CN111074273A - 使用pcvd着色的电化学沉积产品制作工艺 - Google Patents

使用pcvd着色的电化学沉积产品制作工艺 Download PDF

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CN111074273A
CN111074273A CN201911395778.6A CN201911395778A CN111074273A CN 111074273 A CN111074273 A CN 111074273A CN 201911395778 A CN201911395778 A CN 201911395778A CN 111074273 A CN111074273 A CN 111074273A
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electrochemical deposition
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马晓明
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Huizhou Keen Point Precision Plastic Co ltd
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Abstract

本发明公开了使用PCVD着色的电化学沉积产品制作工艺，在塑胶基材上电化学沉积金属镀层形成电化学沉积原件，而后在电化学沉积原件上进行PCVD着色，获得PCVD着色的电化学沉积产品，从而增强湿法电镀金属层与喷漆膜层的结合力，从而将PCVD着色技术与电化学沉积原件相结合，提高PCVD着色产品的功能性，同时完整保留了电化学沉积层的金属外观以及冷触感，适合作为高端车型内饰。

Description

使用PCVD着色的电化学沉积产品制作工艺
技术领域
本发明涉及塑胶表面处理技术领域，特别是涉及PCVD与电化学沉积结合的表面处理技术。
背景技术
内饰件配色多元化时尚化是未来汽车领域的发展趋势。汽车内饰件实现彩色金属化主要有两种传统工艺：PVD铝层+中漆调色；以及调色金属漆。这两种工艺的劣势在于，最外层需要面漆保护，导致产品的金属质感较低。而金属漆由于靠加入银粉实现金属色，成品外观存在颗粒感，难以接近电镀件光铬的色泽。
利用PCVD工艺同样可以实现塑胶彩色金属化。PCVD工艺即离子体化学气相沉积，可以在基材上制备一层或多层的金属/合金/金属化合物。其制得的涂层本身具有优良的耐蚀性/耐热性/硬度以及强烈的金属质感。通过将PCVD技术与其他工艺适当的组合，即可实现丰富的色彩与质感。本发明是使用PCVD着色的电化学沉积产品制作工艺。该工艺的特点是将PCVD着色技术与电化学沉积原件相结合，制作完成后能够提高PCVD着色产品的功能性，同时完整保留了电化学沉积层的金属外观以及冷触感，适合作为高端车型内饰。
发明内容
本发明的目的是克服现有技术中的不足之处，提供一种使用PCVD着色的电化学沉积产品制作工艺，将电化学沉积工艺与PCVD着色工艺相结合，提升产品的功能性，解决现有技术外观质感不佳，以及PCVD着色产品存在变形、掉膜、耐腐蚀性不佳的问题。
本发明目的是通过以下技术方案来实现的：
使用PCVD着色的电化学沉积产品制作工艺，包括依次实施以下步骤：
S1、将塑胶基体的表面进行化学沉积，形成化学镍镀层；
S2、在化学镍镀层表面进行电化学沉积，形成瓦特镍镀层；
S3、在瓦特镍镀层表面进行电化学沉积，形成铜镀层；
S4、在铜镀层表面进行电化学沉积，形成多层镍镀层；
S5、在多层镍镀层表面进行电化学沉积，形成铬镀层，获得电化学沉积原件；
S6、在电化学沉积原件表面进行离子体化学气相沉积(PCVD)，形成颜色层，获得PCVD着色的电化学沉积产品。
具体的，步骤S3的铜镀层的厚度保持在35um～50um之间。
具体的，步骤S4所述多层镍镀层由下至上依次由半光镍层、光镍层、封口镍层组成。
作为本发明技术方案的一种优选方案，步骤S4所述多层镍镀层的厚度保持在20um～30um之间。
作为本发明技术方案的一种优选方案，所述封口镍层中封口镍微孔数目保持在10000个/cm2～60000个/cm2之间。
作为本发明技术方案的一种优选方案，步骤S5中离子体进行离子体化学气相沉积的具体步骤为：先在电化学沉积原件的表面使用电弧离子镀沉积靶材金属作为过渡层；然后使用电弧离子镀沉积靶材金属与氩气、氮气、氧气其中一种或多种反应形成的化合物作为中间层；最后使用磁控溅射镀沉积靶材金属与氩气、氮气、氧气其中一种或多种反应形成的化合物作为致密的颜色层，从而在电化学沉积原件形成着色的PCVD镀层，获得PCVD着色的电化学沉积产品。
使用PCVD工艺对电化学沉积产品进行着色，需要对电化学沉积工艺进行专门的改进适配，首先要增加电化学沉积镀层的厚度，由于电弧离子镀膜的时候需要对电化学沉积原件施加一个负偏压，对电化学沉积原件表面导电性要求较高，导电不良会导致漏镀/颜色不均，因此，需要将铜镀层的厚度保持在35um～50um之间、多层镍镀层的厚度保持在20um～30um之间，加厚镀层有利于提高电化学沉积原件镀层整体的导电性，同时，由于PCVD工艺中升温较多，塑胶与金属层之间应力变化较大，加厚镀层还有利于抵御应力，防止产品爆开；其次要增强电化学沉积层的抵御电化学腐蚀的能力，由于PCVD镀层本身具有化合物，形成很强的耐腐蚀性，因此在遇到外部的腐蚀溶液时，电化学腐蚀首先发生在电化学沉积镀层，使得产品镀层从内部坍塌剥落，因此，需要在封口镍层引入数量为10000个/cm2～60000个/cm2的微孔，将集中腐蚀分散至各个微孔中，避免集中腐蚀引起的大面积坍塌剥落，提升抗腐蚀性能。
PCVD工艺主要用到两种类型的设备：电弧离子镀膜设备与磁控溅射设备。电弧离子镀膜通过对电化学沉积原件通以负偏压，将靶材作为阴极，与阳极之间产生弧光放电，弧斑放电蒸发靶材物质，并使金属蒸汽离子化，沿电场线向基材方向加速运动并沉积。该设备沉积速率快，反应率高，基材升温较快，但成膜的光泽致密度不及磁控溅射，在本工艺中用于做过渡层和中间层。磁控溅射设备采用中频电源，两个孪生靶轮流作为阴阳极，通常两个靶采用镜像布置，靶之间存在正交电磁场。这样的配置可以极大地提高二次电子与气体分子/金属原子的碰撞概率，提高离化从而实现溅射沉积。该工艺制得膜层高致密高光泽，但沉积速度很慢，适合作为致密颜色层。
与现有技术相比，本发明具有以下优点：
1)能对金属进行着色，使金属具备更加丰富的外观色彩；
2)颜色层较薄且含有金属成分，在提供防护能力的同时最大程度保留金属原色及光泽感；
3)颜色层致密程度高，能够体现金属的光滑触感及金属凉感。
具体实施方式
下面通过实施例与对比例进一步说明本发明。
实施例1
使用PCVD着色的电化学沉积产品制作工艺，包括依次实施以下步骤：
1)将塑胶原料热塑成型，形成塑胶基体；
2)在塑胶基体表面进行化学沉积，形成化学镍镀层；
3)在化学镍镀层表面进行电化学沉积，形成瓦特镍镀层；
4)在瓦特镍镀层表面进行电化学沉积，形成铜镀层，铜镀层的厚度保持在约35um；
5)在铜镀层表面进行电化学沉积，形成由半光镍层、光镍层、封口镍层组成的多层镍镀层，多层镍镀层的厚度保持在约20um，封口镍微孔数保持在约10000个/cm2；
6)在多层镍镀层表面进行电化学沉积，形成铬镀层，获得电化学沉积原件；
7)在电化学沉积原件表面进行离子体化学气相沉积(PCVD)，先使用电弧离子镀在85℃及以下的环境中沉积靶材金属作为过渡层，然后使用电弧离子镀在85℃及以下的环境中沉积靶材金属与氩气、氧气反应形成的化合物作为中间层，最后使用磁控溅射镀在85℃及以下的环境中沉积靶材金属与氩气、氧气反应形成的化合物作为致密的颜色层，形成最终的PCVD镀层，获得PCVD着色的电化学沉积产品。
实施例2
使用PCVD着色的电化学沉积产品制作工艺，包括依次实施以下步骤：
1)将塑胶原料热塑成型，形成塑胶基体；
2)在塑胶基体表面进行化学沉积，形成化学镍镀层；
3)在化学镍镀层表面进行电化学沉积，形成瓦特镍镀层；
4)在瓦特镍镀层表面进行电化学沉积，形成铜镀层，铜镀层的厚度保持在约50um；
5)在铜镀层表面进行电化学沉积，形成由半光镍层、光镍层、封口镍层组成的多层镍镀层，多层镍镀层的厚度保持在约30um，封口镍微孔数保持在约60000个/cm2；
6)在多层镍镀层表面进行电化学沉积，形成铬镀层，获得电化学沉积原件；
7)在电化学沉积原件表面进行离子体化学气相沉积(PCVD)，先使用电弧离子镀在85℃及以下的环境中沉积靶材金属作为过渡层，然后使用电弧离子镀在85℃及以下的环境中沉积靶材金属与氩气、氮气反应形成的化合物作为中间层，最后使用磁控溅射镀在85℃及以下的环境中沉积靶材金属与氩气、氮气反应形成的化合物作为致密的颜色层，形成最终的PCVD镀层，获得PCVD着色的电化学沉积产品。
对比例1
使用PCVD着色的电化学沉积产品制作工艺，包括依次实施以下步骤：
1)将塑胶原料热塑成型，形成塑胶基体；
2)在塑胶基体表面进行化学沉积，形成化学镍镀层；
3)在化学镍镀层表面进行电化学沉积，形成瓦特镍镀层；
4)在瓦特镍镀层表面进行电化学沉积，形成铜镀层，铜镀层的厚度保持在约25um；
5)在铜镀层表面进行电化学沉积，形成由半光镍层、光镍层组成的多层镍镀层，多层镍镀层的厚度保持在约10um；与实施例1或实施例2的区别在于不引入封口镍；
6)在多层镍镀层表面进行电化学沉积，形成铬镀层，获得电化学沉积原件；
7)在电化学沉积原件表面进行离子体化学气相沉积(PCVD)，先使用电弧离子镀沉积靶材金属作为过渡层，然后使用电弧离子镀沉积靶材金属与氩气、氧气反应形成的化合物作为中间层，最后使用磁控溅射镀沉积靶材金属与氩气、氧气反应形成的化合物作为致密的颜色层，形成最终的PCVD镀层，获得PCVD着色的电化学沉积产品。
对比例2
在对比例1的试验基础上，将步骤7)更改为以下方式：
7)在电化学沉积原件表面进行离子体化学气相沉积(PCVD)，先使用电弧离子镀在85℃及以下的环境中沉积靶材金属作为过渡层，然后使用电弧离子镀在85℃及以下的环境中沉积靶材金属与氩气、氮气反应形成的化合物作为中间层，最后使用磁控溅射镀在85℃及以下的环境中沉积靶材金属与氩气、氮气反应形成的化合物作为致密的颜色层，形成最终的PCVD镀层，获得PCVD着色的电化学沉积产品。
对比例3
在对比例2的试验基础上，将步骤4)及步骤5)更改为以下方式：
4)在瓦特镍镀层表面进行电化学沉积，形成铜镀层，铜镀层的厚度保持在约35um；
5)在铜镀层表面进行电化学沉积，形成由半光镍层、光镍层、封口镍层组成的多层镍镀层，多层镍镀层的厚度保持在约20um，不引入封口镍层；
对比例4
在对比例3的试验基础上，将步骤5)更改为以下方式：
5)在铜镀层表面进行电化学沉积，形成由半光镍层、光镍层、封口镍层组成的多层镍镀层，多层镍镀层的厚度保持在约20um，封口镍微孔数保持在约4000个/cm2；
取实施例与对比例制作的产品，采用DBL7402-2014-PV02标准中的刮划测试、百格测试、冷凝水试验、CASS测试、温度冲击测试等方法进行测试，测试结束后统计产品出现的缺陷现象。
Figure BDA0002346260070000061
由测试结果明细可知，采用本发明所提供的技术方案形成的样品，性能明显提升。

Claims (6)

1.使用PCVD着色的电化学沉积产品制作工艺，其特征在于，包括依次实施以下步骤：
S1、将塑胶基体的表面进行化学沉积，形成化学镍镀层；
S2、在化学镍镀层表面进行电化学沉积，形成瓦特镍镀层；
S3、在瓦特镍镀层表面进行电化学沉积，形成铜镀层；
S4、在铜镀层表面进行电化学沉积，形成多层镍镀层；
S5、在多层镍镀层表面进行电化学沉积，形成铬镀层，获得电化学沉积原件；
S6、在电化学沉积原件表面进行离子体化学气相沉积(PCVD)，形成颜色层，获得PCVD着色的电化学沉积产品。
2.根据权利要求1所述的使用PCVD着色的电化学沉积产品制作工艺，其特征在于，步骤S3的铜镀层的厚度保持在35um～50um之间。
3.根据权利要求1所述的使用PCVD着色的电化学沉积产品制作工艺，其特征在于，步骤S4所述多层镍镀层由下至上依次由半光镍层、光镍层、封口镍层组成。
4.根据权利要求3所述的使用PCVD着色的电化学沉积产品制作工艺，其特征在于，步骤S4所述多层镍镀层的厚度保持在20um～30um之间。
5.根据权利要求4所述的使用PCVD着色的电化学沉积产品制作工艺，其特征在于，所述封口镍层中封口镍微孔数目保持在10000个/cm2～60000个/cm2之间。
6.根据权利要求1所述的使用PCVD着色的电化学沉积产品制作工艺，其特征在于，步骤S5中离子体进行离子体化学气相沉积的具体步骤为：先在电化学沉积原件的表面使用电弧离子镀沉积靶材金属作为过渡层；然后使用电弧离子镀沉积靶材金属与氩气、氮气、氧气其中一种或多种反应形成的化合物作为中间层；最后使用磁控溅射镀沉积靶材金属与氩气、氮气、氧气其中一种或多种反应形成的化合物作为致密的颜色层，从而在电化学沉积原件形成着色的PCVD镀层，获得PCVD着色的电化学沉积产品。
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