caused by the movement of the main shaft that rotates at a high speed in the Z-axis direction is known as a "flaw of the main shaft" in the manufacturing process of the cutting device. In the conventional cutting device, the screwing is suppressed by forming the spindle holding mechanism into a large structure. Further, it is known that in a rigid body that rotates at a high speed, a balance of force and a balance of moments are required at the center of gravity of the rigid body. Further, if the moment is unbalanced, a change in the angular momentum is caused in the rigid body that rotates at a high speed. If there is a change in angular momentum in a rigid body that rotates at a high speed, it is also known that a high-speed rotating rigid body produces "spinning".

Since the center of gravity of the spindle does not coincide with the point of action of the force moving in the Z-axis direction, a moment is generated at the center of gravity of the spindle when moving in the Z-axis direction. If a torque is generated, the angular momentum of the spindle changes and a precession occurs on the spindle. On the other hand, in the movement of the rotary blade in the direction of the rotation axis, the moment generated by the movement is negligible. Movement in the direction of the rotary axis does not affect the motion of the spindle.

The first and second cutting devices of the present invention have a structure in which a Z-axis moving mechanism is provided on a table. Thereby, it is not necessary to move the main shaft in the Z-axis direction orthogonal to the rotation axis of the rotary blade. Therefore, in the first and second cutting devices of the present invention, no screwing occurs on the main shaft. It is possible to eliminate the vibration accompanying the rotation.

Further, in the manufacturing process of the conventional cutting device, when the spindle is attached to the spindle holding mechanism, it is necessary to mount a rotating blade for inspection on the spindle, and to perform dynamics such as vibration of the entire device while rotating. The adjustment operation for checking the characteristics (the generation characteristics of the screwing, etc.). On the other hand, the first and second cutting devices of the present invention have a structure in which the main shaft does not move in a direction orthogonal to the rotation axis of the rotary blade, so that it is not necessary to consider the occurrence of the screwing. That is, the manufacturing process of the spindle holding mechanism is simplified.

Further, the spindle holding mechanism of the second cutting device of the present invention does not need to mount the Y-axis moving mechanism except for the Z-axis moving mechanism. Therefore, the manufacturing process of the spindle holding mechanism of the first cutting device is more simplified.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Further, each of the drawings schematically shows each structural portion to the extent that the present invention can be understood. The figures are only an example of the invention and are not intended to limit the invention to the illustrated examples. In the drawings, the same components are denoted by the same reference numerals, and their functions and the like may be omitted.

<Existing cutting device>

First, the structure and operation of a typical exemplary cutting device will be described before explaining the cutting device according to the embodiment of the present invention. Then, the problem to be solved by the present invention will be specifically clarified.

Fig. 1 is a view showing a schematic configuration of a conventional typical cutting device. Fig. 1 shows the constituent elements within the scope required for the description of the problems described below. FIG. 1 is a view schematically showing each component in a simplified manner, and does not strictly show the form of a real-life device that is industrially used.

The cutting device is a device that cuts a workpiece while rotating the rotary blade at a high speed and moving relative to a workpiece such as a semiconductor substrate in the X-axis direction, the Y-axis direction, and the Z-axis direction.

The rotary blade 22 is mounted on a rotary shaft 48 of the spindle 20, which is fixed to the spindle support member 18-4. The spindle supporting member 18-4 is fixed to the Z-axis moving table 18-3 that moves in the Z-axis direction. The Z-axis moving table 18-3 is slidable along the Z-axis guide 18-1. Under the action of the Z-axis ball screw 18-2, the Z-axis moving table 18-3 moves with high precision, thereby performing precise control of the plunging depth.

Therefore, in the conventional cutting device, the Z-axis moving mechanism 18 is constituted by the Z-axis guide 18-1, the Z-axis ball screw 18-2, the Z-axis moving table 18-3, and the spindle supporting member 18-4. The Z-axis guide 18-1 and the Z-axis ball screw 18-2 are fixed to the Y-axis moving mechanism 14. Further, the main shaft 20 is fixed to the main shaft support member 18-4. In other words, the spindle holding mechanism 30 is configured to transmit the Y-axis moving mechanism 14 and the Z-axis moving mechanism 18 that arrange the direction of the rotation axis of the rotary blade 22, that is, the Y-axis direction. Further, the Y-axis moving mechanism 14 is composed of a Y-axis guide 14-1, a Y-axis ball screw 14-2, a Y-axis moving table 14-3, and a Y-axis support body 14-4.

The main shaft 20 is disposed on the base 10 through the Z-axis moving mechanism 18 and the Y-axis moving mechanism 14. The spindle 20 is movable in the Z-axis direction and the Y-axis direction by the spindle holding mechanism 30.

On the other hand, the workpiece 26 such as a semiconductor substrate is carried on the table 24 by vacuum suction or the like. This table 24 is fixed to the upper portion of the θ rotation mechanism 16. Further, the θ rotation mechanism 16 is fixed to the X-axis moving mechanism 12. The X-axis moving mechanism 12 is fixed to the base 10. In other words, the table holding mechanism 28 is configured by the X-axis moving mechanism 12 and the θ rotation mechanism 16 that are provided to move in the X-axis direction that is orthogonal to the rotation axis of the rotary blade 22. The spindle holding mechanism 30 and the table holding mechanism 28 are fixed to the common base 10. The X-axis moving mechanism fixing portion of the X-axis moving mechanism 12 is configured by an X-axis guide 12-1 and an X-axis ball screw 12-2. The X-axis moving mechanism movable portion of the X-axis moving mechanism 12 includes a ball screw nut (not shown) and an X-axis moving table 12-3.

As described above, the conventional cutting device includes the θ rotation mechanism 16 and the X-axis moving mechanism 12 on the table holding mechanism 28 side, and the Z-axis moving mechanism 18 and the Y-axis moving mechanism 14 on the spindle holding mechanism 30 side. The weight of the main shaft 20 is heavy and the main shaft 20 rotates at a high speed. In order to move the spindle 20 with sufficient accuracy, the structure of the spindle holding mechanism 30 including the Z-axis moving mechanism 18 and the Y-axis moving mechanism 14 is complicated. Therefore, the device as a whole is difficult to miniaturize.

In the configuration in which the Z-axis moving mechanism 18 and the Y-axis moving mechanism 14 are provided on the spindle holding mechanism 30 side, the cutting device has a high height in the Z direction. The position of the center of gravity of the device as a whole becomes high. When the speed of the X-axis moving mechanism is increased in order to accelerate the cutting speed of one time, the structure having a high height in the Z-axis direction is likely to generate vibration in the cutting device. Further, since the heavy-weight spindle holding mechanism 30 is moved up and down in one cutting, it is difficult to improve the efficiency of the cutting work.

Further, since the spindle is required to move at a high speed in either of the Z-axis direction and the Y-axis direction, the spindle holding mechanism 30 having the Z-axis moving mechanism 18 and having a heavy weight is particularly large.

<First cutting device>

The structure and operation of the first cutting device according to the embodiment of the present invention will be described with reference to Fig. 2 . FIG. 2 is a view similar to FIG. 1 , which is a schematic view showing structural elements within a range required for the description, and simplified and schematically illustrated. In Fig. 2, the strict shape and structure of the detailed portion of the cutting device specifically constructed in the practice of the present invention are not shown. In particular, FIG. 2 is a view schematically showing an arrangement relationship of the features of the first cutting device for the arrangement of the X-axis moving mechanism and the spindle holding mechanism provided with the table holding mechanism. The detailed configuration and operation of the spindle holding mechanism and the table holding mechanism provided in the first cutting device will be described later with reference to the drawings.

In the conventional cutting device, a Z-axis moving mechanism is provided on the spindle holding mechanism side. On the other hand, in the first cutting device according to the embodiment of the present invention, the Z-axis-θ axis mechanism integrally formed in the Z-axis moving mechanism 34 and surrounded by the θ rotation mechanism 16 is provided on the table holding mechanism 40 side. 50. By arranging the θ rotation mechanism 16 in the Z-axis moving mechanism 34, the position of the center of gravity of the Z-axis-θ axis mechanism 50 can be reduced as compared with the case where the Z-axis moving mechanism 34 and the θ rotation mechanism 16 are overlapped with each other.

The rotary blade 22 is mounted on the rotating shaft 48 of the main shaft 20. The main shaft 20 is fixed to the main shaft support member 36. The Y-axis moving mechanism 14 and the main shaft 20 are firmly fixed to the main shaft support member 36. The Y-axis moving mechanism 14 is fixed to the spindle fixing table 38. Further, the Y-axis moving mechanism 14, the spindle supporting member 36, and the spindle fixing base 38 that move the direction of the rotating shaft of the rotary blade 22, that is, the Y-axis direction, are combined to constitute the spindle holding mechanism 32. Therefore, the main shaft 20 is provided on the base 10 via the main shaft support member 36, the Y-axis moving mechanism 14, and the main shaft fixing table 38. By forming such a configuration, the spindle 20 can be moved in the Y-axis direction by the spindle holding mechanism 32.

A flange is provided on the housing of the main shaft 20. The flange end surface is used as the accuracy reference surface of the spindle 20, and the spindle 20 is produced with this surface as an accuracy reference. Further, the main shaft 20 is fixed to the main shaft support member 36 through the flange. When the spindle is mounted, the strength of the bolt tightening torque of the flange is managed. As described above, the Y-axis moving mechanism 14 and the spindle 20 are firmly fixed via the spindle support member 36.

On the other hand, like the conventional apparatus, the workpiece 26 such as a semiconductor substrate is carried on the table 24 by a vacuum adsorption method or the like. The table 24 is fixed to an upper portion of the Z-axis-θ axis mechanism 50 in which the Z-axis moving mechanism 34 and the θ rotation mechanism 16 are combined. Further, the Z-axis-θ axis mechanism 50 is fixed to the X-axis moving mechanism 12, and the X-axis moving mechanism 12 is fixed to the base 10. That is, the X-axis moving mechanism 12 and the Z-axis-θ axis mechanism 50 are provided to constitute the table holding mechanism 40.

As the X-axis moving mechanism 12, the same configuration as that of the moving mechanism provided in the conventional cutting device can be used. For example, a direct drive motor or a slide mechanism using a ball screw and a linear guide can be suitably used.

The table holding mechanism 40 is characterized by having a Z-axis moving mechanism 34. In order to suppress the integrated height of the θ rotation mechanism 16 and the Z-axis moving mechanism 34 to be low, the mechanism for fixing the θ rotation mechanism 16 to the Z-axis moving mechanism 34 employs a θ rotation mechanism surrounded by the Z-axis moving mechanism. Construction. In addition, in order to ensure the flatness at the time of rotation of the table 24, a mechanism for appropriately adjusting the inclination of the inclination in the θ-axis direction and the Z-axis direction (the θ-axis direction adjustment screw and the Z-axis direction to be described later) are employed. Adjust the construction of the screw).

The spindle holding mechanism 32 and the table holding mechanism 40 are fixed to the common base 10 by the same fixing method as the conventional cutting device.

<Second cutting device>

The structure and operation of the second cutting device according to the embodiment of the present invention will be described with reference to Fig. 3 . FIG. 3 is a view similarly to FIG. 1 and FIG. 2, and is a schematic diagram showing the structural elements within the scope required for the description, and the respective constituent elements are simplified and schematically shown. In Fig. 3, the strict shape and structure of the detailed portion of the cutting device specifically constructed when the present invention is implemented are not shown. In particular, the arrangement relationship between the spindle holding mechanism which is a feature of the second cutting device and the X-axis moving mechanism and the Y-axis moving mechanism provided in the table holding mechanism is schematically shown. The detailed configuration and operation of the spindle holding mechanism and the table holding mechanism provided in the second cutting device will be described later with reference to the drawings.

The second cutting device according to the embodiment of the present invention is characterized in that the Y-axis moving mechanism 14, the Z-axis moving mechanism 34, the X-axis moving mechanism 12, and the θ rotating mechanism 16 are provided on the table holding mechanism 44 side. In other words, in the second cutting device according to the embodiment of the present invention, the moving mechanism is not provided on the spindle holding mechanism 46 side, and the spindle holding mechanism 46 is maintained in the state of being fixed to the base 10.

The rotary blade 22 is mounted on the rotating shaft 48 of the main shaft 20. The spindle 20 is fixed to the spindle support mechanism 36 through the flange of the housing of the spindle 20. A spindle fixing base 38 is firmly fixed to the spindle support mechanism 36. A moving mechanism is not provided on the spindle fixing table 38, and is directly fixed to the base 10. That is, the spindle holding mechanism 46 is constituted by the spindle support mechanism 36 and the spindle fixing base 38.

On the other hand, like the conventional apparatus, the workpiece 26 such as a semiconductor substrate is carried on the table 24 by a vacuum adsorption method or the like. The table 24 is fixed to the XY moving mechanism 52 in which the X-axis moving mechanism 12 and the Y-axis moving mechanism 14 are combined, and the Z-axis moving mechanism 34 on the XY moving mechanism 52 surrounds the θ rotating mechanism 16 to form an integrated structure. Z-axis-θ axis mechanism 50. That is, the X-Y moving mechanism 52 and the Z-axis-θ axis mechanism 50 are provided to constitute the table holding mechanism 44.

In the mechanism for fixing the Z-axis moving mechanism 34 to the θ rotation mechanism 16, in order to suppress the overall height of the θ rotation mechanism 16 and the Z-axis moving mechanism 34 from being lower, the Z-axis moving mechanism 34 is surrounded by the setting. The configuration of the θ rotation mechanism 16. In order to ensure the flatness at the time of rotation, a structure having a mechanism capable of appropriately adjusting the inclination in the θ-axis direction and the Z-axis direction is employed.

Based on this, the spindle holding mechanism 46 and the table holding mechanism 44 are fixed to the common base 10 by the same fixing method as the conventional cutting device.

As described above, in the second cutting device according to the embodiment of the present invention, the Z-axis-θ axis mechanism 50 and the XY moving mechanism 52 are provided on the table holding mechanism 44 side of the workpiece 26, and the spindle holding mechanism for holding the spindle 20 is provided. There are no mobile mechanisms on the 46 side.

<Precision alignment process>

In addition, in the first and second cutting devices, the θ rotation mechanism 16 is capable of rotating 372° (=360°+12°) by applying an angular offset of 12° to the load bearing workpiece, thereby having a range of 0° to 372°. The θ rotation mechanism that functions between rotations. By rotating the table 24 in the X direction, the Y direction, the -X direction, and the -Y direction, it is possible to obtain a margin and rotate the workpiece 26 by 0 to 360 degrees, and perform a process of cutting the workpiece 26. In order to cut the workpiece 26 in the X direction, the Y direction, the -X direction, and the -Y direction, alignment is performed in the X direction, the Y direction, the -X direction, and the -Y direction in advance. Then, the rotation angle of each θ axis is saved in the memory of the computer system. In the conventional cutting device, in order to match the cutting direction and the wafer spacing direction of the wafer, a method of accurately obtaining the rotation angle of the θ-axis is used in the angle approaching process of the precision alignment process.

Before performing the cutting process, precise alignment is performed in the -X direction and the -Y direction of the table holding mechanism 40 in the first cutting device, and in the -X direction of the table holding mechanism 44 in the second cutting device Precision alignment is performed in the -Y direction. In the precision alignment process, the angle approach processing is performed to obtain an accurate rotation angle of the θ axis. By performing such a process in advance, in the process of performing the cutting, not only the cutting in the X direction and the Y direction but also the cutting process in the -X direction and the -Y direction can be performed. The rotation angle obtained by the alignment can be read from the memory, and the rotation angle of the θ-axis is set at the angle for cutting.

In the precision alignment process, the direction of the wafer interval of the workpieces placed on the table 24 is measured (two positions on the same wafer interval are measured by pattern matching or the like to determine the tilt angle). Then, the θ-axis rotation angle is corrected such that the θ-axis is rotated by the measured angle so that the cutting direction (Y-direction) coincides with the wafer interval. However, the correction by one rotation of the θ-axis is not sufficiently uniform. Therefore, the wafer spacing direction measurement and the θ-axis rotation correction are repeatedly performed, and when the difference is smaller than the set value, the process is performed. The measurement of the wafer spacing direction and the correction of the θ-axis rotation are referred to as angle approach processing (see, for example, Patent Document 4).

<Z-axis-θ axis mechanism>

The structure of the Z-axis-θ axis mechanism 50 integrally formed by arranging the θ rotation mechanism 16 in the Z-axis moving mechanism 34 will be described with reference to FIGS. 4 to 12 .

Hereinafter, the configuration of the Z-axis moving mechanism 34 constituting the Z-axis-θ axis mechanism 50 will be described with respect to the movement mechanism in the Z-axis direction and the power mechanism for realizing the movement, the configuration of the θ rotation mechanism 16, and the mounting to the Z-axis moving mechanism 34. The installation method is explained later.

FIG. 4 is a perspective view showing a schematic configuration of the Z-axis moving mechanism 34. The Z-axis moving mechanism 34 is configured to surround the U-shaped Z-axis moving mechanism fixing portion 60 by surrounding the Z-axis moving mechanism movable portion 64.

The Z-axis moving mechanism 34 moves in the Z-axis direction by smoothly moving the Z-axis moving mechanism movable portion 64 in the vertical direction with respect to the Z-axis moving mechanism fixing portion 60. For example, as long as the Z-axis moving mechanism fixing portion 60 and the Z-axis moving mechanism movable portion 64 are brought into contact with each other via the guiding mechanism, they may be slidably formed in the guiding mechanism. Alternatively, as shown in FIG. 4, the Z-axis moving mechanism fixing portion 60 and the Z-axis moving mechanism movable portion 64 are smoothly operated by the cross roller 66 to realize the movement in the Z-axis direction. The cross roller 66 is constructed by combining the cross roller guides 66-1 and 66-2.

A cross roller guide 66-1 is attached to the Z-axis moving mechanism fixing portion 60, and a cross roller guide 66-2 is attached to the Z-axis moving mechanism movable portion 64. The combination of the cross roller guides 66-1 and 66-2 is formed at four locations as shown in FIG.

The θ rotation mechanism 16 to be described later is provided on the Z-axis moving mechanism movable portion bottom surface 62 of the Z-axis moving mechanism movable portion 64. Thus, the θ rotation mechanism 16 is provided through the Z-axis moving mechanism 34, and the θ rotation mechanism 16 is surrounded by the Z-axis moving mechanism 34.

An example of the structure of the cross roller 66 will be described with reference to Fig. 5 . The cross roller 66 includes a cross roller guide 120, a cross roller guide 122, and a cylindrical roller 126. V-shaped grooves are formed in the cross roller guide 120 and the cross roller guide 122, and the cylindrical roller 126 is inserted into the grooves of both. The cross roller guide 122 is smoothly moved relative to the cross roller guide 120 by the cylindrical roller 126. Thereby, the Z-axis moving mechanism movable portion 64 can be smoothly moved in the vertical direction with respect to the Z-axis moving mechanism fixing portion 60.

A power transmission mechanism 56 for moving the Z-axis moving mechanism movable portion 64 up and down with respect to the Z-axis moving mechanism fixing portion 60 will be described with reference to Fig. 6 . The power transmission mechanism 56 is configured by a combination of a ball screw driving device 70, a ball screw nut 72, and a ball screw 74.

A ball screw nut 72 is attached to the Z-axis moving mechanism movable portion 64, and a ball screw driving device 70 is attached to the Z-axis moving mechanism fixing portion 60. In Fig. 6, the detailed structure of the ball screw driving device 70 is omitted, and the area occupied by the ball screw driving device 70 in space is shown by a broken line.

When the ball screw 74 rotates by the ball screw driving device 70, a force is transmitted to the ball screw nut 72 that the ball screw 74 meshes, and the Z-axis moving mechanism movable portion 64 moves relative to the Z-axis moving mechanism fixing portion 60. The moving direction of the Z-axis moving mechanism movable portion 64 is determined by the rotation direction of the ball screw 74.

The installation location of the power transmission mechanism 56 will be described with reference to Fig. 7 . In Fig. 7, in order to avoid complication of the drawing, only the Z-axis moving mechanism movable portion bottom panel 68 of the Z-axis moving mechanism movable portion 64 and the ball screw nut (72-1, 72-2) constituting the power transmission mechanism 56 are taken out. And the ball screw (74-1, 74-2) is shown. The Z-axis moving mechanism movable portion bottom panel 68 is a member constituting the bottom surface of the Z-axis moving mechanism movable portion 64, and is integrated with the side wall portion 64-S constituting the Z-axis moving mechanism movable portion 64 as shown in Fig. 6 .

In Fig. 7, a power transmission mechanism 56 is provided at two locations of the Z-axis moving mechanism movable portion bottom panel 68. The first is the ball screw nut 72-1, where the ball screw 74-1 is engaged, and the second is the ball screw nut 72-2, where the ball screw 74-2 is engaged. Here, an example in which the power transmission mechanism 56 is provided at two places is shown, but it may be one place.

The mounting method of the ball screw driving device 70 to the Z-axis moving mechanism movable portion bottom panel 68 will be described with reference to Figs. 8(A) and 8(B). 8(A) shows an example in which the axial direction of the ball screw 74 is perpendicular to the rotation axis of the motor 54 constituting the ball screw driving device 70. 8(B) shows an example in which the axial direction of the ball screw 74 is mounted in parallel with the rotation axis of the motor 54 constituting the ball screw driving device 70.

The ball screw nut 72 is mounted on the Z-axis moving mechanism movable portion bottom panel 68. The rotation of the motor 54 is transmitted to the coupling portion 76 to become the rotation of the coupling portion 76. The coupling portion 76 is engaged with the ball screw 74, and the rotation of the coupling portion 76 becomes the rotation of the ball screw 74. Since the ball screw 74 meshes with the ball screw nut 72, the Z-axis moving mechanism movable portion bottom panel 68 smoothly moves in the vertical direction by the rotation of the ball screw 74. In other words, the Z-axis moving mechanism movable portion 64 smoothly moves in the vertical direction with respect to the Z-axis moving mechanism fixing portion 60 by the rotation of the ball screw 74.

As to which of FIG. 8(A) or FIG. 8(B) is employed, it is appropriately selected according to the state set by the Z-axis-θ axis mechanism to the table holding mechanism.

The mounting of the Z-axis moving mechanism 34 to the X-Y moving mechanism 52 will be described with reference to Fig. 9 . In FIG. 9, the configuration example in which the X-Y moving mechanism 52 is formed by superimposing the X-axis moving mechanism 100 on the Y-axis moving mechanism 110 is shown. The X-Y moving mechanism 52 may be formed as a structure in which the Y-axis moving mechanism 110 is superposed on the X-axis moving mechanism 100.

In addition, in FIG. 9, the area occupied by the Z-axis moving mechanism 34 is indicated by a one-dot chain line, and the Z-axis moving mechanism fixing portion 60 and the Z-axis moving mechanism are omitted for the Z-axis moving mechanism 34. Detailed structural portions other than the portion of the movable portion bottom panel 68.

Z-axis direction adjusting screws (92-1, 92-2, 92-3) are attached to three portions of the bottom of the Z-axis moving mechanism fixing portion 60. When the Z-axis moving mechanism fixing portion 60 of the Z-axis moving mechanism 34 is fixed to the upper surface of the X-axis moving mechanism 100, the Z-axis moving mechanism fixing portion 60 can be adjusted to move relative to the X-axis by the Z-axis direction adjusting screw. The direction of the upper surface of the mechanism 100. By adjusting the screw in the Z-axis direction of the three portions, the posture of the Z-axis moving mechanism fixing portion 60 is adjusted, and the Z-axis direction of the Z-axis moving mechanism 34 with respect to the upper surface of the X-axis moving mechanism 100 is adjusted. Further, the Z-axis moving mechanism 34 is fixed by three-point support.

Referring to Fig. 10, an attachment method in which the θ rotation mechanism 16 is provided in the Z-axis moving mechanism 34 will be described. In FIG. 10, the area occupied by the Z-axis moving mechanism 34 in the space is indicated by a one-dot chain line, and the Z-axis moving mechanism fixing portion 60 and the Z-axis moving mechanism movable portion are omitted for the Z-axis moving mechanism 34. Detailed structural portions other than portions of the bottom panel 68. Further, detailed structural portions are also omitted for the θ rotation mechanism 16.

As shown in FIG. 10, a structure in which the θ rotation mechanism 16 is surrounded by the Z-axis moving mechanism 34 is employed. Thereby, the position of the center of gravity of the table holding mechanism becomes lower than the case where the Z-axis moving mechanism 34 and the θ rotation mechanism 16 are overlapped.

The structure of the θ rotation mechanism 16 will be described with reference to Fig. 11 . The θ rotation mechanism 16 is configured by providing a table 82 on a direct drive motor (DD motor) 80 including a stator portion 86 and a rotor portion 84. The relationship between the θ rotation mechanism 16 shown in Fig. 11 and the θ rotation mechanism 16 and the table 24 shown in Figs. 2 and 3 is as follows. The table 82 shown in Fig. 11 corresponds to the table 24 shown in Figs. 2 and 3, and the DD motor 80 shown in Fig. 11 corresponds to the θ rotation mechanism 16 shown in Figs. 2 and 3 .

The reason why the DD motor 80 is used is a result considered in order to achieve a more precise rotation than a method in which only a rough mechanical mechanism such as a Geneva mechanism is used in the rotation of the table 82. The θ rotation mechanism 16 using the DD motor 80 is a servo system supported by software. By precisely aligning, the θ rotation angle is adjusted so that the angular offset of the workpiece of the cutting object is within the allowable value. The adjusted angle is saved to the memory as a result of precision alignment.

The rotor 84 has a hollow structure (not shown), and a vacuum tube or the like is disposed inside the hollow. A vacuum tube (not shown) is a member constituting a vacuum suction mechanism for vacuum-absorbing the workpiece onto the table 82.

The mounting of the θ rotation mechanism 16 into the Z-axis moving mechanism 34 will be described with reference to Fig. 12 . In FIG. 12, detailed structural portions other than the portion of the Z-axis moving mechanism movable portion bottom panel 68 are omitted for the Z-axis moving mechanism 34.

The θ-axis direction adjusting screws (90-1, 90-2, 90-3) are attached to three portions of the bottom of the Z-axis moving mechanism movable portion bottom panel 68. When the θ rotation mechanism 16 is fixed to the upper surface of the Z-axis moving mechanism movable portion bottom panel 68, the θ-axis direction adjusting screw can be adjusted to adjust the θ rotation mechanism 16 with respect to the Z-axis moving mechanism movable portion bottom panel 68. The direction of the surface. By adjusting the screw in the θ-axis direction of the three portions, the posture of the θ rotation mechanism 16 is adjusted, and the θ-axis direction of the θ rotation mechanism 16 with respect to the upper surface of the Z-axis moving mechanism movable portion bottom panel 68 is adjusted. Further, the θ rotation mechanism 16 is fixed by three-point support.

6, 10, and 12, the θ rotation axis exists in the center of the θ rotation mechanism 16, and the cross roller guides 66-1 and 66-2 are attached around the Z-axis movement mechanism movable bottom plate 68. A Z-axis guide (four shown in Fig. 6) is constructed. Thus, the position of the θ rotation axis is in a very close positional relationship (substantially identical positional relationship) with the center position of the region surrounded by the Z-axis guide (the center position of the Z-axis moving mechanism movable portion bottom panel 68). Since the two are in such a positional relationship, the direction of the θ-axis can be adjusted with high precision in the Z-axis-θ axis mechanism 50 (see FIGS. 2 and 3).

<Adjustment of Z-axis direction and θ-axis direction of Z-axis-θ axis mechanism>

The Z-axis direction and the θ-axis direction of the Z-axis-θ axis mechanism 50 must be assembled into the cutting device orthogonally to the X-Y plane. In the assembly of the cutting device, first, an X-axis moving mechanism and a Y-axis moving mechanism are disposed on the susceptor, and the orthogonality between the X-axis and the Y-axis is adjusted. After the X-axis moving mechanism and the Y-axis moving mechanism are adjusted, an X-Y plane is formed on the upper surface of the X-axis moving mechanism 100 (the X-axis moving table 12-3 shown in FIGS. 2 and 3). This X-Y plane serves as a reference plane for the Z-axis-θ axis mechanism mounting. The X-axis moving mechanism moves in the X direction, moves through the Y-axis moving mechanism in the Y direction, and the height of the upper surface of the X-axis moving mechanism 100 is measured by a contact type electric micrometer to confirm the accuracy of the plane. Further, in the first cutting device according to the embodiment of the present invention, the contact type electric micrometer is mounted at an appropriate position of the Y-axis moving mechanism through the jig, and in the second cutting device of the embodiment of the present invention, the jig is mounted on the pedestal through the jig The proper location.

The adjustment of the Z-axis direction and the θ-axis direction performed when the Z-axis-θ axis mechanism 50 is assembled in the dicing apparatus will be described with reference to Fig. 13 . FIG. 13 is a schematic configuration diagram when the Z-axis-θ axis mechanism 50 disposed on the upper surface of the X-axis moving mechanism 100 is viewed from a direction perpendicular to the direction of the Z-axis −θ axis. In Fig. 13, the Z-axis direction adjustment in the Z-axis direction adjusting screws (92-1, 92-2, 92-3) and the θ-axis direction adjusting screws (90-1, 90-2, 90-3) is omitted. The screw 92-3 and the θ-axis direction adjustment screw 90-3 are shown.

In order to adjust the Z-axis direction and the θ-axis direction, the Z-axis-θ axis mechanism 50, which is completed by the adjustment operation in the remaining Z-axis direction and the θ-axis direction, is first carried on the upper surface of the X-axis moving mechanism 100. In Fig. 13, the upper surface of the X-axis moving mechanism 100 is used as a reference plane for adjustment. In other words, the Z-axis-θ axis mechanism 50 is placed such that the bottom surface of the Z-axis moving mechanism fixing portion 60 of the Z-axis moving mechanism 34 is positioned directly above the upper surface of the X-axis moving mechanism 100.

FIG. 13 includes means for measuring the inclination in the Z-axis direction and the inclination in the θ-axis direction, respectively. In Fig. 13, the direction indicated by the arrow of P is the direction in which the influence of the Z-axis is inclined (since the inclination in the Z-axis direction is the three-dimensional direction, P is composed of the component shown in the paper surface and the component perpendicular to the paper surface). Further, the direction indicated by the arrow of Q is the direction in which the θ axis is inclined (indicated as a cross section parallel to the X axis in Fig. 13).

The means for measuring the inclination of the upper surface of the table 82 are height measuring probes 94A and 94B. The height of the position (height measurement point A) of the upper surface A of the table 82 is measured by the height measuring probe 94A, and the height of the position (height measuring point B) of the upper surface B of the table 82 is measured by the height measuring probe 94B.

The inclination of the Z-axis-θ axis mechanism 50 in the Z-axis direction is measured by the Z-axis direction measuring probes 96-1 and 96-2. The measurement ends of the Z-axis direction measurement probes 96-1 and 96-2 are in contact with the Z-axis direction measurement reference members 98-1 and 98-2 provided on the side wall portion 64-S of the Z-axis movement mechanism movable portion 64. The X-direction component in the Z-axis direction is measured by the Z-axis direction measuring probe 96-1, and the Y-direction component in the Z-axis direction is measured by the Z-axis direction measuring probe 96-2.

The height measuring probes 94A and 94B and the Z-axis direction measuring probes 96-1 and 96-2 are fixed to the measuring probe supporting bases 88-1 and 88-2. Further, the measurement probe supporting bases 88-1, 88-2 are fixed to the upper surface of the X-axis moving mechanism 100.

As the above-described measuring probe, a contact type electric micrometer is used. The contact type electric micrometer has a measurement accuracy of at least 0.1 μm.

First, the Z-axis direction of the Z-axis-θ axis mechanism 50 is adjusted. This adjustment is performed while measuring the displacement amount by the Z-axis direction measuring probes 96-1 and 96-2 by using the Z-axis direction adjusting screws (92-1, 92-2, 92-3). Specifically, the adjustment of the Z-axis direction is performed by moving the Z-axis moving mechanism movable portion 64 up and down, and the amount of displacement measured by the Z-axis direction measuring probes 96-1 and 96-2 is not dependent on the height. That is, the Z-axis direction adjustment screw (92-1, 92-2, 92-3) is used to adjust the posture of the Z-axis moving mechanism movable portion 64 with respect to the Z-axis moving mechanism fixing portion 60.

Next, the θ-axis direction of the θ rotation mechanism 16 is adjusted. This adjustment is performed while measuring the displacement amount by the height measuring probes 94A and 94B by using the θ-axis direction adjusting screws (90-1, 90-2, 90-3). The adjustment of the θ-axis direction of the θ rotation mechanism 16 is a displacement amount in the height direction that passes through the height measurement point A of the measurement table 82 and the measurement point B (the measurement point B is a position at 180° with respect to the θ axis and the measurement point A). Come on. The position of the measurement point A and the displacement amount at the position of the measurement point B are measured by the height measuring probes 94A and 94B, respectively.

In the case where the θ rotation mechanism 16 is rotatable in the range of 0° to 360°, the measurement of the displacement amount in the height direction may be performed at one position during the adjustment in the θ-axis direction. In this case, any one of the height measuring probes 94A and 94B may be used.

The amount of displacement in the height direction measured by the detectors 94A and 94B is measured with respect to the height of the θ rotation angle, and if curved, it is a curve substantially similar to the sinusoid. FIG. 14 shows a function of giving the amount of displacement in the height direction by using the θ rotation angle as a variable. FIG. 14 shows a configuration in which the θ rotation mechanism 16 can be rotated in the range of 0° to 180°, the solid line indicates the variation of the displacement amount at the height measurement point A, and the broken line indicates the displacement at the height measurement point B. The amount of change. In the case where the θ rotation mechanism 16 is rotatable in the range of 0° to 360°, the measurement at any position of the height measurement point A or B can be shifted from 0° to 360°. the amount.

The fluctuation of the displacement amount of the measurement point A shown in FIG. 14 is 0 when the rotation angles θ=0° and 180°, and the fluctuation of the displacement amount of the measurement point B is 0 at 180° or 360°, but the case is generally The position at which the amount of lower displacement is 0 is not limited to the above angle. In any case, the function of giving the amount of displacement in the height direction is represented by a curve similar to a sinusoid with a period of 360°.

The adjustment in the θ-axis direction is performed while measuring the displacement amount by the height measuring probes 94A and 94B by using the θ-axis direction adjusting screws (90-1, 90-2, 90-3). Specifically, the θ rotation mechanism 16 rotates the table 82 by one rotation so that the sinusoidal amplitude given to the displacement amount measured by the height measurement probes 94A and 94B is adjusted to be zero. Adjustment work in the θ axis direction. That is, the operation of adjusting the posture of the θ rotation mechanism 16 with respect to the upper surface of the Z-axis moving mechanism movable portion bottom panel 68 is performed using the θ-axis direction adjusting screws (90-1, 90-2, and 90-3).

The movable range of the table of the conventional cutting device in the Z-axis direction is 40 mm or less. Since the thickness of the wafer as the workpiece is 1 mm or less, the movement range of the Z-axis direction may be about 1 mm only for the control of the cutting depth. However, since the diameter of the rotary blade to be used is not only one, the range of the movable range in the Z-axis direction is set to be about 40 mm at the maximum.

Here, a case where the Z-axis direction is inclined by 0.01° is assumed. At this time, when the position of the table is moved from the bottom to the top or from the top to the bottom by 40 mm, a positional deviation error of 7 μm (= 40 mm × sin 0.01°) is generated in the X-Y plane. This error is produced in the direction indicated by P in FIG.

On the other hand, a case where the direction of the θ axis is inclined by 0.01° is assumed. When the left and right ends of the diameter of the 8-inch wafer as the workpiece are set to 200 mm, a depth direction of 35 μm (=200 mm × sin 0.01°) in the depth direction (Z-axis direction) is generated between the two points. Shift error. This error is produced in the direction indicated by Q in FIG. If such a deviation error in the depth direction is generated alone, the cutting depth cannot be controlled as a cutting device.

According to the calculation result described above, when the Z-axis direction and the θ-axis direction are inclined at the same angle, the influence of the inclination in the θ-axis direction indicated by Q appears to be larger than the influence of the inclination in the Z-axis direction indicated by P. From this, it is understood that the adjustment of the θ-axis direction of the rotating shaft of the table 82 is important in controlling the cutting depth.

In general, as the cutting device, the θ-axis direction needs to be adjusted with higher precision than the Z-axis direction. As described above, even if the Z-axis direction is inclined by 0.01°, the cutting position accuracy in the X-Y plane is not greatly affected. However, if the θ-axis direction is inclined by 0.01°, the cutting depth cannot be controlled. Further, the cutting position offset in the X-Y plane can be processed by adding positional shift information in the X-Y plane to the control program of the control system of the cutting device. In contrast, the shift of the θ axis makes it impossible to control the depth of cut as a basic function of the cutting device.

As described above, the inclination in the θ-axis direction needs to be adjusted with higher accuracy than the inclination in the Z-axis direction by one or more. Assuming that the θ-axis direction is inclined by 0.001°, a difference in height of 3.5 μm (=200 mm×sin 0.001°) occurs at both ends of the 8-inch wafer. The inclination in the θ-axis direction needs to be within 0.0005° (as the target accuracy, the plunging depth is controlled within 2 μm). Adjustment of the Z-axis direction and the θ-axis direction of the Z-axis-θ axis mechanism is required to pay attention to this point. In other words, it is important to adjust the θ-axis direction with high precision in advance by a mechanical adjustment mechanism such as an adjustment screw.

After the adjustment operation in the Z-axis direction and the θ-axis direction described above is completed, the measurement probe support base (88-1, 88-2), the height measurement probe (94A, 94B), and the Z-axis direction measurement probe are removed ( 96-1, 96-2) and the Z-axis direction measuring reference member 98 complete the adjustment operation of the Z-axis-θ axis mechanism 50.

In addition, if the Z-axis direction and the θ-axis direction of the Z-axis-θ axis mechanism 50 are adjusted in advance on a precision lathe, and then assembled to the upper surface of the X-axis moving mechanism 100 of the cutting device, the adjustment work becomes easy.

. To sum up, the present invention, regardless of its purpose, means and efficacy, shows its distinctive features of the prior art. You are requested to review the examination and express the patent as soon as possible. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the invention is intended to be limited by the scope of the claims.

10. . . Pedestal

12, 100. . . X-axis moving mechanism

12-1. . . X-axis guide

12-2. . . X-axis ball screw

12-3. . . X-axis mobile station

12-4. . . X-axis support

14, 110. . . Y-axis moving mechanism

14-1. . . Y-axis guide

14-2. . . Y-axis ball screw

14-3. . . Y-axis mobile station

14-4. . . Y-axis support

16. . . θ rotation mechanism

18, 34. . . Z-axis moving mechanism

18-1. . . Z-axis guide

18-2. . . Z-axis ball screw

18-3. . . Z-axis mobile station

18-4. . . Spindle support member

36. . . Spindle support member

20. . . Spindle

twenty two. . . Rotating blade

24, 82. . . jobs

26. . . Workpiece

28, 40, 44. . . Workbench holding mechanism

30, 32, 46. . . Spindle retention mechanism

38. . . Spindle fixed table

48. . . Rotary axis

50. . . Z-axis-θ axis mechanism

52. . . X-Y mobile mechanism

54. . . electric motor

56. . . Power transmission mechanism

60. . . Z-axis moving mechanism fixing part

62. . . Z-axis moving mechanism movable part bottom surface

64. . . Z-axis moving mechanism movable part

66. . . Cross roller

66-1, 66-2, 120, 122. . . Cross roller guide

68. . . Z-axis moving mechanism movable bottom panel

70. . . Ball screw drive

72, 72-1, 72-2. . . Ball screw nut

74, 74-1, 74-2. . . Ball screw

76. . . Coupling section

80. . . Direct drive motor (DD motor)

84. . . Rotor

86. . . Stator section

88-1, 88-2. . . Measuring detector support substrate

90-1, 90-2, 90-3. . . Θ-axis adjustment screw

92-1, 92-2, 92-3. . . Z-axis adjustment screw

94A, 94B. . . Height measuring detector

96-1, 96-2. . . Z-axis direction detector

98-1 and 98-2. . . Reference member for Z-axis direction measurement

126. . . Cylindrical roller

Fig. 1 is a schematic view showing the structure of a conventional typical cutting device.

Fig. 2 is a schematic structural view showing a first cutting device according to an embodiment of the present invention.

Fig. 3 is a schematic structural view showing a second cutting device according to an embodiment of the present invention.

4 is a perspective view showing a schematic configuration of a Z-axis moving mechanism.

Fig. 5 is a perspective view showing a schematic configuration of a crossed roller.

FIG. 6 is a view for explaining a power transmission mechanism for moving the Z-axis moving mechanism movable portion up and down with respect to the Z-axis moving mechanism fixing portion.

Fig. 7 is a view for explaining an installation portion of a power transmission mechanism.

8(A) and 8(B) are views for explaining a mounting method of mounting the ball screw driving device to the bottom plate of the movable portion of the Z-axis moving mechanism.

Fig. 9 is a view for explaining the mounting of the Z-axis moving mechanism to the X-Y moving mechanism.

FIG. 10 is a view for explaining an attachment method in which a θ-axis moving mechanism is provided in a Z-axis moving mechanism.

Fig. 11 is a perspective view showing a schematic configuration of a θ-axis moving mechanism.

Fig. 12 is a view for explaining attachment of the θ rotation mechanism to the Z-axis moving mechanism.

FIG. 13 is a view for explaining adjustment of the Z-axis direction and the θ-axis direction of the Z-axis-θ axis mechanism.

Fig. 14 is a view showing a function of a displacement amount in a height direction with respect to a θ rotation angle.

Claims (8)

A cutting device comprising: a spindle holding mechanism and a table holding mechanism, the spindle holding mechanism being provided with a Y-axis moving mechanism for performing movement in an indexing feed direction parallel to a rotation axis of the rotary blade, and a spindle unit for holding the rotary blade, the table holding mechanism for holding a table carrying a workpiece, the table holding mechanism being used for moving in a cutting feed direction with respect to the workpiece The X-axis moving mechanism includes a Z-axis moving mechanism for moving in the cutting direction and a θ rotating mechanism for performing rotation of the θ rotation axis in a direction parallel to the Z-axis direction, the cutting feed direction In the X-axis direction, the index feed direction is a Y-axis direction, the cut-in direction is a Z-axis direction, the θ rotation mechanism is enclosed in the Z-axis moving mechanism, and the Z-axis moving mechanism has a Z-axis a moving mechanism movable bottom panel, wherein a θ-axis direction adjusting screw is attached to a bottom portion of the Z-axis moving mechanism movable bottom panel, and the θ rotation can be adjusted by the θ-axis direction adjusting screw Configuration with respect to the posture of the upper surface of the Z-axis moving mechanism of the movable portion of the bottom panel. A cutting device comprising: a spindle holding mechanism and a table holding mechanism, the spindle holding mechanism being provided with a Y-axis moving mechanism for performing movement in an index feeding direction parallel to a rotating shaft of the rotary blade To maintain a spindle unit mounted with the rotary blade, the table holding mechanism for holding a table carrying a workpiece, the table holding mechanism being X for moving in a cutting feed direction with respect to the workpiece The shaft moving mechanism includes a Z-axis moving mechanism for moving in the cutting direction and a θ rotating mechanism for performing rotation of the θ rotation axis in a direction parallel to the Z-axis direction, wherein the cutting feed direction is In the X-axis direction, the indexing feed direction is a Y-axis direction, the cut-in direction is a Z-axis direction, and the θ rotation mechanism is enclosed in the Z-axis moving mechanism such that the X-axis moving mechanism, The Z-axis moving mechanism has a position where the center of gravity of the table holding mechanism is lower than a case where the Z-axis moving mechanism and the θ rotating mechanism are overlapped, and the Z-axis moving mechanism includes a Z-axis moving machine. a movable portion bottom panel having a θ-axis direction adjustment screw attached to a bottom portion of the Z-axis moving mechanism movable portion bottom panel, wherein the θ-axis direction adjusting screw can adjust the θ rotation mechanism relative to the Z-axis moving mechanism movable portion The posture of the upper surface of the bottom panel. A cutting device comprising: a spindle holding mechanism for holding a spindle unit mounted with a rotary blade, and a table holding mechanism for holding a table carrying the workpiece, The table holding mechanism includes an X-axis moving mechanism for performing movement in a cutting feed direction with respect to the workpiece, and a Y-axis for performing movement in an index feeding direction parallel to a rotating shaft of the rotating blade An XY moving mechanism in which the moving mechanism is combined, and a Z-axis moving mechanism for moving in the cutting direction and a rotation for rotating the axis in the direction parallel to the Z-axis direction are arranged on the XY moving mechanism The θ rotation mechanism, the cutting feed direction is an X-axis direction, the index feed direction is a Y-axis direction, the cut-in direction is a Z-axis direction, and the θ rotation mechanism is surrounded by the Z-axis moving mechanism The Z-axis moving mechanism includes a Z-axis moving mechanism movable portion bottom panel, and a θ-axis direction adjusting screw is attached to a bottom portion of the Z-axis moving mechanism movable portion bottom panel. The θ-axis direction adjusting screw can adjust the posture of the θ rotation mechanism with respect to the upper surface of the Z-axis moving mechanism movable portion bottom panel. A cutting device comprising: a spindle holding mechanism for holding a spindle unit mounted with a rotary blade, and a table holding mechanism for holding a table carrying the workpiece, The table holding mechanism includes an X-axis moving mechanism for performing movement in a cutting feed direction with respect to the workpiece, and a Y-axis for performing movement in an index feeding direction parallel to a rotating shaft of the rotating blade An XY moving mechanism in which the moving mechanism is combined, and a Z-axis moving mechanism for moving in the cutting direction and a rotation for rotating the axis in the direction parallel to the Z-axis direction are arranged on the XY moving mechanism The θ rotation mechanism, the cutting feed direction is an X-axis direction, the index feed direction is a Y-axis direction, the cut-in direction is a Z-axis direction, and the θ rotation mechanism is surrounded by the Z-axis moving mechanism Therefore, the position of the center of gravity of the table holding mechanism is changed as compared with the case where the XY axis moving mechanism, the Z axis moving mechanism, and the θ rotating mechanism are overlapped. The Z-axis moving mechanism includes a Z-axis moving mechanism movable portion bottom panel, and a θ-axis direction adjusting screw is attached to a bottom portion of the Z-axis moving mechanism movable portion bottom panel, and the θ-axis direction adjusting screw can adjust the position The attitude of the θ rotation mechanism with respect to the upper surface of the movable portion bottom panel of the Z-axis moving mechanism is described. The cutting device according to any one of claims 1 to 4, wherein the Z-axis moving mechanism further includes a Z-axis moving mechanism fixing portion, and a Z-axis is attached to a bottom portion of the Z-axis moving mechanism fixing portion. The direction adjusting screw can adjust the posture of the Z-axis moving mechanism fixing portion with respect to the upper surface of the X-axis moving mechanism by the Z-axis direction adjusting screw. The cutting device according to any one of claims 1 to 4, wherein the θ rotation mechanism is rotatable in a range of 0° to 360°, and is capable of being in the X direction, the −X direction, the Y direction, and The workpiece carried on the table is cut in the Y direction. The cutting device according to claim 6, wherein the workpiece carried on the table is subjected to precise alignment including an angle approximation process in the X direction and the Y direction to obtain an accurate rotation of the θ axis. In the cutting process, the rotation angle obtained by the precise alignment is read from the memory, and the rotation angle of the θ-axis is set at the angle to perform cutting. The cutting device according to claim 6, wherein the θ rotation mechanism is rotatable in a range of 0° to 360°, and is carried in the X direction, the −X direction, the Y direction, and the −Y direction. The workpiece on the table is subjected to precise alignment including angle approximation processing, and an accurate rotation angle of the θ-axis is obtained, and a rotation angle obtained by precise alignment is read from the memory in the cutting process, and θ is The rotation angle of the shaft is set at this angle, so that the workpiece can be cut in the X direction, the -X direction, the Y direction, and the -Y direction.