CN111142333A - 柔性感光显影型覆盖膜、包含其的柔性印刷电路板及其制备方法 - Google Patents
柔性感光显影型覆盖膜、包含其的柔性印刷电路板及其制备方法 Download PDFInfo
- Publication number
- CN111142333A CN111142333A CN201911059442.2A CN201911059442A CN111142333A CN 111142333 A CN111142333 A CN 111142333A CN 201911059442 A CN201911059442 A CN 201911059442A CN 111142333 A CN111142333 A CN 111142333A
- Authority
- CN
- China
- Prior art keywords
- resin
- photosensitive
- flexible
- coverlay
- acrylic oligomer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013039 cover film Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims description 26
- 238000011161 development Methods 0.000 title abstract description 20
- 239000010408 film Substances 0.000 claims abstract description 77
- 238000000034 method Methods 0.000 claims abstract description 38
- 238000004519 manufacturing process Methods 0.000 claims abstract description 34
- 238000001035 drying Methods 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims description 137
- 239000011347 resin Substances 0.000 claims description 137
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 94
- 229920001721 polyimide Polymers 0.000 claims description 68
- 239000009719 polyimide resin Substances 0.000 claims description 65
- 239000012790 adhesive layer Substances 0.000 claims description 46
- 239000004840 adhesive resin Substances 0.000 claims description 34
- 229920006223 adhesive resin Polymers 0.000 claims description 34
- 229920005749 polyurethane resin Polymers 0.000 claims description 29
- 239000002585 base Substances 0.000 claims description 24
- 229920001187 thermosetting polymer Polymers 0.000 claims description 22
- 230000014509 gene expression Effects 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 18
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 16
- 239000003513 alkali Substances 0.000 claims description 15
- 239000002904 solvent Substances 0.000 claims description 14
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 13
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 11
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 9
- 230000009257 reactivity Effects 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 150000002923 oximes Chemical class 0.000 claims description 4
- 239000003999 initiator Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 97
- 230000008569 process Effects 0.000 abstract description 12
- 150000001875 compounds Chemical class 0.000 description 65
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 46
- 238000005452 bending Methods 0.000 description 32
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 27
- 239000012787 coverlay film Substances 0.000 description 25
- 238000012546 transfer Methods 0.000 description 24
- 239000002253 acid Substances 0.000 description 18
- -1 diamine compound Chemical class 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 17
- 238000012360 testing method Methods 0.000 description 15
- 230000003287 optical effect Effects 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 13
- 230000001070 adhesive effect Effects 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- 150000001412 amines Chemical class 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 230000003247 decreasing effect Effects 0.000 description 9
- 150000004985 diamines Chemical class 0.000 description 9
- 239000011148 porous material Substances 0.000 description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 239000004593 Epoxy Substances 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- 125000005442 diisocyanate group Chemical group 0.000 description 6
- 150000002009 diols Chemical class 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 229920005575 poly(amic acid) Polymers 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 229920000515 polycarbonate Polymers 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 description 4
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000005484 gravity Effects 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- POYODSZSSBWJPD-UHFFFAOYSA-N 2-methylprop-2-enoyloxy 2-methylprop-2-eneperoxoate Chemical compound CC(=C)C(=O)OOOC(=O)C(C)=C POYODSZSSBWJPD-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- NPNBCGWBCDUDAJ-UHFFFAOYSA-N benzene-1,2,3-triol;methane Chemical compound C.OC1=CC=CC(O)=C1O NPNBCGWBCDUDAJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000004984 smart glass Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0135047 | 2018-11-06 | ||
| KR1020180135048A KR102185327B1 (ko) | 2018-11-06 | 2018-11-06 | Fpic 필름 및 이의 제조방법 |
| KR1020180135047A KR102149191B1 (ko) | 2018-11-06 | 2018-11-06 | Fpic 필름, 이를 포함하는 연성인쇄회로기판 및 이의 제조방법 |
| KR10-2018-0135048 | 2018-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111142333A true CN111142333A (zh) | 2020-05-12 |
Family
ID=70516946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911059442.2A Pending CN111142333A (zh) | 2018-11-06 | 2019-11-01 | 柔性感光显影型覆盖膜、包含其的柔性印刷电路板及其制备方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7104682B2 (ja) |
| CN (1) | CN111142333A (ja) |
| TW (1) | TWI732333B (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101681104A (zh) * | 2007-06-06 | 2010-03-24 | 日立化成工业株式会社 | 感光性粘结剂组合物、膜状粘结剂、粘结片、粘结剂图案的形成方法、具有粘结剂层的半导体晶片、半导体装置、以及半导体装置的制造方法 |
| CN106796402A (zh) * | 2014-10-16 | 2017-05-31 | 太阳油墨制造株式会社 | 层叠结构体、干膜以及柔性印刷电路板 |
| CN107540797A (zh) * | 2016-06-24 | 2018-01-05 | 利诺士尖端材料有限公司 | 非导电性粘结膜用组合物及包含其的非导电性粘结膜 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6762249B1 (en) * | 1999-08-25 | 2004-07-13 | Hitachi Chemical Company, Ltd. | Wiring-connecting material and process for producing circuit board with the same |
| JP2002156758A (ja) * | 2000-11-16 | 2002-05-31 | Ube Ind Ltd | 感光性ポリイミドを用いた高密度フレキシブル基板の製法 |
| JP2004157188A (ja) * | 2002-11-01 | 2004-06-03 | Kanegafuchi Chem Ind Co Ltd | 感光性樹脂組成物およびこれを用いた感光性ドライフィルムレジスト、並びに、これらを用いたフレキシブルプリント配線板 |
| JP2004333672A (ja) * | 2003-05-02 | 2004-11-25 | Kanegafuchi Chem Ind Co Ltd | 貯蔵安定性の良い感光性樹脂組成物及び感光性ドライフィルムレジスト、並びにその利用 |
| WO2016073946A1 (en) * | 2014-11-07 | 2016-05-12 | Multi-Fineline Electronix, Inc. | Photoimageable coverlay composition for flexible printed circuit boards |
| JP6639170B2 (ja) * | 2015-09-18 | 2020-02-05 | 株式会社カネカ | 回路基板用絶縁膜およびその製造方法 |
| TWI634003B (zh) * | 2017-01-26 | 2018-09-01 | 長興材料工業股份有限公司 | 感光型乾膜及其應用 |
-
2019
- 2019-10-31 JP JP2019199139A patent/JP7104682B2/ja active Active
- 2019-11-01 CN CN201911059442.2A patent/CN111142333A/zh active Pending
- 2019-11-05 TW TW108140059A patent/TWI732333B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101681104A (zh) * | 2007-06-06 | 2010-03-24 | 日立化成工业株式会社 | 感光性粘结剂组合物、膜状粘结剂、粘结片、粘结剂图案的形成方法、具有粘结剂层的半导体晶片、半导体装置、以及半导体装置的制造方法 |
| CN106796402A (zh) * | 2014-10-16 | 2017-05-31 | 太阳油墨制造株式会社 | 层叠结构体、干膜以及柔性印刷电路板 |
| CN107540797A (zh) * | 2016-06-24 | 2018-01-05 | 利诺士尖端材料有限公司 | 非导电性粘结膜用组合物及包含其的非导电性粘结膜 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7104682B2 (ja) | 2022-07-21 |
| TW202018418A (zh) | 2020-05-16 |
| TWI732333B (zh) | 2021-07-01 |
| JP2020076989A (ja) | 2020-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6723788B2 (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 | |
| KR102624058B1 (ko) | 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판 | |
| CN111138992B (zh) | 柔性感光显影型覆盖膜及其制备方法 | |
| JP3215657U (ja) | 感光性ドライフィルム | |
| KR20140018117A (ko) | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 | |
| JP6748663B2 (ja) | 硬化性組成物、ドライフィルム、硬化物およびプリント配線板 | |
| TWI751421B (zh) | 感光型可溶性聚醯亞胺樹脂組合物及應用其的保護膜 | |
| CN107148809B (zh) | 干膜及柔性印刷电路板 | |
| JP2020166215A (ja) | ドライフィルム、硬化物、および、電子部品 | |
| JP2020166207A (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 | |
| WO2023190456A1 (ja) | 硬化物、感光性樹脂組成物、ドライフィルムおよびプリント配線板 | |
| CN111142333A (zh) | 柔性感光显影型覆盖膜、包含其的柔性印刷电路板及其制备方法 | |
| KR20230090217A (ko) | 솔더 레지스트 조성물, 드라이 필름, 인쇄 배선 기판 및 이들의 제조방법 | |
| KR102149191B1 (ko) | Fpic 필름, 이를 포함하는 연성인쇄회로기판 및 이의 제조방법 | |
| CN111142334A (zh) | 柔性感光显影型覆盖膜及其制备方法 | |
| KR101785706B1 (ko) | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 | |
| KR102185327B1 (ko) | Fpic 필름 및 이의 제조방법 | |
| JP6603442B1 (ja) | 硬化性樹脂組成物、ドライフィルムおよびその硬化物、並びにプリント配線板 | |
| KR102543365B1 (ko) | 경화성 조성물, 드라이 필름, 경화물 및 프린트 배선판 | |
| JP2024054101A (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 | |
| KR20150122538A (ko) | 광경화성 및 열경화성을 갖는 수지 조성물과, 드라이 필름 솔더 레지스트 | |
| JP2020166211A (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および電子部品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200512 |