CN111063645A - Automatic material receiving and discharging system and method for semiconductor substrate - Google Patents
Automatic material receiving and discharging system and method for semiconductor substrate Download PDFInfo
- Publication number
- CN111063645A CN111063645A CN201911416887.1A CN201911416887A CN111063645A CN 111063645 A CN111063645 A CN 111063645A CN 201911416887 A CN201911416887 A CN 201911416887A CN 111063645 A CN111063645 A CN 111063645A
- Authority
- CN
- China
- Prior art keywords
- semiconductor substrate
- printed
- grabbing
- conveying device
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Warehouses Or Storage Devices (AREA)
Abstract
The invention discloses an automatic material receiving and discharging system and method for a semiconductor substrate. The invention also discloses an automatic material receiving and discharging method of the conductor substrate. The invention can effectively reduce the length, the occupied space and the stations of the conveying section, and can simultaneously reduce the labor intensity and improve the material receiving and discharging efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to an automatic material receiving and discharging system and method for a semiconductor substrate.
Background
The existing material receiving and discharging system comprises the following material receiving and discharging processes of semiconductor products: the method comprises the following steps of firstly clamping a semiconductor board from a bin, placing the semiconductor board on a conveying section, conveying the semiconductor board to a set position for printing, then grabbing a printed finished product to another conveying section, conveying the printed finished product to another finished product bin clamp, and finally conveying the finished product to the next procedure. The material receiving and discharging system is long in conveying section, large in space occupation ratio, and needs to be provided with two stations for taking and placing the bin clamps independently, an operator needs to carry products back and forth between the two bin clamps, the labor intensity is high, and the material receiving and discharging efficiency is low integrally.
Disclosure of Invention
The invention aims to provide an automatic material receiving and discharging system and method for a semiconductor substrate, which are beneficial to reducing the length of a conveying section, the occupied space and stations, and can reduce the labor intensity and improve the material receiving and discharging efficiency.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the utility model provides an automatic material receiving and releasing system of semiconductor substrate, includes the frame, be connected with conveyor in the frame and be used for the drive conveyor horizontal migration's horizontal sliding device, still be connected with the storehouse in the frame and press from both sides and be used for the drive the elevating gear that the storehouse pressed from both sides the lift, conveyor includes the transport support body, be connected with belt conveyor, detection device and grabbing device on the transport support body.
In one embodiment, the conveying frame body is further connected with a limiting device.
In one embodiment, the horizontal sliding device comprises a screw nut transmission mechanism, the screw nut transmission mechanism comprises a screw rod connected with the rack, a sliding nut is screwed on the screw rod, the screw rod is driven to rotate by a first motor, and the sliding nut is connected with the conveying rack body.
In one embodiment, the bin clamp comprises a supporting table, the supporting table is connected with the lifting device, a plurality of bins for placing the semiconductor substrate are connected to the top of the supporting table, a sliding block is connected to one side of the supporting table, a sliding rail is arranged on the rack, and the sliding block can be connected in the sliding rail in a sliding manner.
The material receiving and discharging method of the semiconductor substrate automatic material receiving and discharging system comprises the following steps:
1) driving the conveying device to move horizontally by using a horizontal sliding device until the conveying device moves to a position close to a designated position on the bin clamp for storing the semiconductor substrate to be printed;
2) adjusting the height of the bin clamp by using a lifting device until a selected semiconductor substrate to be printed in the bin clamp moves to a grabbing range of a grabbing device;
3) driving a grabbing device to grab the semiconductor substrate to be printed, placing the semiconductor substrate to be printed on a belt conveying device, and starting the belt conveying device to convey the semiconductor substrate to be printed to a designated station;
4) grabbing the semiconductor substrate to be printed at the appointed station by using printing equipment, printing the semiconductor substrate to be printed, and placing the printed semiconductor substrate at the appointed station in the step 3) by using the printing equipment after the printing is finished;
5) starting the belt conveying device to convey the printed semiconductor substrate to the detection device for detection;
6) after the detection is qualified, the horizontal sliding device is used for adjusting the horizontal position of the conveying device until the conveying device moves to a specified storage position close to the bin clamp, and the lifting device is used for adjusting the height of the bin clamp to a specified height;
7) and driving the grabbing device to place the qualified semiconductor substrate at the designated height of the bin clamp.
In one embodiment, the carrier body is further connected with a limiting device, and the limiting device is used for limiting the position of the semiconductor substrate to be printed, so that the semiconductor substrate to be printed stops at the designated station.
The invention has the following beneficial effects: the automatic material receiving and discharging system and method for the semiconductor substrate greatly save the length of the conveying section, reduce the occupied space, reduce the stations, improve the space utilization rate, avoid the need of operators to carry products back and forth, greatly reduce the labor intensity and improve the material receiving and discharging efficiency.
Drawings
FIG. 1 is a schematic structural diagram of an automatic material receiving and discharging system for semiconductor substrates according to the present invention;
FIG. 2 is a schematic view of the frame of FIG. 1;
FIG. 3 is a schematic view of the conveyor apparatus of FIG. 1;
FIG. 4 is a schematic view of the cartridge clip of FIG. 1;
in the figure: 1. frame, 2, horizontal displacement device, 21, lead screw, 22, slip nut, 23, first motor, 3, conveyor, 31, the carriage body, 32, belt conveyors, 321, conveyor, 33, detection device, 34, grabbing device, 35, stop device, 4, elevating gear, 5, storehouse clamp, 51, brace table, 52, feed bin, 53, slider, 6, semiconductor substrate.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
As shown in fig. 1-4, the embodiment discloses an automatic material receiving and discharging system for semiconductor substrates, which includes a frame 1, wherein the frame 1 is connected with a conveying device 3 and a horizontal sliding device 2, the frame 1 is further connected with a bin clamp 5 and a lifting device 4, the horizontal sliding device 2 is used for driving the conveying device 3 to move horizontally to adjust the horizontal position of the conveying device relative to the bin clamp 5, the lifting device 4 is used for driving the bin clamp 5 to lift to adjust the height of the bin clamp 5, the conveying device 3 includes a conveying frame body 31, and the conveying frame body 31 is connected with a belt conveying device 32, a detecting device 33 and a grabbing device 34; the detecting device 33 is used for detecting whether the printed semiconductor substrate 6 is qualified, and the grabbing device 34 is used for grabbing the semiconductor substrate 6.
Through the setting of horizontal displacement device 2 and elevating gear 4, can realize the adjustment of the relative position of storehouse clamp 5 and grabbing device 34 to make any appointed semiconductor substrate 6 in the storehouse clamp 5 all can conveniently remove to grabbing device 34 department, thereby make grabbing device 34 can grab any selected semiconductor substrate 6, also be convenient for simultaneously place the semiconductor substrate 6 after the printing finishes in the storehouse and press from both sides arbitrary appointed position department in 5.
Wherein, the belt conveying device 32 is driven by a conveying motor 321 to convey belts.
In one embodiment, as shown in fig. 3, a limiting device 35 is further connected to the carriage body 31 for limiting the position of the semiconductor substrate 6 to be printed, so that the semiconductor substrate 6 to be printed is stopped at a designated station, so that a printing device (not shown) can take the corresponding semiconductor substrate 6 to be printed for printing.
In one embodiment, as shown in fig. 2, the horizontal sliding device 2 includes a screw nut transmission mechanism, the screw nut transmission mechanism includes a screw 21 connected to the frame 1, a sliding nut 22 is screwed on the screw 21, the sliding nut 22 is connected to the carriage body 31, and the first motor 23 drives the screw 21 to rotate, so as to drive the sliding nut 22 and the carriage body 31 to move together along the length direction of the screw 21.
In one embodiment, as shown in fig. 4, the magazine clamp 5 includes a support table 51, the support table 51 is connected to the lifting device 4, a plurality of magazines 52 for placing the semiconductor substrates 6 are connected to the top of the support table 51, a slide block 53 is connected to one side of the support table 51, a slide rail is arranged on the frame 1, the slide block 53 is slidably connected to the slide rail, and after the lifting device is started, the magazine clamp 5 and the slide block 53 can move up and down along the slide rail.
Further, a plurality of semiconductor substrates 6 are placed in each magazine 52 from top to bottom.
The embodiment also discloses an automatic material receiving and discharging method of the semiconductor substrate, which comprises the following steps:
1) driving the conveying device 3 to move horizontally by using the horizontal sliding device 2 until the conveying device moves to a position close to a designated position on the bin clamp 5 for storing the semiconductor substrate 6 to be printed; for example: five storage bins 52 are sequentially arranged on the bin clamp 5, and the conveying device can be driven by the horizontal sliding device 2 to horizontally move to a position close to any one storage bin 52;
2) the height of the bin clamp 5 is adjusted by using the lifting device 4 until a selected semiconductor substrate 6 to be printed in the bin clamp 5 moves to a grabbing range of the grabbing device 34; for example, eight semiconductor substrates 6 to be printed are arranged in the magazine clamp 5 in sequence from top to bottom, and after the height of the magazine clamp 5 is adjusted, the gripping device 34 can be made to grip any one of the eight semiconductor substrates 6 to be printed.
3) Driving the gripping device 34 to grip the semiconductor substrate 6 to be printed, placing the semiconductor substrate 6 to be printed on the belt conveying device 32, and starting the belt conveying device 32 to convey the semiconductor substrate 6 to be printed to a designated station;
here, the limiting device 35 may be disposed at the designated station, so that the semiconductor substrate 6 to be printed is limited by the limiting device 35 to stop at the designated station, thereby facilitating the grabbing of the subsequent printing equipment;
4) grabbing the semiconductor substrate 6 to be printed at the appointed station by using printing equipment, printing the semiconductor substrate 6 to be printed, and after the printing is finished, placing the printed semiconductor substrate 6 at the appointed station in the step 3) by using the printing equipment, namely placing the printed semiconductor substrate 6 at the original position of the plate taking;
5) starting the belt conveying device 32 to convey the printed semiconductor substrate 6 to the detection device 33 for detection;
6) after the detection is qualified, the horizontal sliding device 2 is used for adjusting the horizontal position of the conveying device 3 until the conveying device 3 moves to a specified storage position close to the bin clamp 5, and the lifting device 4 is used for adjusting the height of the bin clamp 5 to a specified height;
7) the gripping device 34 is driven to push back the semiconductor substrate 6 that is qualified for inspection to be placed at the designated height of the magazine chuck 5.
And then repeating the steps 1) to 7), and then carrying out the material receiving and discharging of the semiconductor substrate 6 to be printed.
According to the automatic material receiving and discharging system for the semiconductor substrate, the double functions of taking and placing the semiconductor substrate 6 are achieved by using the bin clamp 5, the semiconductor substrate 6 is conveyed back and forth only by using the conveying device 3, the conveying section length is greatly saved, the occupied space is reduced, the stations are reduced, the space utilization rate is improved, an operator does not need to carry the product back and forth, the labor intensity is greatly reduced, and the material receiving and discharging efficiency is improved; overall structure is simple, make full use of conveyor 3's transport and storehouse press from both sides 5's storage function, and the mechanism utilization ratio is high, has reduced mechanical mechanism's the quantity of arranging.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (6)
1. The utility model provides an automatic material system that receives and releases of semiconductor substrate, its characterized in that, includes the frame, be connected with conveyor in the frame and be used for the drive conveyor horizontal migration's horizontal sliding device, still be connected with the storehouse in the frame and press from both sides and be used for the drive the elevating gear that the storehouse pressed from both sides the lift, conveyor is including carrying the support body, be connected with belt conveyor, detection device and grabbing device on carrying the support body.
2. The automatic semiconductor substrate receiving and discharging system as claimed in claim 1, wherein the carrier body is further connected with a limiting device.
3. The automatic semiconductor substrate receiving and discharging system according to claim 1, wherein the horizontal sliding device comprises a screw nut transmission mechanism, the screw nut transmission mechanism comprises a screw connected to the frame, a sliding nut is screwed on the screw, the screw is driven to rotate by a first motor, and the sliding nut is connected to the transport frame.
4. The automatic semiconductor substrate receiving and discharging system according to claim 1, wherein the magazine holder comprises a supporting table, the supporting table is connected to the lifting device, a plurality of magazines for holding semiconductor substrates are connected to the top of the supporting table, a slide block is connected to one side of the supporting table, a slide rail is arranged on the rack, and the slide block is slidably connected to the slide rail.
5. The method for receiving and discharging the semiconductor substrate according to any one of claims 1 to 4, comprising the steps of:
1) driving the conveying device to move horizontally by using a horizontal sliding device until the conveying device moves to a position close to a designated position on the bin clamp for storing the semiconductor substrate to be printed;
2) adjusting the height of the bin clamp by using a lifting device until a selected semiconductor substrate to be printed in the bin clamp moves to a grabbing range of a grabbing device;
3) driving a grabbing device to grab the semiconductor substrate to be printed, placing the semiconductor substrate to be printed on a belt conveying device, and starting the belt conveying device to convey the semiconductor substrate to be printed to a designated station;
4) grabbing the semiconductor substrate to be printed at the appointed station by using printing equipment, printing the semiconductor substrate to be printed, and placing the printed semiconductor substrate at the appointed station in the step 3) by using the printing equipment after the printing is finished;
5) starting the belt conveying device to convey the printed semiconductor substrate to the detection device for detection;
6) after the detection is qualified, the horizontal sliding device is used for adjusting the horizontal position of the conveying device until the conveying device moves to a specified storage position close to the bin clamp, and the lifting device is used for adjusting the height of the bin clamp to a specified height;
7) and driving the grabbing device to place the qualified semiconductor substrate at the designated height of the bin clamp.
6. The receiving and discharging method according to claim 5, wherein a limiting device is further connected to the conveyor frame body, and the limiting device is used for limiting the position of the semiconductor substrate to be printed so that the semiconductor substrate to be printed is stopped at the designated station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911416887.1A CN111063645A (en) | 2019-12-31 | 2019-12-31 | Automatic material receiving and discharging system and method for semiconductor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911416887.1A CN111063645A (en) | 2019-12-31 | 2019-12-31 | Automatic material receiving and discharging system and method for semiconductor substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111063645A true CN111063645A (en) | 2020-04-24 |
Family
ID=70305781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911416887.1A Pending CN111063645A (en) | 2019-12-31 | 2019-12-31 | Automatic material receiving and discharging system and method for semiconductor substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111063645A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114890138A (en) * | 2022-07-13 | 2022-08-12 | 天津金海通半导体设备股份有限公司 | Receiving agencies of chip material pipe |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1734713A (en) * | 2002-05-01 | 2006-02-15 | 日本网目自动制造株式会社 | Substrate treating apparatus |
| CN202944860U (en) * | 2012-10-25 | 2013-05-22 | 奇瑞汽车股份有限公司 | Space-saving grabbing-convenient automatic feeding tool |
| CN103359463A (en) * | 2012-03-29 | 2013-10-23 | 平田机工株式会社 | Transport unit and transport apparatus |
| CN206013831U (en) * | 2016-09-14 | 2017-03-15 | 深圳市海能达通信有限公司 | A kind of automatic feeder |
| CN107093651A (en) * | 2017-05-18 | 2017-08-25 | 江西比太科技有限公司 | The two-in-one automatic loading/unloading equipment of solar silicon wafers |
| KR101770161B1 (en) * | 2017-07-07 | 2017-09-05 | 김기현 | Tray transferring apparatus |
-
2019
- 2019-12-31 CN CN201911416887.1A patent/CN111063645A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1734713A (en) * | 2002-05-01 | 2006-02-15 | 日本网目自动制造株式会社 | Substrate treating apparatus |
| CN103359463A (en) * | 2012-03-29 | 2013-10-23 | 平田机工株式会社 | Transport unit and transport apparatus |
| CN202944860U (en) * | 2012-10-25 | 2013-05-22 | 奇瑞汽车股份有限公司 | Space-saving grabbing-convenient automatic feeding tool |
| CN206013831U (en) * | 2016-09-14 | 2017-03-15 | 深圳市海能达通信有限公司 | A kind of automatic feeder |
| CN107093651A (en) * | 2017-05-18 | 2017-08-25 | 江西比太科技有限公司 | The two-in-one automatic loading/unloading equipment of solar silicon wafers |
| KR101770161B1 (en) * | 2017-07-07 | 2017-09-05 | 김기현 | Tray transferring apparatus |
Non-Patent Citations (2)
| Title |
|---|
| 《职业技能鉴定教材》《职业技能鉴定指导》编审委员会: "《钳工 初级、中级、高级》", 30 April 2001, 中国劳动出版社 * |
| 杨琦，糜娜，曹晶: "《3D打印技术基础及实践》", 31 December 2018, 合肥工业大学出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114890138A (en) * | 2022-07-13 | 2022-08-12 | 天津金海通半导体设备股份有限公司 | Receiving agencies of chip material pipe |
| CN114890138B (en) * | 2022-07-13 | 2022-09-13 | 天津金海通半导体设备股份有限公司 | Receiving agencies of chip material pipe |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110027900B (en) | Production line and feeding device | |
| CN105364450A (en) | Full-automatic part sorting and conveying system | |
| CN209988691U (en) | Production line and material feeding unit | |
| CN214296940U (en) | Battery cell conveying system | |
| CN212075429U (en) | Automatic loading and unloading device from material frame to Tray disc | |
| CN217229420U (en) | Automatic disk changing equipment for chips | |
| CN211253961U (en) | Intelligent storage of charging tray transmission line | |
| CN111063645A (en) | Automatic material receiving and discharging system and method for semiconductor substrate | |
| CN210655162U (en) | Automatic feeding device | |
| CN110027899B (en) | Production line, feeding device and connection mechanism | |
| CN116884899A (en) | Silicon wafer variable-pitch transmission workbench and working method thereof | |
| CN212923658U (en) | Charging tray storage and feeding mechanism | |
| CN106743392B (en) | Automatic transposition mechanism on earphone magnetizing device | |
| CN215853812U (en) | LCD charging tray material loading machine | |
| CN214877515U (en) | Automatic carrying device for two sides of graphite boat | |
| CN215046655U (en) | Material receiving device | |
| CN209834829U (en) | Automatic carrying equipment for IC (integrated circuit) chips | |
| CN112551046A (en) | Positioning mechanism and conveying mechanism with same | |
| CN215556393U (en) | Positioning mechanism and conveying mechanism with same | |
| CN218087707U (en) | Material loading letter sorting system | |
| CN218753501U (en) | Sorting equipment | |
| CN218840916U (en) | Automatic feeding and transferring machine for aging board | |
| CN221017432U (en) | Display screen feeding equipment for automatic assembly production line | |
| CN217971653U (en) | Automatic feeding and discharging mechanism for material tray | |
| CN214651920U (en) | Exposure system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200424 |
|
| RJ01 | Rejection of invention patent application after publication |