CN111162021B - Test probe apparatus for testing semiconductor dies and related systems and methods - Google Patents
Test probe apparatus for testing semiconductor dies and related systems and methods Download PDFInfo
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- CN111162021B CN111162021B CN202010003742.5A CN202010003742A CN111162021B CN 111162021 B CN111162021 B CN 111162021B CN 202010003742 A CN202010003742 A CN 202010003742A CN 111162021 B CN111162021 B CN 111162021B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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Abstract
The invention provides a test probe device for testing a semiconductor bare chip, which comprises a device supporting base, supporting legs, a main supporting rod, a CCD detection camera, side supporting rods, a probe clamping seat structure, an air guide connecting pipe, a connecting data line, an adjustable computer supporting seat structure, an integrated control computer, an adjusting seat, an adjusting screw rod, a semiconductor bare chip supporting seat structure, a test probe and an adjusting hole. The invention tests the detail in and out of the semiconductor bare chip under the action of the CCD detection camera, the signal memory, the analog-to-digital converter, the photodiode and the sensor, and displays the test result on the integrated control computer, thereby increasing the convenience of observation; meanwhile, the fixing of the probe and the semiconductor bare chip is convenient; the method has the advantages of simple operation, obvious intelligent test function, capability of generating a relation graph of the output voltage of the CCD device and the input exposure and displaying the relation graph by a PC display, capability of obtaining related main photoelectric parameter test results, convenience in adjustment and high efficiency.
Description
Technical Field
The present invention relates to the field of semiconductor die test equipment, and more particularly to a test probe apparatus for testing semiconductor dies and related systems and methods.
Background
Semiconductor dies are conventionally fabricated in large area wafers such that hundreds or thousands of identical individual dies are fabricated simultaneously. Such a die may include diodes, transistors, metal oxide semiconductor field effect transistors, insulated gate bipolar transistors, and the like. After formation, the dies of the wafer may be tested for certain characteristics via test equipment (commonly referred to as "wafer probe" or "probe" testing). Typical die testing includes optical testing or electrical testing by contacting the die with probe needles. A die that fails probe testing for any reason is typically marked for removal.
When electrical testing is performed, the die in the wafer that passes the probe test are often damaged, especially the bond pads contacted by the probe pins and the die on the Under Bump Metallization (UBM). Furthermore, oftentimes, dies with only minor skin damage are marked for removal via optical testing. During wafer probing, due to test limitations and the inaccuracies discussed above, some dies are probed through the wafer and are considered "good dies" when the dies are actually defective. Conversely, when the die is actually a "good die," some die fail the wafer probe test and are considered bad die.
Further, chinese patent publication No. CN110031744A entitled test probe system for testing dies of a wafer includes: a first probe interface positioned on a first side of at least one die of the wafer including a 3DI structure, the first probe interface comprising: a voltage source; and at least one first inductor operably coupled to the voltage source. The system further includes a carrier for supporting the wafer on a side of the carrier opposite the first probe interface; and a second probe interface on an opposite side of the carrier from the first probe interface: a voltage sensor; and at least one second inductor operably coupled to the voltage sensor. The voltage source of the first probe interface is configured to inductively induce a voltage within at least one 3DI structure of the die via the at least one first inductor, and wherein the voltage sensor of the carrier is configured to detect a voltage within the at least one 3DI structure via the at least one second inductor. However, the conventional semiconductor die test probe apparatus has the problems that the semiconductor die cannot be displayed in detail, the operation control is inconvenient, and the test efficiency is low.
In view of the foregoing, it is desirable to provide a test probe apparatus for testing semiconductor dies and related systems and methods.
Disclosure of Invention
In order to solve the above technical problems, the present invention provides a probe apparatus for testing a semiconductor die, and a related system and method thereof, so as to solve the problems that the conventional probe apparatus for testing a semiconductor die cannot display the semiconductor die in detail, the operation control is inconvenient, and the testing efficiency is low.
A test probe device for testing a semiconductor bare chip comprises a device supporting base, supporting legs, a main supporting rod, a CCD detection camera, side supporting rods, a probe clamping seat structure, an air guide connecting pipe, a connecting data line, an adjustable computer supporting seat structure, an integrated control computer, an adjusting seat, an adjusting screw rod, a semiconductor bare chip supporting seat structure, a test probe and an adjusting hole, wherein the supporting legs are connected to the four corners of the lower surface of the device supporting base through bolts; the main support rod is in threaded connection with the middle position of the rear part of the upper surface of the equipment support base; the CCD detection camera is connected to the upper end of the main support rod through a bolt; the side supporting rods are respectively in threaded connection with the middle positions of the left side and the right side of the upper surface of the equipment supporting base; the structure screw of the probe clamping seat is connected to the upper end of the side supporting rod; the air guide connecting pipe is embedded outside the probe clamping seat structure; one end of the connecting data wire is inserted at the output end of the CCD detection camera, and the other end of the connecting data wire is inserted at the input end of the integrated control computer; the adjustable computer supporting seat structure is in threaded connection with the right upper side of the upper surface of the equipment supporting base; the integrated control computer is arranged at the front part of the adjustable computer supporting seat structure; the adjusting seat is connected to the middle position of the front side of the upper part of the equipment supporting base through a bolt; the adjusting screw is in threaded connection with the right upper side of the inside of the adjusting seat; the semiconductor bare chip supporting seat structure is arranged at the upper part of the adjusting seat and meshed with the adjusting screw rod; the test probe is clamped at the upper end of the probe clamping seat structure; the adjusting hole is formed in the equipment supporting base.
Preferably, the probe clamping seat structure comprises a supporting seat plate, an air cylinder regulating valve, an air guide pipe, a sealing valve, a fixing ring and a locking screw, wherein the air cylinder regulating valve is in threaded connection with the middle position of the upper part of the supporting seat plate; the air guide pipe is embedded in the middle position of the right side of the air cylinder regulating valve; the sealing valve is sleeved at the right end of the air duct; the fixing ring is connected to the right side of the sealing valve through a screw; the locking screw is in threaded connection with the middle position of the right side of the fixing ring.
Preferably, the adjustable computer supporting seat structure comprises a supporting column, a connecting screw rod, a U-shaped seat, a transverse suspender and a connecting plate, wherein the connecting screw rod is integrally arranged in the middle of the lower part of the supporting column; the U-shaped seat is connected to the upper end of the supporting column through a bolt; one end of the transverse suspender is connected to the right side of the inside of the U-shaped seat in a shaft mode, and the other end of the transverse suspender is connected to the middle of the rear portion of the connecting plate in a screw mode.
Preferably, the semiconductor bare chip supporting seat structure comprises a supporting bracket, an outer groove, an inner placing groove and an object taking groove, wherein the outer groove is formed in the inner outer side position of the supporting bracket; the inner placing groove is arranged in the middle of the upper part of the supporting bracket; the fetching groove is arranged at the right side position of the upper part of the supporting bracket.
Preferably, the top end of the locking screw is glued with an arc-shaped silica gel pad; the test probe is inserted into the fixing ring and is clamped and fixed by a locking screw.
Preferably, the air guide connecting pipe is embedded at the left side of the air cylinder adjusting valve and is communicated with the air guide pipe and the sealing valve.
Preferably, the connecting plate is a rectangular stainless steel plate; the inner wall of the connecting plate is provided with a circular through hole; the integrated control computer is arranged on the front surface of the connecting plate.
A related system for testing a semiconductor bare chip comprises a workbench, an equipment supporting base, a CCD detection camera, a self-balancing adjusting module and an integrated control computer, wherein the equipment supporting base is placed at the upper part of the workbench; the CCD detection camera, the self-balancing adjusting module and the integrated control computer are electrically connected with each other and are arranged on the upper part of the equipment supporting base.
Preferably, the CCD detection camera includes a signal memory, an analog-to-digital converter, a photodiode and a sensor, and the signal memory, the analog-to-digital converter, the photodiode and the sensor are electrically connected to each other.
Preferably, the integrated control computer further comprises an external control output module, an image processing module and a display screen, wherein the external control output module and the image processing module are respectively and electrically connected with the display screen.
Preferably, the signal memory, the analog-to-digital converter, the photodiode and the sensor are respectively and electrically connected with the image processing module.
An operating method for a test probe device for testing semiconductor dies, comprising in particular the steps of:
the method comprises the following steps: clamping and fixing the test probe;
step two: fixing the semiconductor bare chip;
step three: marking of the first landing pad;
step four: implementation of an interconnect;
step five: starting a CCD detection camera for testing;
step six: outputting test data;
step seven: the marking of the semiconductor die is replaced.
Preferably, in the first step, the probe for testing is inserted into the fixing ring, the locking screw is tightened for fixing, and the air duct is rotated so as to adjust the probe to a proper angle.
Preferably, in the second step, the semiconductor die is placed in the internal placement groove.
Preferably, in step three, marking is performed on the scribe line of the semiconductor die with a first landing pad.
Preferably, in step four, a first interconnect is implemented on the scribe line and between the landing pad and the cluster of dies on the wafer.
Preferably, in the fifth step, the CCD detection camera and the integrated control computer are started; testing a cluster of dies using automated test equipment implements one or more die-to-die links on a scribe line by contacting landing pads to probe tips and applying automated test equipment resources to the cluster of dies through the probe tips.
Preferably, in the sixth step, the data displayed on the integrated control computer is output, and may be output in a Word or Excel format.
Preferably, in step seven, the taking tool penetrates through the fetching groove, so that the convenience of replacing the semiconductor die is increased.
Compared with the prior art, the invention has the beneficial effects that: the in-out test is carried out on the semiconductor bare chip in detail under the action of the CCD detection camera, the signal memory, the analog-to-digital converter, the photodiode and the sensor, and the in-out test is displayed on the integrated control computer, so that the convenience of observation is improved; meanwhile, when the probe and the semiconductor bare chip are fixed, the fixing ring, the locking screw, the supporting bracket, the outer side groove, the adjusting seat and the adjusting screw are controlled to increase the convenience of adjustment; the method has the advantages of simple operation, obvious intelligent test function, capability of generating a relation graph of the output voltage of the CCD device and the input exposure and displaying the relation graph by a PC display, capability of obtaining related main photoelectric parameter test results, convenience in adjustment and high efficiency.
Drawings
FIG. 1 is a front schematic view of the semiconductor die test probe apparatus of the present invention;
FIG. 2 is a schematic diagram of a side view of the semiconductor die test probe apparatus of the present invention;
FIG. 3 is a schematic top view of the apparatus support base of the present invention;
FIG. 4 is a schematic structural diagram of a probe holder structure according to the present invention;
FIG. 5 is a schematic view of an adjustable computer support structure according to the present invention;
FIG. 6 is a schematic structural diagram of a semiconductor die support pedestal structure according to the present invention;
FIG. 7 is a schematic diagram of a related system for testing semiconductor die test probe apparatus of the present invention;
FIG. 8 is a schematic diagram of the construction of the CCD detection camera system of the present invention;
FIG. 9 is a schematic diagram of an integrated control computer system according to the present invention;
FIG. 10 is a flow chart of a method of use of the present invention;
in the figure:
1. an equipment support base; 2. a support leg bar; 3. a main support bar; 4. a CCD detection camera; 5. a side support bar; 6. a probe holder structure; 61. a support base plate; 62. a cylinder regulating valve; 63. an air duct; 64. a sealing valve; 65. a fixing ring; 66. locking the screw; 7. an air guide connecting pipe; 8. connecting a data line; 9. the structure of the computer supporting seat can be adjusted; 91. a support pillar; 92. connecting a screw rod; 93. a U-shaped seat; 94. a transverse boom; 95. a connecting plate; 10. an integrated control computer; 11. an adjusting seat; 12. adjusting the screw rod; 13. a semiconductor die support pedestal structure; 131. a support bracket; 132. an outer groove; 133. an internal placement groove; 134. fetching grooves; 14. testing the probe; 15. and adjusting the hole.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in fig. 1 to 2, the present invention provides a test probe apparatus for testing a semiconductor bare chip, which includes an apparatus supporting base 1, supporting legs 2, a main supporting leg 3, a CCD detection camera 4, a side supporting leg 5, a probe clamping base structure 6, an air guide connecting tube 7, a connecting data line 8, an adjustable computer supporting base structure 9, an integrated control computer 10, an adjusting base 11, an adjusting screw 12, a semiconductor bare chip supporting base structure 13, a test probe 14 and an adjusting hole 15, wherein the supporting legs 2 are partially screwed at four corners of the lower surface of the apparatus supporting base 1; the main support rod 3 is in threaded connection with the middle position of the rear part of the upper surface of the equipment support base 1; the CCD detection camera 4 is connected to the upper end of the main support rod 3 through a bolt; the side supporting rods 5 are respectively in threaded connection with the middle positions of the left side and the right side of the upper surface of the equipment supporting base 1; the probe clamping seat structure 6 is connected to the upper end of the side supporting rod 5 through a screw; the air guide connecting pipe 7 is embedded outside the probe clamping seat structure 6; one end of the connecting data wire 8 is inserted at the output end of the CCD detection camera 4, and the other end is inserted at the input end of the integrated control computer 10; the adjustable computer supporting seat structure 9 is in threaded connection with the right upper side of the upper surface of the equipment supporting base 1; the integrated control computer 10 is arranged at the front part of the adjustable computer supporting seat structure 9; the adjusting seat 11 is connected with the middle position of the front side of the upper part of the equipment supporting base 1 through a bolt; the adjusting screw 12 is in threaded connection with the right upper side of the inside of the adjusting seat 11; the semiconductor bare chip supporting seat structure 13 is arranged at the upper part of the adjusting seat 11 and is meshed with the adjusting screw 12; the test probe 14 is clamped at the upper end of the probe clamping seat structure 6; the adjusting hole 15 is arranged in the equipment supporting base 1.
In this embodiment, specifically, the probe holder structure 6 includes a support holder plate 61, an air cylinder adjusting valve 62, an air duct 63, a sealing valve 64, a fixing ring 65 and a locking screw 66, wherein the air cylinder adjusting valve 62 is screwed in the middle of the upper portion of the support holder plate 61; the air duct 63 is embedded in the middle position of the right side of the air cylinder regulating valve 62; the sealing valve 64 is sleeved at the right end of the air duct 63; the fixing ring 65 is screwed on the right side of the sealing valve 64; the locking screw 66 is in threaded connection with the middle position of the right side of the fixing ring 65.
In this embodiment, specifically, the adjustable computer supporting seat structure 9 includes a supporting pillar 91, a connecting screw 92, a U-shaped seat 93, a horizontal suspension rod 94 and a connecting plate 95, wherein the connecting screw 92 is integrally disposed at the middle position of the lower portion of the supporting pillar 91; the U-shaped seat 93 is connected to the upper end of the supporting column 91 through a bolt; one end of the transverse suspender 94 is coupled to the right side of the inside of the U-shaped seat 93, and the other end is screwed to the middle position of the rear part of the connecting plate 95.
In this embodiment, specifically, the semiconductor die supporting base structure 13 includes a supporting bracket 131, an outer groove 132, an inner placing groove 133 and an fetching groove 134, wherein the outer groove 132 is opened at an inner outer position of the supporting bracket 131; the inner placing groove 133 is arranged at the middle position of the upper part of the supporting bracket 131; the fetching groove 134 is opened at the upper right position of the supporting bracket 131.
In this embodiment, specifically, an arc-shaped silica gel pad is glued to the top end of the locking screw 66; the test probe 14 is inserted into the fixing ring 65 and clamped and fixed by the locking screw 66.
In this embodiment, specifically, the air guide connecting pipe 7 is embedded at the left side of the cylinder adjusting valve 62 and is communicated with the air guide pipe 63 and the sealing valve 64.
In this embodiment, specifically, the connecting plate 95 is a rectangular stainless steel plate; the inner wall of the connecting plate 95 is provided with a circular through hole; the integrated control computer 10 is mounted on the front surface of the connection plate 95.
A related system for testing a semiconductor bare chip comprises a workbench, an equipment supporting base, a CCD detection camera, a self-balancing adjusting module and an integrated control computer, wherein the equipment supporting base is placed at the upper part of the workbench; the CCD detection camera, the self-balancing adjusting module and the integrated control computer are electrically connected with each other and are arranged on the upper part of the equipment supporting base.
In this embodiment, the CCD detection camera includes a signal memory, an analog-to-digital converter, a photodiode, and a sensor, where the signal memory, the analog-to-digital converter, the photodiode, and the sensor are electrically connected to each other.
In this embodiment, specifically, the integrated control computer further includes an external control output module, an image processing module and a display screen, and the external control output module and the image processing module are respectively and electrically connected to the display screen.
In this embodiment, specifically, the signal memory, the analog-to-digital converter, the photodiode and the sensor are electrically connected to the image processing module respectively.
An operating method for a test probe device for testing semiconductor dies, comprising in particular the steps of:
the method comprises the following steps: clamping and fixing the test probe;
step two: fixing the semiconductor bare chip;
step three: marking of the first landing pad;
step four: implementation of an interconnect;
step five: starting a CCD detection camera for testing;
step six: outputting test data;
step seven: the marking of the semiconductor die is replaced.
In this embodiment, specifically, in step one, the probe for testing is inserted into the fixing ring 65, and the locking screw 66 is tightened to fix the probe, so as to rotate the air duct 63 to adjust the probe to a proper angle.
In this embodiment, specifically, in the second step, the semiconductor die is placed in the internal placement groove 133.
In this embodiment, in particular, in step three, a first landing pad is implemented for marking on the scribe line of the semiconductor die.
In this embodiment, in particular, in step four, a first interconnect is implemented on the scribe line and between the landing pad and the cluster of dies on the wafer.
In this embodiment, specifically, in the fifth step, the CCD detection camera and the integrated control computer are started; testing a cluster of dies using automated test equipment implements one or more die-to-die links on a scribe line by contacting landing pads to probe tips and applying automated test equipment resources to the cluster of dies through the probe tips.
In this embodiment, specifically, in the sixth step, the data displayed on the integrated control computer is output, and may be output in a Word or Excel format.
In this embodiment, specifically, in step seven, the fetching tool penetrates through the fetching groove 134, so as to increase the convenience of replacing the semiconductor die.
The invention provides a test probe device for testing a semiconductor bare chip and a related system and method, which are used for carrying out detailed in-and-out test on the semiconductor bare chip under the actions of a CCD (charge coupled device) detection camera, a signal memory, an analog-to-digital converter, a photodiode and a sensor, and displaying the test result on an integrated control computer, thereby increasing the convenience of observation; meanwhile, when the probe and the semiconductor bare chip are fixed, the fixing ring 65 and the locking screw 66, the supporting bracket 131, the outer groove, the adjusting seat and the adjusting screw are controlled to increase the convenience of adjustment; the method has the advantages of simple operation, obvious intelligent test function, capability of generating a relation graph of the output voltage of the CCD device and the input exposure and displaying the relation graph by a PC display, capability of obtaining related main photoelectric parameter test results, convenience in adjustment and high efficiency.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like made within the design concept of the present invention should be included in the scope of the present invention.
Claims (10)
1. The device for testing the semiconductor bare chip comprises a device supporting base (1), supporting leg rods (2), a main support rod (3), a CCD detection camera (4), side support rods (5), a probe clamping seat structure (6), an air guide connecting pipe (7), a connecting data line (8), an adjustable computer supporting seat structure (9), an integrated control computer (10), an adjusting seat (11), an adjusting screw rod (12), a semiconductor bare chip supporting seat structure (13), a testing probe (14) and an adjusting hole (15), wherein the supporting leg rods (2) are respectively connected to four corners of the lower surface of the device supporting base (1) through screws; the main support rod (3) is in threaded connection with the middle position of the rear part of the upper surface of the equipment support base (1); the CCD detection camera (4) is connected to the upper end of the main support rod (3) through a bolt; the side supporting rods (5) are respectively in threaded connection with the middle positions of the left side and the right side of the upper surface of the equipment supporting base (1); the probe clamping seat structure (6) is connected to the upper end of the side supporting rod (5) through a screw; the air guide connecting pipe (7) is embedded outside the probe clamping seat structure (6); one end of the connecting data wire (8) is inserted at the output end of the CCD detection camera (4), and the other end is inserted at the input end of the integrated control computer (10); the adjustable computer supporting seat structure (9) is in threaded connection with the right upper side of the upper surface of the equipment supporting base (1); the integrated control computer (10) is arranged at the front part of the adjustable computer supporting seat structure (9); the adjusting seat (11) is connected to the middle position of the front side of the upper part of the equipment supporting base (1) through a bolt; the adjusting screw rod (12) is in threaded connection with the right upper side position inside the adjusting seat (11); the semiconductor bare chip supporting seat structure (13) is arranged at the upper part of the adjusting seat (11) and is meshed with the adjusting screw rod (12); the test probe (14) is clamped at the upper end of the probe clamping seat structure (6); the adjusting hole (15) is formed in the equipment supporting base (1).
2. The test probe apparatus for testing semiconductor dies according to claim 1, wherein the probe holder structure (6) comprises a support holder plate (61), a cylinder regulating valve (62), a gas guiding tube (63), a sealing valve (64), a fixing ring (65) and a locking screw (66), the cylinder regulating valve (62) is screwed at an upper middle position of the support holder plate (61); the air guide pipe (63) is embedded in the middle position of the right side of the air cylinder regulating valve (62); the sealing valve (64) is sleeved at the right end of the air duct (63); the fixing ring (65) is screwed on the right side of the sealing valve (64); the locking screw (66) is in threaded connection with the middle position of the right side of the fixing ring (65).
3. The test probe apparatus for testing semiconductor dies according to claim 2, wherein the adjustable computer support structure (9) comprises a support pillar (91), a connection screw (92), a U-shaped seat (93), a cross-bar (94) and a connection plate (95), the connection screw (92) is integrally disposed at a lower middle position of the support pillar (91); the U-shaped seat (93) is connected to the upper end of the supporting column (91) through a bolt; one end of the transverse suspender (94) is connected to the right side of the inside of the U-shaped seat (93) in a shaft mode, and the other end of the transverse suspender is connected to the middle position of the rear portion of the connecting plate (95) in a screw mode.
4. The test probe device for testing semiconductor dies according to claim 3, wherein the semiconductor die supporting base structure (13) comprises a supporting bracket (131), an outer recess (132), an inner placing groove (133) and an extraction recess (134), the outer recess (132) being opened at an inner outer position of the supporting bracket (131); the inner placing groove (133) is arranged at the middle position of the upper part of the supporting bracket (131); the fetching groove (134) is arranged at the right side position of the upper part of the supporting bracket (131).
5. The apparatus according to claim 4, wherein the locking screw (66) has an arc-shaped silicone pad glued to its tip; the test probe (14) is inserted into the fixing ring (65) and clamped and fixed by a locking screw (66).
6. Test probe device for testing semiconductor dies according to claim 5, characterized in that the connection plate (95) is embodied as a rectangular stainless steel plate; the inner wall of the connecting plate (95) is provided with a circular through hole; the integrated control computer (10) is arranged on the front surface of the connecting plate (95).
7. A related system for testing semiconductor die test probe devices as recited in claim 1, including a table, a device support base, a CCD detection camera, a self-balancing adjustment module and an integrated control computer, said device support base being disposed above said table; the CCD detection camera, the self-balancing adjusting module and the integrated control computer are electrically connected with each other and are arranged on the upper part of the equipment supporting base.
8. The system of claim 7, wherein the CCD inspection camera includes a signal memory, an analog-to-digital converter, a photodiode, and a sensor, the signal memory, the analog-to-digital converter, the photodiode, and the sensor being electrically connected to each other.
9. The system of claim 7, wherein the integrated control computer further comprises an external control output module, an image processing module and a display, and the external control output module and the image processing module are electrically connected to the display respectively.
10. The method of claim 1, further comprising the steps of:
the method comprises the following steps: clamping and fixing the test probe;
step two: fixing the semiconductor bare chip;
step three: marking of the first landing pad;
step four: implementation of an interconnect;
step five: starting a CCD detection camera for testing;
step six: outputting test data;
step seven: the marking of the semiconductor die is replaced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010003742.5A CN111162021B (en) | 2020-01-03 | 2020-01-03 | Test probe apparatus for testing semiconductor dies and related systems and methods |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010003742.5A CN111162021B (en) | 2020-01-03 | 2020-01-03 | Test probe apparatus for testing semiconductor dies and related systems and methods |
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| CN111162021A CN111162021A (en) | 2020-05-15 |
| CN111162021B true CN111162021B (en) | 2020-09-18 |
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| CN101568844A (en) * | 2006-12-26 | 2009-10-28 | 东京毅力科创株式会社 | Probe inspecting device, displacement correcting method, information processor, information processing method, and program |
| CN202102020U (en) * | 2011-06-10 | 2012-01-04 | 陈冠男 | Gas-oil pressure needle seat |
| CN204944429U (en) * | 2015-05-30 | 2016-01-06 | 东莞市兆丰精密仪器有限公司 | A kind of full-automatic dimensional measurement system |
| CN110308352A (en) * | 2019-07-16 | 2019-10-08 | 珠海达明科技有限公司 | A kind of intelligence probe test platform and its test method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101568844A (en) * | 2006-12-26 | 2009-10-28 | 东京毅力科创株式会社 | Probe inspecting device, displacement correcting method, information processor, information processing method, and program |
| CN202102020U (en) * | 2011-06-10 | 2012-01-04 | 陈冠男 | Gas-oil pressure needle seat |
| CN204944429U (en) * | 2015-05-30 | 2016-01-06 | 东莞市兆丰精密仪器有限公司 | A kind of full-automatic dimensional measurement system |
| CN110308352A (en) * | 2019-07-16 | 2019-10-08 | 珠海达明科技有限公司 | A kind of intelligence probe test platform and its test method |
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