CN204262924U - A kind of semi-automatic silicon wafer polishing machine - Google Patents

Abstract

The utility model relates to a semi-automatic silicon wafer polishing machine, which comprises a bench drill, a slurry collection pool, a sample rack and a water tank. There is a motor at one end of the bench drill, a drill at the other end, a tray on the drill bed, and a water tank on the pedestal; a lifting handle is provided on the drill, and a sample holder is connected to the end of the drill through a connecting rod; There is a slurry pool, and the upper end of the slurry pool is provided with a lower polishing sheet connected to the connecting rod of the drilling machine; an upper polishing sheet is provided above the sample holder, and a set of adjustments with compression springs are arranged symmetrically on both sides of the upper polishing sheet. nut; the compression spring is covered with a fixed screw rod, and is connected with the lower polishing sheet through the fixed screw rod; the sample holder and the lower polishing sheet are connected together through the grinding sheet holder; the bottom side of the water tank is provided with a water inlet pipe, and there is a A water pump, the water pump is connected to the grinding plate frame through the water outlet pipe I; the bottom of the slurry pool is provided with a water outlet, and the water outlet communicates with the water tank through the water outlet pipe II. The utility model has the advantages of simple structure and convenient use.

Description

A semi-automatic silicon wafer polishing machine

technical field

The utility model relates to the field of polishing equipment, in particular to a semi-automatic silicon wafer polishing machine.

Background technique

Silicon wafer polishing refers to the use of mechanical and chemical effects to remove the mechanical damage layer on the surface, and further use chemical methods to process it into a double mirror to meet the detection requirements. At present, the research and manufacture of silicon wafer mechanical polishing equipment has become mature at home and abroad. There are many kinds of silicon wafer polishing machines on the market, all of which have high work efficiency, but all have the disadvantages of complex structure, high price and high maintenance cost; according to I understand that some companies use traditional manual grinding methods to polish silicon wafers, but the polishing level is difficult to control, human influence factors are large, and efficiency is low.

Utility model content

The technical problem to be solved by the utility model is to provide a semi-automatic silicon chip polishing machine with simple structure and convenient use.

In order to solve the above problems, a semi-automatic silicon wafer polishing machine described in the utility model is characterized in that: the polishing machine includes a bench drill, a slurry pool, a sample holder and a water tank; one end of the bench drill is provided with a motor, and its The other end is provided with a drill bit, a tray is provided on the drill bed, and the water tank is provided on the pedestal; a lift handle is provided on the drill bit, and the sample holder is connected to the end of the drill bit through a drill connecting rod; In the slurry pool, the upper end of the slurry pool is provided with a lower polishing sheet connected to the connecting rod of the drilling machine; an upper polishing sheet is provided above the sample holder, and a group of strips are symmetrically arranged on both sides of the upper polishing sheet. The adjusting nut of the compression spring; the compression spring is covered with a fixed screw rod, and is connected with the lower polishing sheet through the fixed screw rod; the sample holder and the lower polishing sheet are connected together through the grinding sheet frame; There is a water inlet pipe on one side of the bottom of the water tank, and a water pump is arranged in it, and the water pump is connected with the grinding disc frame through the water outlet pipe I; Communicate with the water tank.

The center of the sample holder is connected with the upper polishing sheet through a fixing nut.

The bench drill is provided with a bench drill motor shield.

Both the lower polishing sheet and the upper polishing sheet are composed of stainless steel grinding wheels of different grain sizes.

A dust cover is wrapped on the upper polishing sheet.

The sample holder is provided with a number of fixed-sized circular sample fixing holes arranged in a staggered manner and designed according to the size of the silicon wafer.

Compared with the prior art, the utility model has the following advantages:

1. The utility model adopts a bench drill as the power system, and by adjusting the pressure of the compression spring on the fixed screw rod, the force on the surface of the silicon wafer is uniform and the thickness is consistent.

2. Both the middle and lower polishing sheets and the upper polishing sheet of the utility model are composed of stainless steel grinding wheels of different particle sizes. Therefore, when in use, with corresponding polishing paste, polishing/grinding powder, the silicon wafer can be directly polished into a mirror surface by step-by-step polishing. The part of chemical polishing is omitted.

3. In the utility model, there are several fixed-size circular sample fixing holes arranged in a staggered manner and designed according to the size of the silicon wafers on the sample holder, so multiple wafers can be polished simultaneously.

4. The utility model changes the traditional manual grinding into mechanical polishing, which can not only improve work efficiency and save production costs, but also greatly improve the polishing quality of silicon wafers.

5. The utility model has simple structure and low cost, which can effectively reduce the investment of purchasing funds.

Description of drawings

Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail.

Fig. 1 is the structural representation of the utility model.

Fig. 2 is a structural schematic diagram of the sample holder in the utility model.

In the figure: 1—bench drill 2—bench drill motor protective cover 3—lifting handle 4—sample rack 5—upper polishing sheet 6—fixed screw 7—lower polishing sheet 8—slurry pool 9—outlet pipe Ⅰ 10—water pump 11 —Water inlet pipe 12—Water outlet 13—Water outlet pipe II 14—Water tank 15—Clamping spring 16—Adjusting nut.

Detailed ways

As shown in FIGS. 1 and 2 , a semi-automatic silicon wafer polishing machine includes a bench drill 1 , a slurry pool 8 , a sample holder 4 and a water tank 14 .

One end of the bench drill 1 is provided with a motor, the other end is provided with a drill bit, a tray is provided on the drill bed, and a water tank 14 is provided on the pedestal; the drill bit is provided with a lifting handle 3, and the end is connected with a sample holder 4 through a drill bit connecting rod. The tray is provided with a slurry pool 8, and the upper end of the slurry pool 8 is provided with a lower polishing sheet 7 connected to the drill press connecting rod; the top of the sample holder 4 is provided with an upper polishing sheet 5, and both sides of the upper polishing sheet 5 A group of adjusting nuts 16 with compression springs 15 are symmetrically arranged; the compression springs 15 are sleeved with a fixed screw 6, and are connected to the lower polishing sheet 7 through the fixed screw 6; the sample holder 4 and the lower polishing sheet 7 pass through the grinding sheet holder connected together; the bottom side of the water tank 14 is provided with a water inlet pipe 11, which is provided with a water pump 10, and the water pump 10 is connected with the grinding plate frame through the water outlet pipe I9; the bottom of the slurry pool 8 is provided with a water outlet 12, the outlet The water port 12 communicates with the water tank 14 through the water outlet pipe II13.

in:

The center of the sample holder 4 is connected with the upper polishing sheet 5 through a fixing nut.

The bench drill 1 is provided with a bench drill motor protective cover 2 .

Both the lower polishing sheet 7 and the upper polishing sheet 5 are made of stainless steel grinding wheels of different grain sizes.

The upper polishing sheet 5 is wrapped with a dust cover.

The sample rack 4 is provided with a plurality of fixed-size circular sample fixing holes arranged in a staggered manner and designed according to the size of the silicon wafer.

When in use, first select a suitable sample holder 4 according to the diameter of the silicon wafer, fix it on the drill bit through the drill bit connecting rod, and rotate it driven by the drill bit, put the silicon wafer to be polished into the circular sample fixing hole in the sample holder 4, adjust the Position the polishing sheet 5, start the bench drill 1, rotate the lifting handle 3, press down the upper polishing sheet 5 for polishing; at the same time, water is introduced from the water outlet pipe I9 to the polishing sheet frame through the water pump 10, and fixed on the tray of the bench drill 1 The slurry pool 8 can collect the powder and water pollution produced when the silicon wafer is polished, and the settled water is introduced into the water tank 14 through the outlet pipe II13. After the end, close the bench drill 1, and take out the silicon wafer.

Claims (6)

1. A semi-automatic silicon wafer polishing machine, characterized in that: the polishing machine includes a bench drill (1), a slurry pool (8), a sample holder (4) and a water tank (14); the bench drill (1) One end is provided with a motor, the other end is provided with a drill bit, the drill bed is provided with a tray, and the pedestal is provided with the water tank (14); the drill bit is provided with a lifting handle (3), and its end is connected by a drill bit connecting rod. There is the sample holder (4); the tray is provided with the slurry pool (8), and the upper end of the slurry pool (8) is provided with a lower polishing sheet (7) connected to the connecting rod of the drilling machine; An upper polishing sheet (5) is provided above the sample holder (4), and a set of adjusting nuts (16) with compression springs (15) are arranged symmetrically on both sides of the upper polishing sheet (5); The spring (15) is sleeved with a fixed screw (6), and is connected to the lower polishing sheet (7) through the fixed screw (6); the sample holder (4) and the lower polishing sheet (7) are passed through the grinding The film holders are connected together; the bottom side of the water tank (14) is provided with a water inlet pipe (11), and a water pump (10) is provided in it, and the water pump (10) is connected with the grinding plate The bottom of the slurry pool (8) is provided with a water outlet (12), and the water outlet (12) communicates with the water tank (14) through the water outlet pipe II (13). 2. A semi-automatic silicon wafer polishing machine according to claim 1, characterized in that: the center of the sample holder (4) is connected to the upper polishing piece (5) through a fixing nut. 3. A semi-automatic silicon wafer polishing machine according to claim 1, characterized in that: the bench drill (1) is provided with a bench drill motor protective cover (2). 4. A semi-automatic silicon wafer polishing machine according to claim 1, characterized in that: both the lower polishing sheet (7) and the upper polishing sheet (5) are composed of stainless steel grinding wheels of different grain sizes. 5. A semi-automatic silicon wafer polishing machine according to claim 1, characterized in that: said upper polishing sheet (5) is wrapped with a dust cover. 6. A semi-automatic silicon wafer polishing machine as claimed in claim 1, characterized in that: the sample holder (4) is provided with several fixed-size circular samples arranged in a staggered manner and designed according to the size of the silicon wafer Fixing hole.