CN111146165A - Cooling body and cooling device with cooling body - Google Patents
Cooling body and cooling device with cooling body Download PDFInfo
- Publication number
- CN111146165A CN111146165A CN201911066440.6A CN201911066440A CN111146165A CN 111146165 A CN111146165 A CN 111146165A CN 201911066440 A CN201911066440 A CN 201911066440A CN 111146165 A CN111146165 A CN 111146165A
- Authority
- CN
- China
- Prior art keywords
- cooling body
- carbon nanostructure
- cnb
- protrusions
- projections
- Prior art date
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 51
- 239000002717 carbon nanostructure Substances 0.000 claims abstract description 47
- 239000000835 fiber Substances 0.000 claims abstract description 47
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 6
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 6
- 239000002826 coolant Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a cooling body (1) having at least one main body (6) which has a plurality of projections (3). At least a plurality of the projections (3) are provided with fibers (CNB) based on carbon nano-structures, especially carbon nano-tubes (CNT), which are fixed on the projections in a heat conduction manner. The invention also relates to a cooling device with a cooling body (1).
Description
Technical Field
The invention relates to a cooling body with at least one base body, which has a plurality of projections. The invention also relates to a cooling device with a cooling body of said type.
Background
A so-called Pin-Fin heat exchanger (Pin-Fin-W ä rmeteaucher), also referred to as a cooling body, is known from US 2004150956, which has a base body with a plurality of projections which are in the form of pins or plates (Finnen) and are used for heat exchange.
Disclosure of Invention
The cooling body according to the invention has at least one base body which has a plurality of projections. On at least some of the projections, in particular, carbon nanostructure-based fibers made of carbon nanotubes or graphite flakes are fixed in a thermally conductive manner. The carbon nanostructure-based fibers very effectively enlarge the heat exchange surface of the cooling body in such a way that they conduct heat away from the protrusions. The coolant preferably flows along the cooling body, as a result of which heat is removed from the projections and from the carbon nanostructure-based fibers. The carbon nanostructure-based fibers have a very good thermal conductivity and are also flexible, so that they can be fastened to the projections in a simple manner in a thermally conductive manner.
According to a further development of the invention, at least several of the projections are thermally connected to one another by means of carbon nanostructure-based fibers. The carbon nanostructure-based fibers not only lead to an enlargement of the heat exchange surface in this respect, but also to a heat distribution in such a way that the more strongly heated projections discharge a part of their heat through the carbon nanostructure-based fibers to the less strongly heated projections. Such a heat sink according to the invention is preferably used in power electronics in order to dissipate the corresponding heat, in particular at power peaks during operation. The coolant can in particular be a liquid, i.e. liquid cooling, but it is also possible to use a gas, in particular air, which is subjected to normal or forced convection, for example by means of a ventilator.
Provision is preferably made for the carbon nanostructure-based fibers to run straight between the relevant projections. The carbon nanostructure-based fibers can extend in particular between the projections in a tensioned manner, wherein, however, no great tensions are required, but great tensions are also possible.
Preferably, the base body has a base, and the protruding portion protrudes from the base. On the base body itself, components are fastened, i.e. for example power electronics components, from which heat should be dissipated if an application in the field of power electronics is concerned. The heat of this assembly is transferred to the substrate, from the substrate to the protrusions and from the protrusions to the carbon nanostructure-based fibers. Or the heat source is connected to the heat sink (base) through a coolant circuit. The coolant carries away heat, wherein the coolant also flows over the projection and preferably also at least over a part of the substrate.
Preferably, it can be provided that the projection is configured as a pin. The pin may preferably have a circular or oval cross-section.
For simple and thermally conductive fixing, it can preferably be provided that the carbon nanostructure-based fibers are arranged in a wound manner around the projections. It is particularly sufficient here to wind the carbon nanostructure-based fibers only in a single layer around the protrusions. The integrated length of the carbon nanostructure-based fiber is sufficient to interconnect at least two protrusions, and if necessary also many more than two protrusions.
According to one embodiment of the invention, the carbon nanostructure-based fibers are fastened to the projections in a plurality of directions and/or in a plurality of planes. Different fiber extension directions may therefore be present on different protrusions. In addition or alternatively, it is also possible for fibres running in different directions to be fastened to one and the same projection. It is also possible for not only one fiber but also a plurality of fibers to be fastened to a projection, to be precise in the same plane or distributed over the length of the projection, so that different planes are present.
One embodiment of the invention provides that the carbon nanostructure-based fibers extend along the same side or different sides of the projection. The projections of the projection rows are thus connected by means of the fibers, which can be based on carbon nanostructures, in such a way that the fibers are located on the same side of the projections, respectively. Alternatively or additionally, however, it is also possible for the fibers to bear along their course on different sides of the projections arranged in a row.
The invention also relates to a cooling device with a cooling body as already explained above and with a flow path for a flowing coolant. Provision is made for the carbon nanostructure-based fibres to extend in the direction of the flow path and/or transversely, in particular perpendicularly, to the direction of the flow path. The counterpressure of the cooling device is hardly changed, provided that the carbon nanostructure-based fibers extend in the direction of the flow path, i.e. in the flow direction of the coolant. The positive effect is a reduction of the temperature gradient in the flow direction of the coolant. However, in addition or alternatively, the fibers may also be oriented transversely to the direction of the flow path, as a result of which flow vortices may be generated, which may improve the cooling efficiency.
Drawings
The invention is illustrated by way of example in the accompanying drawings, in which:
fig. 1 shows a cooling body in a side sectional view in the longitudinal direction of the flow;
FIG. 2 is a top view of the cooling body of FIG. 1;
FIG. 3 is a side cross-sectional view of a region of a protrusion of the cooling body of FIG. 1;
fig. 4 shows a further exemplary embodiment of a heat sink in a top view;
fig. 5 shows a further exemplary embodiment of a heat sink in a top view;
fig. 6 shows a further exemplary embodiment of a heat sink in a top view;
fig. 7 shows a further exemplary embodiment of a heat sink in a top view; and is
Fig. 8 shows a side sectional view of a further embodiment of the cooling body in the longitudinal direction of the flow.
Detailed Description
Fig. 1 shows a cooling body 1 in a side sectional view. The heat sink 1 is shown in fig. 2 in a plan view. The heat sink 1 has a substrate (Grundsubstrat) 2, which is designed in the present exemplary embodiment as a metal plate. The projection 3 projects from the base 2 on one side. The base 2 and the projection 3 together form a base body 6 of the heat sink 1. The projections 3 may be arranged in a matrix as shown in fig. 2 (in particular forming rows, preferably longitudinal rows and transverse rows). In the present embodiment, the protrusion is configured as a pin (stub) 4 having a circular cross-section. Based on the matrix-shaped arrangement of the pins 4, a pin row 5 is obtained according to fig. 2. In practice, a component to be heated, for example a power semiconductor component (not shown) of a power electronic component, is fixed in a thermally conductive manner on the substrate 2. Power electronics belong to electric vehicles, for example. The flow path is defined by an upper wall 8 and a side wall, not shown.
The carbon nanostructure-based fibers CNB, in particular carbon nanotubes cnt, are fastened to the projections 3 of the cooling body 1 in a thermally conductive manner, are configured in the form of a yarn (garnartig) or a ribbon, for the thermally conductive fastening to the projections 3, the carbon nanostructure-based fibers are arranged in a manner wound around the respective projection 3, the winding is carried out in a single layer in the exemplary embodiment of fig. 1 to 7, that is to say, only one turn of the carbon nanostructure-based fibers CNB is laid around each projection 3, respectively, the arrangement is now such that the carbon nanostructure-based fibers CNB extend from the projection 3 towards the projection 3, in particular along the respective pin row 5 (or projection row), thereby thermally connecting the respective projections 3 or pins 4 to one another, it is clear from fig. 1 that the carbon nanostructure-based fibers CNB are arranged in a plurality of planes on the projections 3, that is to be arranged in a superposed manner (Ü) underneath the carbon nanostructure-based fibers CNB, that the cooling body 1 is fastened to one another, and the cooling agent is preferably discharged in a thermally conductive manner that the cooling body 1, wherein the cooling agent flows in a substantially thermally extended manner that the cooling body 1, and that the cooling agent flows in a substantially parallel to the cooling body 7, and that the cooling body is arranged in a substantially parallel to the cooling body, and that the cooling body is arranged in a substantially parallel to which is arranged in a substantially parallel to the cooling body, and a substantially parallel to the cooling body, wherein the cooling body is arranged in which is arranged in a substantially parallel to be cooled heat-to be cooled, and a substantially parallel to be cooled heat-to be cooled, and a heat-.
Fig. 3 illustrates in cross section a section of the projections 3 of fig. 1 and 2, which are designed as pins 4, it can be seen that a plurality of carbon nanostructure-based fibers CNB are fastened to the projections 3 in a single layer, i.e. each with only one turn, one above the other and spaced apart from one another, in the exemplary embodiment of fig. 2 the respective carbon nanostructure-based fibers CNB run straight between the projections 3 of interest (dazugeh ö rigen), more precisely only on one side of the projections 3.
Fig. 4 illustrates an embodiment corresponding to fig. 2, wherein, however, the projection 3 is configured as a pin 4 with an oval cross-section.
Fig. 5 illustrates another embodiment, which corresponds to the embodiment of fig. 2, but in which the carbon nanostructure-based fibers CNB extend not only along the sides of the pins 4 of each of their pin rows 5, but also along two mutually opposite sides of the pins 4 of the respective pin row 5. Thereby again enlarging the surface and improving the heat distribution of the cooling body 1.
In the embodiment of fig. 6, again a base body 6 is present, and as is also evident from fig. 4, a pin 4 is also provided with an oval cross section. The carbon nanostructure-based fibers CNB extend in this case through a cross shape such that a cross of the carbon nanostructure-based fibers CNB is present between two pins 4 of one pin row 5, respectively, which are on two sides opposite to each other in the region of the pins 4.
Fig. 7 again corresponds to the exemplary embodiment of fig. 5, but the carbon nanostructure-based fibers CNB extend not only in the direction of the flow path 7, but also transversely thereto, in particular perpendicularly thereto, in such a way that the respective pins 4 are provided with carbon nanostructure-based fibers CNB on two mutually opposite sides and offset by 90 ° and then once again on two mutually opposite sides.
Applicable to all embodiments of fig. 1 to 7 is that the thermally conductive fixing of the respective carbon nanostructure-based fiber CNB is done by winding (heraulegen) in a single layer, i.e. in one turn (windong) around the respective protrusion 3. In the exemplary embodiment of fig. 8, the thermally conductive fixing on the respective projection 3 is achieved by the respective carbon nanostructure-based fiber CNB being wound around the respective projection 3 in a plurality of layers, for example by two or more windings.
It is therefore essential in the context of the invention that the carbon nanostructure-based fibers CNB are connected thermally, in particular by winding, to the respective projections 3 of the cooling body 1. The heat flow from the respective projection 3 to the adjacent projection 3 is thereby greatly increased, and thus heat balance occurs. At the same time, the carbon nanostructure-based fibers CNB also greatly increase the surface of the cooling body 1, thereby greatly improving heat dissipation. The fixing of the carbon nanostructure-based fibres on the pins (protrusions) is preferably purely mechanical. Alternatively, a preferably material-locking connection is provided. This can be achieved, for example, by brazing with a suitable brazing filler metal which wets the metal and the carbon nanostructure-based fibers. Another possibility for a cohesive connection is to separate the metals on the pins and on the carbon nanostructure-based fibers without current.
Claims (11)
1. Cooling body (1) with at least one substrate (6) having a plurality of protrusions (3), characterized in that carbon nanostructure-based fibers (CNB), in particular Carbon Nanotubes (CNT), are fixed in a thermally conductive manner at least on a number of the protrusions (3).
2. Method according to claim 1, characterized in that at least several of the protrusions (3) are thermally connected to each other by means of the carbon nanostructure-based fibers (CNB).
3. Cooling body according to any one of the preceding claims, characterized in that the carbon nanostructure-based fibres (CNB) extend straight between the relevant protrusions (3).
4. Cooling body according to any one of the preceding claims, characterized in that the basic body (6) has a base (2) from which the projections (3) project.
5. Cooling body according to one of the preceding claims, characterized in that the projections (3) are configured as pins (4).
6. Cooling body according to one of the preceding claims, characterized in that the pins (4) have a circular or oval cross section.
7. The cooling body according to any one of the preceding claims, characterized in that the carbon nanostructure-based fibers (CNB) are arranged in a wound manner around the protrusion (3), in particular for their thermally conductive fixation.
8. Cooling body according to any one of the preceding claims, characterized in that the carbon nanostructure-based fibres (CNB) are wound around the protrusions (3) in a single layer.
9. Cooling body according to any one of the preceding claims, characterized in that the carbon nanostructure-based fibres (CNB) are fixed to the protrusions (3) extending in a plurality of directions and/or in a plurality of planes.
10. Cooling body according to any one of the preceding claims, characterized in that the carbon nanostructure-based fibres (CNB) extend along the same and/or different sides of the protrusions (3).
11. Cooling device with a cooling body according to one or more of the preceding claims and with a flow path (7) for a flowing coolant, characterized in that the carbon nanostructure-based fibers (CNB) extend in the direction of the flow path (7) and/or transversely, in particular perpendicularly, to the direction of the flow path (7).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018218831.9 | 2018-11-05 | ||
| DE102018218831.9A DE102018218831B4 (en) | 2018-11-05 | 2018-11-05 | Heat sink and cooling arrangement with heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111146165A true CN111146165A (en) | 2020-05-12 |
Family
ID=70469892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911066440.6A Pending CN111146165A (en) | 2018-11-05 | 2019-11-04 | Cooling body and cooling device with cooling body |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7452979B2 (en) |
| CN (1) | CN111146165A (en) |
| DE (1) | DE102018218831B4 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116325142A (en) * | 2020-12-16 | 2023-06-23 | 索尼集团公司 | Cooling mechanism having nano-capillary structure, semiconductor device provided with cooling mechanism, method for manufacturing semiconductor device, and electronic apparatus |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040150956A1 (en) | 2003-01-24 | 2004-08-05 | Robert Conte | Pin fin heat sink for power electronic applications |
| US20050126766A1 (en) | 2003-09-16 | 2005-06-16 | Koila,Inc. | Nanostructure augmentation of surfaces for enhanced thermal transfer with improved contact |
| US20080225489A1 (en) * | 2006-10-23 | 2008-09-18 | Teledyne Licensing, Llc | Heat spreader with high heat flux and high thermal conductivity |
| DE102006050508B4 (en) * | 2006-10-26 | 2009-04-09 | Rainer Schmitt | Radiator with water pockets |
| JP2010243035A (en) * | 2009-04-03 | 2010-10-28 | Sony Corp | Heat transport device, electronic apparatus and method of manufacturing the heat transport device |
| EP2417843A2 (en) | 2009-04-08 | 2012-02-15 | NS Acquisition LLC | Low stress-inducing heat sink |
| CN102006542B (en) | 2009-08-28 | 2014-03-26 | 清华大学 | Sound generating device |
| JP6846879B2 (en) | 2016-06-07 | 2021-03-24 | 昭和電工株式会社 | How to make a heat sink |
| JP7049849B2 (en) | 2018-02-13 | 2022-04-07 | 昭和電工株式会社 | Cooling system |
-
2018
- 2018-11-05 DE DE102018218831.9A patent/DE102018218831B4/en active Active
-
2019
- 2019-10-31 JP JP2019198327A patent/JP7452979B2/en active Active
- 2019-11-04 CN CN201911066440.6A patent/CN111146165A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE102018218831A1 (en) | 2020-05-07 |
| JP7452979B2 (en) | 2024-03-19 |
| DE102018218831B4 (en) | 2021-09-30 |
| JP2020077875A (en) | 2020-05-21 |
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