CN111223663B - Metal support ceramic capacitor and preparation method thereof - Google Patents
Metal support ceramic capacitor and preparation method thereof Download PDFInfo
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- CN111223663B CN111223663B CN202010025774.5A CN202010025774A CN111223663B CN 111223663 B CN111223663 B CN 111223663B CN 202010025774 A CN202010025774 A CN 202010025774A CN 111223663 B CN111223663 B CN 111223663B
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 28
- 239000002184 metal Substances 0.000 title claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims abstract description 111
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 110
- 239000003990 capacitor Substances 0.000 claims abstract description 94
- 238000007747 plating Methods 0.000 claims abstract description 72
- 238000009713 electroplating Methods 0.000 claims abstract description 67
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 45
- 239000011248 coating agent Substances 0.000 claims abstract description 37
- 238000000576 coating method Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 28
- 238000003466 welding Methods 0.000 claims abstract description 24
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims abstract description 11
- 239000003973 paint Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 14
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 10
- 238000012216 screening Methods 0.000 claims description 10
- 229910007116 SnPb Inorganic materials 0.000 claims description 9
- 230000005496 eutectics Effects 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229910000905 alloy phase Inorganic materials 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 6
- 238000005253 cladding Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a preparation method of a metal support ceramic capacitor, which comprises the following steps: sequentially electroplating a first nickel layer and a first tin-lead plating layer on the terminal electrode of the capacitor; sequentially electroplating a second nickel layer and a second tin-lead plating layer on the electrode sheet base material; forming a pin and a supporting leg; respectively welding first rectangular sheets of the two electrode sheets on two end electrodes of the capacitor; immersing the capacitor and the electrode plate into electroplating liquid to enable the electrode plate to be electroplated with a low-lead tin-lead alloy layer; and (3) coating an anti-flashover insulating paint on the capacitor body, and baking and curing. The invention also provides a metal support ceramic capacitor. The alloy phase formed by the invention has high liquefaction temperature, secondary remelting in the use process is avoided, the welding bonding strength of the capacitor and the circuit board can be improved, and the capacitor body is prevented from falling off in welding or use.
Description
Technical Field
The invention relates to a metal support ceramic capacitor and a preparation method thereof.
Background
In order to support the capacitor from the circuit board, improve the bending resistance of the circuit board of the capacitor, and enable a large amount of heat generated by the capacitor due to power consumption to be quickly conducted out, a metal bracket is generally welded on the capacitor, and when the capacitor is used, the metal bracket is welded on the circuit board, but in the prior art, the capacitor and an electrode plate generally adopt a coating with higher soldering tin quantity, such as a pure tin coating or a SnPb10 coating, so, even if a high-temperature and high-lead solder is used for welding in the welding process, the liquefaction temperature of an alloy phase formed after the solder and the coating are remelted is generally lower than 240 ℃, so that the bracket capacitor is easy to have secondary remelting in the use process to cause the separation of the capacitor and the metal bracket, and in serious cases, the product fails due to lap short circuit of the solder between chips or between adjacent products, on the other hand, the bonding pad of the metal bracket is generally a whole metal plate, the welding bonding strength is not high, and moreover current metal support with the condenser welding in-process, the condenser drops easily, not only influences the condenser normal use, still influences the engineering progress.
Disclosure of Invention
The invention aims to provide a metal support ceramic capacitor and a preparation method thereof aiming at the defects of the prior art, the formed alloy phase has high liquefaction temperature, secondary remelting in the use process is avoided, the welding bonding strength of the capacitor and a circuit board can be improved, and the capacitor body is prevented from falling off in welding or use.
The invention is realized by the following technical scheme:
a preparation method of a metal support ceramic capacitor comprises the following steps:
A. sequentially electroplating a first nickel layer and a first tin-lead plating layer on the terminal electrode of the capacitor, wherein the lead content of the first tin-lead plating layer is not less than 80%, and the thickness of the first tin-lead plating layer is 2-20 mu m;
B. preparing an electrode plate base material by a method of stamping or etching the whole metal strip, and electroplating a second nickel layer and a second tin-lead plating layer on the electrode plate base material in sequence by adopting a rack plating process, wherein the lead content of the second tin-lead plating layer is not less than 80%, and the thickness of the second tin-lead plating layer is 2-20 mu m;
C. b, the electrode plate base material comprises a first rectangular sheet, a second rectangular sheet, a connecting sheet and two strip-shaped sheets, wherein the first rectangular sheet and the second rectangular sheet are arranged at intervals, the connecting sheet is connected between the first rectangular sheet and the second rectangular sheet, the two strip-shaped sheets are respectively arranged at two ends of the second rectangular sheet and extend towards the first rectangular sheet, the second rectangular sheet and the two strip-shaped sheets are respectively bent by 90 degrees to form pins and supporting legs, and a plurality of through holes are formed in the second rectangular sheet at intervals;
D. respectively welding first rectangular sheets of the two electrode sheets on two end electrodes of the capacitor;
E. immersing the capacitor and the electrode plate into electroplating liquid to enable the electrode plate to be electroplated with a low-lead tin-lead alloy layer;
F. and (3) coating an anti-flashover insulating paint on the capacitor body, and baking and curing.
Further, in the step A, the thickness of the first nickel layer is 1-5 μm, the electroplating time of the first nickel layer is 30-150min, the electroplating current of the first nickel layer is 4-14A, the first tin-lead coating is specifically SnPb (80-95), the electroplating time of the first tin-lead coating is 45-150min, and the electroplating current of the first tin-lead coating is 3-10A.
Further, in the step B, the thickness of the electrode plate base material is 0.1-0.5mm, the thickness of the second nickel layer is 1-5 μm, the electroplating time of the second nickel layer is 4-15min, the current for electroplating the second nickel layer is 2-7A, the second tin-lead coating is specifically SnPb (80-95), the electroplating time of the second tin-lead coating is 5-30min, and the current for electroplating the second tin-lead coating is 2-8A.
Furthermore, in the step C, the length of the pin is not less than 0.5mm, and the length of the supporting leg is 0.2-0.5 mm.
Further, the metal support ceramic capacitor comprises a plurality of capacitors connected in parallel, two adjacent capacitor bodies are connected through red glue, baking and curing are carried out, the curing temperature is 130-170 ℃, and the curing time is 8-15 min.
Furthermore, in the step D, a reflow soldering process or a vacuum eutectic furnace soldering process is adopted to solder the first rectangular plate on the terminal electrode of the capacitor.
Further, in the step E, the tin-lead alloy layer is SnPb (5-15), the time for electroplating the tin-lead and gold layers is 8-30min, and the current for electroplating the tin-lead and gold is 3-12A.
Further, in the step F, the baking curing temperature is 130-170 ℃, and the baking curing time is 40-90 min.
Further, the method also comprises the following steps:
G. screening the appearance of the capacitor subjected to the step F by using a body type microscope, and screening out the capacitor which has cracks on the capacitor body, is broken by the pins or the supporting legs on the electrode sheet, has scratches which exceed 30% of the length of the pins on the electrode sheet, and is not electroplated and covered at other parts except the tail ends of the pins;
H. g, testing the capacitance and the loss tangent of the capacitor after the step G by using a capacitance tester; testing the dielectric voltage resistance of the product by using a voltage resistance insulation analyzer; the insulation resistance of the product was tested using a high resistance meter.
The invention is also realized by the following technical scheme:
the utility model provides a metal support ceramic capacitor, includes the capacitor body, set up the both ends head electrode at capacitor body both ends respectively, two electrode slices, set gradually first nickel layer and first tin lead cladding material on the head electrode, set gradually second nickel layer and second tin lead cladding material on the electrode slice, and set up the solder layer between first, second tin lead cladding material, first, second tin lead cladding material lead content all is not less than 80%, solder layer adopts high lead solder.
The invention has the following beneficial effects:
1. the invention sequentially electroplates a first nickel layer and a first tin-lead plating layer on a terminal electrode, and electroplates a second nickel layer and a second tin-lead plating layer on an electrode piece, wherein the lead content of the first tin-lead plating layer and the second tin-lead plating layer is not less than 80 percent, the thickness of the first tin-lead plating layer and the second tin-lead plating layer is 2-20 mu m, thus, in the welding process, the liquefying temperature of the alloy phase formed after the solder is remelted with the first tin-lead plating layer and the second tin-lead plating layer is high (the liquefying temperature is more than 260 ℃), thus avoiding the situation that the end electrode is separated from the electrode plate due to secondary remelting in the using process, the condition that the products are failed due to the lap short circuit of the solder between the capacitor bodies or between the adjacent products can be avoided, the arrangement of the through holes can improve the welding bonding strength of the capacitor and the circuit board, and the support legs can prevent the capacitor body from falling off during welding or use, so that the capacitor is more convenient and safer in the use process.
2. According to the invention, the electrode plate base material is manufactured by a stamping or etching method, and the pins and the supporting legs are formed by bending, so that the electrode plate base material has more attractive appearance and simpler process.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a metal-support ceramic capacitor according to a first embodiment of the present invention.
Fig. 2 is a schematic cross-sectional structural view of a metal-support ceramic capacitor according to a first embodiment of the present invention.
Fig. 3 is a schematic structural diagram of an electrode sheet base material according to a first embodiment of the present invention.
Wherein, 1, capacitor body; 2. a tip electrode; 21. a first nickel layer; 22. a first tin-lead plating layer; 3. an electrode sheet; 32. a second tin-lead plating layer; 33. a first rectangular sheet; 34. a second rectangular sheet; 35. connecting sheets; 36. strip-shaped pieces; 37. a pin; 38. supporting legs; 39. a through hole; 4. a solder layer; 5. red glue; 6. insulating paint; 7. a ceramic dielectric.
Detailed Description
The first embodiment is as follows:
as shown in fig. 1 to 3, the metal mount capacitor includes two horizontally stacked and parallel ceramic capacitors and two electrode plates 3 (in other embodiments, two or more ceramic capacitors may also be vertically stacked and parallel connected), the ceramic capacitor includes a capacitor body 1 and two terminal electrodes 2 respectively disposed at two ends of the capacitor body 1, a ceramic medium 7 is disposed inside the capacitor body 1, and the two ceramic capacitors are connected together by a red glue 5. Electrode slice 3 is made by electrode slice 3 substrate, and electrode slice 3 substrate includes first rectangle piece 33, second rectangle piece 34 of interval arrangement, connect the connection piece 35 between first rectangle piece 33, second rectangle piece 34 and set up respectively at second rectangle piece 34 both ends and to two bar pieces 36 of first rectangle piece 33 extension, bend 90 respectively with second rectangle piece 34 and two bar pieces 36 and form pin 37 and supporting legs 38, set up a plurality of through-hole 39 at the interval on second rectangle piece 34, form electrode slice 3 promptly. First nickel layer 21 and first tin-lead plating layer 22 have set gradually on end electrode 2, second nickel layer and second tin-lead plating layer 32 have set gradually on electrode slice 3, be provided with solder layer 4 between first tin-lead plating layer 22 and second tin-lead plating layer 32, first tin-lead plating layer 22 and second tin-lead plating layer 32 contain plumbous volume and are all not less than 80%, solder layer 4 adopts high lead solder, still scribble the insulating varnish 6 of preventing the flashover on the capacitor body 1, electrode slice 3 outmost has the tin-lead alloy layer of low plumbous.
The preparation method of the metal bracket capacitor comprises the following steps:
A. sequentially electroplating a first nickel layer 21 and a first tin-lead plating layer 22 on the capacitor terminal electrode 2, wherein the lead content of the first tin-lead plating layer 22 is not less than 80%, and the thickness of the first tin-lead plating layer 22 is 2 mu m; wherein the thickness of the first nickel layer 21 is 1 μm, the electroplating time of the first nickel layer 21 is 45min, the current for electroplating the first nickel layer 21 is 4A, the first tin-lead plating layer 22 is specifically SnPb (80-95), the electroplating time of the first tin-lead plating layer 22 is 45min, and the current for electroplating the first tin-lead plating layer 22 is 3A;
B. the electrode plate 3 base material is manufactured by a method of stamping or etching the whole metal strip, and a second nickel layer and a second tin-lead plating layer 32 are sequentially electroplated on the electrode plate 3 base material by adopting a rack plating process, wherein the lead content of the second tin-lead plating layer 32 is not less than 80 percent, and the thickness of the second tin-lead plating layer 32 is 2 mu m; wherein the thickness of the base material of the electrode plate 3 is 0.1mm, the thickness of the second nickel layer is 1 μm, the electroplating time of the second nickel layer is 4min, the current for electroplating the second nickel layer is 2A, the second tin-lead plating layer 32 is specifically SnPb (80-95), the electroplating time of the second tin-lead plating layer 32 is 5min, and the current for electroplating the second tin-lead plating layer 32 is 2A;
C. the electrode plate 3 base material in the step B comprises a first rectangular sheet 33, a second rectangular sheet 34, a connecting sheet 35 and two strip-shaped sheets 36, wherein the first rectangular sheet 33 and the second rectangular sheet 34 are arranged at intervals, the connecting sheet 35 is connected between the first rectangular sheet 33 and the second rectangular sheet 34, the two strip-shaped sheets 36 are respectively arranged at two ends of the second rectangular sheet 34 and extend towards the first rectangular sheet 33, the second rectangular sheet 34 and the two strip-shaped sheets 36 are respectively bent by 90 degrees to form a pin 37 and a supporting leg 38, and a plurality of through holes 39 are arranged on the second rectangular sheet 34 at intervals; wherein, the length of the pin 37 is 0.5mm, and the length of the supporting leg 38 is 0.2 mm;
D. connecting two adjacent capacitor bodies 1 through red glue 5, and baking and curing at the curing temperature of 130 ℃ for 15 min;
E. respectively welding the first rectangular sheets 33 of the two electrode sheets 3 on the two end electrodes 2 of the capacitor by adopting a reflow soldering process or a vacuum eutectic furnace process; wherein the reflow soldering temperature is 340 ℃, and the tape moving speed of reflow soldering is 45 cm/min; the welding temperature of the vacuum eutectic furnace is 320 ℃, and the whole welding time is 7 min;
F. immersing the capacitor and the electrode plate 3 into electroplating liquid to electroplate a low-lead tin-lead alloy layer on the electrode plate 3; the tin-lead and gold layers are specifically SnPb5, the time for electroplating the tin-lead and gold layers is 8min, and the current for electroplating the tin-lead and gold layers is 3A;
G. coating an anti-flashover insulating paint 6 on the capacitor body 1, and baking and curing; wherein the baking curing temperature is 130 ℃, and the baking curing time is 90 min;
H. screening the appearance of the capacitor subjected to the step G by using a body type microscope, and screening out the capacitor which is cracked on the capacitor body 1, has broken pins 37 or supporting legs 38 on the electrode plate 3, has scratches which exceed the length of the pins 37 by 30 percent on the electrode plate 3 and is not electroplated and covered at other parts except the tail ends of the pins 37;
I. testing the capacitance and the loss tangent of the capacitor obtained in the step H by using a capacitance tester; testing the dielectric voltage resistance of the product by using a voltage resistance insulation analyzer; the insulation resistance of the product was tested using a high resistance meter.
Example two:
the metal support capacitor comprises two ceramic capacitors and two electrode plates, wherein the ceramic capacitors are horizontally stacked and connected in parallel, the ceramic capacitors comprise capacitor bodies and two end electrodes respectively arranged at two ends of the capacitor bodies, and the two ceramic capacitors are connected together through red glue. The electrode slice is made by the electrode slice substrate, and the electrode slice substrate includes first rectangle piece, second rectangle piece of interval arrangement, connects the connection piece between first rectangle piece, second rectangle piece and sets up respectively at second rectangle piece both ends and to the two bar pieces that first rectangle piece extends, bends 90 formation pins and supporting legs respectively with second rectangle piece and two bar pieces, sets up a plurality of through-hole at the interval on the second rectangle piece, forms the electrode slice promptly. The end electrode is sequentially provided with a first nickel layer and a first tin-lead coating, the electrode piece is sequentially provided with a second nickel layer and a second tin-lead coating, a solder layer is arranged between the first tin-lead coating and the second tin-lead coating, the lead content of the first tin-lead coating and the lead content of the second tin-lead coating are not less than 80%, the solder layer adopts high-lead solder, the capacitor body is also coated with insulating paint for preventing flashover, and the outermost layer of the electrode piece is provided with a low-lead tin-lead alloy layer.
The preparation method of the metal bracket capacitor comprises the following steps:
A. sequentially electroplating a first nickel layer and a first tin-lead plating layer on the terminal electrode of the capacitor, wherein the lead content of the first tin-lead plating layer is not less than 80%, and the thickness of the first tin-lead plating layer is 20 mu m; wherein the thickness of the first nickel layer is 5 μm, the electroplating time of the first nickel layer is 150min, the current for electroplating the first nickel layer is 14A, the first tin-lead plating layer is specifically SnPb95, the electroplating time of the first tin-lead plating layer is 150min, and the current for electroplating the first tin-lead plating layer is 10A;
B. preparing an electrode plate base material by a method of stamping or etching the whole metal strip, and electroplating a second nickel layer and a second tin-lead plating layer on the electrode plate base material in sequence by adopting a rack plating process, wherein the lead content of the second tin-lead plating layer is not less than 80%, and the thickness of the second tin-lead plating layer is 20 mu m; the thickness of the electrode plate base material is 0.5mm, the thickness of the second nickel layer is 5 microns, the electroplating time of the second nickel layer is 15min, the current for electroplating the second nickel layer is 7A, the second tin-lead coating is specifically SnPb95, the electroplating time of the second tin-lead coating is 30min, and the current for electroplating the second tin-lead coating is 8A;
C. the electrode plate base material in the step B comprises a first rectangular sheet, a second rectangular sheet, a connecting sheet connected between the first rectangular sheet and the second rectangular sheet and two strip-shaped sheets which are respectively arranged at two ends of the second rectangular sheet and extend towards the first rectangular sheet, the second rectangular sheet and the two strip-shaped sheets are respectively bent for 90 degrees to form a pin and a supporting leg, and a plurality of through holes are formed in the second rectangular sheet at intervals; wherein, the length of the pin is 0.7mm, and the length of the supporting leg is 0.5 mm;
D. connecting two adjacent capacitor bodies through red glue, and baking and curing at 170 ℃ for 8 min;
E. respectively welding the first rectangular sheets of the two electrode sheets on the electrodes at the two ends of the capacitor by adopting a reflow soldering process or a vacuum eutectic furnace process; wherein the reflow soldering temperature is 360 ℃, and the tape moving speed of reflow soldering is 80 cm/min; the welding temperature of the vacuum eutectic furnace is 350 ℃, and the whole welding time is 15 min;
F. immersing the capacitor and the electrode plate into electroplating liquid to enable the electrode plate to be electroplated with a low-lead tin-lead alloy layer; the tin-lead and gold layers are SnPb15, the tin-lead and gold layer electroplating time is 30min, and the tin-lead and gold electroplating current is 12A;
G. coating insulating paint for preventing arcing on the capacitor body, and baking and curing; wherein the baking curing temperature is 155 ℃, and the baking curing time is 65 min;
H. screening the appearance of the capacitor subjected to the step F by using a body type microscope, and screening out the capacitor which has cracks on the capacitor body, is broken by the pins or the supporting legs on the electrode sheet, has scratches which exceed 30% of the length of the pins on the electrode sheet, and is not electroplated and covered at other parts except the tail ends of the pins;
I. g, testing the capacitance and the loss tangent of the capacitor after the step G by using a capacitance tester; testing the dielectric voltage resistance of the product by using a voltage resistance insulation analyzer; the insulation resistance of the product was tested using a high resistance meter.
Example three:
the metal support capacitor comprises two ceramic capacitors and two electrode plates, wherein the ceramic capacitors are horizontally stacked and connected in parallel, the ceramic capacitors comprise capacitor bodies and two end electrodes respectively arranged at two ends of the capacitor bodies, and the two ceramic capacitors are connected together through red glue. The electrode slice is made by the electrode slice substrate, and the electrode slice substrate includes first rectangle piece, second rectangle piece of interval arrangement, connects the connection piece between first rectangle piece, second rectangle piece and sets up respectively at second rectangle piece both ends and to the two bar pieces that first rectangle piece extends, bends 90 formation pins and supporting legs respectively with second rectangle piece and two bar pieces, sets up a plurality of through-hole at the interval on the second rectangle piece, forms the electrode slice promptly. The end electrode is sequentially provided with a first nickel layer and a first tin-lead coating, the electrode piece is sequentially provided with a second nickel layer and a second tin-lead coating, a solder layer is arranged between the first tin-lead coating and the second tin-lead coating, the lead content of the first tin-lead coating and the lead content of the second tin-lead coating are not less than 80%, the solder layer adopts high-lead solder, the capacitor body is also coated with insulating paint for preventing flashover, and the outermost layer of the electrode piece is provided with a low-lead tin-lead alloy layer.
The preparation method of the metal bracket capacitor comprises the following steps:
A. sequentially electroplating a first nickel layer and a first tin-lead plating layer on the terminal electrode of the capacitor, wherein the lead content of the first tin-lead plating layer is not less than 80%, and the thickness of the first tin-lead plating layer is 10 mu m; wherein the thickness of the first nickel layer is 3 μm, the electroplating time of the first nickel layer is 100min, the current for electroplating the first nickel layer is 11A, the first tin-lead plating layer is specifically SnPb85, the electroplating time of the first tin-lead plating layer is 100min, and the current for electroplating the first tin-lead plating layer is 6A;
B. preparing an electrode plate base material by a method of stamping or etching the whole metal strip, and electroplating a second nickel layer and a second tin-lead plating layer on the electrode plate base material in sequence by adopting a rack plating process, wherein the lead content of the second tin-lead plating layer is not less than 80%, and the thickness of the second tin-lead plating layer is 10 mu m; the thickness of the electrode plate base material is 0.3mm, the thickness of the second nickel layer is 3 microns, the electroplating time of the second nickel layer is 7min, the current for electroplating the second nickel layer is 3A, the second tin-lead coating is specifically SnPb85, the electroplating time of the second tin-lead coating is 17min, and the current for electroplating the second tin-lead coating is 5A;
C. the electrode plate base material in the step B comprises a first rectangular sheet, a second rectangular sheet, a connecting sheet connected between the first rectangular sheet and the second rectangular sheet and two strip-shaped sheets which are respectively arranged at two ends of the second rectangular sheet and extend towards the first rectangular sheet, the second rectangular sheet and the two strip-shaped sheets are respectively bent for 90 degrees to form a pin and a supporting leg, and a plurality of through holes are formed in the second rectangular sheet at intervals; wherein, the length of the pin is 0.6mm, and the length of the supporting leg is 0.3 mm;
D. connecting two adjacent capacitor bodies through red glue, and baking and curing at 150 ℃ for 11 min;
E. respectively welding the first rectangular sheets of the two electrode sheets on the electrodes at the two ends of the capacitor by adopting a reflow soldering process or a vacuum eutectic furnace process; wherein the reflow soldering temperature is 350 ℃, and the tape moving speed of reflow soldering is 63 cm/min; the welding temperature of the vacuum eutectic furnace is 335 ℃, and the whole welding time is 11 min;
F. immersing the capacitor and the electrode plate into electroplating liquid to enable the electrode plate to be electroplated with a low-lead tin-lead alloy layer; the tin-lead and gold layers are SnPb10, the tin-lead and gold layer electroplating time is 20min, and the tin-lead and gold electroplating current is 8A;
G. coating insulating paint for preventing arcing on the capacitor body, and baking and curing; wherein the baking curing temperature is 150 ℃, and the baking curing time is 60 min;
H. screening the appearance of the capacitor subjected to the step F by using a body type microscope, and screening out the capacitor which has cracks on the capacitor body, is broken by the pins or the supporting legs on the electrode sheet, has scratches which exceed 30% of the length of the pins on the electrode sheet, and is not electroplated and covered at other parts except the tail ends of the pins;
I. g, testing the capacitance and the loss tangent of the capacitor after the step G by using a capacitance tester; testing the dielectric voltage resistance of the product by using a voltage resistance insulation analyzer; the insulation resistance of the product was tested using a high resistance meter.
Example four:
the present embodiment differs from the first to third embodiments in that: in the present embodiment, there is only one ceramic capacitor, so the step of connecting the two capacitor bodies by red glue is omitted.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents and modifications within the scope of the description.
Claims (8)
1. A preparation method of a metal support ceramic capacitor comprises a capacitor and two electrode plates, wherein the capacitor comprises a body and end electrodes arranged at two ends of the body, and is characterized in that: the method comprises the following steps:
A. sequentially electroplating a first nickel layer and a first tin-lead plating layer on the end electrode of the capacitor, wherein the thickness of the first tin-lead plating layer is 2-20 mu m;
B. preparing an electrode plate base material by a method of stamping or etching the whole metal strip, and electroplating a second nickel layer and a second tin-lead plating layer on the electrode plate base material in sequence by adopting a rack plating process, wherein the thickness of the second tin-lead plating layer is 2-20 mu m;
C. b, the electrode plate base material comprises a first rectangular sheet, a second rectangular sheet, a connecting sheet and two strip-shaped sheets, wherein the first rectangular sheet and the second rectangular sheet are arranged at intervals, the connecting sheet is connected between the first rectangular sheet and the second rectangular sheet, the two strip-shaped sheets are respectively arranged at two ends of the second rectangular sheet and extend towards the first rectangular sheet, the second rectangular sheet and the two strip-shaped sheets are respectively bent by 90 degrees to form pins and supporting legs, and a plurality of through holes are formed in the second rectangular sheet at intervals;
D. respectively welding first rectangular sheets of the two electrode sheets on two end electrodes of the capacitor;
E. immersing the capacitor and the electrode plate into electroplating liquid to enable the electrode plate to be electroplated with a low-lead tin-lead alloy layer;
F. coating insulating paint for preventing arcing on the capacitor body, and baking and curing;
in the step A, the thickness of the first nickel layer is 1-5 mu m, the electroplating time of the first nickel layer is 30-150min, the current for electroplating the first nickel layer is 4-14A, the first tin-lead plating layer is specifically SnPb (80-95), the electroplating time of the first tin-lead plating layer is 45-150min, and the current for electroplating the first tin-lead plating layer is 3-10A;
in the step B, the thickness of the electrode slice base material is 0.1-0.5mm, the thickness of the second nickel layer is 1-5 μm, the electroplating time of the second nickel layer is 4-15min, the current for electroplating the second nickel layer is 2-7A, the second tin-lead coating is specifically SnPb (80-95), the electroplating time of the second tin-lead coating is 5-30min, and the current for electroplating the second tin-lead coating is 2-8A.
2. The method of claim 1, wherein the method comprises the steps of: in the step C, the length of the pin is not less than 0.5mm, and the length of the supporting leg is 0.2-0.5 mm.
3. The method of claim 1, wherein the method comprises the steps of: the metal support ceramic capacitor comprises a plurality of capacitors connected in parallel, two adjacent capacitor bodies are connected through red glue, baking and curing are carried out, the curing temperature is 130-170 ℃, and the curing time is 8-15 min.
4. The method of claim 1, wherein the method comprises the steps of: and D, welding the first rectangular sheet on the end electrode of the capacitor by adopting a reflow soldering process or a vacuum eutectic furnace soldering process.
5. The method of claim 1, wherein the method comprises the steps of: in the step E, the tin-lead alloy layer is SnPb (5-15), the time for electroplating the tin-lead and gold layers is 8-30min, and the current for electroplating the tin-lead and gold is 3-12A.
6. The method of claim 1, wherein the method comprises the steps of: in the step F, the baking curing temperature is 130-170 ℃, and the baking curing time is 40-90 min.
7. The method of claim 1, wherein the method comprises the steps of: further comprising the steps of:
G. screening the appearance of the capacitor subjected to the step F by using a body type microscope, and screening out the capacitor which has cracks on the capacitor body, is broken by the pins or the supporting legs on the electrode sheet, has scratches which exceed 30% of the length of the pins on the electrode sheet, and is not electroplated and covered at other parts except the tail ends of the pins;
H. g, testing the capacitance and the loss tangent of the capacitor after the step G by using a capacitance tester; testing the dielectric voltage resistance of the product by using a voltage resistance insulation analyzer; the insulation resistance of the product was tested using a high resistance meter.
8. The metal-supported ceramic capacitor of the method for manufacturing a metal-supported ceramic capacitor according to claim 1, wherein: the capacitor comprises a capacitor body, two end electrodes arranged at two ends of the capacitor body respectively, two electrode plates, a first nickel layer and a first tin-lead plating layer which are sequentially arranged on the end electrodes, a second nickel layer and a second tin-lead plating layer which are sequentially arranged on the electrode plates, and a solder layer arranged between the first tin-lead plating layer and the second tin-lead plating layer, wherein the first tin-lead plating layer and the second tin-lead plating layer are both SnPb (80-95), and the solder layer adopts high-lead solder.
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