CN111246660A - 一种防潮除湿型pcb板 - Google Patents
一种防潮除湿型pcb板 Download PDFInfo
- Publication number
- CN111246660A CN111246660A CN202010186989.5A CN202010186989A CN111246660A CN 111246660 A CN111246660 A CN 111246660A CN 202010186989 A CN202010186989 A CN 202010186989A CN 111246660 A CN111246660 A CN 111246660A
- Authority
- CN
- China
- Prior art keywords
- pcb
- heat dissipation
- moisture
- fixedly connected
- pcb main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007791 dehumidification Methods 0.000 title claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims abstract description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000741 silica gel Substances 0.000 claims abstract description 25
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 25
- 238000013016 damping Methods 0.000 claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 239000002274 desiccant Substances 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims abstract description 9
- 238000001035 drying Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 12
- 230000005855 radiation Effects 0.000 claims description 7
- 230000000694 effects Effects 0.000 abstract description 13
- 230000035939 shock Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
- F16F15/08—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with rubber springs ; with springs made of rubber and metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Acoustics & Sound (AREA)
- Aviation & Aerospace Engineering (AREA)
- Mechanical Engineering (AREA)
- Combustion & Propulsion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Drying Of Gases (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010186989.5A CN111246660B (zh) | 2020-03-17 | 2020-03-17 | 一种防潮除湿型pcb板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010186989.5A CN111246660B (zh) | 2020-03-17 | 2020-03-17 | 一种防潮除湿型pcb板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111246660A true CN111246660A (zh) | 2020-06-05 |
CN111246660B CN111246660B (zh) | 2021-04-30 |
Family
ID=70866066
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010186989.5A Active CN111246660B (zh) | 2020-03-17 | 2020-03-17 | 一种防潮除湿型pcb板 |
Country Status (1)
Country | Link |
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CN (1) | CN111246660B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112888151A (zh) * | 2021-01-12 | 2021-06-01 | 兴宁市精维进电子有限公司 | 一种高密度高频多层柔性电路板 |
CN113696574A (zh) * | 2021-11-01 | 2021-11-26 | 赛柯赛斯新能源科技(苏州)有限公司 | 一种柔性线路板及其加工工艺 |
CN117686760A (zh) * | 2024-02-01 | 2024-03-12 | 黄河科技集团网信产业有限公司 | 一种电子元件测试用万用表装置 |
CN118139268A (zh) * | 2024-01-31 | 2024-06-04 | 杭州出厂科技有限公司 | 一种高效散热的多层电路板 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060067053A1 (en) * | 2004-09-30 | 2006-03-30 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
JP2007128999A (ja) * | 2005-11-02 | 2007-05-24 | Matsushita Electric Ind Co Ltd | 放熱部品の取り付け金具及び放熱部品の取り付け金具を備えたプリント基板 |
US20110182035A1 (en) * | 2010-01-28 | 2011-07-28 | Takashi Yajima | Electronic device |
CN104393502A (zh) * | 2014-11-19 | 2015-03-04 | 镇江船舶电器有限责任公司 | 带预报警装置的船舶低压配电板 |
US20160374232A1 (en) * | 2015-06-16 | 2016-12-22 | Cisco Technology, Inc. | High Impact Resistant Heat Sink |
CN107610607A (zh) * | 2017-10-19 | 2018-01-19 | 苏州中蟹网电子商务有限公司 | 一种带有散热效果的led显示屏 |
CN107673147A (zh) * | 2017-11-03 | 2018-02-09 | 苏州福特美福电梯有限公司 | 一种减震与散热的操纵箱 |
CN207560577U (zh) * | 2017-12-12 | 2018-06-29 | 东莞文殊电子科技有限公司 | 一种抗震性好的线路板 |
CN108650811A (zh) * | 2018-04-28 | 2018-10-12 | 孝感市奇思妙想文化传媒有限公司 | 一种防潮散热电路板 |
US10342119B1 (en) * | 2018-03-27 | 2019-07-02 | Nio Usa, Inc. | Thermal spring frame and shield for sealed processing systems |
CN209517621U (zh) * | 2018-12-14 | 2019-10-18 | 成都欣金奥电子科技有限公司 | 一种用于高度集成耐热电路板 |
CN209593888U (zh) * | 2018-11-23 | 2019-11-05 | 福州瑞华印制线路板有限公司 | 一种空调用多层印制线路板 |
CN209693142U (zh) * | 2018-12-07 | 2019-11-26 | 深圳市拓驰电子有限公司 | 一种散热型印制线路板 |
CN209882214U (zh) * | 2019-03-07 | 2019-12-31 | 深圳市创芯智汇电子科技有限公司 | 一种散热快速的柔性印刷电路板 |
-
2020
- 2020-03-17 CN CN202010186989.5A patent/CN111246660B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060067053A1 (en) * | 2004-09-30 | 2006-03-30 | Hon Hai Precision Industry Co., Ltd. | Locking device for heat dissipating device |
JP2007128999A (ja) * | 2005-11-02 | 2007-05-24 | Matsushita Electric Ind Co Ltd | 放熱部品の取り付け金具及び放熱部品の取り付け金具を備えたプリント基板 |
US20110182035A1 (en) * | 2010-01-28 | 2011-07-28 | Takashi Yajima | Electronic device |
CN104393502A (zh) * | 2014-11-19 | 2015-03-04 | 镇江船舶电器有限责任公司 | 带预报警装置的船舶低压配电板 |
US20160374232A1 (en) * | 2015-06-16 | 2016-12-22 | Cisco Technology, Inc. | High Impact Resistant Heat Sink |
CN107610607A (zh) * | 2017-10-19 | 2018-01-19 | 苏州中蟹网电子商务有限公司 | 一种带有散热效果的led显示屏 |
CN107673147A (zh) * | 2017-11-03 | 2018-02-09 | 苏州福特美福电梯有限公司 | 一种减震与散热的操纵箱 |
CN207560577U (zh) * | 2017-12-12 | 2018-06-29 | 东莞文殊电子科技有限公司 | 一种抗震性好的线路板 |
US10342119B1 (en) * | 2018-03-27 | 2019-07-02 | Nio Usa, Inc. | Thermal spring frame and shield for sealed processing systems |
CN108650811A (zh) * | 2018-04-28 | 2018-10-12 | 孝感市奇思妙想文化传媒有限公司 | 一种防潮散热电路板 |
CN209593888U (zh) * | 2018-11-23 | 2019-11-05 | 福州瑞华印制线路板有限公司 | 一种空调用多层印制线路板 |
CN209693142U (zh) * | 2018-12-07 | 2019-11-26 | 深圳市拓驰电子有限公司 | 一种散热型印制线路板 |
CN209517621U (zh) * | 2018-12-14 | 2019-10-18 | 成都欣金奥电子科技有限公司 | 一种用于高度集成耐热电路板 |
CN209882214U (zh) * | 2019-03-07 | 2019-12-31 | 深圳市创芯智汇电子科技有限公司 | 一种散热快速的柔性印刷电路板 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112888151A (zh) * | 2021-01-12 | 2021-06-01 | 兴宁市精维进电子有限公司 | 一种高密度高频多层柔性电路板 |
CN113696574A (zh) * | 2021-11-01 | 2021-11-26 | 赛柯赛斯新能源科技(苏州)有限公司 | 一种柔性线路板及其加工工艺 |
CN118139268A (zh) * | 2024-01-31 | 2024-06-04 | 杭州出厂科技有限公司 | 一种高效散热的多层电路板 |
CN117686760A (zh) * | 2024-02-01 | 2024-03-12 | 黄河科技集团网信产业有限公司 | 一种电子元件测试用万用表装置 |
CN117686760B (zh) * | 2024-02-01 | 2024-04-16 | 黄河科技集团网信产业有限公司 | 一种电子元件测试用万用表装置 |
Also Published As
Publication number | Publication date |
---|---|
CN111246660B (zh) | 2021-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A moisture-proof and dehumidification PCB board Effective date of registration: 20211117 Granted publication date: 20210430 Pledgee: Jiujiang Bank Co.,Ltd. Wan'an sub branch Pledgor: WANAN YUWEI ELECTRONICS Co.,Ltd. Registration number: Y2021980012543 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 343000 electronic circuit board industrial park, Wan'an County, Ji'an City, Jiangxi Province Patentee after: Wan'an Yuwei Electronics Co.,Ltd. Address before: 343000 electronic circuit board industrial park, Wan'an County, Ji'an City, Jiangxi Province Patentee before: WANAN YUWEI ELECTRONICS Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20210430 Pledgee: Jiujiang Bank Co.,Ltd. Wan'an sub branch Pledgor: WANAN YUWEI ELECTRONICS Co.,Ltd. Registration number: Y2021980012543 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |