CN115302246A - Combined machining tool - Google Patents
Combined machining tool Download PDFInfo
- Publication number
- CN115302246A CN115302246A CN202211084489.6A CN202211084489A CN115302246A CN 115302246 A CN115302246 A CN 115302246A CN 202211084489 A CN202211084489 A CN 202211084489A CN 115302246 A CN115302246 A CN 115302246A
- Authority
- CN
- China
- Prior art keywords
- sliding table
- laser
- servo sliding
- grinding
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003754 machining Methods 0.000 title claims abstract description 41
- 238000000227 grinding Methods 0.000 claims abstract description 124
- 238000012545 processing Methods 0.000 claims abstract description 111
- 238000003801 milling Methods 0.000 claims abstract description 24
- 150000001875 compounds Chemical class 0.000 claims description 22
- 230000008602 contraction Effects 0.000 claims description 2
- 239000002131 composite material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 21
- 230000008569 process Effects 0.000 description 15
- 239000000463 material Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002706 hydrostatic effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000003685 thermal hair damage Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a composite processing machine tool, which comprises: the laser processing device comprises a laser generator, a first servo sliding table and a second servo sliding table, wherein the laser generator is suitable for enabling laser to be incident to the surface of a workpiece to be processed, and the first servo sliding table and the second servo sliding table are suitable for adjusting the incident position of the laser so as to perform laser milling processing on the workpiece to be processed; the grinding device comprises a grinding head, a third servo sliding table and a fourth servo sliding table, wherein the third servo sliding table and the fourth servo sliding table are suitable for driving the grinding head to move so as to adjust the position of the grinding head, and the grinding head is suitable for carrying out precise grinding on the surface of a workpiece to be machined; the rotary table is provided with a rotary disc, the rotary disc is provided with a rotary table, the rotary table is suitable for placing a workpiece to be machined, and the rotary table is suitable for driving the workpiece to be machined to rotate. According to the combined machining tool, the workpiece can be clamped once, two machining processes of laser milling machining and precision grinding machining can be realized simultaneously, and the machining precision and the machining efficiency of the workpiece are improved.
Description
Technical Field
The invention relates to the technical field of mechanical combined machining, in particular to a combined machining tool.
Background
In order to realize the processing of superhard materials, the prior art focuses on methods for realizing various special processing or multi-energy field processing by means of chemical, thermal, electronic, ionic, electromagnetic and other actions. The microstructure is manufactured on the superhard material by adopting laser milling, the surface quality is poor, the processing precision is low, and the nano-scale surface roughness is difficult to obtain. The equipment for processing by adopting electron beams and ion beams is expensive, the processing cost is higher, and the efficiency is extremely low when the superhard material is processed. Although the processing performance is good by using the atmospheric pressure plasma in the plasma chemical evaporation processing, the thermal damage caused by high density is difficult to avoid. In addition, the traditional method adopting the semiconductor processes of general photoetching combined with etching and the like is difficult to manufacture an accurate aspheric surface and cannot meet the requirement on the precision of the surface shape.
Therefore, a compound processing machine tool is needed to solve the problems in the above technical solutions.
Disclosure of Invention
To this end, the present invention provides a compound machine tool that solves or at least alleviates the above-identified problems.
According to an aspect of the present invention, there is provided a compound machine tool adapted to machine a workpiece to be machined, including: the laser processing device comprises a laser generator, a first servo sliding table and a second servo sliding table, wherein the laser generator is suitable for enabling laser to be incident to the surface of a workpiece to be processed, and the first servo sliding table and the second servo sliding table are suitable for adjusting the position where the laser is incident so as to carry out laser milling processing on the workpiece to be processed; the grinding device comprises a grinding head, a third servo sliding table and a fourth servo sliding table, wherein the third servo sliding table and the fourth servo sliding table are suitable for driving the grinding head to move so as to adjust the position of the grinding head, and the grinding head is suitable for carrying out precise grinding on the surface of the workpiece to be machined; the rotary table is provided with a rotary disc, the rotary disc is provided with a rotary table, and the rotary table is suitable for placing a workpiece to be processed; the rotary table is suitable for driving the rotary table on the rotary disc to rotate so as to drive a workpiece to be machined on the rotary table to rotate to a laser machining station, laser is incident to the surface of the workpiece to be machined through the laser generator, and the incident position of the laser is adjusted through the first servo sliding table and the second servo sliding table so as to perform laser milling on the workpiece to be machined; the revolving platform is further suitable for driving a workpiece to be machined on the rotary table to rotate to a grinding machining station, the grinding head is driven to move through the third servo sliding table and the fourth servo sliding table so as to adjust the position of the grinding head, and the grinding head is right to perform precise grinding machining on the surface of the workpiece to be machined.
Optionally, in the compound processing machine tool according to the present invention, further comprising: the lathe body comprises a laser processing station and a grinding processing station; the laser processing device is arranged at a laser processing station, and the grinding processing device is arranged at the grinding processing station.
Optionally, in the compound machine tool according to the present invention, the grinding device further includes: the first reflector, the second reflector and the lens are connected in sequence; the laser generator is suitable for enabling laser to be incident to the surface of the workpiece to be processed through the first reflector, the second reflector and the lens.
Optionally, in the compound processing machine tool according to the present invention, the first servo sliding table and the second servo sliding table are adapted to drive the first reflective mirror, the second reflective mirror, and the lens to move horizontally, so as to adjust the position of the laser incidence.
Alternatively, in the compound machine tool according to the present invention, the second servo slide is connected to the first servo slide through a first support block; the first reflector is arranged on the first supporting block; the second reflective mirror and the first reflective mirror are horizontally arranged oppositely and are connected with the first reflective mirror through a contraction rod; the lens is arranged below the second reflective mirror and is connected with the second reflective mirror through a fixed rod.
Optionally, in the compound machine tool according to the present invention, the grinding device further includes: the grinding head is mounted on the rotary main shaft, and the rotary main shaft is fixed on the fourth servo sliding table through a fixing support; the third servo sliding table is suitable for driving the rotary main shaft and the grinding head to move along the horizontal direction; the fourth servo sliding table is suitable for driving the rotary main shaft and the grinding head to move in the vertical direction.
Optionally, in the compound processing machine tool according to the present invention, a vacuum chuck is provided on the turntable, so that the bottom of the workpiece to be processed is positioned by the vacuum chuck in an adsorbing manner.
Optionally, in the compound machine tool according to the present invention, the turntable includes a first turntable, a second turntable, and a third turntable, and the first turntable, the second turntable, and the third turntable are uniformly distributed around an axial center of the turn table.
Optionally, in the compound machine tool according to the present invention, the grinding device further includes: the third servo sliding table and the fourth servo sliding table are arranged on the grinding rack; the grinding head is fixedly arranged on the fourth servo sliding table, and the fourth servo sliding table is connected with the third servo sliding table; the third servo sliding table is suitable for driving the grinding head to move along the horizontal direction, and the fourth servo sliding table is suitable for driving the grinding head to move along the vertical direction.
Optionally, in the compound machine tool according to the present invention, the laser processing apparatus further includes: the laser processing support, laser generator, first servo slip table, the setting of the servo slip table of second are in on the laser processing support.
Alternatively, in the compound machine tool according to the present invention, the turn table is disposed in the middle of the upper portion of the bed.
According to the technical scheme, the invention provides a compound processing machine tool which comprises a laser processing device, a grinding processing device and a rotary table. Wherein, be equipped with the revolving disk on the revolving platform, be equipped with a plurality of revolving stages on the revolving disk, be suitable for on the revolving platform to place and wait to process the work piece, can drive the revolving stage on the revolving disk through the revolving platform and rotate to the laser beam machining station to the work piece of waiting to process on the drive revolving stage rotates, incides laser extremely through laser generator wait to process the work piece surface, and adjust the position of laser incidence through first servo slip table and the servo slip table of second, so that treat to process the work piece and carry out laser milling process. And then, the rotary table drives the workpiece to be machined on the rotary table to rotate to a grinding machining station, the third servo sliding table and the fourth servo sliding table drive the grinding head to move so as to adjust the position of the grinding head, and the grinding head is used for precisely grinding the surface of the workpiece to be machined. Therefore, the combined machining tool integrates two different machining processes of laser milling and precision grinding, and can be used for machining microstructures of workpieces such as superhard dies. The laser milling processing is carried out on the workpiece through the laser processing device, and the workpiece can be efficiently roughly processed in a non-contact mode. Furthermore, the workpiece is subjected to ultra-precise grinding processing through a small grinding head grinding process of the grinding processing device, so that the workpiece is further polished, and the precision and the surface quality of the microstructure surface are improved. Therefore, the invention can simultaneously realize two processing technologies of laser milling and precision grinding by clamping the workpiece once, thereby not only improving the overall processing efficiency of the workpiece and the processing precision and surface quality of the microstructure surface, but also effectively avoiding the installation error caused by repeated clamping, further ensuring the processing precision and ensuring the processing quality to be more stable. Therefore, the composite processing machine tool has higher practical value and popularization value and meets the market development requirement.
The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.
Drawings
To the accomplishment of the foregoing and related ends, certain illustrative aspects are described herein in connection with the following description and the annexed drawings, which are indicative of various ways in which the principles disclosed herein may be practiced, and all aspects and equivalents thereof are intended to be within the scope of the claimed subject matter. The above and other objects, features and advantages of the present disclosure will become more apparent from the following detailed description read in conjunction with the accompanying drawings. Throughout this disclosure, like reference numerals generally refer to like parts or elements.
FIG. 1 shows a schematic diagram of a compound machine tool 100 according to one embodiment of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Aiming at the defects of low machining precision, poor surface quality, low efficiency, heat damage, high machining cost and the like of a machining tool in the prior art, the invention provides a composite machining tool 100 which is simple in structure, convenient for mounting a workpiece and high in machining efficiency.
FIG. 1 shows a schematic diagram of a compound machine tool 100 according to one embodiment of the invention. The compound machine tool 100 according to the present invention can be used for machining a workpiece to be machined, which may include workpieces of various hard materials, for example, a hard mold. Specifically, the compound processing machine tool 100 of the present invention can be used for precision processing of microstructures of hard molds, including aspheric structures. It should be noted that the present invention is not limited to a particular kind of workpiece.
As shown in fig. 1, the compound machine tool 100 includes a bed 7, and a laser machining device, a grinding machining device, and a rotary table 18 mounted on the bed 7. Specifically, the bed body 7 includes an initial processing station, a laser processing station, and a grinding processing station, the laser processing device is disposed at the laser processing station, and the grinding processing device is disposed at the grinding processing station.
Wherein, be equipped with revolving tray 8 on revolving platform 18, can set up a plurality of revolving stages (for example first revolving stage 21, second revolving stage 20, third revolving stage 5) on revolving tray 8, be used for placing the work piece of treating on the revolving stage. Here, a plurality of turn tables may be evenly distributed on the turn disc 8. The rotary table 18 can drive the rotary disc 8 to rotate, so as to drive the plurality of rotary tables on the rotary disc 8 to rotate, and control the workpiece to be processed on the rotary tables to switch the processing stations.
The laser processing device comprises a laser generator 13, a first servo sliding table 12 and a second servo sliding table 9. The laser generator 13 is used for emitting laser to the surface of the workpiece to be processed, and the first servo sliding table 12 and the second servo sliding table 9 are used for adjusting the position of laser incidence so as to perform laser milling (finish milling) on the workpiece to be processed.
In one embodiment, the abrasive machining apparatus further includes: the device comprises a first reflecting mirror 11, a second reflecting mirror 19 and a lens 17, wherein the first reflecting mirror 11, the second reflecting mirror 19 and the lens 17 are connected in sequence. The laser generator 13 can realize incidence of laser light to a processing position of the surface of the workpiece to be processed by the first reflecting mirror 11, the second reflecting mirror 19, and the lens 17. It can be understood that the incident angle of the laser emitted by the laser generator 13 can be changed and adjusted through the first reflective mirror 11, the second reflective mirror 19 and the lens 17, so as to further adjust the position of the laser incident on the surface of the workpiece to be processed, so that the laser is accurately incident on the processing position of the surface of the workpiece to be processed, and the accuracy of laser milling positioning is improved.
Wherein, first servo slip table 12 is connected with second servo slip table 9, first servo slip table 12 and second servo slip table 9 are used for driving first reflector 11, second reflector 19, lens 17 horizontal migration, so that adjust first reflector 11, second reflector 19, the position of lens 17, because through first reflector 11, second reflector 19, lens 17 can change and adjust the incident angle of the laser that laser generator 13 launched, and then realize adjusting the position that laser incides to the work piece surface of treating processing, thereby, drive first reflector 11 through first servo slip table 12 and second servo slip table 9, second reflector 19, lens 17 horizontal migration, adjust first reflector 11, second reflector 19, the position of lens 17, can realize adjusting the position that laser incides.
In one implementation, the first servo sliding table 12 is configured to drive the first reflective mirror 11, the second reflective mirror 19, and the lens 17 to move along a first direction, and the second servo sliding table 9 is configured to drive the first reflective mirror 11, the second reflective mirror 19, and the lens 17 to move along a second direction. The first direction and the second direction are both horizontal directions, and the first direction and the second direction are vertical to each other.
According to the embodiment of the invention, the grinding device comprises a grinding head 25, a third servo sliding table 4 and a fourth servo sliding table 1. The third servo sliding table 4 and the fourth servo sliding table 1 are used for driving the grinding head 25 to move (the grinding head 25 can be driven to move in the horizontal direction and the vertical direction) so as to accurately adjust the position of the grinding head 25, namely, the position of the grinding head 25 for grinding a workpiece to be processed. The grinding head 25 can be used for carrying out precise grinding processing on the surface of the workpiece to be processed, so that the surface of the workpiece to be processed is polished.
In one embodiment, the third servo slide 4 is connected with the fourth servo slide 1, and the grinding head 25 is fixedly mounted on the fourth servo slide 1. The fourth servo sliding table 1 is used for driving the grinding head 25 to move along the vertical direction. The third servo sliding table 4 is used for driving the grinding head 25 to move along the horizontal direction.
In one implementation, as shown in fig. 1, the grinding device of the compound machine tool 100 further includes a rotary main shaft 2, and the grinding head 25 can be mounted at the lower end of the rotary main shaft 2, and the grinding head 25 can be driven to rotate by the rotary main shaft 2 to realize precise grinding processing on the structural surface of the workpiece to be processed.
Specifically, the swivel spindle 2 may be fixed to the fourth servo slide 1 by a fixing bracket 3. The fourth servo sliding table 1 can drive the rotary main shaft 2 and the grinding head 25 to move along the vertical direction through the fixed support 3. The third servo sliding table 4 can drive the rotary main shaft 2 and the grinding head 25 to move along the horizontal direction through the fourth servo sliding table 1 and the fixed support 3.
It should be noted that, in the process of processing the workpiece to be processed, firstly, the operator may place the workpiece to be processed on the turntable located at the initial processing station. In one embodiment, as shown in fig. 1, the plurality of turntables may include: a first turntable 21, a second turntable 20, a third turntable 5. The first turntable 21, the second turntable 20, and the third turntable 5 are uniformly distributed around the axial center of the rotating disk 8, and in the state shown in fig. 1, the position where the first turntable 21 is located is an initial processing station where a workpiece to be processed can be placed on the first turntable 21. In the state shown in fig. 1, the position corresponding to the second turret 20 is a laser processing station, the position corresponding to the third turret 5 is a grinding processing station, the laser processing device is located on the side of the second turret 20, and the grinding processing device is located on the side of the third turret 5.
Subsequently, the plurality of rotary tables on the rotary disk 8 can be driven to rotate by the rotary table 18 to drive the workpiece to be processed on the rotary table (the first rotary table 21) to rotate to the laser processing station, so that the workpiece to be processed is switched to the laser processing station, and at this time, the rotary table 18 is stopped to drive the rotary disk 8 to rotate. And then, at the laser processing station, carrying out laser milling processing on the workpiece to be processed by using a laser processing device. Specifically, laser can be incident to the surface of the workpiece to be machined through the laser generator 13, and the position of the laser incidence can be adjusted through the first servo sliding table 12 and the second servo sliding table 9, so that laser milling of the workpiece to be machined is achieved.
After the laser milling processing of the workpiece to be processed is completed by using the laser processing device, the workpiece to be processed needs to be switched to a grinding processing station, so that the surface of the workpiece to be processed is continuously subjected to precise grinding processing by using the grinding processing device, and the polishing of the surface of the workpiece to be processed is realized.
Specifically, after the laser milling processing of the workpiece to be processed is completed by using the laser processing device, the rotary tables 18 can be used for continuously driving the plurality of rotary tables on the rotary disk 8 to rotate so as to drive the workpiece to be processed on the rotary tables to rotate from the laser processing station to the grinding processing station, so that the workpiece to be processed is switched to the grinding processing station, and at the moment, the rotary tables 18 are stopped to drive the rotary disk 8 to rotate. Next, at the grinding station, precision grinding of the surface of the workpiece to be machined is continued by the grinding device. Specifically, the grinding head 25 is driven to move by the third servo sliding table 4 and the fourth servo sliding table 1 so as to adjust the position of the grinding head 25, and the surface of the workpiece to be machined is subjected to precision grinding machining by the grinding head 25.
In one embodiment, as shown in fig. 1, the rotary disk 8 is circular, the bed 7 can also be circular, the rotary disk 8 can be arranged in the middle of the upper part of the bed 7, and the rotary disk 8 is arranged coaxially with the bed 7.
In one embodiment, the turntable 18 is connected to a driver, and the turntable 18 can rotate the turntable 8 (around the axial center of the turntable 8) under the driving of the driver, so as to rotate the plurality of turntables (the first turntable 21, the second turntable 20, and the third turntable 5) on the turntable 8 and the workpiece to be machined on the turntable (the first turntable 21).
Specifically, the turntable 18 may drive the turntable 8 to rotate around the axis center of the turntable 8, so as to drive the first turntable 21, the second turntable 20, and the third turntable 5 to rotate around the axis center of the turntable 8.
In one embodiment, each turntable is provided with a vacuum chuck. As shown in fig. 1, the first turntable 21 is provided with a first vacuum chuck 24, the second turntable 20 is provided with a second vacuum chuck 23, and the third turntable 5 is provided with a third vacuum chuck 22. Like this, after will treat that the work piece is placed on revolving stage (first revolving stage 21), can treat the bottom of processing the work piece at first through vacuum chuck (first vacuum chuck 24) and adsorb the location, and then, drive a plurality of revolving stages on the revolving stage 8 through revolving stage 18 and rotate to it rotates to the laser beam machining station to drive the work piece of treating on the revolving stage (first revolving stage 21).
In one embodiment, the laser machining apparatus includes a laser machining support 16, as shown in fig. 1, the laser machining support 16 being disposed on one side of the second turntable 20.
The laser generator 13, the first servo sliding table 12 and the second servo sliding table 9 are arranged on the laser processing support 16. Here, a first end (right end) on the laser processing support 16 is provided with the laser generator 13, and a second end (left end) on the laser processing support 16 is provided with the first servo slide table 12 and the second servo slide table 9. Wherein the second servo slide 9 can be connected to the first servo slide 12 via a first support block 10.
The first reflective mirror 11 may be disposed on the first support block 10. The second reflecting mirror 19 is disposed horizontally opposite to the first reflecting mirror 11, and the second reflecting mirror 19 is coupled to the first reflecting mirror 11 through the retracting lever 14. Here, in one implementation, a second support block 26 is also provided on the second servo slide 9, and the second mirror 19 is provided on the second support block 26.
The lens 17 is disposed under the second mirror 19, and the lens 17 may be coupled with the second mirror 19 through the fixing lever 15.
In one implementation, the second mirror 19 is coupled to the first mirror 11 by four retraction rods 14. Therefore, the laser incidence position is adjusted through the reflector, and meanwhile, the laser incidence levelness can be ensured.
In addition, the lens 17 and the second mirror 19 may be connected by four fixing bars 15. Therefore, the perpendicularity of laser incidence can be ensured, and the accuracy of a laser milling position is improved.
In one embodiment, the grinding apparatus further includes a grinding carriage 6, as shown in fig. 1, the grinding carriage 6 being disposed at one side of the third turntable 5. The third servo sliding table 4 and the fourth servo sliding table 1 are arranged on the grinding rack 6, and the third servo sliding table 4 is connected with the fourth servo sliding table 1.
In one implementation, the laser generator 13 of the laser processing apparatus may inject femtosecond laser light to the surface of the workpiece to be processed, so as to finish-mill the workpiece to be processed by the femtosecond laser light. In addition, the first servo sliding table 12 and the second servo sliding table 9 can adopt a coreless linear motor and ball linear guide rail structure, the structure is high in moving precision, good in guiding constraint and high in linearity, so that the first servo sliding table 12 and the second servo sliding table 9 drive the reflector and the lens to move horizontally, the positioning precision requirement for the laser incidence position can be improved, and the precision of laser milling processing on a workpiece is further improved.
In one implementation, the grinding device needs to perform ultra-precise grinding on a workpiece to be machined through the grinding head, the third servo sliding table 4 and the fourth servo sliding table 1 can adopt a coreless linear motor and a hydrostatic guide rail, and thus when the positions of the rotary main shaft 2 and the grinding head are adjusted through the third servo sliding table 4 and the fourth servo sliding table 1, the positioning precision and the repeated positioning precision of the movement of the grinding head can meet the requirement of nanometer precision. In addition, the power head can adopt a sea-floating music hydrostatic pressure main shaft, and has high rigidity, high transmission efficiency, long service life and stable main shaft jumping which is less than 0.25um.
In one implementation, the rotary table 18 may be a hydraulic rotary table, and the high-precision driver controls the positioning of the rotary table during rotation, which is beneficial to improve the positioning precision, so as to control the workpiece to be processed to be accurately switched to the processing station (laser processing station/grinding station).
In one implementation, the base of the bed body 7 is of an eight-support structure and adopts high-quality natural marble with high quality, so that the overall high rigidity of the machine tool can be ensured, and the stability of the machine tool in the process of machining workpieces is improved.
The compound processing machine 100 according to the present invention includes a laser processing device, a grinding device, and a turntable. Wherein, be equipped with the revolving disc on the revolving table, be equipped with a plurality of revolving stages on the revolving disc, be suitable for on the revolving stage to place and wait to process the work piece, can drive the revolving stage rotation on the revolving disc through the revolving table to the work piece of waiting to process on the drive revolving stage rotates to the laser machining station, incides laser extremely through laser generator wait to process the work piece surface, and through the position of first servo slip table and the incident of the servo slip table adjustment laser of second, so that treat to process the work piece and carry out laser milling. And then, the rotary table drives the workpiece to be machined on the rotary table to rotate to a grinding machining station, the third servo sliding table and the fourth servo sliding table drive the grinding head to move so as to adjust the position of the grinding head, and the grinding head is used for precisely grinding the surface of the workpiece to be machined. Therefore, the combined machining tool integrates two different machining processes of laser milling and precision grinding, and can be used for machining microstructures of workpieces such as superhard dies. The laser milling processing is carried out on the workpiece through the laser processing device, and the workpiece can be efficiently roughly processed in a non-contact mode. Furthermore, the workpiece is subjected to ultra-precise grinding processing through a small grinding head grinding process of the grinding processing device, so that the workpiece is further polished, and the precision and the surface quality of the microstructure surface are improved. Therefore, the invention can simultaneously realize two processing technologies of laser milling and precision grinding by clamping the workpiece once, thereby not only improving the overall processing efficiency of the workpiece and the processing precision and surface quality of the microstructure surface, but also effectively avoiding the installation error caused by repeated clamping, further ensuring the processing precision and ensuring the processing quality to be more stable. Therefore, the composite processing machine tool has higher practical value and popularization value and meets the market development requirement.
In the description of the present specification, the terms "connected", "fixed", and the like are to be construed broadly unless otherwise explicitly specified or limited. Furthermore, the terms "front", "back", "upper", "lower", "inner", "outer", "top", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing and simplifying the description, but do not indicate or imply that the referred devices or units must have a specific direction, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Similarly, it should be appreciated that in the foregoing description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure and aiding in the understanding of one or more of the various inventive aspects. However, the disclosed method should not be construed to reflect the intent: rather, the invention as claimed requires more features than are expressly recited in each claim. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of this invention.
Those skilled in the art will appreciate that the modules or units or components of the devices in the examples disclosed herein may be arranged in a device as described in this embodiment or alternatively may be located in one or more devices different from the devices in this example. The modules in the foregoing examples may be combined into one module or may be further divided into multiple sub-modules.
Those skilled in the art will appreciate that the modules in the device in an embodiment may be adaptively changed and disposed in one or more devices different from the embodiment. The modules or units or components of the embodiments may be combined into one module or unit or component, and furthermore they may be divided into a plurality of sub-modules or sub-units or sub-components. All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and all of the processes or elements of any method or apparatus so disclosed, may be combined in any combination, except combinations where at least some of such features and/or processes or elements are mutually exclusive. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.
Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments.
As used herein, unless otherwise specified the use of the ordinal adjectives "first", "second", "third", etc., to describe a common object, merely indicate that different instances of like objects are being referred to, and are not intended to imply that the objects so described must be in a given sequence, either temporally, spatially, in ranking, or in any other manner.
While the invention has been described with respect to a limited number of embodiments, those skilled in the art, having benefit of this description, will appreciate that other embodiments can be devised which do not depart from the scope of the invention as disclosed herein. Furthermore, it should be noted that the language used in the specification has been principally selected for readability and instructional purposes, and may not have been selected to delineate or circumscribe the inventive subject matter. Accordingly, many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the appended claims. The present invention has been disclosed in an illustrative rather than a restrictive sense with respect to the scope of the invention, as defined in the appended claims.
Claims (10)
1. A compound machine tool adapted to machine a workpiece to be machined, comprising:
the laser processing device comprises a laser generator, a first servo sliding table and a second servo sliding table, wherein the laser generator is suitable for enabling laser to be incident to the surface of a workpiece to be processed, and the first servo sliding table and the second servo sliding table are suitable for adjusting the position of the laser incidence so as to carry out laser milling processing on the workpiece to be processed;
the grinding device comprises a grinding head, a third servo sliding table and a fourth servo sliding table, wherein the third servo sliding table and the fourth servo sliding table are suitable for driving the grinding head to move so as to adjust the position of the grinding head, and the grinding head is suitable for carrying out precise grinding on the surface of the workpiece to be machined;
the rotary table is provided with a rotary disc, the rotary disc is provided with a rotary table, and the rotary table is suitable for placing a workpiece to be processed;
the rotary table is suitable for driving the rotary table on the rotary disc to rotate so as to drive a workpiece to be machined on the rotary table to rotate to a laser machining station, laser is incident to the surface of the workpiece to be machined through the laser generator, and the incident position of the laser is adjusted through the first servo sliding table and the second servo sliding table so as to perform laser milling on the workpiece to be machined;
the rotary table is further suitable for driving workpieces to be machined on the rotary table to rotate to a grinding machining station, the grinding head is driven to move by the third servo sliding table and the fourth servo sliding table so as to be adjusted in position, and the grinding head is used for performing precise grinding machining on the surfaces of the workpieces to be machined.
2. The machine tool of claim 1, further comprising:
the lathe body comprises a laser processing station and a grinding processing station;
the laser processing device is arranged at a laser processing station, and the grinding processing device is arranged at the grinding processing station.
3. The machine tool of claim 1 or 2,
the grinding processing device further includes: the first reflector, the second reflector and the lens are connected in sequence;
the laser generator is suitable for enabling laser to be incident to the surface of the workpiece to be processed through the first reflector, the second reflector and the lens.
4. The machine tool of claim 3,
the first servo sliding table and the second servo sliding table are suitable for driving the first reflecting mirror, the second reflecting mirror and the lens to horizontally move so as to adjust the position of the laser incidence.
5. The machine tool of claim 3 or 4, wherein the second servo slide is connected with the first servo slide by a first support block;
the first reflector is arranged on the first supporting block;
the second reflective mirror and the first reflective mirror are horizontally arranged oppositely and are connected with the first reflective mirror through a contraction rod;
the lens is arranged below the second reflective mirror and is connected with the second reflective mirror through a fixed rod.
6. The machine tool according to any one of claims 1 to 5, wherein the grinding processing device further comprises:
the grinding head is mounted on the rotary main shaft, and the rotary main shaft is fixed on the fourth servo sliding table through a fixing support;
the third servo sliding table is suitable for driving the rotary main shaft and the grinding head to move along the horizontal direction;
the fourth servo sliding table is suitable for driving the rotary main shaft and the grinding head to move in the vertical direction.
7. The machine tool of any one of claims 1-6,
and a vacuum chuck is arranged on the rotary table so as to adsorb and position the bottom of the workpiece to be processed through the vacuum chuck.
8. The machine tool of any one of claims 1-7,
the rotary table comprises a first rotary table, a second rotary table and a third rotary table, and the first rotary table, the second rotary table and the third rotary table are uniformly distributed around the shaft center of the rotary disc.
9. The machine tool according to any one of claims 1 to 8, wherein the grinding processing device further comprises:
the third servo sliding table and the fourth servo sliding table are arranged on the grinding rack;
the grinding head is fixedly arranged on the fourth servo sliding table, and the fourth servo sliding table is connected with the third servo sliding table;
the third servo sliding table is suitable for driving the grinding head to move in the horizontal direction, and the fourth servo sliding table is suitable for driving the grinding head to move in the vertical direction.
10. The machine tool according to any one of claims 1 to 9, wherein the laser processing apparatus further comprises:
the laser processing support, laser generator, first servo slip table, the setting of the servo slip table of second are in on the laser processing support.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211084489.6A CN115302246B (en) | 2022-09-06 | 2022-09-06 | Composite processing machine tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211084489.6A CN115302246B (en) | 2022-09-06 | 2022-09-06 | Composite processing machine tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115302246A true CN115302246A (en) | 2022-11-08 |
| CN115302246B CN115302246B (en) | 2024-08-13 |
Family
ID=83866311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211084489.6A Active CN115302246B (en) | 2022-09-06 | 2022-09-06 | Composite processing machine tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115302246B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115771088A (en) * | 2023-02-13 | 2023-03-10 | 江苏万恒铸业有限公司 | Steel casting grinding device with traction function and traction method |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006102812A (en) * | 2004-09-07 | 2006-04-20 | Yamazaki Mazak Corp | Laser machining device |
| CN103715078A (en) * | 2012-10-03 | 2014-04-09 | 株式会社迪思科 | Grinding apparatus and grinding method |
| CN105473272A (en) * | 2013-09-02 | 2016-04-06 | 三菱重工业株式会社 | Composite processing device and composite processing method |
| CN207014574U (en) * | 2017-04-11 | 2018-02-16 | 东莞华晶粉末冶金有限公司 | A kind of Ceramic manufacturing equipment |
| CN111360657A (en) * | 2020-03-21 | 2020-07-03 | 重庆大学 | Laser abrasive belt grinding composite processing equipment and processing method |
| CN111725093A (en) * | 2019-03-19 | 2020-09-29 | 株式会社迪思科 | Processing device |
| CN114121600A (en) * | 2020-08-25 | 2022-03-01 | 株式会社迪思科 | Method for cleaning workpiece |
| CN114453725A (en) * | 2021-05-19 | 2022-05-10 | 江西应用科技学院 | Near-net forming method and device for multi-axis and axis-variable component |
| CN114473527A (en) * | 2022-03-16 | 2022-05-13 | 重庆大学 | Multiple composite structure laser abrasive belt processing method |
| CN114850653A (en) * | 2022-04-08 | 2022-08-05 | 大连理工大学 | Composite machine tool integrating ultrasonic-assisted grinding and laser processing and processing method |
-
2022
- 2022-09-06 CN CN202211084489.6A patent/CN115302246B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006102812A (en) * | 2004-09-07 | 2006-04-20 | Yamazaki Mazak Corp | Laser machining device |
| CN103715078A (en) * | 2012-10-03 | 2014-04-09 | 株式会社迪思科 | Grinding apparatus and grinding method |
| CN105473272A (en) * | 2013-09-02 | 2016-04-06 | 三菱重工业株式会社 | Composite processing device and composite processing method |
| CN207014574U (en) * | 2017-04-11 | 2018-02-16 | 东莞华晶粉末冶金有限公司 | A kind of Ceramic manufacturing equipment |
| CN111725093A (en) * | 2019-03-19 | 2020-09-29 | 株式会社迪思科 | Processing device |
| CN111360657A (en) * | 2020-03-21 | 2020-07-03 | 重庆大学 | Laser abrasive belt grinding composite processing equipment and processing method |
| CN114121600A (en) * | 2020-08-25 | 2022-03-01 | 株式会社迪思科 | Method for cleaning workpiece |
| CN114453725A (en) * | 2021-05-19 | 2022-05-10 | 江西应用科技学院 | Near-net forming method and device for multi-axis and axis-variable component |
| CN114473527A (en) * | 2022-03-16 | 2022-05-13 | 重庆大学 | Multiple composite structure laser abrasive belt processing method |
| CN114850653A (en) * | 2022-04-08 | 2022-08-05 | 大连理工大学 | Composite machine tool integrating ultrasonic-assisted grinding and laser processing and processing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115771088A (en) * | 2023-02-13 | 2023-03-10 | 江苏万恒铸业有限公司 | Steel casting grinding device with traction function and traction method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115302246B (en) | 2024-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102161168B (en) | Small-caliber aspherical composite precise processing machine tool | |
| CN104084651A (en) | Linear module, machining method and machining devices applied to machining method | |
| CN113210636B (en) | Device and method for machining shift-centering type micro lens array | |
| JP2004358624A (en) | Vertical lathe | |
| CN113681309B (en) | Mobile milling machine system and hole system processing method | |
| JP2002346889A (en) | Surface grinding device for annular workpiece and grooving method for the annular workpiece | |
| CN115302246B (en) | Composite processing machine tool | |
| CN112776189A (en) | Automatic multi-shaft machining center of unloading | |
| CN211136247U (en) | Turning and grinding combined machine tool | |
| CN214322195U (en) | Multi-station rotating laser grinding device with multiple cutting heads | |
| CN108746737B (en) | High-precision laser multipoint positioning numerical control machine tool | |
| CN219987037U (en) | Full-automatic multi-axis numerical control high-speed cutter grinding machine | |
| CN219218103U (en) | Multi-degree-of-freedom positioning and clamping device suitable for speed reducer gear | |
| CN112706026A (en) | Optical element grinding and polishing compound machine tool | |
| CN116872172A (en) | Photovoltaic board installation robot based on 3D vision | |
| CN216681460U (en) | Automatic plate part grinding machine | |
| CN107309725B (en) | Horizontal axis round table surface grinding machine with duplex structure | |
| CN214723184U (en) | Machine tool structure for machining spline shaft | |
| CN114438293A (en) | Laser quenching equipment of lead screw raceway | |
| CN112676704A (en) | Multi-station rotating laser grinding device with multiple cutting heads | |
| CN114894128A (en) | Lead screw raceway surface waviness check out test set | |
| CN210996699U (en) | Six machining centers | |
| CN206493001U (en) | A kind of star-wheel grinder structure | |
| CN215509478U (en) | Displacement laser processing equipment | |
| CN215144331U (en) | Rotating pin machining tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |