CN111093991B - 导热性片材、使用了其的安装方法及使用了其的接合方法 - Google Patents
导热性片材、使用了其的安装方法及使用了其的接合方法 Download PDFInfo
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- CN111093991B CN111093991B CN201980004162.3A CN201980004162A CN111093991B CN 111093991 B CN111093991 B CN 111093991B CN 201980004162 A CN201980004162 A CN 201980004162A CN 111093991 B CN111093991 B CN 111093991B
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- thermal conductive
- conductive sheet
- uncured composition
- reaction catalyst
- curing reaction
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Images
Classifications
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Abstract
本发明的导热性片材在含有固化反应催化剂的导热性片材(1)的至少一个主表面上接合有不含固化反应催化剂的导热性未固化组合物(2),上述含有固化反应催化剂的导热性片材(1)含有为了使上述导热性未固化组合物固化所需量的固化反应催化剂。本发明的安装方法是在含有固化反应催化剂的导热性片材(2)的至少一个主表面上接合不含固化反应催化剂的导热性未固化组合物(1),通过上述含有固化反应催化剂的导热性片材(1)的固化反应催化剂的扩散,使上述导热性未固化组合物固化。由此,在即将安装于电子部件等之前,能够将导热性未固化组合物与导热性片材接合,容易追随于发热部和/或散热部的凹凸,在安装后能够将上述未固化组合物固化。
Description
技术领域
本发明涉及在即将安装于电气/电子部件等之前能够将未固化组合物涂布和/或加压压接于含有固化催化剂的导热性片材上的导热性片材、使用了其的安装方法及使用了其的接合方法。
背景技术
近年来的CPU等半导体的性能提高惊人,伴随于此,发热量也变得巨大。因此,在发热那样的电子部件上安装散热体,为了改善半导体与散热部的密合性而使用了导热性有机硅片材。伴随着设备的小型化、高性能化、高集成化,对于导热性有机硅片材,要求柔软性、高导热性能、薄型化。另外为了实现低制造成本,还追求自动安装化的要求。以往,作为加成反应型的导热性有机硅凝胶片材,提出了专利文献1~4等。
现有技术文献
专利文献
专利文献1:日本特开2017-125138号公报
专利文献2:日本特开2017-206678号公报
专利文献3:日本特开2017-005166号公报
专利文献4:日本特开2009-203373号公报
发明内容
发明所要解决的课题
但是,以往的加成反应型的导热性固化有机硅片材存在难以追随于发热部和/或散热部的凹凸的问题,需要改善。一液型或二液型的液状有机硅橡胶虽然对发热部和/或散热部的凹凸的追随性良好,但存在使用期限的限制、和在使用前混合、脱泡等处理变得繁杂的问题。润滑脂虽然对凹凸的追随也良好,但由于不固化,因此在长期使用时,有可能引起会造成泵出(pump out)等功能不全的重大问题。
本发明为了解决上述以往的问题,提供一种导热性片材、使用了其的安装方法及使用了其的接合方法,在即将安装于电子部件等之前,能够将未固化组合物贴合并层叠、或者加压压接、或者涂布于含有固化催化剂的导热性片材上,上述未固化组合物容易追随于发热部和/或散热部的凹凸,所述导热性片材含有在安装后能够将上述未固化组合物固化的固化催化剂。
用于解决课题的手段
本发明的导热性片材的特征在于,在含有固化反应催化剂的导热性片材的至少一个主表面上接合有不含固化反应催化剂的导热性未固化组合物,上述含有固化反应催化剂的导热性片材含有为了使上述导热性未固化组合物固化所需量的固化反应催化剂。
使用了本发明的导热性片材的安装方法的特征在于,其是使用了上述的导热性固化片材的安装方法,在含有固化反应催化剂的导热性片材的至少一个主表面上接合不含固化反应催化剂的导热性未固化组合物,通过上述含有固化反应催化剂的导热性片材的固化反应催化剂的扩散,使上述导热性未固化组合物固化。
使用了本发明的导热性片材的接合方法的特征在于,通过未固化组合物的固化后的粘合性,将上述未固化组合物和与上述未固化组合物接触的物体接合。
发明效果
本发明能够提供一种导热性片材、使用了其的安装方法及使用了其的电气/电子部件的接合方法,所述导热性片材在即将安装于电气/电子部件等之前,能够将导热性未固化组合物贴合并层叠于含有固化催化剂的导热性片材上,上述未固化组合物容易追随于发热部和/或散热部的凹凸,所述导热性片材在安装后能够将上述未固化组合物固化。即,在即将安装于电子部件等之前,能够将未固化组合物贴合于含有固化催化剂的导热性片材上,未固化组合物能够自由变形,能够追随于发热部和/或散热部的凹凸。另外,也可以将压接、涂布有未固化组合物的电气/电子部件压接于含有固化催化剂的导热性片材上,在安装后,通过含有固化催化剂的导热性片材内所含的加成反应催化剂,未固化组合物被固化。进而,热传导片材的表面能够吸引,能够实现使用了自动安装机的拾放(pick and place)安装。导热性片材与未固化组合物的层间通过固化而一体化。另外,电气/电子部件的接合也可简便地进行。
附图说明
图1是本发明的一个实施方式中的导热性有机硅橡胶片材的立体图。
图2A是该实施方式的有机硅凝胶未固化组合物的截面图,图2B是该实施方式的固化片材的截面图,图2C是表示安装于该实施方式的电子部件的发热部与散热器之间的状态的示意性截面图。
图3A是表示本发明的一个实施方式的将使用了自动安装机的拾放安装中的自动安装机前端部移动至导热性有机硅橡胶片材的表面的状态的说明图。
图3B是表示该实施方式的将自动安装机前端部的空气沿箭头的方向吸引而吸附固化片材的状态的说明图。
图3C是表示该实施方式的在吸附有导热性有机硅橡胶片材的状态下移动至搭载有电子部件的发热部的电子部件的上方的状态的说明图。
图3D是表示该实施方式的将导热性有机硅橡胶片材设置于上述电子部件上、将空气释放、在上述电子部件上安装有有机硅片材的状态的说明图。
图3E是表示该实施方式的将自动安装机前端部向上移动、结束了1个循环的状态的说明图。
图4A是表示本发明的另一个实施方式中的将未固化组合物从分配器挤出至导热性有机硅橡胶片材的表面的状态的示意性截面图,图4B是表示该实施方式的与电气/电子部件接合的状态的示意性截面图。
图5A是表示本发明的又一个实施方式中的将未固化组合物从分配器挤出至电气/电子部件的表面上的状态的示意性截面图,图5B是表示该实施方式的将未固化组合物与导热性有机硅橡胶片材的表面进行接合的状态的示意性截面图。
图6是表示本发明的一个实施方式中的将棒状的未固化组合物配置在托盘上而供给的状态的示意性立体图。
图7是表示本发明的另一个实施方式中的将未固化组合物放入管中而供给的状态的示意性立体图。
图8是表示本发明的又一个实施方式中的将带状的未固化组合物卷绕到绕线管上而供给的状态的示意性立体图。
图9A是本发明的一个实施方式中的电气/电子部件的示意性立体图,图9B是表示该实施方式的在电气/电子部件的表面挤出有未固化组合物的状态的示意性立体图,图9C是表示该实施方式的在金属板上粘贴有导热性有机硅橡胶片材的状态的示意性立体图,图9D是表示该实施方式的在导热性有机硅橡胶片材上压接有电气/电子部件的表面的未固化组合物的状态的示意性部分截面图。
图10A是本发明的又一个实施方式中的在电气/电子部件上配置有固化片材的示意性立体图,图10B是表示该实施方式的在金属板上分配有未固化组合物的状态的示意性立体图,图10C是表示该实施方式的在金属板上的未固化组合物上压接有电气/电子部件的固化片材侧的状态的示意性部分截面图。
图11A-B是表示本发明的一个实施例中的试样的热导率的测定方法的说明图。
具体实施方式
本发明是用于在含有固化催化剂的导热性片材的至少一个主表面上层叠不含有固化催化剂的导热性未固化组合物、并使上述未固化组合物固化的导热性片材。在含有固化催化剂的导热性片材内,包含用于将未固化组合物固化的加成反应系催化剂。而且,在即将安装于电气/电子部件等之前,能够将未固化组合物接合或涂布等在导热性片材上。未固化组合物能够自由变形,容易追随于发热部和/或散热部的凹凸。另外,在安装后,通过含有固化催化剂的导热性片材内所含的加成反应或缩合反应催化剂,未固化组合物被固化。进而,即使在将未固化组合物与含有加成反应或缩合反应催化剂的导热性片材接合后,导热性片材的表面也能够吸引,能够实现使用了自动安装机的拾放安装。
通过含有固化催化剂的导热性片材内所含的固化催化剂而固化的未固化组合物的固化机理可以是脱醋酸、脱肟、脱醇等缩合型、利用羟基化的加成反应固化型中的任一者,但由于没有向周边的腐蚀性、放出到系统外的副产物少、可靠地固化至深部等理由,优选为加成反应固化型。
加成反应系催化剂优选为铂族金属催化剂。作为铂族金属催化剂,可以使用作为氢硅化反应中使用的催化剂而公知的催化剂。例如可列举出铂黑、氯化铂、氯化铂酸、氯化铂酸与一元醇的反应产物、氯化铂酸与烯烃类或乙烯基硅氧烷的络合物、双乙酰乙酸铂等铂系催化剂、钯系催化剂、铑系催化剂等铂族金属催化剂。
用于将上述未固化组合物固化的加成反应系催化剂量相对于聚合物成分优选为1~3500ppm,更优选为5~2000ppm,进一步优选为7~700ppm。若将含有固化催化剂的导热性片材与未固化组合物进行涂布和/或加压压接,则含有固化催化剂的导热性片材内的反应催化剂使未固化组合物固化。该机理基于含有固化催化剂的导热性片材中所含有的反应催化剂渗透、扩散至未固化组合物中并使未固化组合物固化。因此,导热性片材与未固化组合物的层间通过固化而一体化。
含有固化催化剂的导热性片材优选为由选自有机硅树胶(silicone gum)、有机硅橡胶(silicone rubber)、有机硅凝胶、天然橡胶、合成橡胶及石蜡中的至少一种材质形成的片材。它们可以是固化物,也可以未固化,但从长期可靠性的观点出发,优选为固化片材。另外,有机硅橡胶固化片材及有机硅凝胶固化片材由于耐热性高,所以进一步优选。
未固化组合物优选为选自未固化的有机硅树胶、有机硅橡胶、有机硅凝胶、有机硅润滑脂、有机硅油的涂敷体、粘接有机硅橡胶、天然橡胶、合成橡胶及石蜡中的至少一种的未固化组合物。其中,未固化的有机硅橡胶、有机硅凝胶、有机硅润滑脂、有机硅油、粘接有机硅橡胶由于耐热性高,所以进一步优选。
在含有固化催化剂的导热性(固化)片材及未固化组合物中,优选混合有导热性填料。导热性填料有电传导性填料、电绝缘性填料等,可以是任一种。作为电传导性的填料,有炭黑等碳粉末或金属粉末。在金属粉末的情况下,表面电阻为1Ω/□以下的物质较好,具体而言,优选使用由金、银、铂、铜、镍、铁、钯、钴、铬、铝等金属类或不锈钢等合金类形成的粉末、或为了降低电阻而将表面用金、银等贵金属覆盖而得到的金属粉末。作为电绝缘性填料,优选氧化铝、氧化锌、氧化镁、氮化铝、氮化硼、氢氧化铝、石英或二氧化硅。形状可以使用球状、鳞片状、多面体状等各种形状。在使用氧化铝的情况下,优选纯度为99.5重量%以上的α-氧化铝。导热性粒子的比表面积优选为0.06~10m2/g的范围。比表面积为BET比表面积,测定方法按照JIS R1626。在使用平均粒径的情况下,优选0.1~100μm的范围。平均粒径为在利用激光衍射光散射法的粒度分布测定中基于体积基准的累积粒度分布的D50(中值粒径)。作为其测定器,例如有堀场制作所社制的激光衍射/散射式粒子分布测定装置LA-950S2。上述有机硅片材的热导率优选为0.5W/mK以上。优选的热导率为0.7W/mK以上。
含有固化催化剂的导热性片材的厚度优选为0.1~1.5mm。关于未固化物的厚度,若为片材状则优选为0.5~3.0mm。另外,若为棒状则直径优选为0.5~3.0mm,长度优选为50~300mm,若为带状则厚度优选为0.5~3.0mm,宽度优选为5~50mm,若涂抹,则厚度优选为0.5~3.0mm。若为上述的范围,则方便组装入发热性电气/电子部件中。
优选在含有固化催化剂的导热性片材的上下表面配置有覆盖膜。若在上下表面配置有覆盖膜,则处理性良好,还具有作为有机硅片材的保护的功能。在将该有机硅片材使用自动安装机进行拾放安装时,将上述上下表面的覆盖膜中的至少一个剥离,排列于载带之上供给至自动安装机。
导热性未固化组合物优选具有固化后粘合性。若在固化后具有粘合性,则通过未固化组合物的固化后的粘合性,能够将上述未固化组合物和与上述未固化组合物接触的物体接合。上述导热性未固化组合物的固化后的粘合性以Tackiness Checker(粘力计)计优选为0.5N以上,更优选为1.0N以上,进一步优选为1.5N以上。
上述导热性未固化组合物优选为腻子片材(putty sheet)、带、或从选自分配器、注射器及管中的至少一种容器挤出的状态。因此,上述导热性未固化组合物以腻子片材、带、收纳于分配器中、收纳于注射器中及收纳于管中的状态被供给至安装工序。
本发明的安装方法作为一个例子有下述的方法。
(1)在含有固化反应催化剂的导热性片材的至少一个主表面上接合导热性未固化组合物,在该状态下组装入电气/电子部件中,然后,通过含有固化反应催化剂的导热性片材内的反应催化剂使未固化组合物固化。
(2)将接合有导热性未固化组合物的电气/电子部件压接在含有固化反应催化剂的导热性片材的至少一个主表面上,然后,通过含有固化反应催化剂的导热性片材内的反应催化剂使未固化组合物固化。
(3)将接合有含有固化反应催化剂的导热性片材的电气/电子部件压接于导热性未固化组合物上,然后,通过含有固化反应催化剂的导热性片材内的反应催化剂使导热性未固化组合物固化。
使未固化组合物固化的时间优选在室温下为4~48小时,更优选在室温下为12~24小时。若为上述的范围,则可谋求安装的效率化。作为一个例子,将使含有固化催化剂的导热性片材与未固化组合物贴合层叠而得到的有机硅片材使用自动安装机进行拾放安装。该装置例如可以使用空气压力吸脱附式拾放。
未固化组合物优选为下述组成的混合物(compound)。
(A)基础聚合物成分:在1分子中含有平均2个以上且键合在分子链两末端的硅原子上的烯基的直链状有机聚硅氧烷:100重量份
(B)交联成分:在1分子中含有平均2个以上的键合在硅原子上的氢原子的有机氢聚硅氧烷:相对于上述A成分中的硅原子键合烯基1摩尔为低于1摩尔的量
(C)导热性粒子:相对于A成分100重量份为100~3000重量份
含有固化催化剂的导热性有机硅片材优选下述混合物。
(D)基础聚合物:加成反应固化型或过氧化物固化型有机硅橡胶或有机硅凝胶100重量份
(E)铂系金属催化剂:相对于D成分以重量单位计为1~3500ppm(固化有效量的10~35000倍)。
(F)导热性粒子:相对于D成分100重量份为100~3000重量份
以下,对各成分进行说明。
(1)基础聚合物成分(A成分)
基础聚合物成分是在一分子中含有2个以上的键合在硅原子上的烯基的有机聚硅氧烷,含有2个烯基的有机聚硅氧烷为本发明的未固化组合物中的主剂(基础聚合物成分)。该有机聚硅氧烷中,作为烯基,在一分子中具有2个乙烯基、烯丙基等碳原子数为2~8、特别是2~6的键合在硅原子上的烯基。从作业性、固化性等出发,优选粘度在25℃下为10~1000000mPa·s、特别是100~100000mPa·s。
具体而言,使用下述通式(化学式1)所表示的在1分子中含有平均2个以上且键合在分子链末端的硅原子上的烯基的有机聚硅氧烷。25℃下的粘度为10~1000000mPa·s的有机聚硅氧烷从作业性、固化性等出发是优选的。需要说明的是,该直链状有机聚硅氧烷也可以是在分子链中含有少量的支链状结构(三官能性硅氧烷单元)的有机聚硅氧烷。
[化学式1]
式中,R1为彼此相同或异种的不具有脂肪族不饱和键的非取代或取代一价烃基,R2为烯基,k为0或正的整数。其中,作为R1的不具有脂肪族不饱和键的非取代或取代的一价烃基,例如优选碳原子数为1~10、特别是1~6的一价烃基,具体而言,可列举出甲基、乙基、丙基、异丙基、丁基、异丁基、叔丁基、戊基、新戊基、己基、环己基、辛基、壬基、癸基等烷基;苯基、甲苯基、二甲苯基、萘基等芳基;苄基、苯基乙基、苯基丙基等芳烷基;以及将这些基团的氢原子的一部分或全部用氟、溴、氯等卤素原子、氰基等取代而得到的基团例如氯甲基、氯丙基、溴乙基、三氟丙基等卤素取代烷基、氰乙基等。作为R2的烯基,例如优选碳原子数为2~6、特别是2~3的烯基,具体而言,可列举出乙烯基、烯丙基、丙烯基、异丙烯基、丁烯基、异丁烯基、己烯基、环己烯基等,优选为乙烯基。在通式(1)中,k一般为满足0≤k≤10000的0或正的整数,优选为满足5≤k≤2000、更优选为满足10≤k≤1200的整数。
作为A成分的有机聚硅氧烷,也可以并用在一分子中具有3个以上、通常3~30个、优选3~20个左右的例如乙烯基、烯丙基等碳原子数为2~8、特别是2~6的键合在硅原子上的烯基的有机聚硅氧烷。分子结构可以是直链状、环状、支链状、三维网状中的任一种分子结构。优选为主链包含二有机硅氧烷单元的重复、分子链两末端被三有机硅烷氧基封链的25℃下的粘度为10~1000000mPa·s、特别是100~100000mPa·s的直链状有机聚硅氧烷。
烯基只要键合在分子的某一部分上即可。例如也可以包含键合在分子链末端、或分子链非末端(分子链途中)的硅原子上的烯基。其中,下述通式(化学式2)所表示的在分子链两末端的硅原子上分别具有1~3个烯基(其中,在键合在该分子链末端的硅原子上的烯基在两末端合计低于3个的情况下,具有至少1个键合在分子链非末端(分子链途中)的硅原子上的烯基(例如作为二有机硅氧烷单元中的取代基)的直链状有机聚硅氧烷、并且也如上文所述的那样25℃下的粘度为10~1,000,000mPa·s的有机聚硅氧烷从作业性、固化性等出发是优选的。需要说明的是,该直链状有机聚硅氧烷也可以是在分子链中含有少量的支链状结构(三官能性硅氧烷单元)的直链状有机聚硅氧烷。
[化学式2]
式中,R3为彼此相同或异种的非取代或取代一价烃基,至少1个为烯基。R4为彼此相同或异种的不具有脂肪族不饱和键的非取代或取代一价烃基,R5为烯基,l、m为0或正的整数。其中,作为R3的一价烃基,优选碳原子数为1~10、特别是1~6的一价烃基,具体而言,可列举出甲基、乙基、丙基、异丙基、丁基、异丁基、叔丁基、戊基、新戊基、己基、环己基、辛基、壬基、癸基等烷基;苯基、甲苯基、二甲苯基、萘基等芳基、苄基、苯基乙基、苯基丙基等芳烷基;乙烯基、烯丙基、丙烯基、异丙烯基、丁烯基、己烯基、环己烯基、辛烯基等烯基;或将这些基团的氢原子的一部分或全部用氟、溴、氯等卤素原子、氰基等取代而得到的基团例如氯甲基、氯丙基、溴乙基、三氟丙基等卤素取代烷基或氰乙基等。
另外,作为R4的一价烃基,也优选碳原子数为1~10、特别是1~6的一价烃基,可例示出与上述R1的具体例子同样的一价烃基,但不包含烯基。作为R5的烯基,例如优选碳数为2~6、特别是碳数为2~3的烯基,具体而言可例示出与上述式(化学式1)的R2相同的烯基,优选为乙烯基。
l、m一般为满足0<l+m≤10000的0或正的整数,优选满足5≤l+m≤2000、更优选10≤l+m≤1200、并且0<l/(l+m)≤0.2、优选0.0011≤l/(l+m)≤0.1的整数。
(2)交联成分(B成分)
本发明的B成分的有机氢聚硅氧烷是作为交联剂起作用的成分,是通过该成分中的SiH基与A成分中的烯基进行加成反应(氢硅化)而形成固化物的成分。所述有机氢聚硅氧烷只要是在一分子中具有2个以上键合在硅原子上的氢原子(即SiH基)则可以是任意的有机氢聚硅氧烷,该有机氢聚硅氧烷的分子结构可以是直链状、环状、支链状、三维网状结构中的任一种,可以使用一分子中的硅原子的数目(即聚合度)为2~1000、特别是2~300左右的有机氢聚硅氧烷。
[化学式3]
上述的式中,R6为彼此相同或异种的氢、烷基、苯基、环氧基、丙烯酰基、甲基丙烯酰基、烷氧基,至少2个为氢。L为0~1,000的整数、特别是0~300的整数,M为1~200的整数。
(3)催化剂成分(E成分)
E成分的催化剂成分可以使用氢硅化反应中使用的催化剂。例如可列举出铂黑、氯化铂、氯化铂酸、氯化铂酸与一元醇的反应产物、氯化铂酸与烯烃类或乙烯基硅氧烷的络合物、双乙酰乙酸铂等铂系催化剂、钯系催化剂、铑系催化剂等铂族金属催化剂。优选相对于D成分以重量单位计添加1~3500ppm(固化有效量的10~35000倍)。
(4)导热性粒子(C及F成分)
C及F成分的导热性粒子相对于作为基体成分的A成分100重量份优选添加100~3000重量份。由此能够较高地保持热导率。作为热传导粒子,优选为选自氧化铝、氧化锌、氧化镁、氮化铝、氮化硼、氢氧化铝、石英及二氧化硅中的至少一种。形状可以使用球状、鳞片状、多面体状等各种形状。在使用氧化铝的情况下,优选纯度为99.5重量%以上的α-氧化铝。导热性粒子的比表面积优选为0.06~10m2/g的范围。比表面积为BET比表面积,测定方法按照JIS R1626。在使用平均粒径的情况下,优选为0.1~100μm的范围。粒径的测定通过激光衍射光散射法来测定中值粒径。作为其测定器,例如有堀场制作所制社制的激光衍射/散射式粒子分布测定装置LA-950S2。
导热性粒子也可以将平均粒径不同的至少2种无机粒子并用。这是因为若像这样操作,则小粒径的导热性无机粒子埋入大粒径之间,能够以接近最密填充的状态填充,导热性变高。
无机粒子优选经RaSi(OR’)3-a(R为碳数为1~20的非取代或取代有机基团,R’为碳数为1~4的烷基,a为0或1)所示的硅烷化合物、或其部分水解物进行表面处理。关于RaSi(OR’)3-a(R为碳数为1~20的非取代或取代有机基团、R’为碳数1~4的烷基、a为0或1)所示的烷氧基硅烷化合物(以下简称为“硅烷”),作为一个例子,有甲基三甲氧基硅烷、乙基三甲氧基硅烷、丙基三甲氧基硅烷、丁基三甲氧基硅烷、戊基三甲氧基硅烷、己基三甲氧基硅烷、己基三乙氧基硅烷、辛基三甲氧基硅烷、辛基三乙氧基硅烷、癸基三甲氧基硅烷、癸基三乙氧基硅烷、十二烷基三甲氧基硅烷、十二烷基三乙氧基硅烷、十六烷基三甲氧基硅烷、十六烷基三乙氧基硅烷、十八烷基三甲氧基硅烷、十八烷基三乙氧基硅烷等硅烷化合物。上述硅烷化合物可以使用一种或将两种以上混合使用。作为表面处理剂,也可以将烷氧基硅烷与单末端硅烷醇硅氧烷并用。这里所谓的表面处理,除了共价键合以外,还包含吸附等。关于平均粒径为2μm以上的粒子,在将粒子整体设为100重量%时,优选添加50重量%以上。
(5)加成反应固化型或过氧化物固化型有机硅橡胶或有机硅凝胶(D成分)
所适用的热固化型有机硅橡胶或凝胶可以适用二甲基有机硅橡胶或凝胶、甲基乙烯基有机硅橡胶或凝胶、甲基苯基乙烯基有机硅橡胶或凝胶、氟有机硅橡胶或凝胶等。一般在有机硅橡胶或凝胶中,根据需要使用了各种填充剂、添加剂,它们也没有特别限制,也可以使用硅胶、以AEROSIL#200(商品名)为代表的增强性二氧化硅、以Celite为代表的硅藻土、以及根据需要的加工助剂或阻燃赋予剂、耐热性提高剂、增塑性、颜料等添加剂。另外,有机硅橡胶或凝胶的固化体系可以使用加成反应固化型、过氧化物固化型中的任一种,另外,也可以不固化。
(6)其他的成分
在本发明的组合物中,根据需要可以配合上述以外的成分。例如也可以添加氧化铁红、氧化钛、氧化铈等耐热提高剂、阻燃助剂、用于填料的表面处理等的烷基三烷氧基硅烷等。作为出于填料表面处理等目的而添加的材料,也可以添加含烷氧基的有机硅。也可以添加硅烷偶联剂等粘接促进剂。出于着色、调色的目的,也可以添加有机或无机颜料。
以下使用附图进行说明。在以下的附图中,同一符号表示同一物。图1是本发明的一个实施方式中的有机硅凝胶片材的立体图。该有机硅凝胶片材在即将安装于发热性电子部件之前在固化片材1的表面接合不含有固化催化剂的未固化片材2、之后被安装。在固化片材1内,由于过量地包含用于将未固化片材2固化的加成反应系催化剂,所以在安装后,例如在室温、24小时的情况下,未固化片材2也固化。
图2A是有机硅凝胶未固化组合物2的截面图,图2B是固化片材1的截面图,图2C是表示安装于电子部件5的发热部的状态的示意性截面图。固化片材1及未固化片材2分别通过保护膜3a、3b、4a、4b保护,在即将安装于发热性电子部件5之前,保护膜3b、4a被剥离、层叠。保护膜例如使用聚酯(PET)膜。在安装时,未固化片材2能够自由变形,追随于发热性电子部件5的凹凸而变形。在未固化片材2侧也可以组装散热器6。由于在固化片材1内过量地包含用于将未固化片材2固化的加成反应系催化剂,因此在安装后、例如在室温、24小时的情况下,未固化片材2也固化。
图3A-图3E是使用了本发明的一个实施方式的自动安装机的拾放安装的工序图。
(1)图3A是表示将自动安装机7移动至有机硅片材1的表面的状态的说明图。在固化片材1的下表面接合有未固化片材2。固化片材1与未固化组合物2的层叠体被排列在载带(图示省略)上,1片1片地被送至左侧。在右侧的离开的位置,在布线基板10上配置有搭载有CPU的电子部件11。
(2)图3B是表示将自动安装机前端部7的空气沿箭头8的方向吸引而吸附有固化片材1的状态的说明图。在固化片材1的下方接合有未固化组合物2。
(3)图3C是表示以吸附有固化片材1的状态移动至搭载CPU的电子部件11的上方的状态的说明图。
(4)图3D是表示将固化片材1设置于电子部件11上、将空气如箭头9中所示的那样释放、在电子部件11上安装固化片材1和未固化组合物2的状态的说明图。
(5)图3E是表示将自动安装机前端部7向上移动、结束了1个循环的状态的说明图。
图4A是表示本发明的另一个实施方式中的将未固化组合物13b从分配器12挤出至导热性有机硅橡胶固化片材1的表面的状态的示意性截面图。在导热性有机硅橡胶固化片材1中过量地包含用于将未固化组合物13b固化的加成反应系催化剂。固化片材1贴合于散热器6上。以在分配器12中收纳有未固化组合物13a的状态被供给至安装工序。图4B是通过在未固化组合物上放置电气/电子部件14并进行压接而形成未固化组合物层13c的示意性截面图。若未固化组合物层13c以该状态固化,则固化片材1与电气/电子部件14被接合。
图5A是表示本发明的又一个实施方式中的将未固化组合物13b从分配器12挤出至电气/电子部件15的表面的状态的示意性截面图,图5B是表示该实施方式的将未固化组合物13c与导热性有机硅橡胶片材1的表面接合的状态的示意性截面图。即使如电气/电子部件15那样在表面具有凹凸,未固化组合物13c也追随。
图6-8是说明将未固化组合物供给至安装工序的状态的图。图6是表示本发明的一个实施方式中的将棒状的未固化组合物17配置在托盘16上而供给的状态的示意性立体图。图7是表示本发明的另一个实施方式中的将未固化组合物放入管18中而供给的状态的示意性立体图。图8是表示本发明的又一个实施方式中的将带状的未固化组合物20卷绕到绕线管19上而供给的状态的示意性立体图。也可以在带状的未固化组合物20上包裹树脂膜。此外,也可以放入注射器中而供给。
图9A是本发明的一个实施方式中的电气/电子部件21的示意性立体图。例如在变压器、放大器、电池等电气/电子部件21上形成空腔(凹部)22,如图9B中所示的那样在空腔22内配置棒状的未固化组合物23。如图9C中所示的那样,在金属板24上粘贴导热性有机硅橡胶固化片材25。然后,如图9D中所示的那样,将图9B的电气/电子部件21颠倒,在导热性有机硅橡胶固化片材25上压接未固化组合物23。若未固化组合物层23以状态固化,则电气/电子部件21介由固化片材25上的未固化组合物23与金属板24接合。
图10A是本发明的又一个实施方式中的在电气/电子部件21上配置有固化片材25的示意性立体图,图10B是表示该实施方式的在金属板24上分配有未固化组合物26的状态的示意性立体图,图10C是表示该实施方式的在金属板24上的未固化组合物26上压接有电气/电子部件21的固化片材25侧的状态的示意性部分截面图。若未固化组合物层26以该状态固化,则电气/电子部件21介由固化片材25上的未固化组合物26与金属板24接合。
实施例
以下使用实施例进行说明。本发明并不限定于实施例。
(实施例1~8、比较例1~2)
(1)含催化剂片材的配合物1~9的制作
如表1~2中所示的那样制作配合物1~9。配合物1~9中使用的各材料的内容如下。
基础聚合物:有机硅聚合物、Dow Corning Toray Silicone Co.,Ltd.制、商品名"SE1185U"
基础聚合物:有机硅聚合物、Bluestar Silicone公司制、商品名"BS 621V350"
过氧化物固化剂:有机硅固化剂、Dow Corning Toray Silicone Co.,Ltd.制、商品名"RC-4"
交联剂:有机硅交联剂、Bluestar Silicone公司制、商品名"BS FLD 626V30H2.5"
交联剂:有机硅交联剂、Dow Corning Toray Silicone Co.,Ltd.制、商品名"SH-1107"
固化延迟剂:日信化学工业社制、商品名"Olfine B"
固化延迟剂:乙炔基环己醇
加成反应催化剂:铂系催化剂、Dow Corning Toray Silicone Co.,Ltd.制、商品名"SRX-212"
导热性填料:氧化铝平均粒径为38μm、昭和电工社制、商品名"AS-10"
表1
表2
(2)未固化组合物的配合物10~12的制作
如表3中所示的那样制作了配合物10~12。配合物10~12中使用的各材料的内容如下。
基础聚合物:有机硅聚合物、Bluestar Silicone公司制、商品名"BS 621V350"
交联剂:有机硅交联剂、Bluestar Silicone公司制、商品名"BS FLD 626V30H2.5"
导热性填料:氧化铝平均粒径为38μm、昭和电工社制、商品名"AS-10"
加成反应催化剂:铂系催化剂、Dow Corning Toray Silicone Co.,Ltd.制、商品名"SRX-212"
表3
(3)含催化剂片材与未固化组合物的接合
如表4~5中所示的那样,将含催化剂片材与未固化组合物接合,调查通过未固化组合物的固化进展而变得不从润滑脂状的组合物的表面附着、转印为止的时间。各条件和评价如下。
含催化剂片材的厚度:0.5mm
未固化组合物的涂布厚度:2.0mm
表4
<粘合力的测定>
使用Tackiness Checker(东洋精机株式会社制)进行测定。将触头以接触载荷5N、接触时间3秒按压于对象物,通过负载传感器方式检测剥离时的应力。
<热导率的测定>
导热性片材的热导率通过热盘(Hot Disk)(按照ISO/CD 22007-2)来测定。该热导率测定装置31如图11A中所示的那样,将聚酰亚胺膜制传感器32用2个试样33a、33b夹持,对传感器32施加恒功率,使其恒定发热,根据传感器32的温度上升值对热特性进行解析。传感器32的前端34为直径7mm,如图11B中所示的那样,成为电极的双螺旋结构,在下部配置有施加电流用电极35和电阻值用电极(温度测定用电极)36。热导率通过以下的式(数学式1)来算出。
[数学式1]
λ:热导率(W/m·K)
P0:恒功率(W)
r:传感器的半径(m)
α:试样的热扩散率(m2/s)
t:测定时间(s)
D(τ):无量纲化的τ的函数
ΔT(τ):传感器的温度上升(K)
表5
比较例1 | 比较例2 | |
含催化剂片材 | 配合物2 | 配合物9 |
未固化组合物 | 配合物11 | 配合物12 |
固化时间 | 未固化 | 未固化 |
固化后性状 | 没有变化 | 没有变化 |
由以上的结果获知以下内容。
(1)根据实施例1和比较例1,若在含催化剂片材中不含催化剂,则未固化组合物不固化。
(2)根据实施例1~4,催化剂片材的性状可以是未固化橡胶、加成固化、凝胶、过氧化物硫化橡胶、加成固化橡胶中的任一种。
(3)根据实施例5~7,未固化组合物的固化速度可以通过催化剂片材的催化剂量来调整。
(4)根据实施例5、8、9,未固化组合物的固化后的性状可以通过未固化组合物的配合来调整。
(5)根据比较例2,即使在催化剂片材中加入交联剂、在未固化组合物中加入催化剂,交联剂也没有渗透且不固化。但是,催化剂从未固化组合物中渗透且催化剂片材固化。
产业上的可利用性
本发明的导热性片材作为变压器、放大器、电池、LED、家电等电气/电子部件、包含光通信设备的信息通信模块、车载用途等发热部与散热部之间的散热体是有用的。进而,作为包含半导体的电子部件的散热体也是有用的。
符号的说明
1 固化片材层
2 未固化组合物
3a、3b、4a、4b 保护膜
5 发热性电子部件
6 散热器
7 自动安装机前端部
8、9 自动安装机前端部的空气方向
10 布线基板
11 电子部件的发热部
12 分配器
13a-13c 未固化组合物
14、15、21 电气/电子部件
16 托盘
17、23 棒状的未固化组合物
18 管
19 绕线管
20 带状的未固化组合物
22 空腔(凹部)
24 金属板
25 导热性有机硅橡胶固化片材
26 分配的未固化组合物
31 热导率测定装置
32 聚酰亚胺膜制传感器
33a、33b 试样
34 传感器前端
35 施加电流用电极
36 电阻值用电极(温度测定用电极)
Claims (17)
1.一种导热性片材,其特征在于,其是下述的导热性片材,
在含有固化反应催化剂的导热性片材的至少一个主表面上接合有不含固化反应催化剂的导热性未固化组合物,
所述含有固化反应催化剂的导热性片材含有为了使所述导热性未固化组合物固化所需量的固化反应催化剂,
所述导热性未固化组合物为下述成分的混合物:
(A)基础聚合物成分:在1分子中含有平均2个以上且键合在分子链两末端的硅原子上的烯基的直链状有机聚硅氧烷,为100重量份;
(B)交联成分:在1分子中含有平均2个以上的键合在硅原子上的氢原子的有机氢聚硅氧烷,相对于所述A成分中的硅原子键合烯基1摩尔为低于1摩尔的量;
(C)导热性粒子:相对于A成分100重量份为100~3000重量份。
2.根据权利要求1所述的导热性片材,其中,用于将所述未固化组合物固化的所述固化反应催化剂量为1~3500ppm。
3.根据权利要求1所述的导热性片材,其中,所述固化反应催化剂为铂族金属催化剂。
4.根据权利要求1所述的导热性片材,其中,所述含有固化反应催化剂的导热性片材为选自有机硅橡胶片材、有机硅凝胶片材、天然橡胶片材、及石蜡片材中的至少一种片材。
5.根据权利要求1所述的导热性片材,其中,在所述含有固化反应催化剂的导热性片材及所述未固化组合物中混合有导热性填料,作为整体而热导率为0.5W/mK以上。
6.根据权利要求1所述的导热性片材,其中,所述含有固化反应催化剂的导热性片材的厚度为0.1~1.5mm的范围。
7.根据权利要求1所述的导热性片材,其中,所述导热性未固化组合物通过加成反应或缩合反应而固化。
8.根据权利要求1所述的导热性片材,其中,所述导热性未固化组合物具有固化后粘合性。
9.根据权利要求1所述的导热性片材,其中,所述导热性未固化组合物为选自未固化的有机硅橡胶、未固化的有机硅凝胶、未固化的有机硅润滑脂、以及未固化的有机硅油中的至少一种。
10.根据权利要求1所述的导热性片材,其中,所述导热性未固化组合物为腻子片材、带、或从分配器或管中挤出的状态。
11.一种使用了导热性片材的安装方法,其特征在于,其是使用了权利要求1~10中任一项所述的导热性片材的安装方法,
在含有固化反应催化剂的导热性片材的至少一个主表面上接合不含固化反应催化剂的导热性未固化组合物,
所述导热性未固化组合物为下述成分的混合物:
(A)基础聚合物成分:在1分子中含有平均2个以上且键合在分子链两末端的硅原子上的烯基的直链状有机聚硅氧烷,为100重量份;
(B)交联成分:在1分子中含有平均2个以上的键合在硅原子上的氢原子的有机氢聚硅氧烷,相对于所述A成分中的硅原子键合烯基1摩尔为低于1摩尔的量;
(C)导热性粒子:相对于A成分100重量份为100~3000重量份,
通过所述含有固化反应催化剂的导热性片材的固化反应催化剂的扩散,使所述导热性未固化组合物固化。
12.根据权利要求11所述的使用了导热性片材的安装方法,其中,以在所述含有固化反应催化剂的导热性片材的至少一个主表面上接合有不含固化反应催化剂的导热性未固化组合物的状态,将所述导热性片材组装入电气或电子部件中。
13.根据权利要求11所述的使用了导热性片材的安装方法,其中,将接合有不含固化反应催化剂的导热性未固化组合物的电气或电子部件压接在所述含有固化反应催化剂的导热性片材的至少一个主表面上。
14.根据权利要求11所述的使用了导热性片材的安装方法,其中,将电气或电子部件接合在所述含有固化反应催化剂的导热性片材上,在该状态下,将导热性未固化组合物压接在所述导热性片材的至少一个主表面上。
15.根据权利要求11所述的使用了导热性片材的安装方法,其中,使所述导热性未固化组合物固化的时间在25℃的室温下为4~48小时。
16.根据权利要求11所述的使用了导热性片材的安装方法,其中,所述导热性未固化组合物以腻子片材、带、或收纳于分配器或管中的状态被供给至安装工序。
17.一种使用了导热性片材的接合方法,其特征在于,其是使用了权利要求1~10中任一项所述的导热性片材的接合方法,
通过未固化组合物的固化后的粘合性,将所述未固化组合物和与所述未固化组合物接触的物体接合。
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