CN101659033A - Grinding wheel - Google Patents
Grinding wheel Download PDFInfo
- Publication number
- CN101659033A CN101659033A CN 200910163333 CN200910163333A CN101659033A CN 101659033 A CN101659033 A CN 101659033A CN 200910163333 CN200910163333 CN 200910163333 CN 200910163333 A CN200910163333 A CN 200910163333A CN 101659033 A CN101659033 A CN 101659033A
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- grinding
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- ring
- emery wheel
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Abstract
The invention provides a grinding wheel, which can decrease the finishing time of a grinding tool and prevent a wafer from generating crackles. The grinding wheel is arranged on a wheel seat of a grinding device in the free assemble and unassemble way, the grinding device comprises a grinding fluid supply member for supplying a grinding fluid, a main shaft driven to rotate and the wheel seat connected with the frontend of the main shaft. The grinding wheel is characterized in that the grinding wheel comprises an annular base with an internal wall, an external wall and an installation portion arranged on the wheel seat, and a plurality of grinding tools annularly arranged at the free end of the annular base, wherein a plurality of through holes which are spaced apart at prescribed intervalsare formed on the external wall of the annular base along the circumference direction, the plurality of through holes penetrate through the internal wall for discharging the grindstone dust and the grinding fluid.
Description
Technical field
The present invention relates to be equipped with the emery wheel of the grinding attachment of a plurality of grinding grinding tools at free end.
Background technology
About be formed with from the teeth outwards IC (Integrated Circuit: integrated circuit), LSI (LargeScale Integration: large scale integrated circuit) etc. the device of One's name is legion and one by one device cut apart the semiconductor wafer that preset lines (spacing track) demarcates, utilizing topping machanism that grinding is carried out at the back side after being processed into predetermined thickness, utilize cutter sweep to cut to cutting apart preset lines, thereby this semiconductor wafer is divided into device one by one, and the device that splits is used in the electrical equipments such as mobile phone, personal computer.
The grinding attachment that the back side of wafer is carried out grinding comprises: chuck table, and it keeps wafer; The grinding member, its emery wheel that will be equipped with the grinding grinding tool supports to and can rotate, and described grinding grinding tool carries out grinding to the wafer that remains on the above-mentioned chuck table; And the grinding fluid supply member, it provides grinding fluid to grinding area, and above-mentioned grinding attachment can become grinding wafer desirable thickness (for example, opening flat 7-31268 communique in fact with reference to Japan).
In recent years, for lightweight and the miniaturization that realizes electrical equipment, require to make the thickness of wafer thinner, for example be about 50 μ m.Grinding gets very thin processing of wafers and gets up very difficultly like this, exists in possibility damaged in the conveyance etc.
Therefore, in TOHKEMY 2007-243112 communique etc., following method for grinding has been proposed: only grinding is carried out at the back side corresponding with device area of wafer, and wafer with form the ring-type rib around the corresponding back side of the periphery remaining area of device area.
Be formed with the wafer of ring-type rib about periphery so overleaf, after having removed the ring-type rib, cut apart preset lines separated (for example, with reference to TOHKEMY 2007-193795 communique) along what be called as spacing track from the face side of wafer.
Patent documentation 1: Japan opens flat 7-31268 communique in fact
Patent documentation 2: TOHKEMY 2007-243112 communique
Patent documentation 3: TOHKEMY 2007-193795 communique
When grinding area provides grinding fluid, semiconductor wafer is being carried out grinding.Thus, in grinding area, the grindstone dust of wafer is mingled in the grinding fluid.Though mixing grinding fluid or waste liquid that grindstone dust is arranged flows out between a plurality of grinding grinding tools that are adapted to ring-type by means of centrifugal force, but wherein a part can be trapped in emery wheel inside, the grinding grinding tool produces the eyelet obstruction and must carry out the finishing of grinding grinding tool continually thus, has the problem of production efficiency difference.
In addition, the abrasive particle of diamond that comes off from the grinding grinding tool etc. is clipped between wafer and the grinding grinding tool, thereby particularly be formed with in the wafer of ring-type rib in periphery only grinding being carried out at the back side corresponding with device area of wafer, exist the root of ring-type rib is cracked, problem that bending strength reduces.
Summary of the invention
The present invention finishes in view of such problem, and its purpose is, finishing number of times that can reduce the grinding grinding tool and the emery wheel that wafer is cracked are provided.
According to the present invention, a kind of emery wheel is provided, it is installed on the wheel seat of grinding attachment in loading and unloading mode freely, and this grinding attachment has: the grinding fluid supply member that grinding fluid is provided; The main shaft that is driven and rotates; And the above-mentioned wheel seat that is connected with the front end of this main shaft, above-mentioned emery wheel is characterised in that this emery wheel comprises: the ring-type pedestal, and it has internal perisporium, periphery wall and is installed in installation portion on the above-mentioned wheel seat; With a plurality of grinding grinding tools, they are provided in the free end of above-mentioned ring-type pedestal in the form of a ring, on the above-mentioned periphery wall of above-mentioned ring-type pedestal, separate predetermined space ground and be formed with a plurality of through holes along circumferencial direction, these a plurality of through holes connect to above-mentioned internal perisporium, are used for grindstone dust is discharged with grinding fluid.
Preferably, to internal perisporium, be formed with a plurality of grinding fluid supply holes that are used to provide grinding fluid from the installation portion of above-mentioned ring-type pedestal.
According to the present invention, be formed with a plurality of through holes owing on the periphery wall of the ring-type pedestal that constitutes emery wheel, separate predetermined space ground along circumferencial direction, these a plurality of through holes connect to internal perisporium and are used for grindstone dust is discharged, and discharge swimmingly to the outside from through hole so be trapped in the waste liquid of being divided in the space that forms by internal perisporium, grinding grinding tool and the wafer of ring-type pedestal.Thus, can reduce the grindstone dust of sneaking in waste liquid and make the grinding grinding tool produce the eyelet phenomenon of blocking, thereby can reduce the finishing number of times of grinding grinding tool.
In addition, because sneaking into the waste liquid of the abrasive particle that comes off from the grinding grinding tool also discharges to the outside from through hole, this through hole is formed up to periphery wall from the internal perisporium of ring-type pedestal, so the root of ring-type rib that has a wafer of ring-type rib at chip back surface is cracked, thereby the bending strength of wafer is reduced.
Description of drawings
Fig. 1 is the face side stereogram of semiconductor wafer.
Fig. 2 is the rear side stereogram that is pasted with the semiconductor wafer of boundary belt.
Fig. 3 is the stereoscopic figure of grinding attachment.
The stereogram of the chuck table of first embodiment when Fig. 4 is the expression grinding and the relation of the position between the emery wheel.
Fig. 5 is the stereogram of the emery wheel of first embodiment.
Fig. 6 is the cutaway view of cutting open with wheel seat along the 6-6 line among Fig. 5.
(A) of Fig. 7 is the cutaway view along the 7A-7A line among Fig. 5, and (B) of Fig. 7 is the sectional elevation of ring-type pedestal.
The wafer that keeps on the chuck table of the second embodiment of the invention when Fig. 8 is the expression grinding and the stereogram of the relation between the emery wheel.
Label declaration
2: grinding attachment; 11: semiconductor wafer; 16: the grinding unit; 30,30A: emery wheel; 32,32A: ring-type pedestal; 34: the grinding grinding tool; 42: the grinding fluid supply hole; 50: chuck table; 56: through hole.
The specific embodiment
Below, be elaborated with reference to the emery wheel of accompanying drawing to embodiment of the present invention.Fig. 1 is the stereogram that is machined to the preceding semiconductor wafer of predetermined thickness.Semiconductor wafer 11 shown in Figure 1 is that the silicon wafer of 700 μ m constitutes by for example thickness, is clathrate ground and is formed with many spacing tracks 13 on surperficial 11a, and be formed with devices 15 such as IC, LSI being divided in a plurality of zones that form by these many spacing tracks 13.
The silicon wafer 11 of Gou Chenging comprises like this: the device area 17 that is formed with device 15; With periphery remaining area 19 around device area 17.In addition, in the periphery of silicon wafer 11, be formed with recess 21 as the mark of the crystal orientation of representing silicon wafer.
On the surperficial 11a of silicon wafer 11, paste operation by boundary belt and be pasted with boundary belt 23.Therefore, the surperficial 11a of silicon wafer 11 has formed the form that back side 11b exposes as shown in Figure 2 by boundary belt 23 protections.
Below, with reference to Fig. 3 the grinding attachment 2 that the back side 11b of the silicon wafer 11 that will constitute like this is ground to predetermined thickness is described.The housing 4 of grinding attachment 2 is made of horizontal housing parts 6 and vertical shell part 8.
On vertical shell part 8, be fixed with the pair of guide rails 12,14 of extending at above-below direction.Grinding member (grinding unit) 16 is installing in the mode that upper and lower moves up along this a pair of guide rail 12,14.Grinding unit 16 is installed on the mobile foundation 18 via support portion 20, and this mobile foundation 18 moves up at upper and lower along pair of guide rails 12,14.
As among Fig. 6 the most clearly the expression, be fixed with wheel seat 28 at the leading section of main shaft 24, on this wheel seat 28, utilize screw 31 that emery wheel 30 is installed.For example, as shown in Figure 4, emery wheel 30 is at the fixing a plurality of grinding grinding tools 34 of the free end of ring-type pedestal 32 and constitute, and these a plurality of grinding grinding tools 34 are that the diamond abrasive grain of 0.3～1.0 μ m utilizes vitrified bond etc. to be fixed up to form with particle diameter.
Grinding fluid is provided for grinding member (grinding unit) 16 through flexible pipe 36.Preferably, use pure water as grinding fluid.As shown in Figure 6, the grinding fluid that provides from flexible pipe 36 is through grinding fluid supply hole 38, space 40 and a plurality of grinding fluid supply hole 42, be provided for grinding grinding tool 34 and the wafer 11 that remains in chuck table 50, wherein, above-mentioned grinding fluid supply hole 38 is formed at main shaft 24, above-mentioned space 40 is formed at wheel seat 28, and above-mentioned a plurality of grinding fluid supply holes 42 are formed at the ring-type pedestal 32 of emery wheel 30.
Referring again to Fig. 3, grinding attachment 2 has grinding unit feed mechanism 44, and this grinding unit feed mechanism 44 makes grinding unit 16 move up at upper and lower along pair of guide rails 12,14.Grinding unit feed mechanism 44 is made of ball-screw 46 and the impulse motor 48 that is fixed on an end of ball-screw 46.When paired pulses motor 48 carries out pulsed drive, ball-screw 46 rotation, the nut of the ball-screw 46 of mobile foundation 18 and moving up at upper and lower through being fixed on mobile foundation 18 inside.
With reference to Fig. 5, represented the stereogram of the emery wheel 30 of first embodiment of the invention.Fig. 6 is the cutaway view of cutting open with wheel seat along the 6-6 line among Fig. 5, and (A) of Fig. 7 is the cutaway view along the 7A-7A line among Fig. 5, and (B) of Fig. 7 is the sectional elevation of emery wheel.
Shown in Fig. 6 and Fig. 7 (A), the ring-type pedestal 32 of emery wheel 30 has periphery wall 32a and band tapering shape internal perisporium 32b, and, a plurality of grinding fluid supply holes 42 separate predetermined space ground in a circumferential direction and form, and these a plurality of grinding fluid supply holes 42 connect to internal perisporium 32b from the installation portion that is installed on the wheel seat 28 of ring-type pedestal 32.
In addition, can be clear and definite with reference to Fig. 7 (A) and Fig. 7 (B), between adjacent grinding fluid supply hole 42, be formed with from band tapering shape internal perisporium 32b and connect through hole 56 to periphery wall 32a.
Grinding operation to the grinding attachment 2 of such formation describes below.When attracting to remain on wafer 11 on the chuck table 50 in boundary belt 23 mode down and be positioned in grinding position shown in Figure 4; chuck table 50 is rotated to arrow a direction with the speed of for example 300rpm; make simultaneously emery wheel 30 with the speed of for example 6000rpm to the direction identical with chuck table 50, be the rotation of arrow b direction; and; make 44 work of grinding unit feed mechanism, grinding grinding tool 34 is contacted with the back side 11b of wafer 11.
Then, make emery wheel 30 carry out the grinding and feeding of scheduled volume downwards, implement the grinding of wafer 11 with predetermined grinding and feeding speed (for example 3～5 μ m/ second).When the thickness measurement equipment that utilizes not shown contact is measured the thickness of wafer, wafer is refined to the thickness of expection, 100 μ m for example.
When grinding wafer 11, on one side provide grinding fluid to grinding area through flexible pipe 36 and grinding fluid supply hole 42, carry out grinding on one side, though having sneaked into the waste liquid of the grindstone dust of wafer 11 in grinding fluid flows out to the outside in the gap between grinding grinding tool 34 by means of the centrifugal force of emery wheel 30, but a part of waste liquid but can be back to emery wheel inside, and is trapped in the space that is formed by the internal perisporium 32b of ring-type pedestal 32, the grinding grinding tool 34 that is adapted to ring-type and wafer 11 divisions.
In the emery wheel 30 of present embodiment, the waste liquid of delay is discharged to the outside swimmingly through through hole 56.Thus, can reduce the grindstone dust of sneaking in waste liquid and make grinding grinding tool 34 produce the eyelet phenomenon of blocking, thereby can reduce the finishing number of times of grinding grinding tool 34.
In addition, the waste liquid of sneaking into the diamond abrasive grain that comes off from grinding grinding tool 34 also can be discharged to the outside energetically from through hole 56, and above-mentioned through hole 56 is formed up to periphery wall 32a from the internal perisporium 32b of ring-type pedestal 32.
Next, with reference to Fig. 8 the emery wheel 30A of second embodiment of the invention is described.The emery wheel 30A of second embodiment is the emery wheel that is applicable to following situation: only grinding is carried out at the back side corresponding with device area 17 of wafer 11, and wafer and form the ring-type rib around the corresponding back sides of the periphery remaining area 19 of device area 17.
Compare with the emery wheel 30 of first embodiment shown in Figure 4, the diameter of the emery wheel 30A of present embodiment is less.Emery wheel 30A is installed on the wheel seat 28A that is fixed in main shaft 24A front end in the fastening mode of screw.
Except the diameter little this point of diameter than the ring-type pedestal 32 of first embodiment shown in Figure 4 of the ring-type pedestal 32A of emery wheel 30A, other structure is identical with ring-type pedestal 32, therefore omits its detailed description.
In the present embodiment, the pivot of the pivot of chuck table 50 and emery wheel 30A is eccentric state, the external diameter of grinding grinding tool 34 is set at such size: less than the diameter of the device area 17 of wafer 11 and the boundary line of periphery remaining area 19 and greater than the radius of boundary line, thereby the grinding grinding tool 34 of ring-type is set at the pivot by chuck table 50.
The same with first embodiment, make chuck table 50 with the speed of 300rpm in the rotation of the direction shown in the arrow a, emery wheel 30A is rotated to the direction shown in the arrow b with the speed of 6000rpm, and make 44 work of grinding and feeding mechanism, the grinding grinding tool 34 of emery wheel 30A is contacted with the back side of wafer 11.Then, make emery wheel 30A carry out the grinding and feeding of scheduled volume downwards with predetermined grinding and feeding speed.
Its result is: as shown in Figure 8, at the back side of semiconductor wafer 11, the zone corresponding with device area 17 is ground and forms circular depressions 25, and the zone corresponding with periphery remaining area 19 retained and formed ring-type rib 27.
In the emery wheel 30A of present embodiment, the same with the emery wheel 30 of first embodiment, on the basis of a plurality of grinding fluid supply holes 42 that vertically extend, therefore be formed with a plurality of through holes 56 from internal perisporium 32b to periphery wall 32a, be trapped in the waste liquid of dividing in the space that forms by internal perisporium 32b, grinding grinding tool 34 and the wafer 11 of ring-type pedestal 32A and discharge swimmingly to the outside through through hole 56.Thus, can reduce the grindstone dust of sneaking in waste liquid and make grinding grinding tool 34 produce the eyelet phenomenon of blocking, thereby can reduce the finishing number of times of grinding grinding tool 34.
In addition, also discharge to the outside,, prevented that the bending strength of wafer from reducing so the root of ring-type rib 27 is cracked by the through hole 56 that is formed at ring-type pedestal 32A owing to sneak into the waste liquid of the diamond abrasive grain that comes off from grinding grinding tool 34.
Claims (2)
1. emery wheel, it is installed on the wheel seat of grinding attachment in loading and unloading mode freely, and this grinding attachment has: the grinding fluid supply member that grinding fluid is provided; The main shaft that is driven and rotates; And the above-mentioned wheel seat that is connected with the front end of this main shaft, above-mentioned emery wheel is characterised in that,
This emery wheel comprises:
The ring-type pedestal, it has internal perisporium, periphery wall and is installed in installation portion on the above-mentioned wheel seat; With
A plurality of grinding grinding tools, they are provided in the free end of above-mentioned ring-type pedestal in the form of a ring,
Separate predetermined space ground along circumferencial direction and be formed with a plurality of through holes on the above-mentioned periphery wall of above-mentioned ring-type pedestal, these a plurality of through holes connect to above-mentioned internal perisporium, are used for grindstone dust is discharged with grinding fluid.
2. emery wheel according to claim 1 is characterized in that,
From the above-mentioned installation portion of above-mentioned ring-type pedestal to above-mentioned internal perisporium, be formed with a plurality of grinding fluid supply holes that are used to provide grinding fluid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008218239 | 2008-08-27 | ||
| JP2008218239A JP2010052076A (en) | 2008-08-27 | 2008-08-27 | Grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101659033A true CN101659033A (en) | 2010-03-03 |
Family
ID=41787396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910163333 Pending CN101659033A (en) | 2008-08-27 | 2009-08-13 | Grinding wheel |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2010052076A (en) |
| CN (1) | CN101659033A (en) |
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| CN102398227A (en) * | 2010-09-08 | 2012-04-04 | 株式会社迪思科 | Grinding wheel |
| CN102452045A (en) * | 2010-10-18 | 2012-05-16 | 株式会社迪思科 | Grinding wheel |
| CN102909664A (en) * | 2011-08-01 | 2013-02-06 | 舒能（苏州）工业技术有限公司 | Grinding device and method for manufacturing same |
| CN104044086A (en) * | 2013-03-12 | 2014-09-17 | 株式会社迪思科 | Grinding wheel |
| CN104108073A (en) * | 2013-04-18 | 2014-10-22 | 株式会社迪思科 | Grinding wheel |
| CN104875130A (en) * | 2015-05-14 | 2015-09-02 | 赵静 | Cutter grinding wheel of crocodile type shearing machine |
| CN108422318A (en) * | 2017-02-14 | 2018-08-21 | 株式会社迪思科 | It is ground emery wheel |
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| CN111093900A (en) * | 2017-09-13 | 2020-05-01 | 罗伯特·博世有限公司 | Grinding tool |
| CN112045577A (en) * | 2020-09-22 | 2020-12-08 | 苏州浩耐特磨具有限公司 | Automatic heat dissipation grinding wheel and automatic heat dissipation method |
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| JP2001205560A (en) * | 2000-01-28 | 2001-07-31 | Disco Abrasive Syst Ltd | Grinding wheel and manufacturing method for grinding wheel |
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| CN102452045A (en) * | 2010-10-18 | 2012-05-16 | 株式会社迪思科 | Grinding wheel |
| CN102909664A (en) * | 2011-08-01 | 2013-02-06 | 舒能（苏州）工业技术有限公司 | Grinding device and method for manufacturing same |
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| CN104108073A (en) * | 2013-04-18 | 2014-10-22 | 株式会社迪思科 | Grinding wheel |
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| CN104875130A (en) * | 2015-05-14 | 2015-09-02 | 赵静 | Cutter grinding wheel of crocodile type shearing machine |
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| CN110142683A (en) * | 2019-06-26 | 2019-08-20 | 河南城建学院 | A kind of sheet for architectural decoration light device |
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| CN111070055A (en) * | 2019-12-27 | 2020-04-28 | 科达半导体有限公司 | Ultra-thin wafer processingequipment |
| CN112045577B (en) * | 2020-09-22 | 2021-08-10 | 苏州浩耐特磨具有限公司 | Automatic heat dissipation grinding wheel and automatic heat dissipation method |
| CN112045577A (en) * | 2020-09-22 | 2020-12-08 | 苏州浩耐特磨具有限公司 | Automatic heat dissipation grinding wheel and automatic heat dissipation method |
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Application publication date: 20100303 |