CN111129679B - 微波电路中金丝键合慢波匹配结构的设计制作方法 - Google Patents
微波电路中金丝键合慢波匹配结构的设计制作方法 Download PDFInfo
- Publication number
- CN111129679B CN111129679B CN202010033685.5A CN202010033685A CN111129679B CN 111129679 B CN111129679 B CN 111129679B CN 202010033685 A CN202010033685 A CN 202010033685A CN 111129679 B CN111129679 B CN 111129679B
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- slow wave
- wave matching
- line
- matching circuit
- microstrip line
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- 238000013461 design Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000000034 method Methods 0.000 title claims description 19
- 230000005540 biological transmission Effects 0.000 claims description 92
- 239000000758 substrate Substances 0.000 claims description 58
- 238000004364 calculation method Methods 0.000 claims description 10
- 238000011156 evaluation Methods 0.000 claims description 10
- 238000004088 simulation Methods 0.000 abstract description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6605—High-frequency electrical connections
- H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6644—Packaging aspects of high-frequency amplifiers
- H01L2223/6655—Matching arrangements, e.g. arrangement of inductive and capacitive components
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Waveguides (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010033685.5A CN111129679B (zh) | 2020-01-13 | 2020-01-13 | 微波电路中金丝键合慢波匹配结构的设计制作方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010033685.5A CN111129679B (zh) | 2020-01-13 | 2020-01-13 | 微波电路中金丝键合慢波匹配结构的设计制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN111129679A CN111129679A (zh) | 2020-05-08 |
CN111129679B true CN111129679B (zh) | 2024-06-11 |
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Family Applications (1)
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CN202010033685.5A Active CN111129679B (zh) | 2020-01-13 | 2020-01-13 | 微波电路中金丝键合慢波匹配结构的设计制作方法 |
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CN (1) | CN111129679B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111834720A (zh) * | 2020-07-10 | 2020-10-27 | 北京邮电大学 | 一种基于多枝节匹配的金丝键合结构和多芯片微波电路 |
CN112786407B (zh) * | 2020-12-29 | 2023-03-24 | 成都天成电科科技有限公司 | Ka波段的慢波结构开关芯片 |
Citations (10)
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---|---|---|---|---|
US3414756A (en) * | 1965-12-28 | 1968-12-03 | Sfd Lab Inc | Impedance matched periodic microwave circuits and tubes using same |
US3684913A (en) * | 1970-09-03 | 1972-08-15 | Varian Associates | Coupled cavity slow wave circuit for microwave tubes |
US3925738A (en) * | 1974-11-08 | 1975-12-09 | Us Army | Rail or pedestal mounted meander line circuit for crossed-field amplifiers |
CN104600403A (zh) * | 2015-01-08 | 2015-05-06 | 电子科技大学 | 基于共面波导传输线的太赫兹三倍频器 |
CN107833815A (zh) * | 2017-10-30 | 2018-03-23 | 电子科技大学 | 一种平面角度对数曲折的带状慢波系统 |
CN108389766A (zh) * | 2018-03-01 | 2018-08-10 | 电子科技大学 | 一种微带周期曲折线慢波结构 |
CN108461885A (zh) * | 2018-03-23 | 2018-08-28 | 南京邮电大学 | 一种采用交叉金丝键合线的慢波结构功分器 |
CN109193160A (zh) * | 2018-08-09 | 2019-01-11 | 北京北斗星通导航技术股份有限公司深圳分公司 | 一种新型移相器 |
CN109904049A (zh) * | 2019-03-22 | 2019-06-18 | 电子科技大学 | 一种对称脊加载共形微带曲折线慢波装置 |
CN210723306U (zh) * | 2020-01-13 | 2020-06-09 | 成都理工大学 | 慢波匹配电路和金丝键合慢波匹配结构 |
-
2020
- 2020-01-13 CN CN202010033685.5A patent/CN111129679B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3414756A (en) * | 1965-12-28 | 1968-12-03 | Sfd Lab Inc | Impedance matched periodic microwave circuits and tubes using same |
US3684913A (en) * | 1970-09-03 | 1972-08-15 | Varian Associates | Coupled cavity slow wave circuit for microwave tubes |
US3925738A (en) * | 1974-11-08 | 1975-12-09 | Us Army | Rail or pedestal mounted meander line circuit for crossed-field amplifiers |
CN104600403A (zh) * | 2015-01-08 | 2015-05-06 | 电子科技大学 | 基于共面波导传输线的太赫兹三倍频器 |
CN107833815A (zh) * | 2017-10-30 | 2018-03-23 | 电子科技大学 | 一种平面角度对数曲折的带状慢波系统 |
CN108389766A (zh) * | 2018-03-01 | 2018-08-10 | 电子科技大学 | 一种微带周期曲折线慢波结构 |
CN108461885A (zh) * | 2018-03-23 | 2018-08-28 | 南京邮电大学 | 一种采用交叉金丝键合线的慢波结构功分器 |
CN109193160A (zh) * | 2018-08-09 | 2019-01-11 | 北京北斗星通导航技术股份有限公司深圳分公司 | 一种新型移相器 |
CN109904049A (zh) * | 2019-03-22 | 2019-06-18 | 电子科技大学 | 一种对称脊加载共形微带曲折线慢波装置 |
CN210723306U (zh) * | 2020-01-13 | 2020-06-09 | 成都理工大学 | 慢波匹配电路和金丝键合慢波匹配结构 |
Non-Patent Citations (4)
Title |
---|
Bandwidth expansion and slow-wave effect achievement of bond wire interconnection on LTCC substrate;Bo Zhou等;《2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)》;20120611;1-4 * |
微带型曲折线慢波结构的理论研究;张大勇等;《中国电子学会真空电子学分会第十五届学术年会暨军用微波管研讨会》;20170130;436-439 * |
石墨烯与肖特基二极管对的倍频频谱对比分析;盛浩轩;《2019年全国微波毫米波会议论文集》;20190519;218-220 * |
移相器的小型化及超宽带技术的研究;安森松;全国优秀硕士学位论文全文数据库》;20170315;21-58 * |
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CN111129679A (zh) | 2020-05-08 |
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Inventor after: Chen Chuan Inventor after: Fang Yong Inventor after: Sheng Haoxuan Inventor after: Guo Yong Inventor after: Guo Tingting Inventor after: Zhong Xiaoling Inventor after: Duo Bin Inventor before: Fang Yong Inventor before: Sheng Haoxuan Inventor before: Guo Yong Inventor before: Guo Tingting Inventor before: Zhong Xiaoling Inventor before: Duo Bin |
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