CN111070055A - Ultra-thin wafer processingequipment - Google Patents

Ultra-thin wafer processingequipment Download PDF

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Publication number
CN111070055A
CN111070055A CN201911375531.8A CN201911375531A CN111070055A CN 111070055 A CN111070055 A CN 111070055A CN 201911375531 A CN201911375531 A CN 201911375531A CN 111070055 A CN111070055 A CN 111070055A
Authority
CN
China
Prior art keywords
wafer
grinding wheel
ultra
water tank
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201911375531.8A
Other languages
Chinese (zh)
Inventor
刘锋杰
李守亮
李向坤
刘传利
刘星义
王琪
徐金金
王曰兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KEDA SEMICONDUCTOR CO Ltd
Original Assignee
KEDA SEMICONDUCTOR CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KEDA SEMICONDUCTOR CO Ltd filed Critical KEDA SEMICONDUCTOR CO Ltd
Priority to CN201911375531.8A priority Critical patent/CN111070055A/en
Publication of CN111070055A publication Critical patent/CN111070055A/en
Withdrawn legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines

Abstract

The invention provides an ultrathin wafer processing device, wherein a grinding wheel is disc-shaped and is placed at the top of a wafer, and the bottom of the wafer is adsorbed on a wafer operating platform through vacuum; the edge of the bottom of the grinding wheel is provided with a clamping groove, a grinding disc is connected in the clamping groove through a buckle, the top of the clamping groove is provided with a water tank, the water tank penetrates through the top of the grinding wheel, and a water pipe is arranged in the water tank; the middle part of the grinding wheel is provided with a connecting shaft, and the connecting shaft is connected with a motor; has the advantages that: the invention reduces the breakage rate of the edge of the wafer, keeps the thickness of the edge of the wafer, reduces breakage caused by over-thin edge in the thinning process, reduces wafer cracking and improves the yield of the wafer.

Description

Ultra-thin wafer processingequipment
Technical Field
The invention relates to the field of wafer processing, in particular to an ultrathin wafer processing device.
Background
At present, the back thinning process of the wafer in the semiconductor field in the market is single, and the thickness of the thinned wafer is generally 150 microns or more. When the thickness of the thinned wafer is 120 microns or less, the edge of the wafer is easily broken during the thinning process due to the fact that the processed wafer is too thin, so that the wafer is cracked, and the yield of the wafer is low.
In the prior art, a wafer is gradually thinned through high-speed rotation of a large-size grinding wheel, and because a large amount of heat is generated due to high-speed friction thinning, the temperature of the grinding wheel needs to be reduced by high-pressure water flushing outside the wafer. The diameter of the grinding wheel may be larger than the diameter of the wafer. At present, the production line mostly adopts the method to thin the wafer. When the size thickness of the thinned wafer is larger than 150 micrometers and above, the fragment rate of the wafer is not high, but when the size of the thinned wafer is smaller than 120 micrometers, the wafer is easy to break in high-speed friction due to the thin edge, so that the fragment rate of the wafer is high, the waste of the wafer is caused, and the cost is increased.
Disclosure of Invention
The present invention is directed to provide an ultra-thin wafer processing apparatus for solving the disadvantages of the prior art.
The new technical scheme of the invention is as follows: an ultrathin wafer processing device comprises a grinding wheel, a water tank, a grinding disc and a connecting shaft, wherein the grinding wheel is disc-shaped and is placed at the top of a wafer, and the bottom of the wafer is adsorbed on a wafer operating platform through vacuum; the edge of the bottom of the grinding wheel is provided with a clamping groove, a grinding disc is connected in the clamping groove through a buckle, the top of the clamping groove is provided with a water tank, the water tank penetrates through the top of the grinding wheel, and a water pipe is arranged in the water tank; the middle part of the grinding wheel is provided with a connecting shaft, and the connecting shaft is connected with a motor.
The number of the clamping grooves is 8.
The number of the grinding plates is 8.
The abrasive disc is made of silicon, silicon nitride or diamond.
The grinding wheel is made of silicon, silicon nitride or diamond.
The diameter of the grinding wheel is smaller than that of the wafer.
The invention has the beneficial effects that: the invention reduces the breakage rate of the edge of the wafer, keeps the thickness of the edge of the wafer, reduces breakage caused by over-thin edge in the thinning process, reduces wafer cracking and improves the yield of the wafer.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Wherein: 1 is a grinding wheel, 2 is a water tank, 3 is a grinding sheet, 4 is a connecting shaft, and 5 is a wafer.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
An ultrathin wafer processing device comprises a grinding wheel 1, a water tank 2, a grinding disc 3 and a connecting shaft 4, wherein the grinding wheel 1 is disc-shaped, the grinding wheel 1 is placed on the top of a wafer 5, and the bottom of the wafer 5 is adsorbed on a wafer operating platform through vacuum; the edge of the bottom of the grinding wheel 1 is provided with a clamping groove, a grinding disc 3 is connected in the clamping groove through a buckle, the top of the clamping groove is provided with a water tank 2, the water tank 2 penetrates through the top of the grinding wheel 1, and a water pipe is arranged in the water tank 2; the middle part of the grinding wheel 1 is provided with a connecting shaft 4, and the connecting shaft 4 is connected with a motor.
The number of the clamping grooves is 8.
The number of the grinding plates 3 is 8.
The abrasive disc 3 is made of silicon, silicon nitride or diamond.
The grinding wheel 1 is made of silicon, silicon nitride or diamond.
The diameter of the grinding wheel 1 is smaller than that of the wafer 5.
The ultrathin wafer processing device is characterized in that a small-size grinding wheel 1 rotates at a high speed in a wafer 5 to gradually thin the wafer 5, but a circular ring with the edge of about 2mm of the wafer 5 is not thinned, the edge of the thinned wafer is effectively protected by the circular ring, and edge crack caused by high-speed friction of the thinner edge of the wafer 5 in the thinning process is reduced; because of the thinning friction in-process produces a large amount of heats, need reduce the residue that abrasive disc 3 temperature and clean 5 top attenuate in-process produced through the bath, design basin 2 on emery wheel 1, basin 2 connects the water pipe, and 2 bottoms of basin communicate abrasive disc 3, and high-pressure water injection utilizes water to cool down for abrasive disc 3. When the thinning wafer is used, only the edge of 2mm needs to be removed.
The ultra-thin wafer processing device can thin the wafer 5 to about 60 microns.
The radius of the thinned wafer is R, the width of the grinding plate 3 is L, and the diameter of the grinding wheel 1 is D.
D＞R＞(D-L)。

Claims (6)

1. The utility model provides an ultra-thin wafer processingequipment, includes emery wheel (1), basin (2), abrasive disc (3) and connecting axle (4), its characterized in that: the grinding wheel (1) is disc-shaped, the grinding wheel (1) is placed at the top of the wafer (5), and the bottom of the wafer (5) is adsorbed on the wafer operating platform through vacuum; the edge of the bottom of the grinding wheel (1) is provided with a clamping groove, a grinding disc (3) is connected in the clamping groove through a buckle, the top of the clamping groove is provided with a water tank (2), the water tank (2) penetrates through the top of the grinding wheel (1), and a water pipe is arranged in the water tank (2); the grinding wheel (1) is provided with a connecting shaft (4) in the middle, and the connecting shaft (4) is connected with a motor.
2. The ultra-thin wafer processing device of claim 1, wherein: the number of the clamping grooves is 8.
3. The ultra-thin wafer processing device of claim 1, wherein: the number of the grinding plates (3) is 8.
4. An ultra-thin wafer processing apparatus as claimed in claim 1 or 3, wherein: the abrasive disc (3) is made of silicon, silicon nitride or diamond.
5. The ultra-thin wafer processing device of claim 1, wherein: the grinding wheel (1) is made of silicon, silicon nitride or diamond.
6. An ultra-thin wafer processing apparatus as claimed in claim 1 or 5, wherein: the diameter of the grinding wheel (1) is smaller than that of the wafer (5).
CN201911375531.8A 2019-12-27 2019-12-27 Ultra-thin wafer processingequipment Withdrawn CN111070055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911375531.8A CN111070055A (en) 2019-12-27 2019-12-27 Ultra-thin wafer processingequipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911375531.8A CN111070055A (en) 2019-12-27 2019-12-27 Ultra-thin wafer processingequipment

Publications (1)

Publication Number Publication Date
CN111070055A true CN111070055A (en) 2020-04-28

Family

ID=70318470

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911375531.8A Withdrawn CN111070055A (en) 2019-12-27 2019-12-27 Ultra-thin wafer processingequipment

Country Status (1)

Country Link
CN (1) CN111070055A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60259378A (en) * 1984-06-01 1985-12-21 Hitachi Seiko Ltd Grinding liquid supply in grinder
JPH01171762A (en) * 1987-12-28 1989-07-06 Shibayama Kikai Kk Suction chuck cleaning device for semiconductor wafer grinding machine
CN1208682A (en) * 1997-08-15 1999-02-24 株式会社迪思科 Apparatus and method for machining workpieces
CN101659033A (en) * 2008-08-27 2010-03-03 株式会社迪思科 Grinding wheel
CN102294637A (en) * 2010-06-28 2011-12-28 株式会社迪思科 Grinding machining tool

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60259378A (en) * 1984-06-01 1985-12-21 Hitachi Seiko Ltd Grinding liquid supply in grinder
JPH01171762A (en) * 1987-12-28 1989-07-06 Shibayama Kikai Kk Suction chuck cleaning device for semiconductor wafer grinding machine
CN1208682A (en) * 1997-08-15 1999-02-24 株式会社迪思科 Apparatus and method for machining workpieces
CN101659033A (en) * 2008-08-27 2010-03-03 株式会社迪思科 Grinding wheel
CN102294637A (en) * 2010-06-28 2011-12-28 株式会社迪思科 Grinding machining tool

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Application publication date: 20200428

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