CN111129743A - Transparent flexible antenna board and manufacturing method thereof - Google Patents
Transparent flexible antenna board and manufacturing method thereof Download PDFInfo
- Publication number
- CN111129743A CN111129743A CN202010033826.3A CN202010033826A CN111129743A CN 111129743 A CN111129743 A CN 111129743A CN 202010033826 A CN202010033826 A CN 202010033826A CN 111129743 A CN111129743 A CN 111129743A
- Authority
- CN
- China
- Prior art keywords
- thickness
- layer
- flexible antenna
- transparent
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Abstract
The invention discloses a transparent flexible antenna plate and a manufacturing method thereof, wherein the transparent flexible antenna plate consists of 8 layers which are sequentially from top to bottom: an upper protective film with the thickness of 15-50 mu m, a transparent adhesive layer with the thickness of 15-30 mu m, a surface blackened layer with the thickness of 0.1-0.3 mu m, a copper conductor layer with the thickness of 0.5-1 mu m, a back blackened layer with the thickness of 0.1-0.3 mu m, a PET dielectric layer or COP dielectric layer with the thickness of 25-50 mu m, an acrylic adhesive layer with the thickness of 25-50 mu m and a lower protective film with the thickness of 50-100 mu m. The invention has the advantages that: (1) the flexible antenna board is transparent, and is more attractive than the traditional opaque flexible antenna board when being arranged on communication equipment for receiving and amplifying signals, and the application range is enlarged; (2) the transparent flexible antenna board has low material cost and manufacturing cost.
Description
Technical Field
The invention relates to a flexible antenna board and a manufacturing method thereof, in particular to a transparent flexible antenna board and a manufacturing method thereof, and belongs to the technical field of antennas.
Background
Polyimide (PI) is a polymer containing imido groups (-C (O) -N-C (O)) in the main chain, has a density of 1.36-1.43 g/cm, and is nontoxic, odorless, tasteless, and yellowish white powder or granule. As a special engineering material, PI is widely applied to the fields of aviation, aerospace, microelectronics, nano-scale, liquid crystal, separation membranes, laser and the like.
Liquid Crystal Polymer (LCP) is a new type of Polymer material that generally becomes Liquid crystalline under certain heating conditions, hence its name. LCP has excellent heat resistance and moldability, and also has excellent electrical insulation, and is used in the fields of electronics, electrical, optical fiber, automobiles, aerospace, and the like.
The existing flexible antenna board is mainly manufactured by adopting a PI single-sided copper foil or an LCP single-sided copper foil, and sequentially comprises a protective film, an opaque adhesive layer, a copper wire, a PI dielectric layer or an LCP dielectric layer from top to bottom, the circuit is formed in an exposure etching mode, the etched circuit is composed of large copper blocks, and the lines are thick. The flexible antenna board has high material cost and high manufacturing cost. In addition, the circuit is composed of large copper blocks, lines are thick, the PI dielectric layer is dark brown, and the LCP dielectric layer is white, so that the manufactured flexible antenna board is not transparent, the product is not attractive in installation, and the use of the flexible antenna board is limited to a certain extent.
Disclosure of Invention
To overcome the disadvantages of the prior art, an object of the present invention is to provide a transparent flexible antenna board.
In order to achieve the above object, the present invention adopts the following technical solutions:
a transparent flexible antenna board is characterized by comprising 8 layers which are as follows from top to bottom:
an upper protective film with a thickness of 15-50 μm;
a transparent adhesive layer with a thickness of 15-30 μm;
a surface blackening layer with a thickness of 0.1-0.3 μm;
a copper conductor layer with a thickness of 0.5-1 μm;
a back blackening layer with a thickness of 0.1-0.3 μm;
a PET dielectric layer or COP dielectric layer with the thickness of 25-50 μm;
an acrylic glue layer with the thickness of 25-50 mu m;
a lower protective film with a thickness of 50-100 μm.
The transparent flexible antenna board is characterized in that the upper protective film is a PET film.
The transparent flexible antenna board is characterized in that the transparent adhesive layer is 3M transparent OCA optical adhesive.
The transparent flexible antenna board is characterized in that the lower protective film is a PET film.
The manufacturing method of the transparent flexible antenna board is characterized by comprising the following steps:
step 1: attaching a layer of photosensitive dry film on the surface of the PET single-sided copper foil or the COP single-sided copper foil;
step 2: using a negative film pattern, and irradiating the photosensitive dry film by using ultraviolet rays to complete pattern transfer;
and step 3: sequentially developing, etching and stripping the copper foil after the pattern transfer is completed on a DES production line;
and 4, step 4: performing blackening treatment on the surface and the bottom surface of the COPPER foil by using OPC BLACK COPPER/OPC BLACK KEEP, and performing anti-discoloration treatment on the BLACK film by using OPC BLACK KEEP;
and 5: silk-screen printing 3M transparent OCA optical cement on the top surface of a product by a 120T screen printing plate through a printing machine;
step 6: processing the acrylic adhesive with the protective film into a required shape, and attaching the acrylic adhesive to the bottom surface of a product;
and 7: attaching a protective film on the top surface of the product;
and 8: and punching the product into a required shape by using a punch and a die.
In the above-mentioned production method, the solution used for the development in step 3 is Na having a concentration of 1.0 w/v%2CO3And (3) solution.
In the above manufacturing method, in step 3, the solution used for stripping is a NaOH solution with a concentration of 4 w/v%.
The invention has the advantages that:
(1) the flexible antenna board provided by the invention is a transparent flexible antenna board, is more beautiful than the traditional opaque flexible antenna board when being installed on communication equipment for receiving and amplifying signals, has an expanded application range, can be applied to the fields of space flight and aviation, modernization factories, civilian use and the like, has a far-reaching market prospect, and can generate more than one hundred million-yuan market demand particularly along with the arrival of 5G communication;
(2) compared with the existing PI antenna plate (which is manufactured by adopting PI single-sided copper foil) and the LCP antenna plate (which is manufactured by adopting LCP single-sided copper foil), the transparent flexible antenna plate provided by the invention has lower material cost and manufacturing cost, and the total cost is almost 30% of the total cost of the existing PI antenna plate and LCP antenna plate.
Drawings
Fig. 1 is a stacked view of a transparent flexible antenna board provided by the present invention;
fig. 2 is a product diagram of a transparent flexible antenna board provided by the present invention.
Detailed Description
The invention is described in detail below with reference to the figures and the embodiments.
The transparent flexible antenna board provided by the invention takes copper foil as a base material, takes transparent material polyethylene terephthalate (PET) or cycloolefin polymer (COP) as a dielectric layer, and the whole transparent flexible antenna board consists of 8 layers, and with reference to fig. 1, the following steps are carried out in sequence from top to bottom:
an upper protective film with a thickness of 15-50 μm;
a transparent adhesive layer with a thickness of 15-30 μm;
a surface blackening layer with a thickness of 0.1-0.3 μm;
a copper conductor layer with a thickness of 0.5-1 μm;
a back blackening layer with a thickness of 0.1-0.3 μm;
a PET dielectric layer or COP dielectric layer with the thickness of 25-50 μm;
an acrylic glue layer with the thickness of 25-50 mu m;
a lower protective film with a thickness of 50-100 μm.
Wherein:
(1) the upper protective film positioned at the topmost layer is a PET film, preferably a PET film with a color (such as blue);
(2) the transparent adhesive layer on the second layer uses 3M transparent OCA optical adhesive, which mainly comprises epoxy resin, active toughening agent, diluent, etc.;
(3) the lower protective film positioned at the lowermost layer is a PET film, and preferably a PET film with a color (e.g., blue) is used.
When the PET is used as the dielectric layer, the PET has the properties of transparency, bending resistance, low water absorption, stable molecular structure and the like, so that the corresponding transparent flexible antenna board is suitable for the field of aerospace.
When the COP is used as the dielectric layer, the COP not only has the performances of high light transmittance, low water absorption, stable molecular structure, low dielectric constant and the like, but also has excellent high-frequency high-speed performance, so that the corresponding transparent flexible antenna board is suitable for the fields of space flight and aviation and high-frequency high-speed.
Example 1: copper wire layer 0.5 μm + PET dielectric layer 25 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 0.5 μm;
a back blackening layer with a thickness of 0.2 μm;
a PET medium layer with the thickness of 25 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The manufacturing method of the transparent flexible antenna board comprises the following specific steps:
(1) directly purchasing a PET single-sided copper foil from a material manufacturer, wherein the thickness of the copper foil is 0.5 mu m, and the thickness of a PET dielectric layer is 25 mu m;
(2) pasting a layer of photosensitive dry film on the surface of the copper foil, wherein the thickness of the photosensitive dry film is 10 mu m, and the parameters of pasting the photosensitive dry film are as follows: the temperature is 100 ℃, the speed is 0.10m/min, and the pressure is 6 kg;
(3) irradiating the photosensitive dry film by using a negative film pattern and ultraviolet rays to enable the photosensitive dry film to generate polymerization reaction, and transferring the film pattern to the photosensitive dry film through the ultraviolet irradiation of an exposure machine by using a light-transmitting part on the film to finish pattern transfer;
(4) and developing, etching and stripping the copper foil after the pattern transfer is completed on a DES production line in sequence, wherein:
(a) and (3) developing: na was used at a concentration of 1.0% (w/v)2CO3Removing the photosensitive dry film which does not undergo polymerization reaction by using the solution to expose the copper foil layer;
(b) etching: using etching liquid medicine to bite the exposed copper foil, and keeping a useful pattern;
(c) film stripping: removing the photosensitive dry film attached to the copper foil by using a NaOH solution with the concentration of 4% (w/v) to finish the circuit pattern manufacture, wherein the line width is 10 mu m, and the line distance is 0.9 mm;
(5) the surface and bottom surfaces of the COPPER foil were subjected to blackening treatment using a blackening treatment solution of OPC BLACK COPPER/OPC BLACK keek top (the blackening treatment solution contains COPPER ions, does not microetch COPPER, does not roughen the surface of the COPPER foil, and thus a BLACK film without increasing resistance can be formed on the surface of the COPPER foil, and further, the formed BLACK film also forms an alloy layer with the COPPER ions in the blackening treatment solution and the COPPER ions on the surface of the COPPER foil, and thus the bonding force between the BLACK film and the COPPER foil can be improved), to prevent line oxidation, and then the BLACK film was subjected to discoloration prevention using OPC BLACK KEEP, to prevent discoloration of the BLACK film, and finally a surface blackening layer having a thickness of 0.2 μm and a bottom blackening layer having a thickness of 0.2 μm were formed on the surface and bottom surfaces of the COPPER foil, respectively.
(6) Adopting a silk-screen printing technology, and silk-screening 3M transparent OCA optical cement to the surface (top surface) of a product by a printing machine by using a 120T screen printing plate to form a transparent cement layer with the thickness of 15 mu M;
(7) directly purchasing acrylic adhesive with a protective film from a material manufacturer, wherein the thickness of the acrylic adhesive layer is 50 microns, the thickness of the protective film is 75 microns, processing the acrylic adhesive layer into a required shape, and attaching the acrylic adhesive layer to the bottom surface of a product to form the acrylic adhesive layer and the lower protective film;
(8) an upper protective film with the thickness of 15 mu m, namely a blue PET film, is attached to the surface (top surface) of the product for protection;
(9) the product is die cut into the desired shape using a punch plus die, as shown in fig. 2.
Example 2: copper wire layer 0.5 μm + PET dielectric layer 50 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 0.5 μm;
a back blackening layer with a thickness of 0.2 μm;
a PET dielectric layer with the thickness of 50 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Example 3: copper conductor layer 0.5 μm + COP dielectric layer 25 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 0.5 μm;
a back blackening layer with a thickness of 0.2 μm;
a COP dielectric layer with a thickness of 25 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Example 4: copper conductor layer 0.5 μm + COP dielectric layer 50 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 0.5 μm;
a back blackening layer with a thickness of 0.2 μm;
a COP dielectric layer with a thickness of 50 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Example 5: copper conductor layer 1 μm + PET dielectric layer 25 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 1 μm;
a back blackening layer with a thickness of 0.2 μm;
a PET medium layer with the thickness of 25 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Example 6: copper conductor layer 1 μm + PET dielectric layer 50 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 1 μm;
a back blackening layer with a thickness of 0.2 μm;
a PET dielectric layer with the thickness of 50 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Example 7: copper conductor layer 1 μm + COP dielectric layer 25 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 1 μm;
a back blackening layer with a thickness of 0.2 μm;
a COP dielectric layer with a thickness of 25 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Example 8: copper conductor layer 1 μm + COP dielectric layer 50 μm
The transparent flexible antenna board provided by the embodiment is composed of 8 layers, and the following are sequentially arranged from top to bottom:
an upper protective film having a thickness of 15 μm;
a transparent adhesive layer with the thickness of 15 mu m;
a surface blackening layer with the thickness of 0.2 mu m;
a copper conductor layer with a thickness of 1 μm;
a back blackening layer with a thickness of 0.2 μm;
a COP dielectric layer with a thickness of 50 μm;
an acrylic glue layer with the thickness of 50 mu m;
and a lower protective film having a thickness of 75 μm.
The method of manufacturing the transparent flexible antenna board is the same as that of embodiment 1.
Subsequently, the structural performance and the environmental resistance of 8 flexible antenna boards obtained in examples 1 to 8 were respectively tested, wherein the test results of the structural performance are shown in table 1, and the test results of the environmental resistance are shown in table 2.
Table 18 structural Properties of Flexible antenna boards
Environment resistant performance of table 28 flexible antenna board
As can be seen from tables 1 and 2, the present invention provides a transparent flexible antenna board:
(1) the surface resistance value is below 3.5 omega, and the signal transmission is fast;
(2) the total light transmittance is more than 80%, and the transparency is high;
(3) the opening rate of the circuit is more than 98 percent (namely the residual copper rate is less than 2 percent), the circuit has no influence on the transparency, and the product yield is high;
(4) the thickness of the copper wire (namely the height of each copper wire) is 0.5 mu m or more, and the electrical property can completely meet the requirement;
(5) the peeling strength is within the range of 15-20N, and the reliability is excellent;
(6) the environmental resistance can reach high temperature 95 ℃ for 1000h, low temperature 40 ℃ for 1000h, moisture resistance 85 ℃, 85% RH for 1000h, thermal shock 40 ℃ for 0.5h to 85 ℃ for 0.5h for 1000cycle, not only the absorptivity is low (the qualified high temperature and high humidity test can indicate the problem), but also the molecular structure is stable (the qualified thermal shock can indicate the problem).
Therefore, the flexible antenna plate provided by the invention has high transparency, stable molecular structure and low moisture absorption rate, and can be completely used in the fields of aerospace and high frequency and high speed.
It should be noted that the above-mentioned embodiments do not limit the present invention in any way, and all technical solutions obtained by using equivalent alternatives or equivalent variations fall within the protection scope of the present invention.
Claims (7)
1. A transparent flexible antenna board is characterized by comprising 8 layers which are as follows from top to bottom:
an upper protective film with a thickness of 15-50 μm;
a transparent adhesive layer with a thickness of 15-30 μm;
a surface blackening layer with a thickness of 0.1-0.3 μm;
a copper conductor layer with a thickness of 0.5-1 μm;
a back blackening layer with a thickness of 0.1-0.3 μm;
a PET dielectric layer or COP dielectric layer with the thickness of 25-50 μm;
an acrylic glue layer with the thickness of 25-50 mu m;
a lower protective film with a thickness of 50-100 μm.
2. The transparent flexible antenna board according to claim 1, wherein the upper protective film is a PET film.
3. The transparent flexible antenna board of claim 1, wherein the transparent adhesive layer is 3M transparent OCA optical adhesive.
4. The transparent flexible antenna board according to claim 1, wherein the lower protective film is a PET film.
5. The method of manufacturing a transparent flexible antenna sheet according to any of claims 1 to 4, comprising the steps of:
step 1: attaching a layer of photosensitive dry film on the surface of the PET single-sided copper foil or the COP single-sided copper foil;
step 2: using a negative film pattern, and irradiating the photosensitive dry film by using ultraviolet rays to complete pattern transfer;
and step 3: sequentially developing, etching and stripping the copper foil after the pattern transfer is completed on a DES production line;
and 4, step 4: performing blackening treatment on the surface and the bottom surface of the COPPER foil by using OPC BLACK COPPER/OPC BLACK KEEP, and performing anti-discoloration treatment on the BLACK film by using OPC BLACK KEEP;
and 5: silk-screen printing 3M transparent OCA optical cement on the top surface of a product by a 120T screen printing plate through a printing machine;
step 6: processing the acrylic adhesive with the protective film into a required shape, and attaching the acrylic adhesive to the bottom surface of a product;
and 7: attaching a protective film on the top surface of the product;
and 8: and punching the product into a required shape by using a punch and a die.
6. The method according to claim 5, wherein in step 3, the solution used for development is Na having a concentration of 1.0 w/v%2CO3And (3) solution.
7. The method of claim 5, wherein in step 3, the solution used for stripping is NaOH solution with concentration of 4 w/v%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010033826.3A CN111129743A (en) | 2020-01-13 | 2020-01-13 | Transparent flexible antenna board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010033826.3A CN111129743A (en) | 2020-01-13 | 2020-01-13 | Transparent flexible antenna board and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111129743A true CN111129743A (en) | 2020-05-08 |
Family
ID=70490418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010033826.3A Pending CN111129743A (en) | 2020-01-13 | 2020-01-13 | Transparent flexible antenna board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111129743A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928954A (en) * | 2022-06-08 | 2022-08-19 | 深圳市志凌伟业光电有限公司 | Processing method of indoor transparent compatible 5G antenna and electromagnetic shielding film |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811862A (en) * | 2014-02-17 | 2014-05-21 | 东莞劲胜精密组件股份有限公司 | Manufacturing method of transparent antenna |
| CN203850428U (en) * | 2014-03-27 | 2014-09-24 | 上海安费诺永亿通讯电子有限公司 | Novel transparent antenna device |
| CN106662950A (en) * | 2014-09-24 | 2017-05-10 | 株式会社Lg化学 | Conductive structure and a preparation method therefor |
| CN107248618A (en) * | 2017-04-26 | 2017-10-13 | 深圳市金立通信设备有限公司 | Shell production method after decorative membrance, rear shell, terminal and terminal |
| CN107430467A (en) * | 2015-03-27 | 2017-12-01 | 富士胶片株式会社 | Touch sensor and contact panel |
| CN107646095A (en) * | 2015-05-22 | 2018-01-30 | 三星电子株式会社 | Display module and its manufacture method |
| CN207781861U (en) * | 2017-09-12 | 2018-08-28 | 上海安费诺永亿通讯电子有限公司 | A kind of vehicle-mounted transparent flexible two-in-one antenna component and automobile |
| WO2019039877A1 (en) * | 2017-08-24 | 2019-02-28 | 동우화인켐 주식회사 | Film antenna and display device comprising same |
| US20190148821A1 (en) * | 2017-11-14 | 2019-05-16 | GM Global Technology Operations LLC | Method and apparatus to conceal near transparent conductors |
| US10319116B1 (en) * | 2014-12-02 | 2019-06-11 | Amazon Technologies, Inc. | Dynamic color adjustment of electronic content |
| CN110565123A (en) * | 2019-08-28 | 2019-12-13 | 清华大学 | Manufacturing method and device of transferable transparent flexible breathable antenna |
| US20200006053A1 (en) * | 2013-05-17 | 2020-01-02 | Microcontinuum, Inc. | Tools and methods for producing nanoantenna electronic devices |
-
2020
- 2020-01-13 CN CN202010033826.3A patent/CN111129743A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200006053A1 (en) * | 2013-05-17 | 2020-01-02 | Microcontinuum, Inc. | Tools and methods for producing nanoantenna electronic devices |
| CN103811862A (en) * | 2014-02-17 | 2014-05-21 | 东莞劲胜精密组件股份有限公司 | Manufacturing method of transparent antenna |
| CN203850428U (en) * | 2014-03-27 | 2014-09-24 | 上海安费诺永亿通讯电子有限公司 | Novel transparent antenna device |
| CN106662950A (en) * | 2014-09-24 | 2017-05-10 | 株式会社Lg化学 | Conductive structure and a preparation method therefor |
| US10319116B1 (en) * | 2014-12-02 | 2019-06-11 | Amazon Technologies, Inc. | Dynamic color adjustment of electronic content |
| CN107430467A (en) * | 2015-03-27 | 2017-12-01 | 富士胶片株式会社 | Touch sensor and contact panel |
| CN107646095A (en) * | 2015-05-22 | 2018-01-30 | 三星电子株式会社 | Display module and its manufacture method |
| CN107248618A (en) * | 2017-04-26 | 2017-10-13 | 深圳市金立通信设备有限公司 | Shell production method after decorative membrance, rear shell, terminal and terminal |
| WO2019039877A1 (en) * | 2017-08-24 | 2019-02-28 | 동우화인켐 주식회사 | Film antenna and display device comprising same |
| CN207781861U (en) * | 2017-09-12 | 2018-08-28 | 上海安费诺永亿通讯电子有限公司 | A kind of vehicle-mounted transparent flexible two-in-one antenna component and automobile |
| US20190148821A1 (en) * | 2017-11-14 | 2019-05-16 | GM Global Technology Operations LLC | Method and apparatus to conceal near transparent conductors |
| CN110565123A (en) * | 2019-08-28 | 2019-12-13 | 清华大学 | Manufacturing method and device of transferable transparent flexible breathable antenna |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928954A (en) * | 2022-06-08 | 2022-08-19 | 深圳市志凌伟业光电有限公司 | Processing method of indoor transparent compatible 5G antenna and electromagnetic shielding film |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102238809B (en) | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof | |
| US20170177108A1 (en) | Transparent conductive component with interconnect circiut tab comprising cured organic polymeric material | |
| US20140036465A1 (en) | Packaging substrate, method for manufacturing same, and chip packaging body having same | |
| CN206481556U (en) | Have the high shielding EMI screened films of black polyamide thin film | |
| CN105263263A (en) | Processing technology optimization method of ultrathin flexible plate | |
| CN108495486A (en) | A kind of production method and High speed rear panel of High speed rear panel | |
| CN111129743A (en) | Transparent flexible antenna board and manufacturing method thereof | |
| CN105722317B (en) | Rigid-flexible combination printed circuit board and preparation method thereof | |
| CN111642068A (en) | RCC substrate and multi-layer laminated flexible board | |
| CN108621513A (en) | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material | |
| CN101146406B (en) | Shaping method for flexible printing line circuit | |
| CN206497882U (en) | Nano metal substrate for ultra fine-line FPC and COF material | |
| CN112437598B (en) | High-shielding electromagnetic interference shielding film of multi-aperture copper foil and preparation method thereof | |
| CN206644406U (en) | Nano metal substrate for ultra fine-line FPC and COF material | |
| CN103009713A (en) | Thermal compression bonding copper-clad plate by adopting polymethyl methacrylate as medium, printed circuit board as well as manufacturing method thereof | |
| CN101626661A (en) | Method for manufacturing double-side hollowed-out plates | |
| SE7907298L (en) | PROCEDURE FOR MANUFACTURING PRINTED CIRCUITS WITH MULTIPLE LAYERS | |
| CN202998642U (en) | Multilayer printed circuit board | |
| CN108430156A (en) | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material | |
| CN203032024U (en) | Hot-pressed copper-clad board and printed circuit board adopting polymethyl methacrylate as medium | |
| CN207766662U (en) | A kind of flexible circuit board containing ladder circuit | |
| CN219338871U (en) | Solder resist dry film for packaging carrier plate | |
| CN214381548U (en) | Mistake proofing multilayer circuit board structure | |
| CN111586967A (en) | Copper-clad circuit board and preparation method thereof | |
| CN219627987U (en) | Flexible printed circuit board structure, device and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200508 |
|
| RJ01 | Rejection of invention patent application after publication |