CN111244246B - Light-emitting micro-element, transfer system thereof and display device - Google Patents
Light-emitting micro-element, transfer system thereof and display device Download PDFInfo
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- CN111244246B CN111244246B CN201811446299.8A CN201811446299A CN111244246B CN 111244246 B CN111244246 B CN 111244246B CN 201811446299 A CN201811446299 A CN 201811446299A CN 111244246 B CN111244246 B CN 111244246B
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
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- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/95053—Bonding environment
- H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly
Abstract
The invention relates to the technical field of display panels and discloses a light-emitting micro-element, a transfer system thereof and a display device. The light-emitting micro-component comprises a light-emitting body and a first electrode assembly, wherein the first electrode assembly is fixed on one side of the light-emitting body and is connected with the light-emitting body, and the center of gravity of the light-emitting micro-component is adjacent to one end with the first electrode assembly. Through the mode, the transfer efficiency of the light-emitting micro-element can be improved.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to a light-emitting micro-element, a transfer system thereof and a display device.
Background
A Light Emitting Diode (LED) is a photoelectric semiconductor element, which has the advantages of low power consumption, small size, high brightness, easy matching with an integrated circuit, high reliability, and the like, and is widely used as a Light source. As LED technology has matured, LED displays or Micro LED (Micro light emitting diode) displays that directly utilize LEDs as self-luminous display point pixels have also become widely used.
The Micro LED display screen integrates the technical characteristics of a TFT-LCD and an LED display screen, the display principle is that the LED structure design is subjected to thinning, microminiaturization and arraying, then the Micro LED is transferred to a circuit substrate from an initial growth substrate, and one of the difficulties in the current Micro LED technology development is the transfer process of the Micro LED.
Disclosure of Invention
In view of the above, the present invention provides a light emitting micro-device, a transfer system thereof and a display device, which can improve the transfer efficiency of the light emitting micro-device.
In order to solve the technical problems, the invention adopts a technical scheme that: a light emitting micro-component is provided, the light emitting micro-component includes a light emitting body and a first electrode assembly fixed to one side of the light emitting body and connected to the light emitting body, the center of gravity of the light emitting micro-component is adjacent to one end having the first electrode assembly.
In order to solve the technical problem, the invention adopts another technical scheme that: providing a transfer system of a light-emitting micro-element, wherein the transfer system comprises a driving substrate, a driving substrate and a transfer mechanism, wherein one side surface of the driving substrate is provided with pixel grooves which are arranged in an array manner; the screen plate is provided with a plurality of guide through holes corresponding to the pixel grooves, and the guide through holes are used for guiding the light-emitting micro-elements to be embedded into the pixel grooves on the driving substrate; wherein the light-emitting micro-component is the light-emitting micro-component described in the above embodiments.
In order to solve the technical problem, the invention adopts another technical scheme that: the display device comprises a driving substrate, wherein one side surface of the driving substrate is provided with pixel grooves which are arranged in an array manner, and contact electrodes are arranged in the pixel grooves; the light emitting micro-device is the light emitting micro-device described in the above embodiments, and the light emitting micro-device is embedded in the pixel groove, and the first electrode assembly of the light emitting micro-device is coupled to the contact electrode.
The invention has the beneficial effects that: different from the prior art, the invention provides a light-emitting micro-component. The light-emitting micro-component comprises a light-emitting body and a first electrode assembly fixed on one side of the light-emitting body, wherein the first electrode assembly is connected with the light-emitting body. The center of gravity of the light-emitting micro-component is adjacent to one end with the first electrode assembly, so that the end with the first electrode assembly moves downwards in the process of assembling the light-emitting micro-component in the fluid so as to be correctly installed on the substrate for receiving the light-emitting micro-component, links of removing and/or adjusting the incorrectly installed light-emitting micro-component in the prior art are reduced, and the transfer efficiency of the light-emitting micro-component is improved.
Drawings
FIG. 1 is a schematic structural diagram of a first embodiment of a light-emitting micro-device according to the present invention;
FIG. 2 is a schematic structural view of an embodiment of the stabilizing cap of the present invention;
FIG. 3 is a schematic structural diagram of a second embodiment of a light-emitting micro-device according to the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of a second electrode of the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of a second electrode of the present invention;
FIG. 6 is a schematic structural diagram of a third embodiment of a light-emitting micro-device according to the present invention;
FIG. 7 is a schematic structural diagram of a fourth embodiment of a light-emitting micro-device according to the present invention;
FIG. 8 is a schematic structural diagram of an embodiment of a transfer system for a light-emitting micro-device according to the present invention;
FIG. 9 is a schematic structural diagram of a display device according to an embodiment of the present invention;
fig. 10 is a schematic structural diagram of an embodiment of a transfer process of a light-emitting micro-device according to the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
In order to solve the technical problem of low transfer efficiency of the light-emitting micro-device in the prior art, an embodiment of the invention provides a light-emitting micro-device. The light-emitting micro-component comprises a light-emitting body and a first electrode assembly fixed on one side of the light-emitting body, wherein the first electrode assembly is connected with the light-emitting body. Wherein the center of gravity of the light emitting micro-component is adjacent to the end having the first electrode assembly. As described in detail below.
The Micro LED display is a display which realizes image display by taking a high-density Micro-sized LED array integrated on a substrate as display pixels, each pixel can be addressed and independently driven to light, the distance between pixel points is reduced from millimeter level to micron level, and the Micro LED display and an organic light emitting diode display belong to self-luminous displays.
The micrometastasis technology is a mainstream method for preparing a Micro LED display at present, and the specific preparation process comprises the following steps: firstly growing Micro LEDs on a sapphire substrate, then separating the Micro LEDs from the sapphire substrate by a laser lift-off technology, and then transferring the Micro LEDs from the sapphire substrate to a position reserved by a receiving substrate, namely finishing the work of transferring the Micro LEDs to the receiving substrate, thereby manufacturing the Micro LED display.
The operation of the Micro transfer technology of the Micro LED is greatly limited due to the Micro LED size and the transfer number. Aiming at Micro transfer technology based on fluid assembly, the fluid is utilized to realize the massive transfer of the Micro LED. The receiving substrate is provided with a groove for mounting the Micro LEDs, when suspension with the Micro LEDs flows over the receiving substrate, part of the Micro LEDs fall into the groove correctly, and then the part of the Micro LEDs are transferred.
However, the fluid assembly is adopted to carry out massive transfer of the Micro LEDs, and the distribution of the Micro LEDs is too disordered and random, so that a large amount of blank areas on the receiving substrate need to be filled, which is time-consuming and labor-consuming. In addition, in the process of fluid assembly, the movement posture of the Micro LED is random and changeable, so that the Micro LED cannot be correctly assembled with the receiving substrate after reaching the receiving substrate, and an extra process is needed to remove/adjust the incorrectly-installed Micro element, so that the batch transfer process of the Micro LED is increased, the preparation cost of the Micro LED display is increased, and the transfer efficiency of the Micro LED is low.
In view of the above, an embodiment of the present invention provides a light emitting Micro device, which can solve the technical problem of low transfer efficiency of Micro devices including the Micro LED in the prior art.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a light-emitting micro-device according to a first embodiment of the invention.
In one embodiment, the light emitting micro-component 1 includes a light emitting body 11 and a first electrode assembly 12. The light-emitting body 11 is a light-emitting structure of the light-emitting micro-device 1, and can be excited to generate an electron transition and emit light. The first electrode assembly 12 is fixed to one side of the light emitting body 11 and is connected to the light emitting body 11. Wherein the center of gravity of the light emitting micro-component 1 is adjacent to the end thereof having the first electrode assembly 12.
Since the center of gravity of the light emitting micro-component 1 is adjacent to its end having the first electrode assembly 12. Therefore, during the assembly of the fluid, the light-emitting micro-component 1 moves from top to bottom, before the light-emitting micro-component 1 is corrected to the correct motion attitude, the end with the first electrode assembly 12 has a greater acceleration than the other end of the light-emitting micro-component 1 under the combined action of the gravity and the fluid acting force, so that the motion speed of the end with the first electrode assembly 12 of the light-emitting micro-component 1 is greater than that of the other end of the light-emitting micro-component 1, thereby correcting the motion attitude of the light-emitting micro-component 1 until the end with the first electrode assembly 12 of the light-emitting micro-component 1 moves downwards and to the corresponding position on the receiving substrate. The receiving substrate is provided with electrodes for corresponding connection with the first electrode assembly 12, and the first electrode assembly 12 of the light-emitting micro-component 1 is required to be in contact with the electrodes, so that the correct mounting manner is achieved. Therefore, the light-emitting micro-component 1 of the present embodiment can ensure that the end having the first electrode assembly 12 is always facing downward, so as to ensure that the light-emitting micro-component 1 is correctly mounted on the receiving substrate.
It can be seen that the light-emitting micro-component 1 described in this embodiment can maintain a correct motion posture during the fluid assembly process, thereby ensuring that the light-emitting micro-component 1 can be correctly mounted on the receiving substrate, and reducing the links of removing and/or adjusting the incorrectly mounted light-emitting micro-component 1 in the conventional process, thereby improving the transfer efficiency of the light-emitting micro-component 1, and reducing the manufacturing process and cost of the display.
Further, the light emitting micro-component 1 further comprises a weight block 13. The weight member 13 is fixed to a side of the first electrode assembly 12 away from the light emitting body 11. Since the density of the weight 13 is greater than that of the other parts of the light-emitting micro-component 1, and preferably the density of the weight 13 is greater than that of the other parts of the light-emitting micro-component 1, the center of gravity of the light-emitting micro-component 1 is adjacent to the end of the light-emitting micro-component 1 having the weight 13, that is, the end of the light-emitting micro-component 1 having the first electrode assembly 12. In this way, during the descending process of the light emitting micro-component 1 in the fluid environment, the end of the light emitting micro-component 1 having the weight block 13 moves downward, so as to be correctly mounted on the receiving substrate.
Preferably, the weight member 13 may be a metal with a relatively high density and good conductive performance, such as gold, silver, copper, tungsten, and the like, which may be one of the above metal materials or a combination of more of the above metal materials.
To further ensure the kinematic attitude of the light-emitting micro-component 1 during its movement, the light-emitting micro-component 1 further comprises a second electrode assembly 14 and a stabilizing cap 15. The second electrode assembly 14 is fixed to a side of the light emitting body 11 away from the first electrode assembly 12 and connected to the light emitting body 11. The stabilizing cap 15 is secured to the second electrode assembly 14 on a side thereof remote from the first electrode assembly 12.
The density of the end of light-emitting micro-component 1 having stabilizing cap 15 is less than the rest of light-emitting micro-component 1, further bringing the center of gravity of light-emitting micro-component 1 closer to the end thereof having first electrode assembly 12. It may specifically be: the density of the stabilizing cap 15 is less than that of the other parts of the light-emitting micro-element 1, so that the center of gravity of the light-emitting micro-element 1 is closer to the end thereof having the first electrode assembly 12, to form the above-described structure in which the center of gravity of the light-emitting micro-element 1 is adjacent to the end having the first electrode assembly 12.
Preferably, the material of the stabilizing cap 15 may be an organic polymer material, such as photoresist, which is preferably vinyl monomer, azide-containing quinone compound, polyvinyl alcohol laurate, etc.; alternatively, the material of the stabilizing cap 15 may be polymethyl methacrylate (PMMA). The density of the stabilizing cap 15 is small so that the density of the stabilizing cap 15 is smaller than the density of the rest of the light-emitting micro-component 1 so that the center of gravity of the light-emitting micro-component 1 is adjacent to its end with the weight 13.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an embodiment of a stabilizing cap of the present invention.
In an alternative embodiment, the stabilizing cap 21 is a hollow cylindrical structure and is perforated vertically. An end of the second electrode assembly 22 remote from the light emitting body is disposed in the stabilization cap 21, and an end of the stabilization cap 21 remote from the second electrode assembly 22 is open such that the inside of the stabilization cap 21 communicates with the outside. And the surface of the stabilizing cap 21 is subjected to special surface treatment, so that bubbles 23 are easily formed in the liquid inside the stabilizing cap 21, and since the density of the gas is much lower than that of the liquid, after the bubbles 23 are formed in the stabilizing cap 21 in the above manner, the density of one end of the stabilizing cap 21 with the bubbles 23 is greatly reduced, and the light-emitting micro-component can be further ensured to keep a correct motion posture in the fluid assembly process. And because the selection range of the assembly liquid for satisfying the fluid assembly of the light-emitting micro-component is limited, the structure of the stabilizing cap 21 is beneficial to obtaining better descending speed and more stable descending posture.
It should be noted that, the density of the weight block 13 on the light-emitting micro-component is high, and the density of the stabilizing cap 15 is low, when the light-emitting micro-component moves from top to bottom in the fluid, the buoyancy and the gravity act together, which is beneficial for the light-emitting micro-component to stabilize the movement posture thereof, and the light-emitting micro-component is installed on the receiving substrate in a correct movement posture. The weight member 13 of the light emitting micro-component is disposed at one end of the light emitting micro-component having the first electrode assembly 12, so that the first electrode assembly 12 is connected to the corresponding electrode of the receiving substrate, and the light emitting micro-component is electrically connected to the pixel driving circuit of the receiving substrate. The advantage of the structure of the light emitting micro-components described in this embodiment is that, when the light emitting micro-components are transferred in batch, each light emitting micro-component can be stabilized to a correct motion posture, so that each light emitting micro-component is the first electrode assembly 12 facing downward and connected to the receiving substrate, and it is avoided that there is a part of the light emitting micro-component which is not the first electrode assembly 12 facing downward and connected to the receiving substrate.
Further, the first electrode assembly 12 includes a first electrode 121 and a first semiconductor 122, the first semiconductor 122 is connected between the first electrode 121 and the light emitting body, and an end of the first electrode 121 away from the first semiconductor 122 is connected to the weight member 13. The second electrode assembly 14 includes a second electrode 141 and a second semiconductor 142, and the second semiconductor 142 is connected between the second electrode 141 and the light emitting body. The first electrode assembly 12 and the second electrode assembly 14 are respectively an anode structure and a cathode structure for driving the light emitting body to emit light.
Alternatively, the first semiconductor 122 may be a P-type semiconductor, i.e., a hole-type semiconductor. The first semiconductor 122 is an impurity semiconductor having a hole concentration much greater than a free electron concentration. Correspondingly, the first electrode 121 may be a P electrode. The second semiconductor 142 may be an N-type semiconductor, i.e., an electronic type semiconductor. The second semiconductor 142 is an impurity semiconductor having a free electron concentration much greater than a hole concentration. Correspondingly, the second electrode 141 may be an N electrode.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a light-emitting micro-device according to a second embodiment of the present invention.
In an alternative embodiment, the positions of the first electrode assembly and the second electrode assembly on the light emitting micro-component can be interchanged. That is, the weight 33 of the light-emitting micro-component 3 can be arranged at the end of the light-emitting micro-component 3 having the second electrode assembly 32, and the stabilizing cap 34 can be arranged at the end of the light-emitting micro-component 3 having the first electrode assembly 31. Correspondingly, the center of gravity of the light-emitting micro-component 3 is adjacent to the end thereof having the second electrode assembly 32. During the fluid assembly, the second electrode assembly 32 of the light-emitting micro-component 3 faces downward and is connected to the receiving substrate.
If the positions of the first electrode assembly 31 and the second electrode assembly 32 on the light-emitting micro-component 3 are interchanged, the electrodes on the receiving substrate to which the light-emitting micro-component 3 is connected need to be replaced accordingly. That is, the electrodes on the receiving substrate for connection to the light-emitting micro-elements 3 correspond to the first electrode assembly 31/the second electrode assembly 32. Corresponding electrodes are required to establish electrical connection with the corresponding electrode assemblies.
Moreover, the electrode in the electrode assembly at the end of the light-emitting micro-element 3 where the stabilizing cap 34 is located can be prepared after the transfer of the light-emitting micro-element 3 is completed. For example, in the above embodiment, the stabilizing cap 34 is disposed at the end of the light-emitting micro-element 3 having the first electrode assembly 31, so that the first electrode 311 in the first electrode assembly 31 can be prepared after the transfer of the light-emitting micro-element 3 is completed.
Please continue to refer to fig. 1. Since the first and second semiconductors 122 and 142 are generally transparent structures, they do not block the light source output of the light emitting body 11. Since the first electrode assembly 12 of the light-emitting micro-component 1 is butted with the receiving substrate, the second electrode assembly 14 is required not to affect the light source output of the light-emitting body 11. This means that the second electrode 141 should minimize the blocking of the light source output of the light emitting body 11.
Alternatively, the second electrode 41 may be a circular electrode, and the second electrode 41 is a transparent structure, so as to minimize the blocking of the light source output of the light emitting body 42 by the second electrode 41, as shown in fig. 4. Alternatively, the second electrode 51 may be a ring structure with a surface area smaller than that of the circular structure, so as to minimize the obstruction of the light source output of the light-emitting body 52 by the second electrode 51, as shown in fig. 5.
It should be noted that, since the second electrode 141 is an N-electrode, the current spreading capability of the N-electrode is better, which may allow the ring-shaped electrode structure to be adopted. When the second electrode assembly 14 of the light-emitting micro-component 1 is abutted to the receiving substrate and the first electrode assembly 12 is required not to affect the light source output of the light-emitting body 11, the current spreading capability of the P electrode is poor because the first electrode 121 is a P electrode, which is preferably a circular electrode structure.
Further, the light emitting micro-component 1 further includes a welding electrode 16, and the welding electrode 16 is fixed on a side of the weight block 13 away from the first electrode assembly 12. The solder electrodes 16 serve as an electrical connection medium between the light-emitting micro-component 1 and the receiving substrate. In order to realize the current path of the light-emitting micro-component 1, the weight 13 connected to the welding electrode 16 is also an electrical conductor, which can be used to transmit electrical signals. The side wall of the light emitting micro-component 1 is provided with an insulating protective layer 17, and the insulating protective layer 17 is coated on the side wall of the light emitting micro-component 1, and is used for preventing the side wall of the light emitting micro-component 1 from electric leakage and maintaining the stability of the internal structure of the light emitting micro-component 1, and is not affected by the external environment.
Please refer to fig. 6-7. Alternatively, the light-emitting micro-component 1 may be a cylinder or a truncated cone, and the first electrode assembly 12 and the second electrode assembly 14 are disposed on the top surface and the bottom surface of the cylinder or the truncated cone, respectively. When the light-emitting micro-component 1 is in the correct motion posture, the rotational symmetry axis of the cylinder or the circular truncated cone coincides with the motion direction of the light-emitting micro-component 1. The cylindrical or truncated cone-shaped light-emitting micro-component 1 is beneficial to keeping the motion posture stable. Preferably, the dimension of the light-emitting micro-component 1 in the thickness direction is usually between 0.5 and 10 μm, and the planar dimension is usually between 1 and 100 μm. The inventors have found that the light-emitting micro-component 1 having the above-mentioned dimensions is more advantageous for obtaining a better descending speed and a more stable descending posture during the fluid assembly process.
In summary, the center of gravity of the light-emitting micro-component provided by the present invention is adjacent to the end having the first electrode assembly, so that the end having the first electrode assembly moves downward during the fluid assembly process of the light-emitting micro-component to be correctly mounted on the substrate receiving the light-emitting micro-component, thereby reducing the links of removing and/or adjusting the incorrectly mounted light-emitting micro-component, and improving the transfer efficiency of the light-emitting micro-component.
Referring to fig. 8, fig. 8 is a schematic structural diagram of a transfer system of a light-emitting micro-device according to an embodiment of the present invention.
In one embodiment, the transfer system 6 of the light-emitting micro-devices includes a driving substrate 61 and a screen 62, and the screen 62 is disposed on the driving substrate 61 when the transfer system 6 performs the fluid assembly of the light-emitting micro-devices. The driving substrate 61 has pixel grooves 611 arranged in an array on a surface of one side thereof. The screen 62 is provided with a plurality of guiding through holes 621 corresponding to the pixel grooves 611, and the guiding through holes 621 are used for guiding the light emitting micro-components to be embedded into the pixel grooves 611 on the driving substrate 61.
In view of the fact that the distribution of light-emitting micro-components is too random and random during the conventional fluid assembly process. In the present embodiment, the guiding through holes 621 of the screen 62 are used to guide the light-emitting micro-components to be embedded into the pixel grooves 611 on the driving substrate 61, so as to enhance the controllability of the fluid assembly process of the light-emitting micro-components, thereby avoiding the technical problem that a large number of empty pixel grooves on the driving substrate without light-emitting micro-components need to be additionally filled in the conventional fluid assembly, and improving the batch transfer efficiency of the light-emitting micro-components. Moreover, since the light-emitting micro-component described in this embodiment is the light-emitting micro-component described in the above embodiment, the light-emitting micro-component has a unique structure that stabilizes the motion posture thereof, so as to be correctly installed in the pixel groove 611 under the guidance of the screen 62, thereby reducing the links of removing and/or adjusting the light-emitting micro-component that is not correctly installed, and further improving the batch transfer efficiency of the light-emitting micro-component.
Further, the mesh plate 62 includes a guide plate 622 and a movable plate 623 which are stacked up and down, and the guide through hole 621 includes a first guide through hole 6211 and a second guide through hole 6212. The guide plate 622 is provided with a first guide through hole 6211, the movable plate 623 is provided with a second guide through hole 6212, and the movable plate 623 is movable on the guide plate 622 for communicating/offsetting the second guide through hole 6212 with the first guide through hole 6211. The aperture of the first guiding through hole 6211 gradually increases from one end adjacent to the movable plate 623 to the direction away from the movable plate 623, so that the light emitting micro-component falls into the first guiding through hole 6211; the aperture of the second guiding through hole 6212 and the notch of the pixel groove 611 on the driving substrate 61 are adapted to each other in shape and size, so that the light-emitting micro-element can be embedded into the pixel groove 611 when moving into the second guiding through hole 6212, and is prevented from being stuck between the second guiding through hole 6212 and the pixel groove 611.
Since the movable plate 623 can move on the guide plate 622, after each pixel groove 611 on the driving substrate 61 is correctly mounted with a light emitting micro-component, the movable plate 623 moves on the guide plate 622, so that the first guide through hole 6211 and the second guide through hole 6212 are misaligned with each other, thereby closing the passage of the light emitting micro-component into the pixel groove 611.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a display device according to an embodiment of the invention.
In one embodiment, the display device 7 includes a driving substrate 71 and a light emitting micro-device 72. A pixel groove 711 arranged in an array is formed in the surface of one side of the driving substrate 71, and a contact electrode 7111 is disposed in the pixel groove 711. The light emitting micro-component 72 is embedded in the pixel groove 711, and the first electrode assembly 721 of the light emitting micro-component 72 is coupled with the contact electrode 7111. The light-emitting micro-device 72 described in this embodiment is the light-emitting micro-device described in the above embodiment, and will not be described herein again.
The following generally describes the fluid assembly process for light-emitting micro-components provided by the present invention:
the first step is as follows: providing a driving substrate and a screen plate, and arranging the screen plate on the driving substrate;
the second step is that: moving a movable plate of the screen plate, communicating a first guide through hole and a second guide through hole on the screen plate, aligning the first guide through hole and a pixel groove on the driving substrate, and fixing the relative position of the driving substrate and the screen plate;
the third step: placing the driving substrate and the screen plate in a container, wherein the driving substrate is positioned below the screen plate;
the fourth step: pouring assembling liquid into the container, and submerging the driving substrate and the screen plate; wherein, the assembly liquid is non-corrosive and volatile liquid, and is preferably water, ethanol, propanol and the like;
the fifth step: uniformly spraying enough light-emitting micro-element suspension liquid into the container, and standing for a period of time until almost all pixel grooves on the driving substrate are provided with light-emitting micro-elements; fig. 10 shows the transfer of the light-emitting micro-components 82 in the container 81.
And a sixth step: moving a movable plate of the screen plate to enable the first guide through holes and the second guide through holes to be mutually staggered, closing a channel for guiding the light-emitting micro-elements, taking out the driving substrate and the screen plate, and separating the driving substrate from the screen plate after drying the assembly liquid; the volatile assembly liquid can reduce the time consumption of the process of the air drying step;
the seventh step: and placing the driving substrate in a reflow furnace for reflow soldering, so that the first electrode assembly of the light-emitting micro-component and the contact electrode in the pixel groove are soldered into a whole, and the batch transfer process of the light-emitting micro-component fluid assembly is completed.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A light-emitting micro-component, comprising:
a light emitting body;
a first electrode assembly secured to one side of the light emitting body and connected thereto, the center of gravity of the light emitting micro-component being adjacent to the end having the first electrode assembly such that the end of the light emitting micro-component having the first electrode assembly moves downward in a fluid environment.
2. The light-emitting micro-component of claim 1, wherein the light-emitting micro-component comprises a weight fixed to a side of the first electrode assembly remote from the light-emitting body to form a structure with the center of gravity adjacent to an end having the first electrode assembly; wherein the density of the balancing weight is greater than other parts of the light-emitting micro-element.
3. A light-emitting micro-component according to claim 2, wherein the light-emitting micro-component comprises a second electrode assembly and a stabilization cap;
the second electrode assembly is fixed on one side of the light-emitting body, which is far away from the first electrode assembly, and is connected with the light-emitting body;
the stabilizing cap is secured to the second electrode assembly on a side thereof remote from the first electrode assembly, and the light-emitting micro-components have ends of the stabilizing cap less dense than other portions of the light-emitting micro-components to form a structure having the center of gravity adjacent to the end having the first electrode assembly.
4. The luminescent micro-element of claim 3, wherein the stabilizing cap has a density less than other portions of the luminescent micro-element.
5. The light-emitting micro-component of claim 3, wherein the stabilizing cap is a hollow cylindrical structure in which bubbles are easily formed in the liquid, the end of the second electrode assembly away from the light-emitting body is disposed in the stabilizing cap, and the end of the stabilizing cap away from the second electrode assembly is open.
6. The light-emitting micro-component of claim 3, wherein the first electrode assembly comprises a first electrode and a first semiconductor, the first semiconductor is connected between the first electrode and the light-emitting body, and an end of the first electrode away from the first semiconductor is connected to the weight;
the second electrode assembly includes a second electrode and a second semiconductor, and the second semiconductor is connected between the second electrode and the light emitting body.
7. Light-emitting micro-component according to claim 2,
the light-emitting micro-component comprises a welding electrode, and the welding electrode is fixed on one side of the balancing weight, which is far away from the first electrode component; wherein, the balancing weight is a conductor.
8. A system for transferring light-emitting micro-components, comprising:
a driving substrate, one side surface of which is provided with pixel grooves arranged in an array;
the screen plate is provided with a plurality of guide through holes corresponding to the pixel grooves, and the guide through holes are used for guiding the light-emitting micro-elements to be embedded into the pixel grooves on the driving substrate; wherein the light-emitting micro-component is a light-emitting micro-component according to any one of claims 1 to 7.
9. The transfer system according to claim 8, wherein the mesh plate includes a guide plate and a movable plate stacked up and down, and the guide through-hole includes a first guide through-hole and a second guide through-hole;
the guide plate is provided with the first guide through hole, the movable plate is provided with the second guide through hole, the movable plate can move on the guide plate and is used for enabling the second guide through hole and the first guide through hole to be communicated/staggered with each other, and the aperture of the first guide through hole is gradually increased from one end, close to the movable plate, of the first guide through hole to the direction far away from the movable plate.
10. A display device, comprising:
the driving substrate is provided with pixel grooves arranged in an array mode on one side surface, and contact electrodes are arranged in the pixel grooves;
a light-emitting micro-component as claimed in any one of claims 1 to 7, embedded in the pixel recess, the first electrode assembly of the light-emitting micro-component being coupled to the contact electrode.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811446299.8A CN111244246B (en) | 2018-11-29 | 2018-11-29 | Light-emitting micro-element, transfer system thereof and display device |
| KR1020217019448A KR102548245B1 (en) | 2018-11-29 | 2019-05-28 | Micro light emitting device and its transfer system, display device |
| PCT/CN2019/088853 WO2020107837A1 (en) | 2018-11-29 | 2019-05-28 | Light-emitting micro-element and transfer system thereof, and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811446299.8A CN111244246B (en) | 2018-11-29 | 2018-11-29 | Light-emitting micro-element, transfer system thereof and display device |
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| CN111244246A CN111244246A (en) | 2020-06-05 |
| CN111244246B true CN111244246B (en) | 2021-08-17 |
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| KR (1) | KR102548245B1 (en) |
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| US6927382B2 (en) * | 2002-05-22 | 2005-08-09 | Agilent Technologies | Optical excitation/detection device and method for making same using fluidic self-assembly techniques |
| US9178123B2 (en) * | 2012-12-10 | 2015-11-03 | LuxVue Technology Corporation | Light emitting device reflective bank structure |
| US9825202B2 (en) | 2014-10-31 | 2017-11-21 | eLux, Inc. | Display with surface mount emissive elements |
| TWI557831B (en) * | 2015-05-15 | 2016-11-11 | 友達光電股份有限公司 | Method for transferring micro device |
| US9368549B1 (en) * | 2015-09-02 | 2016-06-14 | Nthdegree Technologies Worldwide Inc. | Printed mesh defining pixel areas for printed inorganic LED dies |
| CN107833525B (en) * | 2016-09-15 | 2020-10-27 | 伊乐视有限公司 | System and method for fluid assembly of light emitting displays |
| US10002856B1 (en) * | 2017-01-26 | 2018-06-19 | International Business Machines Corporation | Micro-LED array transfer |
| CN107170773B (en) * | 2017-05-23 | 2019-09-17 | 深圳市华星光电技术有限公司 | Micro- LED display panel and preparation method thereof |
| CN107425101B (en) * | 2017-07-11 | 2019-03-01 | 华灿光电（浙江）有限公司 | A kind of method of micro-led chip flood tide transfer |
| CN108475661B (en) * | 2017-07-24 | 2022-08-16 | 歌尔股份有限公司 | Micro light emitting diode display device and manufacturing method thereof |
| CN107910413B (en) * | 2017-11-21 | 2019-07-12 | 福州大学 | A kind of the flood tide transfer device and transfer method of MicroLED |
| CN108682312B (en) * | 2018-05-12 | 2020-11-06 | 汕头超声显示器技术有限公司 | Manufacturing method of LED array device |
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| KR102548245B1 (en) | 2023-06-27 |
| WO2020107837A1 (en) | 2020-06-04 |
| KR20210088001A (en) | 2021-07-13 |
| CN111244246A (en) | 2020-06-05 |
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